2-Channel Headset Microphone EMI Filter with ESD Protection

CM1412
2-Channel Headset
/ Microphone EMI Filter
Array with ESD Protection
Product Description
The CM1412 is a dual, low−pass filter array integrating two pi−style
filters (C−R−C) that reduce EMI/RFI emissions while providing ESD
protection. This part is custom−designed to interface with
a microphone port on a cellular telephone or similar device. Each high
quality filter provides more than 35 dB attenuation in the 800 to
2700 MHz range. These pi−style filters support bidirectional filtering
that control EMI both to and from a microphone element. They also
support AC signals, enabling audio signals to pass through without
distortion.
In addition, the CM1412 provides a very high level of protection for
sensitive electronic components that may be subjected to electrostatic
discharge (ESD). The input pins safely dissipate ESD strikes of ±8 kV,
the maximum requirement of the IEC 61000−4−2 international
standard. Using the MIL−STD−883 (Method 3015) specification for
Human Body Model (HBM) ESD, the device provides protection for
contact discharges to greater than ±15 kV.
The CM1412 is particularly well suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package format and low weight. The CM1412 incorporates
OptiGuardt coating which results in improved reliability at assembly
and is available in a space−saving, low−profile Chip Scale Package
with lead−free finishing.
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WLCSP5
CP SUFFIX
CASE 567AZ
BLOCK DIAGRAM
68 W R
A1
MIC_IN1
47 pF
47 pF
C
C
68 W R
A3
MIC_IN2
47 pF
C3
MIC_OUT2
47 pF
C
GND
C1
MIC_OUT1
C
B2
Features
• Functionally and Pin Compatible with ON Semiconductor’s
•
•
•
•
•
•
•
•
•
•
CSPEMI202A
OptiGuardt Coated for Improved Reliability at Assembly
Two Channels of EMI Filtering
Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
Network
Greater than 40 dB Attenuation at 1 GHz
±8 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±15 kV ESD Protection on Each Channel (HBM)
Supports AC Signals−Ideal for Audio Applications
Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
5−Bump, 0.930 mm X 1.410 mm Footprint Chip Scale Package
(CSP)
These Devices are Pb−Free and are RoHS Compliant
Applications
• EMI Filtering and ESD Protection for Headset
•
•
•
March, 2011 − Rev. 4
CB
CB
= CM1412−03CP
ORDERING INFORMATION
Device
Package
Shipping†
CM1412−03CP
WLCSP5
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• Digital Camcorders
• Notebooks
• Desktop PCs
Microphone Ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
© Semiconductor Components Industries, LLC, 2011
MARKING DIAGRAM
1
Publication Order Number:
CM1412/D
CM1412
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Pin
Name
A1
MIC_IN1
Microphone Input 1 (from Microphone)
Description
A3
MIC_IN2
Microphone Input 2 (from Microphone)
B2
GND
C1
MIC_OUT1
Microphone Output 1 (to Audio Circuitry)
A
C3
MIC_OUT2
Microphone Output 2 (to Audio Circuitry)
B
Top View
(Bumps Down View)
Orientation
Marking
1 2 3
+
C3
C1
CB
Device Ground
Bottom View
(Bumps Up View)
Orientation
Marking
C
B2
A1
A1
A3
CM1412
WLCSP5 Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Storage Temperature Range
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R
RMATCH
C
Parameter
Conditions
Resistance
Typ
Max
Units
61
68
75
W
5
%
56
pF
1.0
mA
Resistance Matching
Capacitance
38
ILEAK
Diode Leakage Current
VIN = 5.0 V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Notes 2 and 4)
VCL
Clamping Voltage during ESD Discharge MIL−STD−883
(Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2, 3 and 4)
Cut−Off Frequency, ZSOURCE = 50 W, ZLOAD = 50 W
R = 68 W, C = 47 pF
fC
Min
5
−15
47
7
−10
15
−5
V
kV
±15
±8
V
+15
−19
60
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open.
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2
CM1412
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)
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3
CM1412
APPLICATION INFORMATION
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
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4
CM1412
PACKAGE DIMENSIONS
WLCSP5, 0.94x1.41
CASE 567AZ−01
ISSUE O
D
2X
A
ÈÈ
ÈÈ
PIN A1
REFERENCE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
ÉÉÉ
ÉÉÉ
A2
OptiGuard Option
0.05 C
0.05 C
NOTE 3
A1
A
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
C
SEATING
PLANE
A1
eD/2
5X
0.05 C A B
0.03 C
PACKAGE
OUTLINE
0.87
eD
b
MILLIMETERS
MIN
MAX
0.56
0.72
0.21
0.27
0.40 REF
0.29
0.35
0.94 BSC
1.41 BSC
0.50 BSC
0.435 BSC
eE
C
0.44
0.25
0.50
B
A
5X
0.25
DIMENSIONS: MILLIMETERS
1 2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
OptiGuard is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1412/D
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