2 Line USB 1.1 Upstream EMI Filter

NUF2222FC
2 Line USB 1.1 Upstream
EMI Filter
This device is a 2 line EMI filter array for USB port protection in
wireless applications. Greater than −20 dB attenuation is obtained at
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated
ESD protection. ESD protection is provided across all capacitors.
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Features
A3
• EMI Filtering and ESD Protection
• Integration of 10 Discretes
• Provides Protection for IEC61000−4−2 (Level 4)
•
•
•
1.3 K
A1
33 R
C1
15 kV (Contact)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
D2
(Gnd Pin)
33 R
Benefits
E1
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
•
•
Filter Response
Integrated Solution Improves System Reliability
This is a Pb−Free Device
MARKING
DIAGRAM
1
Flip−Chip
FC SUFFIX
CASE 499AM
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Products
Notebook Computers
MP3 Players
2222
A
Y
WW
2222AYWW
= Specific Device Code
= Assembly Location
= Year
= Work Week
PIN CONFIGURATION
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
E3
1
Applications
•
•
•
•
•
C3
B2
♦
Symbol
Value
Unit
VPP
15
kV
Operating Temperature Range
TOP
−40 to +85
°C
C
Storage Temperature Range
TSTG
−55 to +150
°C
D
TJ
+125
°C
E
ESD Discharge
IEC61000−4−2
Contact Discharge
Junction Temperature
3
2 1
A
B
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Device
Package
Shipping†
NUF2222FCT1G
Flip−Chip
3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 0
1
Publication Order Number:
NUF2222FC/D
NUF2222FC
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
Maximum Reverse Working Voltage
VRWM
−
−
−
5.6
V
VBR
IR = 1.0 mA
6.0
−
8.8
V
IR
VRWM = 3.3 V
−
1.0
100
nA
Pull Up Resistance
Rpu
−
1.1
1.3
1.5
kW
Series Resistance
RS
−
28
33
38
W
CLINE
f = 1.0 MHz, 0 Vdc
−
36
40
pF
f3dB
50 W Source and 50 W Load Termination
−
190
−
MHz
Breakdown Voltage
Leakage Current
Capacitance
Cut−Off Frequency
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2
NUF2222FC
TYPICAL PERFORMANCE CURVES
(TA = 25°C unless otherwise specified)
0
0
−5
−10
−20
S41 (dB)
S21 (dB)
−10
−15
−20
−30
−40
−25
−50
−30
−35
1.0E+6
10E+6
100E+6
1.0E+9
10E+9
−60
1.0E+6
10E+6
100E+6
1.0E+9
10E+9
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss
Characteristics
Figure 2. Typical Crosstalk Characteristics
1350
34.50
1340
RESISTANCE (W)
1330
33.50
33.00
32.50
1320
1310
1300
1290
1280
1270
32.00
1260
31.50
−40
−15
10
35
60
85
1250
−40
−15
TEMPERATURE (°C)
10
60
Figure 4. Typical Resistance (R1300) vs.
Temperature
45
35
25
15
0
35
TEMPERATURE (°C)
Figure 3. Typical Resistance (R33) vs.
Temperature
CAPACITANCE (pF)
RESISTANCE (W)
34.00
1
2
3
4
REVERSE VOLTAGE (V)
Figure 5. Typical Line Capacitance vs. Reverse
Bias Voltage
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3
5
85
NUF2222FC
PRINTED CIRCUIT BOARD RECOMMENDATIONS
500 mm Pitch
300 or 350 mm Solder Ball
Parameter
250 mm +25
−0
PCB Pad Size
Pad Shape
Round
Pad Type
NSMD
350 mm "25
Solder Mask Opening
125 mm
Solder Stencil Thickness
Stencil Aperture
250 x 250 mm sq.
Solder Flux Ratio
50/50
Solder Paste Type
No Clean Type 3 or Finer
Trace Finish
OSP Cu
Trace Width
150 mm Max
Copper
Solder mask
NSMD
SMD
Figure 6. NSMD vs. SMD
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Tp = (15−30 sec)
Tp = 260°C − 5°C
RAMP−UP
RAMP−DOWN
tL
(60−90 sec)
PRE−HEAT
ZONE
0−
15 −
30 −
45 −
60 −
75 −
90 −
105 −
119 −
134 −
149 −
165 −
180 −
195 −
209 −
224 −
239 −
254 −
269 −
284 −
299 −
314 −
329 −
344 −
359 −
374 −
389 −
404 −
419 −
434 −
449 −
464 −
479 −
494 −
TEMPERATURE (°C)
280
270
260
250
240
230
TL= 217 210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
TIME (seconds)
Figure 7. Typical Pb−Free Solder Heating Profile
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4
NUF2222FC
PACKAGE DIMENSIONS
8 PIN FLIP−CHIP
CASE 499AM−01
ISSUE O
D
4X
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
0.10 C
TERMINAL A1
LOCATOR
E
DIM
A
A1
A2
D
E
b
e
E1
TOP VIEW
A2
A1
0.10 C
A
0.05 C
C
SIDE VIEW
SEATING
PLANE
e
e/2
8X
b
0.05 C A B
0.03 C
E
D
C
B
A
e
1 2 3
E1
e/2
BOTTOM VIEW
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5
MILLIMETERS
MIN
MAX
−−−
0.700
0.210
0.270
0.380
0.430
1.270 BSC
1.970 BSC
0.290
0.340
0.700 BSC
1.400 BSC
NUF2222FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
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Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUF2222FC/D
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