4-Channel EMI Filter Array with ESD Protection

CM1425
4-Channel EMI Filter Array
with ESD Protection
Product Description
The CM1425 is an EMI filter array with ESD protection, which
integrates 4 pi filters (C−R−C). The CM1425 has component values of
20 pF − 100 − 20 pF. The parts include ESD protection diodes on
every pin, which provide a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). The ESD diodes connected to the filter ports safely dissipate
ESD strikes of ±15 kV, well beyond the maximum requirement of the
IEC 61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater than ±30 kV.
This device is particularly well−suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package and easy−to−use pin assignments. In particular, the CM1425
is ideal for EMI filtering and protecting data lines from ESD in
wireless handsets.
All CM1425 devices are optionally available with OptiGuardt
coating which results in improved reliability at assembly. These
devices are also available with standard lead−free finishing. The
CM1425 is housed in a space−saving, low−profile, chip−scale package
and is fabricated with the Centuriont processes.
http://onsemi.com
WLCSP9
CP SUFFIX
CASE 567BF
MARKING DIAGRAM
N251
N253
CM1425−01
9−Bump CSP Package
CM1425−03
9−Bump CSP Package
N251
N253
= CM1425−01CP
= CM1425−03CP
Features
• Four Channels of EMI Filtering with ESD Protection
• Pin Compatible with the CSPRC032A
• Greater than 30 dB Attenuation Over the 800 MHz to 3 GHz
Frequency Range
• ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
• ±30 kV ESD Protection (HBM)
• 9−Bump, 2.470 mm x 0.970 mm Footprint Chip Scale Package
(CSP)
• Available with OptiGuardt Coating for Improved Reliability
• These Devices are Pb−Free and are RoHS Compliant
ORDERING INFORMATION
Device
Package
Shipping†
CM1425−01CP
CSP−9
(Pb−Free)
3500/Tape & Reel
CM1425−03CP
CSP−9
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
• Filtering for Antenna and Keypad Data Lines
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
•
Computers
EMI Filtering for LCD and Chip−to−Chip Data Lines in Mobile
Electronic Devices that Use Flexible PCB Interconnections
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 3
1
Publication Order Number:
CM1425/D
CM1425
BLOCK DIAGRAM
100 FILTER+ESD1
20 pF
20 pF
FILTER
+ESD1
FILTER
+ESD3
20 pF
FILTER
+ESD2
FILTER
+ESD4
100 FILTER+ESD2
20 pF
100 FILTER+ESD3
20 pF
20 pF
100 FILTER+ESD4
20 pF
20 pF
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
+
1
2
3
4
Orientation
Marking
5
A1
Orientation
Marking
(see Note)
Bottom View
(Bumps Up View)
A
N251
B
A5
A4
B5
B4
B3
A2
A1
B2
B1
CM1425−01
CSP Package (No Coating)
+
1
2
3
4
Orientation
Marking
5
A1
Orientation
Marking
(see Note)
A
N253
B
A5
A4
B5
B4
B3
A2
A1
B2
B1
CM1425−03
CSP Package (OptiGuardt coating)
Note: Lead−free devices are specified by using a “+” character for the top side orientation mark.
Table 1. PIN DESCRIPTIONS
Pins
Name
A1
FILTER+ESD1
A2
A4
Description
Pins
Name
Filter Channel 1
B1
FILTER+ESD1
Filter Channel 1
FILTER+ESD2
Filter Channel 2
B2
FILTER+ESD2
Filter Channel 2
FILTER+ESD3
Filter Channel 3
B4
FILTER+ESD3
Filter Channel 3
A5
FILTER+ESD4
Filter Channel 4
B5
FILTER+ESD4
Filter Channel 4
B3
GND
Device Ground
http://onsemi.com
2
Description
CM1425
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
R
Resistance
C
Capacitance
At 2.5 V DC, 1 MHz,
30 mV AC
VDIODE
Min
Typ
Max
80
100
120
16
20
24
pF
nA
Diode Standoff Voltage
IDIODE = 10 A
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = +3.3 V
100
300
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
−0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
RDYN
Dynamic Resistance
Positive
Negative
fC
(Note 2)
5.6
−1.5
R = 100 , C = 20 pF
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
http://onsemi.com
3
V
V
kV
±30
±15
1.5
0.9
Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50 Units
86
MHz
CM1425
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 VDC and 255C)
http://onsemi.com
4
CM1425
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 m
Solder Ball Side Coplanarity
±20 m
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
5
CM1425
PACKAGE DIMENSIONS
WLCSP9, 2.47x0.97
CASE 567BF−01
ISSUE O
ÈÈ
ÈÈ
PIN A1
REFERENCE
2X
0.05 C
2X
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
A B
D
E
DIM
A
A1
A2
b
D
E
e
TOP VIEW
ÉÉÉÉÉÉ
OptiGuard Option
0.05 C
A2
RECOMMENDED
SOLDERING FOOTPRINT*
A
A1
0.05 C
NOTE 3
9X
0.03 C
C
SIDE VIEW
A1
e
b
0.05 C A B
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.42 REF
0.29
0.35
2.47 BSC
0.97 BSC
0.50 BSC
PACKAGE
OUTLINE
SEATING
PLANE
9X
0.50
e
0.50
PITCH
B
0.25
DIMENSIONS: MILLIMETERS
A
1
2
3
4
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
5
BOTTOM VIEW
OptiGuardt and Centuriont are trademarks of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1425/D
Similar pages