CM1412 2-Channel Headset / Microphone EMI Filter Array with ESD Protection Product Description The CM1412 is a dual, low−pass filter array integrating two pi−style filters (C−R−C) that reduce EMI/RFI emissions while providing ESD protection. This part is custom−designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35 dB attenuation in the 800 to 2700 MHz range. These pi−style filters support bidirectional filtering that control EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion. In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV. The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuardt coating which results in improved reliability at assembly and is available in a space−saving, low−profile Chip Scale Package with lead−free finishing. http://onsemi.com WLCSP5 CP SUFFIX CASE 567AZ BLOCK DIAGRAM 68 W R A1 MIC_IN1 47 pF 47 pF C C 68 W R A3 MIC_IN2 47 pF C3 MIC_OUT2 47 pF C GND C1 MIC_OUT1 C B2 Features • Functionally and Pin Compatible with ON Semiconductor’s • • • • • • • • • • CSPEMI202A OptiGuardt Coated for Improved Reliability at Assembly Two Channels of EMI Filtering Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network Greater than 40 dB Attenuation at 1 GHz ±8 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±15 kV ESD Protection on Each Channel (HBM) Supports AC Signals−Ideal for Audio Applications Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance 5−Bump, 0.930 mm X 1.410 mm Footprint Chip Scale Package (CSP) These Devices are Pb−Free and are RoHS Compliant Applications • EMI Filtering and ESD Protection for Headset • • • March, 2011 − Rev. 4 CB CB = CM1412−03CP ORDERING INFORMATION Device Package Shipping† CM1412−03CP WLCSP5 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • Digital Camcorders • Notebooks • Desktop PCs Microphone Ports Wireless Handsets Handheld PCs / PDAs MP3 Players © Semiconductor Components Industries, LLC, 2011 MARKING DIAGRAM 1 Publication Order Number: CM1412/D CM1412 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Pin Name A1 MIC_IN1 Microphone Input 1 (from Microphone) Description A3 MIC_IN2 Microphone Input 2 (from Microphone) B2 GND C1 MIC_OUT1 Microphone Output 1 (to Audio Circuitry) A C3 MIC_OUT2 Microphone Output 2 (to Audio Circuitry) B Top View (Bumps Down View) Orientation Marking 1 2 3 + C3 C1 CB Device Ground Bottom View (Bumps Up View) Orientation Marking C B2 A1 A1 A3 CM1412 WLCSP5 Package SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Storage Temperature Range Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 200 mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol R RMATCH C Parameter Conditions Resistance Typ Max Units 61 68 75 W 5 % 56 pF 1.0 mA Resistance Matching Capacitance 38 ILEAK Diode Leakage Current VIN = 5.0 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Notes 2 and 4) VCL Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4) Cut−Off Frequency, ZSOURCE = 50 W, ZLOAD = 50 W R = 68 W, C = 47 pF fC Min 5 −15 47 7 −10 15 −5 V kV ±15 ±8 V +15 −19 60 MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. 4. Unused pins are left open. http://onsemi.com 2 CM1412 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2) http://onsemi.com 3 CM1412 APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 3. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 4 CM1412 PACKAGE DIMENSIONS WLCSP5, 0.94x1.41 CASE 567AZ−01 ISSUE O D 2X A ÈÈ ÈÈ PIN A1 REFERENCE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉ ÉÉÉ A2 OptiGuard Option 0.05 C 0.05 C NOTE 3 A1 A SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* C SEATING PLANE A1 eD/2 5X 0.05 C A B 0.03 C PACKAGE OUTLINE 0.87 eD b MILLIMETERS MIN MAX 0.56 0.72 0.21 0.27 0.40 REF 0.29 0.35 0.94 BSC 1.41 BSC 0.50 BSC 0.435 BSC eE C 0.44 0.25 0.50 B A 5X 0.25 DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW OptiGuard is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1412/D