4 and 8-Channel EMI Filter Arrays with ESD Protection

CM1407
4 and 8-Channel EMI Filter
Arrays with ESD Protection
Product Description
ON Semiconductor CM1407 is an EMI filter array with ESD
protection, which integrates either four or eight pi filters (C−R−C).
The CM1407 has component values of 7.5 pF − 200 W − 7.5 pF
(fC = 210 MHz). The parts include ESD protection diodes on every
pin, providing a very high level of protection for sensitive electronic
components that may be subjected to electrostatic discharge (ESD).
The ESD diodes connected to the filter ports safely dissipate ESD
strikes of ±15 kV contact discharge, twice the specification
requirement of the IEC 61000−4−2, Level 4 international standard.
Using the MIL−STD−883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for contact
discharges at greater than ±30 kV.
This device is particularly well−suited for portable electronics
(e.g. mobile handsets, PDAs, notebook computers) because of its
small package and easy−to−use pin assignments. In particular,
the CM1407 is ideal for EMI filtering and protecting data lines from
ESD in wireless handsets.
The CM1407 is available in space−saving, low−profile, 8 and
16−lead WDFN packages. It is fabricated with ON Semiconductor’s
Centuriont process and available with optional lead−free finishing.
•
•
Four and Eight Channels of EMI Filtering with ESD Protection
Greater than 25 dB of Attenuation from 800 Mhz to 3 GHz
±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
±30 kV ESD Protection (MIL−STD−883, Method 3015, HBM)
Fabricated with Centuriont Advanced Low Capacitance Zener
Process Technology
Space Saving, Low Profile 8 and 16−lead 0.5 mm Pitch WDFN
Packages
These Devices are Pb−Free and are RoHS Compliant
Applications
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
•
WDFN16
DF/DE SUFFIX
CASE 511AU
WDFN8
DF/DE SUFFIX
CASE 511BE
BLOCK DIAGRAM
200 W
FILTERn*
FILTERn*
7.5 pF
C
GND
7.5 pF
C
1 of 4/8 EMI Filtering + ESD Channels
*See Package/Pinout Diagrams for Expanded Pin Information.
Features
•
•
•
•
•
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Computers
EMI Filtering for LCD, Camera and Chip−to−Chip Data Lines
MARKING DIAGRAM
N78X
N07
4X
N07 4X = Specific Device Code
N78X = Specific Device Code
ORDERING INFORMATION
Device
Package
Shipping†
CM1407−04DF
WDFN8
(Pb−Free)
3000/Tape & Reel
CM1407−08DF
WDFN16
(Pb−Free)
3000/Tape & Reel
CM1407−04DE
WDFN8
(Pb−Free)
3000/Tape & Reel
CM1407−08DE
WDFN16
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 3
1
Publication Order Number:
CM1407/D
CM1407
PACKAGE / PINOUT DIAGRAMS
Top View
(Pins Down View)
8
7
6
Bottom View
(Pins Up View)
5
1 2 3 4
CM1407−04DE/DF
8−Lead WDFN Package
GND
PAD
N07
4X
Pin 1
Marking
8 7 6 5
1
2
3
4
16 15 14 13 12 11 10 9
1
CM1407−08DE/DF
16−Lead WDFN Package
with Exposed End Pads
7
8
16 15 14 13 12 11 10
9
N78X
Pin 1
Marking
1
2
3
4
5
2
3
4
5
6
GND PAD
6
7
8
Note: See Ordering Information section for device specific marking.
Table 1. PIN DESCRIPTIONS
Pins
Pins
1406−04Dx
1406−08Dx
Description
1406−04Dx
Name
1406−08Dx
1
1
Name
Description
FILTER1
Filter Channel 1
8
16
FILTER1
Filter Channel 1
2
2
FILTER2
Filter Channel 2
7
15
FILTER2
Filter Channel 2
3
3
FILTER3
Filter Channel 3
6
14
FILTER3
Filter Channel 3
4
4
FILTER4
Filter Channel 4
5
13
FILTER4
Filter Channel 4
5
FILTER5
Filter Channel 5
12
FILTER5
Filter Channel 5
6
FILTER6
Filter Channel 6
11
FILTER6
Filter Channel 6
7
FILTER7
Filter Channel 7
10
FILTER7
Filter Channel 7
8
FILTER8
Filter Channel 8
9
FILTER8
Filter Channel 8
GND
Device Ground
GND Pad
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2
CM1407
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
–65 to +150
°C
DC Power per Resistor
100
mW
Package DC Power Rating
300
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
160
200
240
W
6
7.5
9
pF
R
Resistance
C
Capacitance
At 2.5 V DC, 1 MHz, 30 mV AC
Diode Standoff Voltage
IDIODE = 10 mA
6.0
ILEAK
Diode Leakage Current (Reverse Bias)
VDIODE = 3.3 V
0.1
1
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
−0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per
IEC 61000−4−2 Level 4
VDIODE
(Note 2)
5.6
−1.5
30
15
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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3
Units
V
mA
V
kV
CM1407
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 1. Channel 1 EMI Filter Performance (CM1407−04)
Figure 2. Channel 2 EMI Filter Performance (CM1407−04)
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4
CM1407
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 3. Channel 3 EMI Filter Performance (CM1407−04)
Figure 4. Channel 4 EMI Filter Performance (CM1407−04)
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5
CM1407
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 5. Channel 1 EMI Filter Performance (CM1407−08)
Figure 6. Channel 2 EMI Filter Performance (CM1407−08)
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6
CM1407
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 7. Channel 3 EMI Filter Performance (CM1407−08)
Figure 8. Channel 4 EMI Filter Performance (CM1407−08)
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7
CM1407
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 9. Channel 5 EMI Filter Performance (CM1407−08)
Figure 10. Channel 6 EMI Filter Performance (CM1407−08)
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8
CM1407
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 11. Channel 7 EMI Filter Performance (CM1407−08)
Figure 12. Channel 8 EMI Filter Performance (CM1407−08)
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9
CM1407
PERFORMANCE INFORMATION (Cont’d)
Figure 13. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 V DC and 255C)
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10
CM1407
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE−01
ISSUE O
A
D
PIN ONE
REFERENCE
2X
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.10 C
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
TOP VIEW
ÇÇ
ÉÉ
EXPOSED Cu
DETAIL B
A
0.10 C
A3
A3
MOLD CMPD
A1
DETAIL B
0.08 C
NOTE 4
C
D2
1
8X
4
SEATING
PLANE
L
5
e
BOTTOM VIEW
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.25 REF
0.20
0.40
−−−
0.15
RECOMMENDED
SOLDERING FOOTPRINT*
8X
1.70
PACKAGE
OUTLINE
E2
8
ÉÉ
ÇÇ
ÇÇ
ALTERNATE
CONSTRUCTIONS
A1
SIDE VIEW
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
0.10 C
2X
L
L
B
0.50
b
0.10 C A B
0.05 C
2.30
1.00
NOTE 3
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
CM1407
PACKAGE DIMENSIONS
WDFN16, 4x1.6, 0.5P
CASE 511AU−01
ISSUE O
A B
D
PIN ONE
REFERENCE
2X
ÉÉ
ÉÉ
ÉÉ
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
0.10 C
2X
0.10 C
ÉÉ
ÇÇ
EXPOSED Cu
TOP VIEW
(A3)
DETAIL B
0.10 C
0.08 C
A1
SIDE VIEW
D2
DETAIL A
1
K
F
C
16X
8
16
9
e
e/2
MOLD CMPD
ÉÉÉ
ÇÇÇ
ÇÇÇ
A3
A1
DETAIL B
A
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
SEATING
PLANE
ALTERNATE
CONSTRUCTIONS
DIM
A
A1
A3
b
D
D2
E
E2
e
F
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
4.00 BSC
3.10
3.30
1.60 BSC
0.30
0.50
0.50 BSC
0.25 REF
0.30 REF
0.20
0.40
−−−
0.15
L
E2
RECOMMENDED
SOLDERING FOOTPRINT*
4.30
16X
2X
b
0.10 C A B
0.05 C
0.35
16X
3.30
0.53
NOTE 3
BOTTOM VIEW
1.90
3X
0.50
16X 0.30
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Centurion is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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CM1407/D
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