45 V, 60 mA ± 15%, 2.7 W package, Adjustable Constant Current Regulator & LED Driver, DPAK

NSI45060DDT4G
Adjustable Constant Current
Regulator & LED Driver
45 V, 60 − 100 mA + 15%, 2.7 W Package
The adjustable constant current regulator (CCR) is a simple,
economical and robust device designed to provide a cost effective
solution for regulating current in LEDs. The CCR is based on
patent- pending Self- Biased Transistor (SBT) technology and
regulates current over a wide voltage range. It is designed with a
negative temperature coefficient to protect LEDs from thermal
runaway at extreme voltages and currents.
The CCR turns on immediately and is at 20% of regulation with
only 0.5 V Vak. The Radj pin allows Ireg(SS) to be adjusted to higher
currents by attaching a resistor between Radj (Pin 3) and the Cathode
(Pin 4). The Radj pin can also be left open (No Connect) if no
adjustment is required. It requires no external components allowing it
to be designed as a high or low−side regulator. The high anodecathode voltage rating withstands surges common in Automotive,
Industrial and Commercial Signage applications. This device is
available in a thermally robust package, which is lead-free RoHS
compliant and uses halogen- free molding compound. For the
AEC−Q101 part please see the NSI45060JD datasheet.
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Ireg(SS) = 60 − 100 mA
@ Vak = 7.5 V
Anode
1
3
Radj
4
Cathode
4
1 2
Features
•
•
•
•
•
•
•
•
•
Robust Power Package: 2.7 Watts
Adjustable up to 100 mA
Wide Operating Voltage Range
Immediate Turn-On
Voltage Surge Suppressing − Protecting LEDs
SBT (Self−Biased Transistor) Technology
Negative Temperature Coefficient
Eliminates Additional Regulation
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Automobile: Chevron Side Mirror Markers, Cluster, Display &
Instrument Backlighting, CHMSL, Map Light
• AC Lighting Panels, Display Signage, Decorative Lighting, Channel
•
•
•
Lettering
Switch Contact Wetting
Application Note AND8391/D − Power Dissipation Considerations
Application Note AND8349/D − Automotive CHMSL
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 0
1
3
DPAK
CASE 369C
MARKING DIAGRAM
A
1
Radj
Y
WW
NSI60D
G
YWW
NSI
60DG
C
= Year
= Work Week
= Specific Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
Package
NSI45060DDT4G
DPAK
(Pb−Free)
Shipping†
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NSI45060DD/D
NSI45060DDT4G
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Anode−Cathode Voltage
Reverse Voltage
Operating and Storage Junction Temperature Range
ESD Rating:
Human Body Model
Machine Model
Symbol
Value
Vak Max
45
V
VR
500
mV
TJ, Tstg
−55 to +150
ESD
Unit
°C
Class 2
Class B
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Steady State Current @ Vak = 7.5 V (Note 1)
Voltage Overhead (Note 2)
Symbol
Min
Typ
Max
Unit
Ireg(SS)
51
60
69
mA
76.95
mA
Voverhead
1.8
Ireg(P)
Capacitance @ Vak = 7.5 V (Note 4)
C
17
pF
Capacitance @ Vak = 0 V (Note 4)
C
70
pF
1.
2.
3.
4.
54.7
66
V
Pulse Current @ Vak = 7.5 V (Note 3)
Ireg(SS) steady state is the voltage (Vak) applied for a time duration ≥ 80 sec, using FR−4 @ 300 mm2 2 oz. Copper traces, in still air.
Voverhead = Vin − VLEDs. Voverhead is typical value for 65% Ireg(SS).
Ireg(P) non−repetitive pulse test. Pulse width t ≤ 300 msec.
f = 1 MHz, 0.02 V RMS.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
PD
1771
14.16
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5)
RθJA
70.6
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 5)
RψJL4
PD
6.8
°C/W
2083
16.67
mW
mW/°C
Total Device Dissipation (Note 5) TA = 25°C
Derate above 25°C
Total Device Dissipation (Note 6) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 6)
RθJA
60
°C/W
Thermal Reference, Junction−to−Lead 4 (Note 6)
RψJL4
PD
6.3
°C/W
2080
16.64
mW
mW/°C
RθJA
60.1
°C/W
RψJL4
PD
6.5
°C/W
2441
19.53
mW
mW/°C
RθJA
51.2
°C/W
RψJL4
PD
5.9
°C/W
2309
18.47
mW
mW/°C
54.1
°C/W
Total Device Dissipation (Note 7) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 7)
Thermal Reference, Junction−to−Lead 4 (Note 7)
Total Device Dissipation (Note 8) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 8)
Thermal Reference, Junction−to−Lead 4 (Note 8)
Total Device Dissipation (Note 9) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 9)
RθJA
Thermal Reference, Junction−to−Lead 4 (Note 9)
RψJL4
PD
Total Device Dissipation (Note 10) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 10)
Thermal Reference, Junction−to−Lead 4 (Note 10)
Junction and Storage Temperature Range
6.2
°C/W
2713
21.71
mW
mW/°C
RθJA
46.1
°C/W
RψJL4
TJ, Tstg
5.7
°C/W
−55 to +150
°C
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
5. FR−4 @ 300 mm2, 1 oz. copper traces, still air.
6. FR−4 @ 300 mm2, 2 oz. copper traces, still air.
7. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
8. FR−4 @ 500 mm2, 2 oz. copper traces, still air.
9. FR−4 @ 700 mm2, 1 oz. copper traces, still air.
10. FR−4 @ 700 mm2, 2 oz. copper traces, still air.
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2
NSI45060DDT4G
TYPICAL PERFORMANCE CURVES
Minimum FR−4 @ 300 mm2, 2 oz Copper Trace, Still Air
60
50
40
30
20
10
0
−10
TA = 25°C, Radj = Open
Ireg(P), PULSE CURRENT (mA)
−20
−10
0
10
20
30
40
60
50
80
Ireg(SS), STEADY STATE CURRENT (mA)
70
70
70
TA = −40°C
60
TA = 25°C
30
[ −0.113 mA/°C
typ @ Vak = 7.5 V
20
10
0
DC Test Steady State, Still Air, Radj = Open
0
1
2
3
4
5
6
7
8
9
10
Vak, ANODE−CATHODE VOLTAGE (V)
Figure 1. General Performance Curve for CCR
Figure 2. Steady State Current (Ireg(SS)) vs.
Anode−Cathode Voltage (Vak)
TA = 25°C
Non−Repetitive Pulse Test
4.0
5.0
6.0
7.0
8.0
9.0
70
10
Vak @ 7.5 V
TA = 25°C
68
66
64
62
60
58
56
54
52
50
54
Vak, ANODE−CATHODE VOLTAGE (V)
56
58
60 62
64
66
68
70 72
74
76
78
Ireg(P), PULSE CURRENT (mA)
Figure 3. Pulse Current (Ireg(P)) vs.
Anode−Cathode Voltage (Vak)
Figure 4. Steady State Current vs. Pulse
Current Testing
66
100
Ireg(SS), STEADY STATE CURRENT (mA)
Ireg, CURRENT REGULATION (mA)
[ −0.106 mA/°C
typ @ Vak = 7.5 V
TA = 125°C
40
Vak, ANODE−CATHODE VOLTAGE (V)
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
3.0
Vak @ 7.5 V
TA = 25°C
Radj = Open
65
64
63
62
61
60
59
[ −0.179 mA/°C
typ @ Vak = 7.5 V
TA = 85°C
50
Ireg(SS), STEADY STATE CURRENT (mA)
Ireg, CURRENT REGULATION (mA)
80
0
10
20
30
40
50
60
70
80
90
Vak @ 7.5 V
TA = 25°C
90
80
70
60
50
1
TIME (s)
10
100
Radj (W)
Figure 6. Ireg(SS) vs. Radj
Figure 5. Current Regulation vs. Time
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3
1000
POWER DISSIPATION (mW)
NSI45060DDT4G
4200
700 mm2/2 oz
3900
3600
500 mm2/2 oz
3300
3000
2700
300 mm2/2 oz
2400
2100
1800 700 mm2/1 oz
1500
1200
500 mm2/1 oz
900
600
300 mm2/1 oz
300
40
100
−40 −20
0
20
60
80
120
TA, AMBIENT TEMPERATURE (°C)
Figure 7. Power Dissipation vs. Ambient
Temperature @ TJ = 1505C
APPLICATIONS
D1
Anode
D1
Q1
Cathode
+
−
Q2
Radj
LED
Vin
HF3−R5570
Qx
Radj
LED
HF3−R5570
Anode
Q1
Cathode
Radj
LED
+
−
HF3−R5570
Vin
Q2
Radj
Qx
Radj
LED
HF3−R5570
LED
HF3−R5570
LED
HF3−R5570
LED
HF3−R5570
LED
HF3−R5570
LED
LED
HF3−R5570
HF3−R5570
LED
LED
HF3−R5570
HF3−R5570
Figure 8. Typical Application Circuit
(30 mA each LED String)
Figure 9. Typical Application Circuit
(90 mA each LED String)
Number of LED’s that can be connected is determined by:
D1 is a reverse battery protection diode
LED’s = ((Vin − QX VF − D1 VF)/LED VF)
Example: Vin = 12 Vdc, QX VF = 3.5 Vdc, D1VF = 0.7 V
LED VF = 2.2 Vdc @ 30 mA
(12 Vdc − 4.2 Vdc)/2.2 Vdc = 3 LEDs in series.
Number of LED’s that can be connected is determined by:
D1 is a reverse battery protection diode
Example: Vin = 12 Vdc, QX VF = 3.5 Vdc, D1VF = 0.7 V
LED VF = 2.6 Vdc @ 90 mA
(12 Vdc − (3.5 + 0.7 Vdc))/2.6 Vdc = 3 LEDs in series.
Number of Drivers = LED current/30 mA
90 mA/30 mA = 3 Drivers (Q1, Q2, Q3)
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4
Radj
NSI45060DDT4G
Comparison of LED Circuit using CCR vs. Resistor Biasing
ON Semiconductor CCR Design
Resistor Biased Design
Constant brightness over full Supply Voltage
(more efficient), see Figure 10
Large variations in brightness over full Automotive Supply Voltage
Little variation of power in LEDs, see Figure 11
Large variations of current (power) in LEDs
Constant current extends LED strings lifetime, see Figure 10
High Supply Voltage/ Higher Current in LED strings limits lifetime
Current decreases as voltage increases, see Figure 10
Current increases as voltage increases
Current supplied to LED string decreases as temperature
increases (self-limiting), see Figure 2
LED current decreases as temperature increases
Single resistor is used for current select
Requires costly inventory
(need for several resistor values to match LED intensity)
Fewer components, less board space required
More components, more board space required
Surface mount component
Through-hole components
80
600
TA = 25°C
70 Circuit Current with
CCR Device
60
Pd LEDs (mW)
500
I (mA)
50
Circuit Current
with 125 W
40
30
Representative Test Data
for Figure 8 Circuit, Current
of LEDs, FR−4 @ 300 mm2,
2 oz Copper Area
20
10
0
9
10
11
TA = 25°C
12
13
14
15
LED Power with
CCR Device
400
300
LED Power
with 125 W
200
Representative Test Data
for Figure 8 Circuit, Pd of
LEDs, FR−4 @ 300 mm2,
2 oz Copper Area
100
0
16
9
10
11
12
13
14
Vin (V)
Vin (V)
Figure 10. Series Circuit Current
Figure 11. LED Power
Current Regulation: Pulse Mode (Ireg(P)) vs DC
Steady-State (Ireg(SS))
15
16
Ireg(SS) for stated board material, size, copper area and
copper thickness. Ireg(P) will always be greater than Ireg(SS)
due to the die temperature rising during Ireg(SS). This heating
effect can be minimized during circuit design with the
correct selection of board material, metal trace size and
weight, for the operating current, voltage, board operating
temperature (TA) and package. (Refer to Thermal
Characteristics table).
There are two methods to measure current regulation:
Pulse mode (Ireg(P)) testing is applicable for factory and
incoming inspection of a CCR where test times are a
minimum. (t < 300 ms). DC Steady-State (Ireg(SS)) testing
is applicable for application verification where the CCR will
be operational for seconds, minutes, or even hours. ON
Semiconductor has correlated the difference in Ireg(P) to
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5
NSI45060DDT4G
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE C
−T−
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
E
R
4
Z
A
S
1
2
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
3
U
K
F
J
L
H
D 2 PL
G
0.13 (0.005)
M
INCHES
MIN
MAX
0.235 0.245
0.250 0.265
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.180 BSC
0.034 0.040
0.018 0.023
0.102 0.114
0.090 BSC
0.180 0.215
0.025 0.040
0.020
−−−
0.035 0.050
0.155
−−−
MILLIMETERS
MIN
MAX
5.97
6.22
6.35
6.73
2.19
2.38
0.69
0.88
0.46
0.58
0.94
1.14
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.57
5.45
0.63
1.01
0.51
−−−
0.89
1.27
3.93
−−−
T
RECOMMENDED FOOTPRINT
6.20
0.244
2.58
0.101
5.80
0.228
3.0
0.118
1.6
0.063
6.172
0.243
SCALE 3:1
mm Ǔ
ǒinches
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSI45060DD/D
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