4-, 6- and 8-Channel LCD and Camera Filter Arrays with ESD Protection

CM1426
LCD and Camera EMI Filter
Array with ESD Protection
Product Description
The CM1426 is a family of pi−style EMI filter arrays with ESD
protection, which integrates four, six and eight filters (C−R−C) in a
Chip Scale Package with 0.50 mm pad pitch. The CM1426 has
component values of 8.5 pF − 100 − 8.5 pF per channel. The
CM1426 has a cut−off frequency of 230 MHz and can be used in
applications where the data rates are as high as 92 Mbps. The parts
include avalanche−type ESD diodes on every pin that provide a very
high level of protection for sensitive electronic components against
possible ESD strikes. The ESD protection diodes safely dissipate ESD
strikes of ±8 kV, well beyond the maximum requirement of the
IEC61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater than ±15 kV.
These devices are particularly well−suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of their
small package and easy−to−use pin assignments. In particular, the
CM1426 is ideal for EMI filtering and protecting data and control lines
for the I/O data ports, LCD display and camera interface in mobile
handsets.
The CM1426 incorporates OptiGuardt which results in improved
reliability at assembly. The CM1426 is available in a space−saving,
low−profile Chip Scale Package with RoHS compliant lead−free
finishing.
Features
• Four, Six and Eight Channels of EMI Filtering with Integrated
ESD Protection
• 0.5 mm Pitch, 10−Bump, 1.96 mm x 1.33 mm Footprint Chip
•
•
•
•
•
•
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WLCSP10
CP SUFFIX
CASE 567BL
WLCSP15
CP SUFFIX
CASE 567BL
WLCSP20
CP SUFFIX
CASE 567BX
MARKING DIAGRAM
N264
N266
N268
CM1426−04
CM1426−06
CM1426−08
N264
N266
N268
= CM1426−04CP
= CM1426−06CP
= CM1426−08CP
ORDERING INFORMATION
Device
Package
Shipping†
CM1426−04CP
CSP−10
(Pb−Free)
3500/Tape & Reel
CM1426−06CP
CSP−15
(Pb−Free)
3500/Tape & Reel
Scale Package (CM1426−04)
CM1426−08CP
CSP−20 3500/Tape & Reel
0.5 mm Pitch, 15−Bump, 2.96 mm x 1.33 mm Footprint Chip
(Pb−Free)
Scale Package (CM1426−06)
†For information on tape and reel specifications,
0.5 mm Pitch, 20−Bump, 3.96 mm x 1.33 mm Footprint Chip
including part orientation and tape sizes, please
Scale Package (CM1426−08)
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
Network
±8 kV ESD Protection on Each Channel
• Greater than 20 dB Attenuation (Typical) at 1 GHz
(IEC 61000−4−2 Level 4, Contact Discharge)
• OptiGuardtCoated for Improved Reliability at
±15 kV ESD Protection on Each Channel (HBM)
Assembly
These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook
• Wireless Handsets
• Handheld PCs/PDAs
• LCD and Camera Modules
Computers, PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computers
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 3
1
Publication Order Number:
CM1426/D
CM1426
BLOCK DIAGRAM
100 FILTER+ESDn*
(Pins A1−An)
8.5 pF
FILTER+ESDn*
(Pins C1−Cn)
8.5 pF
GND
(Pins B1−Bm)
1 of 4, 6 or 8 EMI/RFI + ESD Channels
*See Package/Pinout Diagrams for expanded pin information.
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Orientation
Marking
A
+
1
2
3
Bottom View
(Bumps Up View)
4
C1
N264
B
C3
B1
Orientation
Marking
C
C2
A1
A1
C4
B2
A2
A3
A4
C3
C4
C5
CM1426−04CP
10 Bump CSP Package
Orientation
Marking
A +
1
2
3
4
5
6
C1
N266
B
Orientation
Marking
B1
Orientation
Marking
C
C2
B2
C6
B3
A1
A1
A2
A3
A4
A5
A6
C2
C3
C4
C5
C6
C7
CM1426−06CP
15 Bump CSP Package
+
A
B
C
1
2
3
4
5
6
7
8
C1
N268
Orientation
Marking
CM1426−08CP
20 Bump CSP Package
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2
B1
A1
A1
B2
A2
A3
B3
A4
A5
C8
B4
A6
A7
A8
CM1426
Table 1. PIN DESCRIPTIONS
Pin(s)
Name
Pin(s)
Name
A1
FILTER1
Filter + ESD Channel 1
Description
C1
FILTER1
Filter + ESD Channel 1
Description
A2
FILTER2
Filter + ESD Channel 2
C2
FILTER2
Filter + ESD Channel 2
A3
FILTER3
Filter + ESD Channel 3
C3
FILTER3
Filter + ESD Channel 3
A4
FILTER4
Filter + ESD Channel 4
C4
FILTER4
Filter + ESD Channel 4
A5
FILTER5
Filter + ESD Channel 5
C5
FILTER5
Filter + ESD Channel 5
A6
FILTER6
Filter + ESD Channel 6
C6
FILTER6
Filter + ESD Channel 6
A7
FILTER7
Filter + ESD Channel 7
C7
FILTER7
Filter + ESD Channel 7
A8
FILTER8
Filter + ESD Channel 8
C8
FILTER8
Filter + ESD Channel 8
B1−B4
GND
Device Ground
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R
CTOTAL
Parameter
Conditions
Resistance
Min
Typ
Max
Units
80
100
120
Total Channel Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
13.6
17
20.4
pF
C
Capacitance C1
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
6.8
8.5
10.2
pF
VDIODE
Standoff Voltage
IDIODE = 10 A
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = 3.3 V
0.1
1
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
−0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
RDYN
Dynamic Resistance
Positive
Negative
fC
(Note 2)
5.6
−1.5
R = 100 , C = 17 pF
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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3
A
V
kV
±15
±8
2.3
0.9
Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50 V
230
MHz
CM1426
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)
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4
CM1426
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2)
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5
CM1426
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B3)
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6
CM1426
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 7. Insertion Loss vs. Frequency (A7−C7 to GND B4)
Figure 8. Insertion Loss vs. Frequency (A8−C8 to GND B4)
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7
CM1426
PERFORMANCE INFORMATION (Cont’d)
Typical Diode Capacitance vs. Input Voltage
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 VDC and 255C)
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8
CM1426
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 m
Solder Ball Side Coplanarity
±20 m
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 10. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile
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9
CM1426
PACKAGE DIMENSIONS
WLCSP10, 1.96x1.33
CASE 567BL−01
ISSUE O
PIN A1
REFERENCE
2X
ÈÈ
ÈÈ
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
OptiGuard Option
0.05 C
ÉÉÉÉÉÉ
A2
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05 C
NOTE 3
A1
SIDE VIEW
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.40 REF
0.29
0.35
1.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
C
0.25
SEATING
PLANE
A1
0.25
PACKAGE
OUTLINE
eD
10X
0.05 C A B
0.03 C
0.87
eD/2
b
eE
C
0.44
B
0.50
PITCH
A
1 2 3
4 5 6
10X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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10
CM1426
PACKAGE DIMENSIONS
WLCSP15, 2.96x1.33
CASE 567BS−01
ISSUE O
PIN A1
REFERENCE
2X
D
ÈÈ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD/2
15X
0.05 C A B
0.03 C
PACKAGE
OUTLINE
A1
0.87
eD
b
eE
0.44
C
15X
0.50
PITCH
B
A
1 2 3
4 5 6
MILLIMETERS
MIN
MAX
0.65
0.56
0.21
0.27
0.40 REF
0.29
0.35
2.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
7 8 9
BOTTOM VIEW
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11
CM1426
PACKAGE DIMENSIONS
WLCSP20, 3.96x1.33
CASE 567BX−01
ISSUE O
PIN A1
REFERENCE
2X
D
ÈÈ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
ÉÉÉÉÉÉÉÉÉÉ
OptiGuard Option
0.05 C
A2
MILLIMETERS
MIN
MAX
0.56
0.72
0.21
0.27
0.40 REF
0.29
0.35
3.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
A
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD/2
20X
eD
b
0.05 C A B
0.03 C
eE
C
B
A
1 2 3
4 5 6
7 8 9
10 11 12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.87
0.44
20X
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
OptiGuardt is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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CM1426/D
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