4-Channel Headset EMI Filter Array with ESD Protection

CM1410
4-Channel Headset EMI
Filter Array with ESD
Protection
Product Description
The CM1410 is a quad low−pass filter array integrating four
pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the
same time providing ESD protection. This device is custom−designed
to interface with the headset port on a cellular telephone, and contains
three different filter values. Each high quality filter provides more than
20 dB attenuation in the 800−2700 MHz range. These pi−style filters
support bidirectional filtering, controlling EMI both to and from the
microphone and speaker elements. They also support bipolar signals,
enabling audio signals to pass through without distortion.
In addition, the CM1410 provides a very high level of protection for
sensitive electronic components that may be subject to electrostatic
discharge (ESD). The CM1410 can safely dissipate ESD strikes of
±8 kV, the maximum requirement of the IEC 61000−4−2 international
standard. Using the MIL−STD−883 (Method 3015) specification for
Human Body Model (HBM) ESD, the device provides protection for
contact discharges to greater than ±15 kV. The CM1410 also includes
a single channel of ESD−only protection.
The CM1410 is particularly well suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package format and low weight.
The CM1410 incorporates OptiGuardt coating which results in
improved reliability at assembly. The CM1410 is available in a
space−saving, low−profile Chip Scale Package with RoHS−compliant
lead−free finishing.
Features
• Functionally and Pin Compatible with CSPEMI200A Device
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
•
•
•
•
•
•
•
Network
Four Channels of EMI Filtering with ESD Protection
Includes One Channel of ESD−Only Protection
Greater than 30 dB Attenuation at 1 GHz
±8 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±15 kV ESD Protection on Each Channel (HBM)
Supports Bipolar Signals − Ideal for Audio
Applications
These Devices are Pb−Free and are RoHS Compliant
March, 2011 − Rev. 3
MARKING DIAGRAM
N103 MG
G
N103
= CM1410−03CP
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
CM1410−03CP
CSP−11
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Inductance for Optimum Filter and ESD Performance
• 11−Bump, 2.046 mm X 1.436 mm Footprint Chip Scale
•
Package (CSP)
OptiGuardt Coated for Improved Reliability at
Assembly
• Digital Camcorders
• Notebooks
• Desktop PCs
EMI Filtering and ESD Protection for Audio Ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
© Semiconductor Components Industries, LLC, 2011
WLCSP11
CP SUFFIX
CASE 567BN
• Chip Scale Package Features Extremely Low Lead
Applications
•
•
•
•
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Publication Order Number:
CM1410/D
CM1410
BLOCK DIAGRAM
MC_IN1
47 pF
47 pF
68 W
C2
10 W
C3
SPKR_IN2
MC_OUT2
47 pF
10 W
C4
SPKR_OUT1
A4
B3
SPKR_OUT2
B2
B4
Top View
(Bumps Down View)
11−bump CSP Package
Pin
Name
A1
N.B.
Orientation
Marking
Description
No Bump − used for orientation
/ alignment
A2
MIC_IN2
A3
SPKR_OUT1
Speaker Output 1 (to speaker)
A4
SPKR_OUT2
Speaker Output 2 (to speaker)
B1
MIC_IN1
Microphone Input 1 (from microphone)
B2
ESD1
ESD Protection Input.
Provides a channel specifically for ESD
protection purposes.
B3
GND
Device Ground
Device Ground
A
Microphone Input 2 (from microphone)
1
B4
GND
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C2
MIC_OUT2
Microphone Output 1 (to audio circuitry)
C3
SPKR_IN1
Speaker Input 1 (from audio circuitry)
2
3
4
A1
N103
B
C1
SPKR_IN2
ESD1
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
C4
A3
100 pF
GND
SPKR_IN1
100 pF
47 pF
GND
MC_OUT1
100 pF
A2
C1
100 pF
MC_IN2
100 W
B1
C
Bottom View
(Bumps Up View)
C1
C2
C3
C4
B1
B2
B3
B4
A2
A3
A4
Orientation
Marking
Speaker Input 2 (from audio circuitry)
A1
CM1410
CSP Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
–65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
400
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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CM1410
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Min
Typ
Max
Units
R1
Resistance 1
Parameter
Conditions
90
100
110
W
R2
Resistance 2
61
68
75
W
R3
Resistance 3
9
10
11
W
C1
Capacitance 1
38
47
57
pF
C2
Capacitance 2
80
100
120
pF
1.0
mA
ILEAK
Diode Leakage Current
VIN = 5.0 V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Notes 2 and 4)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2, 3 and 4)
fC1
Cut−off Frequency 1
(Note 5)
R = 100 W, C = 47 pF
53
MHz
fC2
Cut−off Frequency 2
(Note 5)
R = 68 W, C = 47 pF
61
MHz
fC3
Cut−off Frequency 3
(Note 5)
R = 10 W, C = 100 pF
33
MHz
VCL
5
−15
7
–10
15
−5
V
kV
±15
±8
V
+15
–19
1. TA = 25°C unless otherwise specified.
2. ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open
5. ZSOURCE = 50 W, ZLOAD = 50 W
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CM1410
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1−C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2−C2) EMI Filter Performance
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CM1410
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3−C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4−C4) EMI Filter Performance
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CM1410
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 5. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile
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CM1410
PACKAGE DIMENSIONS
WLCSP11, 2.05x1.44
CASE 567BN−01
ISSUE O
2X
D
È
PIN A1
REFERENCE
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
e
0.05 C
2X
0.05 C
TOP VIEW
ÉÉÉÉÉ
OptiGuard Option
0.05 C
A2
RECOMMENDED
SOLDERING FOOTPRINT*
A
A1
0.05 C
NOTE 3
C
SIDE VIEW
A1
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.42 REF
0.29
0.35
2.05 BSC
1.44 BSC
0.50 BSC
SEATING
PLANE
PACKAGE
OUTLINE
e
11X
0.05 C A B
0.03 C
e/2
b
e
C
0.50
PITCH
B
11X
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
A
1
2
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
4
BOTTOM VIEW
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1410/D
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