300 Watts Peak Pulse Power Zener Transient Voltage Suppressor

SM05T1GSeries,
SZSM05T1G
Transient Voltage
Suppressor Diode Array
SOT−23 Dual Common Anode Diodes
for ESD Protection
http://onsemi.com
These dual monolithic silicon TVS diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
1
Specification Features:
 SOT−23 Package Allows Either Two Separate Unidirectional






Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage Range − 5.0 V to 24 V
Peak Power − 300 Watt (8 X 20 ms)
Low Leakage
Flammability Rating UL 94 V−0
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices*
Mechanical Characteristics:
CASE: Void-Free, Transfer-Molded, Thermosetting Plastic Case
FINISH: Corrosion Resistant Finish, Easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
Use the Device Number to Order the 7 Inch/3,000 Unit Reel
Replace the “T1” with “T3” in the Device Number to Order the
13 Inch/10,000 Unit Reel
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. 6
SOT−23
CASE 318
STYLE 12
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
MARKING DIAGRAM
xxM MG
G
1
xxM = Device Code
xx = 05, 12, 15, 24, 36
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
SM05T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
SZSM05T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
SM12T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
SM15T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
SM24T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
SM36T1G
SOT−23
(Pb−Free)
3,000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
SM05T1/D
SM05T1G Series, SZSM05T1G
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20 ms (Note 1) @ TL  25C
Symbol
Value
Ppk
300
Unit
W
IEC 61000−4−2 (ESD)
Air
Contact
kV
15
8.0
IEC 61000−4−4 (EFT)
40
IEC 61000−4−5 (Lightening)
Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
12
A
225
1.8
556
mW
mW/C
C/W
RqJA
300
2.4
417
mW
mW/C
C/W
TJ, Tstg
− 55 to +150
C
TL
260
C
PD
RqJA
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
PD
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse per Figure 3
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
NOTE: Other voltages may be available upon request
ELECTRICAL CHARACTERISTICS
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
QVBR
I
IF
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
VC VBR VRWM
Test Current
Maximum Temperature Coefficient of VBR
IF
Forward Current
VF
Forward Voltage @ IF
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
V
IR VF
IT
IPP
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
VBR, Breakdown Voltage
VRWM
Max IPP
(Note 4)
Typical
Capacitance
(pF)
Max
mA
(Volts)
(Amps)
Pin 1 to 3
@ 0 Volts
6.2
7.3
1.0
9.8
17
225
13.3
15.75
1.0
19
12
95
16.7
19.6
1.0
24
10
100
1.0
26.7
31.35
1.0
43
5.0
60
1.0
40.0
46.95
1.0
60
4.0
45
Device*
Device
Marking
SM05T1G
05M
5
10
SM12T1G
12M
12
1.0
SM15T1G
15M
15
1.0
SM24T1G
24M
24
SM36T1G
36M
36
(Volts)
IT
(Volts)
IR @ VRWM
VC @
IPP =
1 Amp
(mA)
Min
4. 8  20 ms pulse waveform per Figure 3
*Include SZ-prefix devices where applicable.
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2
SM05T1G Series, SZSM05T1G
TYPICAL CHARACTERISTICS
300
PD, POWER DISSIPATION (mW)
PPP, PEAK PULSE POWER (kW)
10
1
0.1
0.01
0.1
1
100
10
tp, PULSE DURATION (ms)
250
150
100
FR−5 BOARD
50
0
1000
ALUMINA SUBSTRATE
200
0
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time
C, CAPACITANCE (pF)
70
60
50
HALF VALUE IRSM/2 @ 20 ms
40
30
tP
20
75
100
125
TEMPERATURE (C)
150
175
250
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
50
Figure 2. Steady State Power Derating Curve
PEAK VALUE IRSM @ 8 ms
tr
90
210
170
130
10
0
0
20
40
60
90
80
0
1
t, TIME (ms)
2
3
BIAS VOLTAGE (VOLTS)
100
90
80
70
60
50
40
30
20
10
0
0
4
Figure 4. Typical Diode Capacitance (SM05)
Figure 3. 8  20 ms Pulse Waveform
C, CAPACITANCE (pF)
% OF PEAK PULSE CURRENT
100
25
1
5
8
BIAS VOLTAGE (VOLTS)
12
Figure 5. Typical Diode Capacitance (SM12)
http://onsemi.com
3
5
SM05T1G Series, SZSM05T1G
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SOT−23
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of TVS applications are illustrated below.
Computer Interface Protection
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
C
I/O
D
FUNCTIONAL
DECODER
GND
SM05T1G
Series
Microprocessor Protection
VDD
VGG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
SM05T1
Series
CLOCK
CONTROL BUS
GND
SM05T1G
Series
http://onsemi.com
4
SM05T1G Series, SZSM05T1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
e
b
0.25
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
SM05T1/D
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