2-Channel EMI Filter (C-R-C) with ESD

CM1485
Dual Channel EMI Filter
with ESD Protection
Product Description
The CM1485 is a 2 channel pi-style EMI filter array with ESD
protection, housed in a 6−lead SOT−563 package. The CM1485 has
component values of 12 pF − 100 W − 12 pF per channel. The
CM1485 has a cut−off frequency of 125 MHz and can be used in
applications with data rates up to 48 Mbps. The parts include ESD
diodes on every pin, which provide a very high level of protection for
sensitive electronic components that may be subjected to electrostatic
discharge (ESD). The ESD protection diodes safely dissipate ESD
strikes of ±15 kV, well beyond the maximum requirement of the
IEC61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater than ±30 kV.
This device is particularly well−suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of its
small package and easy-to-use pin assignments. In particular, the
CM1485 is ideal for EMI filtering and protecting data and control lines
for the I/O data ports, LCD display and camera interface in mobile
handsets.
The CM1485 is housed in a small, 6−lead SOT−563 package and is
available with lead−free finishing.
Features
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SOT−563
SE SUFFIX
CASE 463A
ELECTRICAL SCHEMATIC
100 W
Filter
+
ESDn*
C
R
12 pF
GND
Filter
+
ESDn*
C
12 pF
1 of 2 EMI/RFI + ESD Channels
* See Package/Pinout Diagrams for expanded pin information.
• Two Channels of EMI Filtering with Integrated ESD Protection
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
MARKING DIAGRAM
Network
• ±15 kV ESD Protection on Each Channel
•
•
•
•
N85 M G
(IEC 61000−4−2 Level 4, Contact Discharge)
±30 kV ESD Protection on Each Channel (HBM)
Greater than 30 dB Attenuation (Typical) at 1 GHz
6−lead SOT−563 Package
These Devices are Pb−Free and are RoHS Compliant
1
N85 = CM1485−02SE
M = Month Code
G
= Pb−Free Package
ORDERING INFORMATION
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
• Wireless Handsets
• Handheld PCs/PDAs
• LCD and Camera Modules
© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 3
1
Device
Package
Shipping†
CM1485−02SE
SOT−563
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
CM1485/D
CM1485
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
6−Lead SOT−563 Package
Pin
Name
1
FILTER1
2
GND
3
FILTER1
Filter + ESD Channel 1
4
FILTER2
Filter + ESD Channel 2
GND
6
FILTER2
CH1
1
GND
2
CH1
3
5
CH2
5
GND
4
CH2
Filter + ESD Channel 1
Ground (Note 1)
Ground (Note 1)
N85
5
Top View
Description
6−Lead SOT−563
Filter + ESD Channel 2
1. Pin 2 and Pin 5 must be well grounded at the same time.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
0.15
W
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R
CTOTAL
Parameter
Conditions
Resistance
Total Channel Capacitance
At 2.5 V DC Reverse Bias,
1 MHz, 30 mV AC
ILEAK
Diode Leakage Current (Reverse Bias)
VDIODE = +3.0 V
VBR
Breakdown Voltage
Positive Clamp
ILOAD = 1 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per
IEC 61000−4−2 Level 4
RDYN
fC
A1GHz
A800MHz − 6GHz
(Note 2)
Min
Typ
Max
Units
90
100
110
W
19.2
24.0
28.8
pF
1.0
mA
6.0
7.0
V
kV
±30
±15
Dynamic Resistance
Positive
Negative
2.3
0.9
Cut−off Frequency
ZSOURCE = 50 W, ZLOAD = 50 W
125
W
MHz
Absolute Attenuation @ 1 GHz from 0 dB Level
ZSOURCE = 50 W, ZLOAD = 50 W,
DC Bias = 0 V (Notes 1 and 3)
35
dB
Absolute Attenuation @ 800 MHz to 1 GHz
from 0 dB Level
ZSOURCE = 50 W, ZLOAD = 50 W,
DC Bias = 0 V (Notes 1 and 3)
30
dB
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Attenuation / RF curves characterized by a network analyzer using microprobes.
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2
CM1485
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND)
Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND)
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3
CM1485
PERFORMANCE INFORMATION (Cont’d)
Figure 3. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5 V DC and 255C)
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4
CM1485
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
5
6
1
2
A
4
b
e
L
E
−Y−
3
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
X Y
M
SOLDERING FOOTPRINT*
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
STYLE 1:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
0.3
0.0118
0.45
0.0177
1.35
0.0531
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1485/D
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