ASM3P2855D Custom Clock Generator for FAX System Product Description Features • ASM3P2855D is a custom clock generator for FAX system. ASM3P2855D realizes all the ten clocks required by the various components and subsystems of the FAX system. It uses an inexpensive 24MHz crystal as the input to generate five synchronized 54.8MHz clocks and three synchronized 50MHz PCI clocks that can be used by CPU, HDD, PCI Analyzer, ASIC2 and ASIC3, Ethernet, LAN PHY and for the CPU Timer, a 19.52MHz clock used by ASIC1 for Scanner. The custom clock generator ASM3P2855D works with a Supply Voltage of 3.3V ± 0.3V. The device is available in a 16L TSSOP Green package. Generates Custom Clocks for FAX system from an inexpensive 24MHz Crystal • 3 x 50MHz synchronized clocks • 5 x 54.8MHz synchronized clocks • 1 x 19.52MHz clock for Scanner • REFOUT Clock • Supply Voltage 3.3 V ± 0.3V • Available in 16L TSSOP, Green package Block Diagram VDD_FOUT VDD 19.52MHz XIN / CLKIN Crystal Oscillator PLL XOUT 3 5 50MHz 54.8MHz REFOUT GND ©2010 SCILLC. All rights reserved. OCTOBER 2010 – Rev. 1.1 GND_FOUT Publication Order Number: ASM3P2855/D ASM3P2855D Pin Diagram CLKIN / XIN 1 16 19.52MHz XOUT 2 15 50MHz VDD 3 14 50MHz 13 50MHz 12 REFOUT VDD_FOUT 4 ASM3P2855D GND_FOUT 5 GND 6 11 54.80MHz 54.80MHz 7 10 54.80MHz 54.80MHz 8 9 54.80MHz Pin Description Pin# Pin Name Type Description 1 CLKIN / XIN I Crystal connection or external reference Clock input. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 VDD P Power supply for the core 4 VDD_FOUT P Power supply for the output buffers. 5 GND_FOUT P Ground connection for the output buffers 6 GND P Ground connection 7 54.80MHz O Synchronous 54.80MHz Clock Output 8 54.80MHz O Synchronous 54.80MHz Clock Output 9 54.80MHz O Synchronous 54.80MHz Clock Output 10 54.80MHz O Synchronous 54.80MHz Clock Output 11 54.80MHz O Synchronous 54.80MHz Clock Output 12 REFOUT O 24MHz Reference Clock Output 13 50MHz O Synchronous 50MHz Clock Output 14 50MHz O Synchronous 50MHz Clock Output 15 50MHz O Synchronous 50MHz Clock Output 16 19.52MHz O 19.52MHz Clock Output Rev. 1 | Page 2 of 7 | www.onsemi.com ASM3P2855D Absolute Maximum Ratings Symbol VDD, VDD_FOUT VIN Parameter Rating Power Supply Voltage relative to GND -0.5 to +4.6 Input Voltage relative to GND (Input Pins) TSTG Unit -0.5 to VDD+0.5 Storage temperature V -65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV Static Discharge Voltage TDV (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Recommended Operating Conditions Symbol Parameter Min TA Operating Temperature 0 VDD Output Core Voltage +3.0 VDD_FOUT Output Buffer Voltage +3.0 DC Electrical Characteristics Symbol Max Units +70 °C +3.3 +3.6 V +3.3 +3.6 V Max Unit VIL Input low voltage GND-0.3 0.8 V VIH Input high voltage 2.0 VDD+0.3 V IIL Input low current -35 µA IIH Parameter Typ Min Typ Input high current 35 µA IXOL XOUT output low current (VXOL @ 0.4V, VDD = 3.3V) 3 mA IXOH XOUT output high current (VXOH @ 2.5V, VDD = 3.3V) 3 mA VOL Output low voltage (VDD = 3.3V, IOL = 10mA) VOH Output high voltage (VDD = 3.3V, IOH = -10mA) IDD ICC VDD VDD_FOUT 0.4 2.5 V 1 Static supply current Dynamic supply current ( VDD = 3.3V,Unloaded Outputs) Operating Core Voltage 12 32 Operating Buffer Voltage Power-up time (first locked cycle after power-up) ZO Output impedance mA mA 3.0 3.3 3.6 3.0 3.3 3.6 V 5 mS 2 tON V 30 Notes: 1. CLKIN / XIN is pulled to GND. 2. VDD and CLKIN inputs are stable. Rev. 1 | Page 3 of 7 | www.onsemi.com V Ω ASM3P2855D AC Electrical Characteristics Symbol XIN / CLKIN Parameter Min Input frequency At Pins 7,8,9,10,11 Output frequency tHL 1 Unit MHz 24 54.80 At Pins 13,14,15 MHz 50 At Pin 16 1 tLH Max 24 At Pin 12 FOUT Typ 19.52 Output rise time (measured from 20% to 80%) 1.0 nS Output fall time (measured from 80% to 20%) 1.0 nS tD Output duty cycle 45 tJP Period Jitter (Unloaded Outputs) Note: 1. tLH and tHL are measured into a capacitive load of 15pF. Period Jitter Rev. 1 | Page 4 of 7 | www.onsemi.com 50 55 % ±275 pS ASM3P2855D Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 24MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance(CP) 18pF Shunt capacitance 7pF maximum ESR 25 Ω Note: Note: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency. Typical Crystal Interface Circuit R Crystal CL Rx CL CL = 2*(CP – CS), Where CP = Load capacitance of crystal CS = Stray capacitance due to CIN, PCB, Trace etc. Rev. 1 | Page 5 of 7 | www.onsemi.com ASM3P2855D Package Information 16-lead Thin Shrunk Small Outline Package (4.40-MM Body) 1 8 PIN 1 ID E 16 A A2 e A1 Seating Plane C θ D 9 H B L D Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.20 A1 0.002 0.006 0.05 0.15 A2 0.031 0.041 0.80 1.05 B 0.007 0.012 0.19 0.30 C 0.004 0.008 0.09 0.20 D 0.193 0.201 4.90 5.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.030 θ 0° 8° 0.50 0.75 0° 8° Rev. 1 | Page 6 of 7 | www.onsemi.com ASM3P2855D Ordering Code Ordering Code ASM3P2855DG-16TR Marking 3P28 Package Type Operating Range 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 0°C to +7 0°C 55D A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free. 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