3-Channel Single Mic / Stereo Speaker CSP EMI Filters with ESD Protection

CSPEMI205G
3-Channel Headset
Microphone EMI Filter with
ESD Protection
Product Description
The CSPEMI205G is a low−pass filter array integrating three
pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the
same time providing ESD protection. This part is custom−designed to
interface with the headset port on a cellular telephone, and contains
two different filter values. Each high quality filter provides more than
30 dB attenuation in the 800−2700 MHz range. These pi−style filters
support bidirectional filtering, controlling EMI both to and from the
microphone and speaker elements. They also support bipolar signals,
enabling audio signals to pass through without distortion.
In addition, the CSPEMI205G provides a very high level of
protection for sensitive electronic components that may be subject to
electrostatic discharge (ESD). The input pins safely dissipate ESD
strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±15 kV.
The CSPEMI205G is particularly well−suited for portable
electronics (e.g. cellular telephones, PDAs, notebook computers)
because of its small package format and low weight. The
CSPEMI205G is available in a space−saving, low−profile Chip Scale
Package with RoHS compliant lead−free finishing.
Features
• Three Channels of EMI Filtering, Two for Earpiece Speakers and
One for a Microphone
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
•
•
•
•
•
•
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WLCSP8
CASE 567BE
MARKING DIAGRAM
+
AF
AF
= CSPEMI205G
ORDERING INFORMATION
Device
Package
Shipping†
CSPEMI205G
CSP−8
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Network
Chip Scale Package Features Extremely Low Parasitic Inductance
for Optimum Filter Performance
Greater than 30 dB Relative Attenuation in the 800−2700 MHz
Range
±8 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±15 kV ESD Protection on each Channel (HBM)
8−Bump, 1.41 x 1.430 mm Footprint Chip Scale Package (CSP)
These Devices are Pb−Free and are RoHS Compliant
Applications
• EMI Filtering and ESD Protection for Headset Microphone and
•
•
•
•
•
Speaker
Cellular / Mobile Phones
Notebooks and Personal Computers
Handheld PCs / PDAs / Tablets
Wireless Handsets
Digital Camcorders
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 4
1
Publication Order Number:
CSPEMI205G/D
CSPEMI205G
ELECTRICAL SCHEMATIC
Microphone
Input
68 W
A5
100 pF
C3
Earpiece 2
Output
GND
GND
C5
Microphone
Output
47 pF
Earpiece 1
Output
47 pF
100 pF
B2
B4
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Pin
Name
A1
EAR1_IN
Earpiece Input 1 (from audio circuitry)
A3
EAR2_IN
Earpiece Input 2 (from audio circuitry)
A5
MIC_IN
Microphone Input (from microphone)
B2
GND
Device Ground
B4
GND
Device Ground
C1
EAR1_OUT
Earpiece Output 1 (to earpiece)
C3
EAR2_OUT
Earpiece Output 2 (to earpiece)
C5
MIC_OUT
Orientation
Marking
8−bump CSP Package
Description
A
Top View
(Bumps Down View)
+
Bottom View
(Pins Up View)
Orientation
Marking
100 pF
C1
10 W
A3
100 pF
Earpiece 2
Input
10 W
A1
1 2 3 4 5
A5
B2
B4
B
C5
C
A1
A3
C3
A1
Earpiece 1
Input
C1
CSPEMI205
CSP Package
Microphone Output (to audio circuitry)
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
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2
Rating
Units
−40 to +85
°C
CSPEMI205G
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Min
Typ
Max
Units
R1
Resistance
Parameter
Conditions
9
10
11
W
R2
Resistance
54
68
75
W
C1
Capacitance
80
100
120
pF
C2
Capacitance
38
47
57
pF
1.0
mA
ILEAK
Diode Leakage Current
VIN = 5.0 V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Notes 2 and 4)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2, 3 and 4)
fC1
Cut−off frequency 1; (Note 5)
R = 10 W, C = 100 pF
34
MHz
fC2
Cut−off frequency 2; (Note 5)
R = 68 W, C = 47 pF
63
MHz
VCL
5
−15
7
−10
15
−5
V
kV
±15
±8
V
+15
−19
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open.
5. ZSOURCE = 50 W, ZLOAD = 50 W
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Earpiece Circuit (A1−C1) EMI Filter Performance
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3
CSPEMI205G
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 2. Earpiece Circuit (A3−C3) EMI Filter Performance
Figure 3. Microphone Circuit (A5−C5) EMI Filter Performance
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4
CSPEMI205G
APPLICATION INFORMATION
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 4. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 5. Lead−free (SnAgCu) Solder Ball Reflow Profile
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5
CSPEMI205G
PACKAGE DIMENSIONS
WLCSP8, 1.43x1.41
CASE 567BE−01
ISSUE O
D
PIN A1
REFERENCE
2X
A
ÈÈ
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
8X
A1
0.03 C
SEATING
PLANE
A1
PACKAGE
OUTLINE
eD
b
0.05 C A B
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.65
0.56
0.21
0.27
0.40 REF
0.29
0.35
1.43 BSC
1.41 BSC
0.50 BSC
0.435 BSC
eE
C
0.44
B
1
2
8X
0.25
0.50
A
3
0.25
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CSPEMI205G/D
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