CSPEMI205G 3-Channel Headset Microphone EMI Filter with ESD Protection Product Description The CSPEMI205G is a low−pass filter array integrating three pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom−designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30 dB attenuation in the 800−2700 MHz range. These pi−style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI205G provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV. The CSPEMI205G is particularly well−suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI205G is available in a space−saving, low−profile Chip Scale Package with RoHS compliant lead−free finishing. Features • Three Channels of EMI Filtering, Two for Earpiece Speakers and One for a Microphone • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) • • • • • • http://onsemi.com WLCSP8 CASE 567BE MARKING DIAGRAM + AF AF = CSPEMI205G ORDERING INFORMATION Device Package Shipping† CSPEMI205G CSP−8 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Network Chip Scale Package Features Extremely Low Parasitic Inductance for Optimum Filter Performance Greater than 30 dB Relative Attenuation in the 800−2700 MHz Range ±8 kV ESD Protection on each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±15 kV ESD Protection on each Channel (HBM) 8−Bump, 1.41 x 1.430 mm Footprint Chip Scale Package (CSP) These Devices are Pb−Free and are RoHS Compliant Applications • EMI Filtering and ESD Protection for Headset Microphone and • • • • • Speaker Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 4 1 Publication Order Number: CSPEMI205G/D CSPEMI205G ELECTRICAL SCHEMATIC Microphone Input 68 W A5 100 pF C3 Earpiece 2 Output GND GND C5 Microphone Output 47 pF Earpiece 1 Output 47 pF 100 pF B2 B4 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Pin Name A1 EAR1_IN Earpiece Input 1 (from audio circuitry) A3 EAR2_IN Earpiece Input 2 (from audio circuitry) A5 MIC_IN Microphone Input (from microphone) B2 GND Device Ground B4 GND Device Ground C1 EAR1_OUT Earpiece Output 1 (to earpiece) C3 EAR2_OUT Earpiece Output 2 (to earpiece) C5 MIC_OUT Orientation Marking 8−bump CSP Package Description A Top View (Bumps Down View) + Bottom View (Pins Up View) Orientation Marking 100 pF C1 10 W A3 100 pF Earpiece 2 Input 10 W A1 1 2 3 4 5 A5 B2 B4 B C5 C A1 A3 C3 A1 Earpiece 1 Input C1 CSPEMI205 CSP Package Microphone Output (to audio circuitry) SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 2 Rating Units −40 to +85 °C CSPEMI205G Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Min Typ Max Units R1 Resistance Parameter Conditions 9 10 11 W R2 Resistance 54 68 75 W C1 Capacitance 80 100 120 pF C2 Capacitance 38 47 57 pF 1.0 mA ILEAK Diode Leakage Current VIN = 5.0 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Notes 2 and 4) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4) fC1 Cut−off frequency 1; (Note 5) R = 10 W, C = 100 pF 34 MHz fC2 Cut−off frequency 2; (Note 5) R = 68 W, C = 47 pF 63 MHz VCL 5 −15 7 −10 15 −5 V kV ±15 ±8 V +15 −19 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. 4. Unused pins are left open. 5. ZSOURCE = 50 W, ZLOAD = 50 W PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. Earpiece Circuit (A1−C1) EMI Filter Performance http://onsemi.com 3 CSPEMI205G PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 2. Earpiece Circuit (A3−C3) EMI Filter Performance Figure 3. Microphone Circuit (A5−C5) EMI Filter Performance http://onsemi.com 4 CSPEMI205G APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 4. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 5 CSPEMI205G PACKAGE DIMENSIONS WLCSP8, 1.43x1.41 CASE 567BE−01 ISSUE O D PIN A1 REFERENCE 2X A ÈÈ B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 8X A1 0.03 C SEATING PLANE A1 PACKAGE OUTLINE eD b 0.05 C A B C SIDE VIEW MILLIMETERS MIN MAX 0.65 0.56 0.21 0.27 0.40 REF 0.29 0.35 1.43 BSC 1.41 BSC 0.50 BSC 0.435 BSC eE C 0.44 B 1 2 8X 0.25 0.50 A 3 0.25 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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