6- and 8-Channel LCD & Camera EMI Filter Arrays with ESD Protection

LCD and Camera EMI Filter Array
with ESD Protection
CM1450
Features
Product Description
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•
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The CM1450 comprises a family of inductor-capacitor
(L-C) based EMI filter arrays with integrated ESD
protection in a CSP form factor. The CM1450-06 and
CM1450-08 are configured in 6 and 8 channel
formats respectively. Each EMI filter channel of the
CM1450 is implemented as a 5-pole L-C filter where
the component values are 14pF-17nH-14pF-17nF14pF. The CM1450's roll-off frequency at -10dB
attenuation is 400MHz and can be used in
applications where the data rates are as high as
160Mbps while providing greater than 35dB over the
800MHz to 2.7GHz frequency range. The parts
integrate ESD protection diodes on every pin, which
provide a very high level of protection for sensitive
electronic components that may be subjected to
electrostatic discharge (ESD). The ESD protection
diodes connected to the filter ports safely dissipate
ESD strikes of ±15kV, exceeding the Level 4
requirement of the IEC61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater
than ±30kV.
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•
•
•
•
•
•
•
•
High bandwidth, high RF rejection filter array
Six and eight channels of EMI filtering
Utilizes Praetorian® inductor-based design
technology for true L-C filter implementation
OptiGuard™ coating for improved reliability
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Better than 40dB of attenuation at 1GHz
Maintains signal integrity for signals that have a
risetime and falltime as fast as 2ns
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 3.006mm x 1.376mm footprint
Chip Scale Package (CM1450-06CS/CP)
20-bump, 4.006mm x 1.376mm footprint
Chip Scale Package (CM1450-08CS/CP)
RoHS-compliant, lead-free finishing
Applications
•
•
•
•
•
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LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data phones in cell phones,
PDAs or notebook computers
Wireless handsets / cell phones
Handheld PCs/PDAs
LCD and camera modules
This device is particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs) because
of its small package format and easy-to-use pin
assignments. In particular, the CM1450 is ideal for
EMI filtering and protecting data and control lines for
the LCD display and camera interface in wireless
handsets while maintaining the integrity of signals
that have rise/fall times as fast as 2ns.
The CM1450 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1450 is
available in a space-saving, low-profile Chip Scale
Package with lead-free finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1450/D
CM1450
Rev. 2 | Page 2 of 16 | www.onsemi.com
CM1450
PIN DESCRIPTIONS
CM1450-06
CM1450-08
CM1450-06
CM1450-08
PIN(s)
PIN(s)
NAME
DESCRIPTION
PIN(s)
PIN(s)
NAME
DESCRIPTION
A1
A1
FILTER1
Filter Channel 1
C1
C1
FILTER1
Filter Channel 1
A2
A2
FILTER2
Filter Channel 2
C2
C2
FILTER2
Filter Channel 2
A3
A3
FILTER3
Filter Channel 3
C3
C3
FILTER3
Filter Channel 3
A4
A4
FILTER4
Filter Channel 4
C4
C4
FILTER4
Filter Channel 4
A5
A5
FILTER5
Filter Channel 5
C5
C5
FILTER5
Filter Channel 5
A6
A6
FILTER6
Filter Channel 6
C6
C6
FILTER6
Filter Channel 6
-
A7
FILTER7
Filter Channel 7
-
C7
FILTER7
Filter Channel 7
-
A8
FILTER8
Filter Channel 8
-
C8
FILTER8
Filter Channel 8
B1-B3
B1-B4
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
15
CSP
CM1450-06CS
N506
CM1450-06CP
N506
20
CSP
CM1450-08CS
N508
CM1450-08CP
N508
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Rev. 2 | Page 3 of 16 | www.onsemi.com
CM1450
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
Current per Inductor
30
mA
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 2 | Page 4 of 16 | www.onsemi.com
CM1450
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
LTOT
L1, L2
RDC IN-OUT
CTOT
C1, C2, C3
f
f
C
RO
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Total Channel Inductance (L1 + L2)
34
nH
Inductance
17
nH
DC Channel Resistance
18
Ω
Total Channel Capacitance (C1+ C2 + C3 )
At 2.5V DC, 1MHz,
30mV AC, Note 3
33.6
42
50.4
pF
Capacitance
At 2.5V DC, 1MHz,
30mV AC, Note 3
11.2
14
16.8
pF
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
137
MHz
Roll-off Frequency at -10dB Attenuation
ZSOURCE=50Ω, ZLOAD=50Ω
400
MHz
V
Diode Standoff Voltage
IDIODE=10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=+3.3V
0.1
1.0
μA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
6.8
-0.8
9.0
-0.4
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 2
VDIODE
VESD
RDYN
5.6
-1.5
Dynamic Resistance
Positive
Negative
±30
kV
±15
kV
2.30
0.90
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 2 | Page 5 of 16 | www.onsemi.com
Ω
Ω
CM1450
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Rev. 2 | Page 6 of 16 | www.onsemi.com
CM1450
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. 2 | Page 7 of 16 | www.onsemi.com
CM1450
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
Rev. 2 | Page 8 of 16 | www.onsemi.com
CM1450
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4)
Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4)
Rev. 2 | Page 9 of 16 | www.onsemi.com
CM1450
[pF]
Performance Information (cont’d)
D.C.Vo ltage
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Transient Response Characteristics
Figure 10. Simulated Transient Response
(input signal risetime and falltime= 2ns, clocked at 25, 50 and 75 MHz,
15Ω Source Resistance, 5pF Load)
Rev. 2 | Page 10 of 16 | www.onsemi.com
CM1450
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 11 of 16 | www.onsemi.com
260°C
CM1450
Mechanical Details
CM1450-06 CSP Mechanical Specifications
The CM1450-06CS/CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
For complete information, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
2.961 3.006 3.051 0.1166 0.1183 0.1201
A2
1.331 1.376 1.421 0.0524 0.0542 0.0559
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.203 0.253 0.303 0.0080 0.0100 0.0119
C2
0.203 0.253 0.303 0.0080 0.0100 0.0119
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1450-06CS/CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 12 of 16 | www.onsemi.com
CM1450
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1450-06
3.006 X 1.376 X
0.644
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm
4mm
Figure 14. Tape and Reel Mechanical Data
Rev. 2 | Page 13 of 16 | www.onsemi.com
CM1450
Mechanical Details (cont’d)
CM1450-08 Mechanical Specifications
The package dimensions for the CM1450-08CS/CP are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
3.961 4.006 4.051 0.1559 0.1577 0.1595
A2
1.331 1.376 1.421 0.0524 0.0542 0.0559
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.203 0.253 0.303 0.0080 0.0100 0.0119
C2
0.203 0.253 0.303 0.0080 0.0100 0.0119
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1450-08CS/CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 14 of 16 | www.onsemi.com
CM1450
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1450-08
4.006 X 1.376 X 0.644
4.11 X 1.57 X 0.76
TAPE
WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
12mm
330mm (13")
3500
4mm
4mm
Figure 15. Tape and Reel Mechanical Data
Rev. 2 | Page 15 of 16 | www.onsemi.com
CM1450
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
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parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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