CM1425 4-Channel EMI Filter Array with ESD Protection Product Description The CM1425 is an EMI filter array with ESD protection, which integrates 4 pi filters (C−R−C). The CM1425 has component values of 20 pF − 100 − 20 pF. The parts include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1425 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. All CM1425 devices are optionally available with OptiGuardt coating which results in improved reliability at assembly. These devices are also available with standard lead−free finishing. The CM1425 is housed in a space−saving, low−profile, chip−scale package and is fabricated with the Centuriont processes. http://onsemi.com WLCSP9 CP SUFFIX CASE 567BF MARKING DIAGRAM N251 N253 CM1425−01 9−Bump CSP Package CM1425−03 9−Bump CSP Package N251 N253 = CM1425−01CP = CM1425−03CP Features • Four Channels of EMI Filtering with ESD Protection • Pin Compatible with the CSPRC032A • Greater than 30 dB Attenuation Over the 800 MHz to 3 GHz Frequency Range • ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) • ±30 kV ESD Protection (HBM) • 9−Bump, 2.470 mm x 0.970 mm Footprint Chip Scale Package (CSP) • Available with OptiGuardt Coating for Improved Reliability • These Devices are Pb−Free and are RoHS Compliant ORDERING INFORMATION Device Package Shipping† CM1425−01CP CSP−9 (Pb−Free) 3500/Tape & Reel CM1425−03CP CSP−9 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Applications • Filtering for Antenna and Keypad Data Lines • I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook • Computers EMI Filtering for LCD and Chip−to−Chip Data Lines in Mobile Electronic Devices that Use Flexible PCB Interconnections © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1425/D CM1425 BLOCK DIAGRAM 100 FILTER+ESD1 20 pF 20 pF FILTER +ESD1 FILTER +ESD3 20 pF FILTER +ESD2 FILTER +ESD4 100 FILTER+ESD2 20 pF 100 FILTER+ESD3 20 pF 20 pF 100 FILTER+ESD4 20 pF 20 pF PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) + 1 2 3 4 Orientation Marking 5 A1 Orientation Marking (see Note) Bottom View (Bumps Up View) A N251 B A5 A4 B5 B4 B3 A2 A1 B2 B1 CM1425−01 CSP Package (No Coating) + 1 2 3 4 Orientation Marking 5 A1 Orientation Marking (see Note) A N253 B A5 A4 B5 B4 B3 A2 A1 B2 B1 CM1425−03 CSP Package (OptiGuardt coating) Note: Lead−free devices are specified by using a “+” character for the top side orientation mark. Table 1. PIN DESCRIPTIONS Pins Name A1 FILTER+ESD1 A2 A4 Description Pins Name Filter Channel 1 B1 FILTER+ESD1 Filter Channel 1 FILTER+ESD2 Filter Channel 2 B2 FILTER+ESD2 Filter Channel 2 FILTER+ESD3 Filter Channel 3 B4 FILTER+ESD3 Filter Channel 3 A5 FILTER+ESD4 Filter Channel 4 B5 FILTER+ESD4 Filter Channel 4 B3 GND Device Ground http://onsemi.com 2 Description CM1425 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions R Resistance C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC VDIODE Min Typ Max 80 100 120 16 20 24 pF nA Diode Standoff Voltage IDIODE = 10 A 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = +3.3 V 100 300 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 RDYN Dynamic Resistance Positive Negative fC (Note 2) 5.6 −1.5 R = 100 , C = 20 pF 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 3 V V kV ±30 ±15 1.5 0.9 Cut−off Frequency ZSOURCE = 50 , ZLOAD = 50 Units 86 MHz CM1425 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. CM1425 Filter Typical Measured Frequency Response Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) http://onsemi.com 4 CM1425 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 m Solder Ball Side Coplanarity ±20 m Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 3. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 5 CM1425 PACKAGE DIMENSIONS WLCSP9, 2.47x0.97 CASE 567BF−01 ISSUE O ÈÈ ÈÈ PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. A B D E DIM A A1 A2 b D E e TOP VIEW ÉÉÉÉÉÉ OptiGuard Option 0.05 C A2 RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 9X 0.03 C C SIDE VIEW A1 e b 0.05 C A B MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.42 REF 0.29 0.35 2.47 BSC 0.97 BSC 0.50 BSC PACKAGE OUTLINE SEATING PLANE 9X 0.50 e 0.50 PITCH B 0.25 DIMENSIONS: MILLIMETERS A 1 2 3 4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW OptiGuardt and Centuriont are trademarks of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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