Custom Clock Generator for FAX System

ASM3P2855D
Custom Clock Generator for
FAX System
Product Description
Features
•
ASM3P2855D is a custom clock generator for FAX system.
ASM3P2855D realizes all the ten clocks required by the
various components and subsystems of the FAX system. It
uses an inexpensive 24MHz crystal as the input to
generate five synchronized 54.8MHz clocks and three
synchronized 50MHz PCI clocks that can be used by CPU,
HDD, PCI Analyzer, ASIC2 and ASIC3, Ethernet, LAN PHY
and for the CPU Timer, a 19.52MHz clock used by ASIC1
for Scanner. The custom clock generator ASM3P2855D
works with a Supply Voltage of 3.3V ± 0.3V. The device is
available in a 16L TSSOP Green package.
Generates Custom Clocks for FAX system from
an inexpensive 24MHz Crystal
•
3 x 50MHz synchronized clocks
•
5 x 54.8MHz synchronized clocks
•
1 x 19.52MHz clock for Scanner
•
REFOUT Clock
•
Supply Voltage 3.3 V ± 0.3V
•
Available in 16L TSSOP, Green package
Block Diagram
VDD_FOUT
VDD
19.52MHz
XIN / CLKIN
Crystal
Oscillator
PLL
XOUT
3
5
50MHz
54.8MHz
REFOUT
GND
©2010 SCILLC. All rights reserved.
OCTOBER 2010 – Rev. 1.1
GND_FOUT
Publication Order Number:
ASM3P2855/D
ASM3P2855D
Pin Diagram
CLKIN / XIN 1
16
19.52MHz
XOUT
2
15
50MHz
VDD
3
14
50MHz
13
50MHz
12
REFOUT
VDD_FOUT 4
ASM3P2855D
GND_FOUT
5
GND
6
11
54.80MHz
54.80MHz
7
10
54.80MHz
54.80MHz
8
9
54.80MHz
Pin Description
Pin#
Pin Name
Type
Description
1
CLKIN / XIN
I
Crystal connection or external reference Clock input.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
3
VDD
P
Power supply for the core
4
VDD_FOUT
P
Power supply for the output buffers.
5
GND_FOUT
P
Ground connection for the output buffers
6
GND
P
Ground connection
7
54.80MHz
O
Synchronous 54.80MHz Clock Output
8
54.80MHz
O
Synchronous 54.80MHz Clock Output
9
54.80MHz
O
Synchronous 54.80MHz Clock Output
10
54.80MHz
O
Synchronous 54.80MHz Clock Output
11
54.80MHz
O
Synchronous 54.80MHz Clock Output
12
REFOUT
O
24MHz Reference Clock Output
13
50MHz
O
Synchronous 50MHz Clock Output
14
50MHz
O
Synchronous 50MHz Clock Output
15
50MHz
O
Synchronous 50MHz Clock Output
16
19.52MHz
O
19.52MHz Clock Output
Rev. 1 | Page 2 of 7 | www.onsemi.com
ASM3P2855D
Absolute Maximum Ratings
Symbol
VDD, VDD_FOUT
VIN
Parameter
Rating
Power Supply Voltage relative to GND
-0.5 to +4.6
Input Voltage relative to GND (Input Pins)
TSTG
Unit
-0.5 to VDD+0.5
Storage temperature
V
-65 to +125
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
Static Discharge Voltage
TDV
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Recommended Operating Conditions
Symbol
Parameter
Min
TA
Operating Temperature
0
VDD
Output Core Voltage
+3.0
VDD_FOUT
Output Buffer Voltage
+3.0
DC Electrical Characteristics
Symbol
Max
Units
+70
°C
+3.3
+3.6
V
+3.3
+3.6
V
Max
Unit
VIL
Input low voltage
GND-0.3
0.8
V
VIH
Input high voltage
2.0
VDD+0.3
V
IIL
Input low current
-35
µA
IIH
Parameter
Typ
Min
Typ
Input high current
35
µA
IXOL
XOUT output low current (VXOL @ 0.4V, VDD = 3.3V)
3
mA
IXOH
XOUT output high current (VXOH @ 2.5V, VDD = 3.3V)
3
mA
VOL
Output low voltage (VDD = 3.3V, IOL = 10mA)
VOH
Output high voltage (VDD = 3.3V, IOH = -10mA)
IDD
ICC
VDD
VDD_FOUT
0.4
2.5
V
1
Static supply current
Dynamic supply current
( VDD = 3.3V,Unloaded Outputs)
Operating Core Voltage
12
32
Operating Buffer Voltage
Power-up time (first locked cycle after power-up)
ZO
Output impedance
mA
mA
3.0
3.3
3.6
3.0
3.3
3.6
V
5
mS
2
tON
V
30
Notes: 1. CLKIN / XIN is pulled to GND.
2. VDD and CLKIN inputs are stable.
Rev. 1 | Page 3 of 7 | www.onsemi.com
V
Ω
ASM3P2855D
AC Electrical Characteristics
Symbol
XIN / CLKIN
Parameter
Min
Input frequency
At Pins 7,8,9,10,11
Output frequency
tHL
1
Unit
MHz
24
54.80
At Pins 13,14,15
MHz
50
At Pin 16
1
tLH
Max
24
At Pin 12
FOUT
Typ
19.52
Output rise time (measured from 20% to 80%)
1.0
nS
Output fall time (measured from 80% to 20%)
1.0
nS
tD
Output duty cycle
45
tJP
Period Jitter (Unloaded Outputs)
Note: 1. tLH and tHL are measured into a capacitive load of 15pF.
Period Jitter
Rev. 1 | Page 4 of 7 | www.onsemi.com
50
55
%
±275
pS
ASM3P2855D
Typical Crystal Specifications
Fundamental AT cut parallel resonant crystal
Nominal frequency
24MHz
Frequency tolerance
± 50 ppm or better at 25°C
Operating temperature range
-25°C to +85°C
Storage temperature
-40°C to +85°C
Load capacitance(CP)
18pF
Shunt capacitance
7pF maximum
ESR
25 Ω
Note: Note: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency.
Typical Crystal Interface Circuit
R
Crystal
CL
Rx
CL
CL = 2*(CP – CS),
Where CP = Load capacitance of crystal
CS = Stray capacitance due to CIN, PCB, Trace etc.
Rev. 1 | Page 5 of 7 | www.onsemi.com
ASM3P2855D
Package Information
16-lead Thin Shrunk Small Outline Package (4.40-MM Body)
1
8
PIN 1 ID
E
16
A
A2
e
A1
Seating Plane
C
θ
D
9
H
B
L
D
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.20
A1
0.002
0.006
0.05
0.15
A2
0.031
0.041
0.80
1.05
B
0.007
0.012
0.19
0.30
C
0.004
0.008
0.09
0.20
D
0.193
0.201
4.90
5.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.030
θ
0°
8°
0.50
0.75
0°
8°
Rev. 1 | Page 6 of 7 | www.onsemi.com
ASM3P2855D
Ordering Code
Ordering Code
ASM3P2855DG-16TR
Marking
3P28
Package Type
Operating Range
16-pin 4.4-mm TSSOP - TAPE & REEL, Green
0°C to +7 0°C
55D
A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free.
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