6 Line EMI Filter with ESD Protection in UDFN Package

NUF6005MU
6-Channel EMI Filter with
Integrated ESD Protection
The NUF6005MU is a six−channel (C−R−C) Pi−style EMI filter
array with integrated ESD protection. Its typical component values of
R = 100 and C = 10 pF deliver a cutoff frequency of 185 MHz and
stop band attenuation greater than −25 dB from 800 MHz to 3.0 GHz.
This performance makes the part ideal for parallel interfaces with
data rates up to 123 Mbps in applications where wireless interference
must be minimized. The specified attenuation range is very effective
in minimizing interference from 2G/3G, GPS, Bluetooth® and
WLAN signals.
The NUF6005MU is available in the low−profile 12−lead
1.2x2.5mm UDFN12 surface mount package.
Features/Benefits
• ±8.0 kV ESD Protection on each channel (IEC61000−4−2 Level 4,
Contact Discharge)
• R/C Values of 100 and 10 pF deliver Exceptional S21 Performance
•
•
Characteristics of 185 MHz f3dB and −25 dB Stop Band Attenuation
from 800 MHz to 3.0 GHz
Integrated EMI/ESD System Solution in UDFN Package Offers
Exceptional Cost, System Reliability and Space Savings
This is a Pb−Free Device
Applications
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MARKING
DIAGRAM
12
1
605MG
G
UDFN12
MU SUFFIX
CASE 517AE
1
605
= Specific Device Code
= Date and Assembly Location
M
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF6005MUT2G
UDFN12
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
• EMI Filtering for LCD and Camera Data Lines
• EMI Filtering and Protection for I/O Ports and Keypads
0
−5
−10
Cd = 10 pF Cd = 10 pF
Filter + ESDn
S21 (dB)
−15
R=100 Filter + ESDn
−20
−25
−30
−35
See Table 1 for pin description
−40
−45
1.0E+6
1.0E+7
1.0E+8
1.0E+9
1.0E+10
FREQUENCY (Hz)
Figure 1. Electrical Schematic
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 4
Figure 2. Typical Insertion Loss Curve
1
Publication Order Number:
NUF6005MU/D
NUF6005MU
1
2
3
4
5
6
GND PAD
12 11 10 9 8 7
(Bottom View)
Figure 3. Pin Diagram
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter
Device Pins
Description
Filter 1
1 & 12
Filter + ESD Channel 1
Filter 2
2 & 11
Filter + ESD Channel 2
Filter 3
3 & 10
Filter + ESD Channel 3
Filter 4
4&9
Filter + ESD Channel 4
Filter 5
5&8
Filter + ESD Channel 5
Filter 6
6&7
Filter + ESD Channel 6
Ground Pad
GND
Ground
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Value
Unit
VPP
8.0
kV
DC Power per Resistor
PR
100
mW
DC Power per Package
PT
600
mW
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Parameter
ESD Discharge IEC61000−4−2
Contact Discharge
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
Max
Unit
5.0
V
7.0
8.0
V
10
100
nA
100
115
VRWM
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.3 V
Resistance
RA
IR = 20 mA
Diode Capacitance
Cd
VR = 2.5 V, f = 1.0 MHz
10
15
pF
Line Capacitance
CL
VR = 2.5 V, f = 1.0 MHz
20
30
pF
3 dB Cut−Off Frequency (Note 1)
f3dB
Above this frequency,
appreciable attenuation occurs
185
MHz
6 dB Cut−Off Frequency (Note 1)
f6dB
Above this frequency,
appreciable attenuation occurs
205
MHz
1. 50 source and 50 load termination.
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2
6.0
85
NUF6005MU
0
0
−5
−10
−10
−20
S41 (dB)
S21 (dB)
−15
−20
−25
−30
−30
−40
−50
−35
−60
−40
−70
−45
1.0E+6
−80
1.0E+7
1.0E+8
1.0E+9
1.0E+10
10E+6
100E+6
Figure 4. Typical Insertion Loss
1.05
NORMALIZED RESISTANCE
NORMALIZED CAPACITANCE
10E+9
Figure 5. Typical Analog Crosstalk
2
1.5
1
0.5
0
1.0E+9
FREQUENCY (Hz)
FREQUENCY (Hz)
0
1
2
3
4
1.025
1.0
0.975
0.95
−40
5
−20
0
20
40
60
TEMPERATURE (°C)
REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
Figure 7. Typical Resistance over Temperature
(Normalized)
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80
NUF6005MU
Theory of Operation
approximation of a square wave, shown below in Equations
1 and 2 in the Fourier series approximation.
From this it can be seen that a square wave consists of odd
order harmonics and to fully construct a square wave n must
go to infinity. However, to retain an acceptable portion of the
waveform, the first two terms are generally sufficient. These
two terms contain about 85% of the signal amplitude and
allow a reasonable square wave to be reconstructed.
Therefore, to reasonably pass a square wave of frequency x
the minimum filter bandwidth necessary is 3x. All ON
Semiconductor EMI filters are rated according to this
principle. Attempting to violate this principle will result in
significant rounding of the waveform and cause problems in
transmitting the correct data. For example, take the filter
with the response shown in Figure 8 and apply three
different data waveforms. To calculate these three different
frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be
used.
The NUF6005MU combines ESD protection and EMI
filtering conveniently into a small package for today’s size
constrained applications. The capacitance inherent to a
typical protection diode is utilized to provide the
capacitance value necessary to create the desired frequency
response based upon the series resistance in the filter. By
combining this functionality into one device, a large number
of discrete components are integrated into one small
package saving valuable board space and reducing BOM
count and cost in the application.
Application Example
The accepted practice for specifying bandwidth in a filter
is to use the 3 dB cutoff frequency. Utilizing points such as
the 6 dB or 9 dB cutoff frequencies results in signal
degradation in an application. This can be illustrated in an
application example. A typical application would include
EMI filtering of data lines in a camera or display interface.
In such an example it is important to first understand the
signal and its spectral content. By understanding these
things, an appropriate filter can be selected for the desired
application. A typical data signal is pattern of 1’s and 0’s
transmitted over a line in a form similar to a square wave.
The maximum frequency of such a signal would be the
pattern 1-0-1-0 such that for a signal with a data rate of
100 Mbps, the maximum frequency component would be
50 MHz. The next item to consider is the spectral content of
the signal, which can be understood with the Fourier series
Equation 1:
a
1 sin((2n * 1) t)
x(t) + 1 ) 2
0
2 n + 1 2n * 1
ƪ
ƫ
(eq. 1)
Equation 2 (simplified form of Equation 1):
ƪ
ƫ
sin( 0t) sin(3 0t) sin(5 0t)
)
)
) AAA (eq. 2)
x(t) + 1 ) 2
1
3
5
2 −3 dB
−6 dB
Magnitude (dB)
−9 dB
f1
f2
100k
1M
f3
100M
10M
1G
10G
Frequency (Hz)
Figure 8. Filter Bandwidth
From the above paragraphs it is shown that the maximum
supported frequency of a waveform that can be passed
through the filter can be found by dividing the bandwidth by
a factor of three (to obtain the corresponding data rate
multiply the result by two). The following table gives the
bandwidth values and the corresponding maximum
supported frequencies and the third harmonic frequencies.
Table 2. Frequency Chart
Bandwidth
Maximum Supported
Frequency
Third Harmonic
Frequency
3 dB–100 MHz
33.33 MHz (f1)
100 MHz
6 dB–200 MHz
66.67 MHz (f2)
200 MHz
9 dB–300 MHz
100 MHz (f3)
300 MHz
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4
NUF6005MU
further and results in even more rounding of the signal edges
as is shown in Figure 9c. The result is the degradation of the
data being transmitted making the digital data (1’s and 0’s)
more difficult to discern. This does not include effects of
other components such as interconnect and other path losses
which could further serve to degrade the signal integrity.
While some filter products may specify the 6 dB or 9 dB
bandwidths, actually using these to calculate supported
frequencies (and corresponding data rates) results in
significant signal degradation. To ensure the best signal
integrity possible, it is best to use the 3 dB bandwidth to
calculate the achievable data rate.
Considering that 85% of the amplitude of the square is in
the first two terms of the Fourier series approximation most
of the signal content is at the fundamental (maximum
supported) frequency and the third harmonic frequency. If a
signal with a frequency of 33.33 MHz is input to this filter,
the first two terms are sufficiently passed such that the signal
is only mildly affected, as is shown in Figure 9a. If a signal
with a frequency of 66.67 MHz is input to this same filter,
the third harmonic term is significantly attenuated. This
serves to round the signal edges and skew the waveform, as
is shown in Figure 9b. In the case that a 100 MHz signal is
input to this filter, the third harmonic term is attenuated even
Input Waveform
Output Waveform
a) Frequency = f1
Input Waveform
Output Waveform
b) Frequency = f2
Input Waveform
c) Frequency = f3
Output Waveform
Figure 9. Input and Output Waveforms of Filter
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NUF6005MU
PACKAGE DIMENSIONS
UDFN12, 2.5x1.2, 0.4P
CASE 517AE−01
ISSUE B
A
B
D
2X
0.15 C
PIN ONE
REFERENCE
2X
ÉÉÉ
ÉÉÉ
E
A1
ÉÉ
ÉÉ
ÇÇ
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL A
0.15 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
(A3)
DETAIL A
A
0.10 C
12X
SEATING
PLANE
0.08 C
SIDE VIEW
D2
12X
SOLDERING FOOTPRINT*
10X
e
L
12X
C
A1
K
1
6
12
7
MILLIMETERS
MIN
NOM MAX
0.45
0.50
0.55
0.00
0.03
0.05
0.127 REF
0.15
0.20
0.25
2.50 BSC
1.70
1.80
1.90
1.20 BSC
0.20
0.30
0.40
0.40 BSC
0.20
−−−
−−−
0.20
0.25
0.30
1.50
E2
12X
BOTTOM VIEW
0.35
0.40
b
0.10 C A B
0.05 C
NOTE 3
11X
0.25
12 X
0.45
1.90
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NUF6005MU/D
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