CM1436 4-, 6- and 8-Channel EMI Filter Arrays with ESD Protection Product Description The CM1436 is an EMI filter array with ESD protection, which integrates either four, six or eight pi filters (C−R−C). Each CM1436 filter has component values of 15 pF − 200 − 15 pF. These parts include ESD protection diodes on every pin, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV contact discharge, twice the specification requirement of the IEC 61000−4−2, Level 4 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1436 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. The CM1436 is available in space−saving, low−profile, 8−lead, 12−lead and 16−lead 0.4 mm pitch WDFN packages. It is fabricated with Centuriont process and available with lead−free finishing. http://onsemi.com WDFN8 DF/DE SUFFIX CASE 511BF WDFN12 DF/DE SUFFIX CASE 511BC WDFN16 DF/DE SUFFIX CASE 511AW BLOCK DIAGRAM 200 FILTERn* 15 pF FILTERn* 15 pF GND 1 of 4/6/8 EMI Filtering + ESD Channels * See Package/Pinout Diagrams for expanded pin information. MARKING DIAGRAM Features • Four, Six and Eight Channels of EMI Filtering with ESD • • • • • • Protection Greater than 30 dB of Attenuation from 800 MHz to 3 GHz ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) ±30 kV ESD Protection (HBM) Fabricated with Centuriont Advanced Low Capacitance Zener Process Technology Space Saving, Low−Profile 8−, 12− and 16−lead 0.4 mm Pitch WDFN Packages These Devices are Pb−Free and are RoHS Compliant 6F/6E N36F/N36E 6F/6E = CM1436−04DF/CM1436−04DE N36F/N36E = CM1436−06DF/CM1436−06DE N368F/N368E = CM1436−08DF/CM1436−08DE ORDERING INFORMATION Device Package Shipping† CM1436−04DF WDFN−8 (Pb−Free) WDFN−8 (Pb−Free) WDFN−12 (Pb−Free) WDFN−12 (Pb−Free) WDFN−16 (Pb−Free) WDFN−16 (Pb−Free) 3000/Tape & Reel CM1436−04DE Applications • I/O Port Protection for Mobile Handsets, Notebook Computers, CM1436−06DF • CM1436−06DE • PDAs, etc. EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers EMI Filtering for LCD, Camera and Chip−to−Chip Data Lines N368F/N368E CM1436−08DF CM1436−08DE 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1436/D CM1436 PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 Bottom View (Pins Up View) 1 2 3 4 6F/6E GND PAD Pin 1 Marking Bottom View (Pins Up View) 1 2 3 4 5 6 N36F/N36E GND PAD Pin 1 Marking 1 2 3 4 5 6 12 11 10 9 8 7 CM1436−06DF/DE 12 Lead WDFN Package 1 2 3 4 8 7 6 5 CM1436−04DF/DE 8 Lead WDFN Package Pin 1 Marking Top View (Pins Down View) 12 11 10 9 8 7 Top View (Pins Down View) 16 15 14 13 12 11 10 9 Bottom View (Pins Up View) 1 2 3 4 5 6 7 8 N368F/N368E GND PAD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CM1436−08DF/DE 16 Lead WDFN Package Table 1. PIN DESCRIPTIONS Pins Pins 1436− 04Dx 1436− 06Dx 1436− 08Dx 1436− 04Dx 1436− 06Dx Name 1436− 08Dx Name 1 1 1 FILTER1 Filter Channel 1 8 12 16 FILTER1 Filter Channel 1 2 2 2 FILTER2 Filter Channel 2 7 11 15 FILTER2 Filter Channel 2 3 3 4 4 3 FILTER3 Filter Channel 3 6 10 14 FILTER3 Filter Channel 3 4 FILTER4 Filter Channel 4 5 9 13 FILTER4 Filter Channel 4 − 5 5 FILTER5 Filter Channel 5 − 8 12 FILTER5 Filter Channel 5 − 6 6 FILTER6 Filter Channel 6 − 7 11 FILTER6 Filter Channel 6 − − 7 FILTER7 Filter Channel 7 − − 10 FILTER7 Filter Channel 7 − − 8 FILTER8 Filter Channel 8 − − 9 FILTER8 Filter Channel 8 GND Device Ground − − − − GND PAD Description Description SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 CM1436 SPECIFICATIONS (Cont’d) Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Parameter Symbol Conditions Min Typ Max Units 160 200 240 12 15 18 pF R Resistance C Capacitance C At 2.5 V DC, 1 MHz, 30 mV AC Diode Stand−off Voltage IDIODE = 10 A 6.0 ILEAK Diode Leakage Current (Reverse Bias) VDIODE = 3.3 V 0.1 1.0 VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −1.5 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 VDIODE fC A1GHz A800Mhz − 6GHz (Note 2) 5.6 −0.4 V A V kV ±30 ±15 Cut−off Frequency ZSOURCE = 50 , ZLOAD = 50 MHz R = 200 C = 15 pF 100 Absolute Attenuation @ 1 GHz from 0 dB Level ZSOURCE = 50 , ZLOAD = 50 , DC Bias = 0 V (Note 1) 35 dB Absolute Attenuation @ 800 MHz to 6 GHz from 0 dB Level ZSOURCE = 50 , ZLOAD = 50 , DC Bias = 0 V (Notes 1 and 3) 30 dB 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Attenuation / RF curves characterized by a network analyzer using microprobes. PERFORMANCE INFORMATION Figure 1. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 V DC and 255C) http://onsemi.com 3 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 2. Channel 1 EMI Filter Performance (CM1436−04 Only) Figure 3. Channel 2 EMI Filter Performance (CM1436−04 Only) http://onsemi.com 4 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 4. Channel 3 EMI Filter Performance (CM1436−04 Only) Figure 5. Channel 4 EMI Filter Performance (CM1436−04 Only) http://onsemi.com 5 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 6. Channel 1 EMI Filter Performance (CM1436−06/08 Only) Figure 7. Channel 2 EMI Filter Performance (CM1436−06/08 Only) http://onsemi.com 6 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 8. Channel 3 EMI Filter Performance (CM1436−06/08 Only) Figure 9. Channel 4 EMI Filter Performance (CM1436−06/08 Only) http://onsemi.com 7 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 10. Channel 5 EMI Filter Performance (CM1436−06/08 Only) Figure 11. Channel 6 EMI Filter Performance (CM1436−06/08 Only) http://onsemi.com 8 CM1436 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 12. Channel 7 EMI Filter Performance (CM1436−08 Only) Figure 13. Channel 8 EMI Filter Performance (CM1436−08 Only) http://onsemi.com 9 CM1436 PACKAGE DIMENSIONS WDFN8, 1.7x1.35, 0.4P CASE 511BF−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÉÉ ÇÇ EXPOSED Cu TOP VIEW (A3) DETAIL B 0.10 C 0.08 C SIDE VIEW DETAIL A D2 1 K 8 A1 C 8X 4 5 e e/2 MOLD CMPD ÉÉÉ ÉÉÉ ÇÇÇ A3 DIM A A1 A3 b D D2 E E2 e K L L1 A1 DETAIL B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L1 ÉÉ ÉÉ 0.10 C 2X L SEATING PLANE ALTERNATE CONSTRUCTIONS MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 1.7 BSC 1.10 1.30 1.35 BSC 0.30 0.50 0.40 BSC 0.22 REF 0.15 0.35 −−− 0.15 L E2 RECOMMENDED SOLDERING FOOTPRINT* 8X b 0.10 C A B 0.05 C 1.30 8X 0.43 NOTE 3 BOTTOM VIEW 1.65 0.50 0.25 8X 0.40 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 CM1436 PACKAGE DIMENSIONS WDFN12, 2.5x1.35, 0.4P CASE 511BC−01 ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C L1 ÉÉ ÉÉ 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS TOP VIEW ÉÉÉ ÇÇÇ EXPOSED Cu (A3) DETAIL B A A1 SIDE VIEW DETAIL A 1 K 12 D2 C 12X 6 7 e e/2 MOLD CMPD ÉÉ ÇÇ ÇÇ DIM A A1 A3 b D D2 E E2 e K L L1 A3 A1 DETAIL B 0.08 C NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D ALTERNATE CONSTRUCTIONS SEATING PLANE L MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 2.50 BSC 1.90 2.10 1.35 BSC 0.30 0.50 0.40 BSC 0.22 REF 0.15 0.35 −−− 0.15 E2 12X RECOMMENDED SOLDERING FOOTPRINT* b 0.10 C A B 0.05 C 2.10 NOTE 3 BOTTOM VIEW 12X 0.44 1.65 0.50 12X 0.25 0.40 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 CM1436 PACKAGE DIMENSIONS WDFN16, 3.3x1.35, 0.4P CASE 511AW−01 ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉ ÉÉ 0.10 C 0.10 C L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÉÉ ÇÇ EXPOSED Cu TOP VIEW (A3) DETAIL B MOLD CMPD A SIDE VIEW DETAIL A D2 1 K 16 A1 C 16X ÇÇÇ ÉÉÉ ALTERNATE CONSTRUCTIONS SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.22 REF 0.15 0.35 −−− 0.15 L 8 9 A3 A1 DETAIL B 0.08 C NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D E2 16X e e/2 RECOMMENDED SOLDERING FOOTPRINT* b 0.10 C A B 0.05 C 16X 2.90 NOTE 3 0.46 BOTTOM VIEW 1.65 0.46 16X 0.25 0.40 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Centurion is a trademark of Semiconductor Components Industries, LCC (SCILCC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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