4-Channel LCD and Camera EMI Filter Array with ESD Protection

CM1408-04DE
4-Channel LCD and Camera
EMI Filter Array with ESD
Protection
Features
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• Four Channels of EMI Filtering with Integrated ESD Protection
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
•
•
•
•
•
•
Network
±15 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±30 kV ESD Protection on Each Channel (HBM)
Greater than −35 dB Attenuation (Typical) at 1 GHz
WDFN Packaging with 0.5 mm Lead Pitch:
• 8−Lead WDFN, 2.0 mm x 2.0 mm
Increased Robustness Against Vertical Impacts During
Manufacturing Process
These Devices are Pb−Free and are RoHS Compliant
1
WDFN8
DE SUFFIX
CASE 511BE
MARKING DIAGRAM
N08 4E
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
•
•
•
•
PDAs, etc.
EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
N08 4E = CM1408−04DE
ORDERING INFORMATION
Device
Package
Shipping†
CM1408−04DE
WDFN−8
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
BLOCK DIAGRAM
100 W
FILTER+ESDn*
Pins 1 − 4
GND
PAD
R
C
8.5 pF
8.5 pF
FILTER+ESDn*
Pins 5 − 8
C
1 of 4 EMI / RFI + ESD Channels
*See Package/Pinout Diagrams for expanded pin information.
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 3
1
Publication Order Number:
CM1408−04DE/D
CM1408−04DE
PACKAGE / PINOUT DIAGRAMS
Pin 1
Marking
Top View
(Pins Down View)
Bottom View
(Pins Up View)
8 7 6 5
1 2 3 4
N08
4E
GND
PAD
1 2 3 4
8 7 6 5
8 Lead WDFN Package
Table 1. PIN DESCRIPTIONS
Device Pin(s)
Name
1
FILTER1
2
Description
Device Pin(s)
Name
Description
Filter + ESD Channel 1
8
FILTER1
Filter + ESD Channel 1
FILTER2
Filter + ESD Channel 2
7
FILTER2
Filter + ESD Channel 2
3
FILTER3
Filter + ESD Channel 3
6
FILTER3
Filter + ESD Channel 3
4
FILTER4
Filter + ESD Channel 4
5
FILTER4
Filter + ESD Channel 4
GND PAD
GND
Device Ground
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
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2
Rating
Units
−40 to +85
°C
CM1408−04DE
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R
CTOTAL
Parameter
Conditions
Resistance
Min
Typ
Max
Units
80
100
120
W
14
17
22
pF
Total Channel Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
Capacitance C
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
8.5
pF
Standoff Voltage
IDIODE = 10 mA
6.0
V
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = 3.3 V
0.1
1.0
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
−0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
RDYN
Dynamic Resistance
Positive
Negative
C
VDIODE
fC
(Notes 2 and 3)
5.6
−1.5
Channel R = 100 W,
Channel CSINGLE = 8.5 pF
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. These parameters are guaranteed by design and characterization.
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3
V
kV
30
15
2.3
0.9
Cut−off Frequency
ZSOURCE = 50 W, ZLOAD = 50 W
mA
200
W
MHz
CM1408−04DE
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND)
Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND)
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4
CM1408−04DE
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND)
Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND)
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5
CM1408−04DE
PERFORMANCE INFORMATION (Cont’d)
Typical Diode Capacitance vs. Input Voltage
Figure 5. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5 VDC and 255C)
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6
CM1408−04DE
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE−01
ISSUE O
A
D
PIN ONE
REFERENCE
2X
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
0.10 C
2X
L
L
B
TOP VIEW
ÇÇ
ÉÉ
ÉÉ
EXPOSED Cu
DETAIL B
A
0.10 C
A3
A3
MOLD CMPD
A1
ÇÇ
ÉÉ
DETAIL B
0.08 C
NOTE 4
ALTERNATE
CONSTRUCTIONS
A1
SIDE VIEW
C
D2
DETAIL A
1
8X
4
SEATING
PLANE
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.25 REF
0.20
0.40
−−−
0.15
RECOMMENDED
SOLDERING FOOTPRINT*
L
8X
1.70
PACKAGE
OUTLINE
0.50
E2
8
5
e
BOTTOM VIEW
8X
b
2.30
1.00
0.10 C A B
0.05 C
NOTE 3
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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7
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1408−04DE/D
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