Bi-directional TVS Array for High-Speed Data Line Protection

NUP4000
Bi-directional TVS Array for
High-Speed Data Line
Protection
The NUP4000 transient voltage suppressor is designed to protect
equipment attached to up to four high speed communication lines from
ESD, EFT, and lightning.
Features:
• SO−8 Package
• Peak Power − 400 W 8 x 20 mS
• ESD Rating:
•
•
IEC 61000−4−2 (ESD) ±15 kV (air) ±8 kV (contact)
IEC 61000−4−4 (EFT) 40 A (5/50 ns)
IEC 61000−4−5 (lightning) 12 A (8/20 ms)
UL Flammability Rating of 94 V−0
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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SO−8
VOLTAGE SUPPRESSOR
400 WATTS PEAK POWER
15 VOLTS
PIN CONFIGURATION
AND SCHEMATIC
Typical Applications:
•
•
•
•
•
•
•
•
High Speed Communication Line Protection
15 V Data and I/O Lines
Microprocessor Based Equipment
LAN/WAN Equipment
Servers
Notebook and Desktop PC
Serial and Parallel Ports
Peripherals
1
8
2
7
3
6
4
5
8
1
SO−8
CASE 751
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Power Dissipation
8 x 20 ms @ TA = 25°C (Note 1)
Ppk
400
W
Peak Pulse Current
8 x 20 ms @ TA = 25°C (Note 1)
IPP
10
A
Junction and Storage
Temperature Range
Lead Solder Temperature −
Maximum 10 Seconds Duration
MARKING DIAGRAM
8
NUP40
AYWWG
G
1
TJ, Tstg
−55 to
+150
°C
TL
260
°C
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUP4000DR2G
SO−8
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 0
1
Publication Order Number:
NUP4000/D
NUP4000
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
VRWM
−
−
15
V
VBR
16.7
−
−
V
Reverse Leakage Current @ VRWM = 15 Volts
IR
N/A
−
1.0
mA
Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 mS
VC
N/A
−
24
V
Maximum Clamping Voltage @ IPP = 5.0 A, 8 x 20 mS
VC
N/A
−
30
V
Maximum Peak Pulse Current
IPP
−
−
10
A
Junction Capacitance @ VR = 0 V, f = 1 MHz
CJ
−
−
75
pF
Reverse Working Voltage
Reverse Breakdown Voltage @ It = 1.0 mA
100
tr
90
% OF PEAK PULSE CURRENT
Ppk, PEAK SURGE POWER (WATTS)
1000
100
10
NOTE: Non−Repetitive Surge.
1
1
10
100
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
1000
PEAK VALUE IRSM @ 8 ms
0
t, TIME (ms)
20
40
60
t, TIME (ms)
Figure 1. Pulse Width
Figure 2. 8 × 20 ms Pulse Waveform
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2
80
NUP4000
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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3
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NUP4000/D