Application Notes

AN11390
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA
MMIC with Bypass
Rev. 2 — 16 March 2016
Application note
Document information
Info
Content
Keywords
BGU7224, 2.4 GHz LNA, 2.4-2.5 GHz ISM, WiFi (WLAN)
Abstract
This document provides circuit schematic, layout, BOM and typical
evaluation board performance for a 2.4 GHz WiFi (WLAN) LNA
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
Revision history
Rev
Date
Description
2
20160316
Chapter 5 “Thermal info” added
1
20141003
First publication
Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
2 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
1. Introduction
The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver
applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured using NXP’s high
performance SiGe:C technology, the BGU7224 couples best-in-class gain, noise figure,
linearity and efficiency with the process stability and ruggedness that are the hallmarks of
SiGe technology. The BGU7224 features a robust temperature-compensated internal
bias network and an integrated bypass / shutdown feature that stabilizes the DC
operating point over temperature and enables operation in the presence of high input
signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x
1.6 mm footprint, with only two external components (a decoupling capacitor at the Vcc
pin, and an optional shunt inductor for impedance matching at RF input pin), makes the
BGU7224 the smallest 256 QAM WLAN LNA with bypass solution on the market, ideal
for space sensitive applications.
Key Benefits:









Fig 1.
AN11390
Application note
Fully integrated, high performance LNA with built-in bypass
Exceptional 1.0 dB noise figure with 13 mA current consumption
Extremely low bypass current (<2 µA)
Single supply 3.0 V to 3.6 V operation
Integrated, temperature stabilized bias network
High IIP3 and low EVM
High ESD protection of 2 kV (HBM) on all pins
Ultra small, 0.5 mm pitch, 1.6 x 1.6 x 0.5 mm QFN-style package, MSL 1 at
260⁰C
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous
Substances (RoHS) following NXP’s RHF-2006 indicator D (dark green)
BGU7224 Block Diagram
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
3 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
2. Design and Application
The overall intent of this application note is to demonstrate the performance of the
BGU7224 in a 2.4 GHz LNA application e.g. 802.11 b/g/n “MIMO” WiFi (WLAN)
applications up to 256 QAM. Key requirements for this type of WLAN application are
gain, noise figure, linearity, input and output return loss, and turn on/off time.
The BGU7224 itself is a fully integrated MMIC consisting of an internal temperature
compensated bias network, an RF Gain block, bypass mode functionality, ESD
protection, internal RF matching, and internal DC blocking. Only two external
components, a 4.7 nF DC-decoupling capacitor and an optional 8.2 nH shunt inductor for
matching at RF input is necessary.
The BGU7224 can be also used without the matching inductor at the RF_IN, but then the
input return loss will be degraded by ~2 dB at 2.4 GHz !
The 2.4 GHz WiFi LNA evaluation board simplifies the evaluation of the BGU7224
application. The evaluation board enables testing of the device performance and requires
no additional support circuitry. The board is fully assembled with the BGU7224 MMIC,
and includes the 4.7 nF DC-decoupling capacitor and the 8.2 nH input matching inductor.
The board is also supplied with two SMA connectors for input and output connection to
RF test equipment.
A 50 ohm “through line” is provided at the top of the evaluation board in case the user
wishes to verify RF connector and grounded coplanar wave guide losses for deembedding purposes.
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
4 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
Fig 2.
AN11390
Application note
BGU7224 Evaluation Board 2.4 GHz WiFi LNA EVB
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
5 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
2.1 Application Circuit Schematic
Fig 3.
BGU7224 Evaluation Board: Schematic
Note: Figure 3 is the schematic for BGU7224 evaluation board, only two external
components (matching shunt inductor on RF_IN and DC-decoupling capacitor, placed
near the VCC pin).
The BGU7224 can be also used without the matching inductor at the RF_IN, but then the
input return loss will be degraded by ~2 dB at 2.4 GHz!
2.2 PCB Layout
AN11390
Application note
-
Use controlled impedance lines (50 Ω) for RF_in & RF_out
-
Place the decoupling capacitor as close as possible to the device pin 6 (Vcc)
-
Proper grounding of the RF GND especially pin 7 (ground pad) is essential for
good RF-performance. Connect the GND pins direct to ground plane and use
through vias on ground pad (size and amount depends on the technology used)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
6 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
2.3 Board Layout
AN11390
Application note
Fig 4.
BGU7224 Evaluation Board
Fig 5.
BGU7224 Stack of the PCB material
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
7 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
2.4 Application Board Bill-Of-Material
Table 1.
BGU7224 2.4 GHz WiFi LNA Part List
Customer can choose their preferred vendor but should be aware that the performance could be
affected. “0402” case size passives are used on NXP’s evaluation board.
Item
Position
on
Layout
Reference
(Fig 2)
Type
Vendor
Value
1
Z1
BGU7224
BGU7224
NXP SEMICONDUCTORS
BGU7224
2
Z2
GRM155
Murata
4.7nF
3
RF_IN
LQP15
X1, X2
Murata
Emerson Network
Power
8.2nH
3
CON-SMA-1
4
X3
C1
Shunt
Inductor
RF_IN,
RF_OUT
Vcc/LNA
gain/bypass
Molex
CON-3PIN
3. Typical Application Board Test Result
This section presents the results of a typical BGU7224 as used in NXP’s Application
Circuit. Unless otherwise noted, all measurement references are at the SMA connectors
on the evaluation board.
3.1.1 S-Parameters
Figures 6 and 7 below show the broadband (10 MHz – 10 GHz) and narrowband
s-parameters for the BGU7224 respectively. Figure 8 shows the measured stability factor
from 1 GHz – 20 GHz.
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
8 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
20
15
10
5
0
-5
S-Parameters
-10
(dB)
-15
-20
-25
S21 Measured
S11 Measured
-30
S22 Measured
-35
S12 Measured
-40
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Fig 6.
BGU7224 Broadband S-Parameters VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
9 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
20
15
10
S21 Measured
5
S11 Measured
0
S-Parameters
(dB)
S22 Measured
S12 Measured
-5
-10
-15
-20
-25
-30
2.4
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.5
Frequency (GHz)
Fig 7.
BGU7224 Narrowband S-Parameters VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
10 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
K Factor
100
10
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Frequency (GHz)
Fig 8.
BGU7224 Broadband K Factor (Rollett Stability Factor) VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
11 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.2 S-Parameters in Bypass Mode
Figure 9 and 10 below shows the gain, input return loss, and output return loss of the
BGU7224 in bypass mode.
0
-5
-10
S-Parameters
-15
(dB)
-20
S21 Measured
S11 Measured
-25
S22 Measured
-30
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Fig 9.
BGU7224 Broadband S-Parameters Bypass Mode Vcc = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
12 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
0
-5
S21 Measured
S11 Measured
S-Parameters
-10
(dB)
S22 Measured
-15
-20
2.4
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.5
Frequency (GHz)
Fig 10. BGU7224 Narrowband S-Parameters Bypass Mode Vcc = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
13 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.3 Noise Figure
The noise figure is physically measured at the SMA connectors of the evaluation board.
The total loss of the connectors and the printed circuit board are 0.3dB at 2.4 GHz
(RF_IN to RF_OUT). After de-embedding the connector and PCB losses (0.15dB at 2.4
GHz) to the device pins, the noise figure is less than 0.8 dB at 2.4 GHz. Figure 11 below
shows both the noise figure at the EVB level and the de-embedded noise figure.
1.4
1.3
1.2
NF
1.1
(dB)
1
Noise Figure [dB] EVB Level
0.9
Noise Figure [dB] De-Embedded
0.8
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
Frequency (GHz)
Fig 11. BGU7224 Noise Figure VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
14 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.4 Small Signal Linearity in Gain mode
Figure 12 shows the input-referred IP3 level for the BGU7224, measured with 5 MHz
tone spacing, -25 dBm input power per tone, and a swept center frequency from 2.4 GHz
to 2.5 GHz.
8
7
iIP3
6
(dBm)
5
4
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
Frequency (GHz)
Fig 12. BGU7224 Swept input-IP3 5MHz Tone Spacing Pin=-25dBm/Tone VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
15 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.5
Large Signal Linearity in Gain mode
Figure 13 shows the input referred P1dB level from 2.4 GHz to 2.5 GHz.
0
-1
-2
iP1dB
(dBm)
-3
-4
-5
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
Frequency (GHz)
Fig 13. BGU7224 input-P1dB vs. frequency
AN11390
Application note
VCC = 3.3V 25C ambient
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
16 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
Figure 14 shows error vector magnitude (EVM) as a function of output power.
Specifically, these data are captured using a 256 QAM OFDM waveform MSC9-VHT40.
Note that the output power is the average power over the burst.
4
3
EVM (%) 2
EVM 2422 MHz
1
EVM 2462 MHz
0
-10
-8
-6
-4
-2
0
2
4
Output Power (dBm)
Fig 14. BGU7224 EVM vs. burst average output power MCS9-VHT40 VCC = 3.3V 25C ambient
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
17 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.6 Out-of-band spurious
In order to characterize the BGU7224 under potential jamming conditions, a 2.462 GHz
signal is applied to the evaluation board at an RF input power level of -30 dBm. A
second tone is applied at 5.180 GHz and swept over a range of input power levels. The
5.180 GHz “leakage” and the second order intermodulation product at 2.718 GHz are
measured. The measurement set-up is shown in Figure 15. As a function of the 5.180
GHz jammer input level, Figure 16 reports the 5.180 GHz jammer output level, the 2.718
GHz IMD2 output level, and the 2.462 GHz Gain.
Fig 15. Out-of-band suppression test setup
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
18 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
16
0
15
-5
-10
14
-15
13
2462 MHz
Gain (dB)
-20
12
-25
11
-30
10
-35
2462 MHz Gain
9
2718 MHz IMD2 POUT
-40
5180 MHz Jammer POUT
-45
8
2718 MHz IMD2 and
5180 MHz Jammer
POUT (dBm)
-50
7
-55
6
-60
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
5180 MHz Jammer PIN (dBm)
Fig 16. BGU7224 5180 MHz Jammer Level at Output, 2718 MHz IMD2 and 2462 MHz Gain vs. Jammer Input
Power
VCC = 3.3V 25C ambient
2.462 GHz input at -30 dBm
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
19 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.7 Harmonics
By applying large RF signals at the input during bypass mode (OFF mode) operation,
harmonics can be created by the LNA and then emanate from its RF input. In a real
operating environment, these harmonic signals can be re-emitted by the antenna. The
measurement set up used for characterizing the harmonics generated by the BGU7224
in bypass mode is shown in Figure 17. A 2.447 GHz signal is used for the measurement
results shown in Figure 18.
Fig 17. Harmonic test setup
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
20 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
-40
2nd Harmonic CW
-50
3rd Harmonic CW
(Noise floor -73dBm)
2nd Harmonic WFM1
-60
3rd Harmonic WFM1
(Noise floor -73dBm)
Harmonic Level
(dBm/1 MHz)
-70
-80
0
1
2
3
4
5
6
7
8
9
10
Average Input Power Level (dBm)
(1) CW – Continuous Wave (only for test / comparison)
(2) WFM1 - 802.11b 1 Mbps (DBPSK) (worst case signal)
Fig 18. BGU7224 (Bypass Mode) 2nd and 3rd Reflected Harmonic Levels 2.447 GHz Fundamental
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
21 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.8 LNA Turn ON-OFF Time
The following diagram shows the setup to test LNA Turn ON and Turn OFF time.
The waveform generator is set to square wave mode and the output amplitude at 3.3V
peak with 50Ω output impedance. The RF signal generator output level is -20dBm at 2.45
GHz. It is very important to minimize or compensate for the time delay skew between the
trigger signal and the detector signal. Also note that the scope input impedances are set
to 50Ω on both channels.
Fig 19. LNA Turn On and Turn Off time test setup
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
22 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.8.1
LNA Turn ON Time
Figure 20 below shows a screen capture from an oscilloscope used to record the turn on
time of the BGU7224.
100Hz 0/3.3V Square Wave, applied on Venable pin, measured from 50% of input pulse to 90% of maximum output power
Fig 20. BGU7224 Turn On Time
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
23 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
3.1.8.2
LNA Turn OFF Time
Figure 21 below shows an oscilloscope screen capture with the turn off time for the
BGU7224.
100Hz 0/3.3V Square Wave, applied on Venable pin, measured from 50% of input pulse to 10% of maximum output
power
Fig 21. BGU7224 Turn Off Time
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
24 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
4. Summary of the Typical Evaluation Board Test Result
Table 2.
Typical results measured on the BGU7224 2.4 GHz WiFi LNA Evaluation Board
with 8.2 nH matching inductor at the RF_IN
Operating frequency 2.4-2.5 GHz, testing at 2.4 GHz and 2.5 GHz in Gain mode unless otherwise
specified, Temp = 25°C. Unless noted, all measurements are done with SMA-connectors as
reference plane.
Parameter
Symbol
Value
Unit
Supply Voltage
VCC
3.3
V
Supply Current
ICC
12.5
mA
ByPass Current
Noise Figure [1]
Power Gain
Input Return Loss
Output Return Loss
Reverse Isolation
Ibypass
1.2
μA
@ 2.4 GHz
NF
1.00
dB
@ 2.5 GHz
NF
1.05
dB
@ 2.4 GHz
Gp
15.4
dB
@ 2.5 GHz
Gp
14.9
dB
@ 2.4 GHz
IRL
11.5
dB
@ 2.5 GHz
IRL
13.0
dB
@ 2.4 GHz
ORL
13.5
dB
@ 2.5 GHz
ORL
11.0
dB
@ 2.4 GHz
ISLrev
-22.1
dB
@ 2.5 GHz
ISLrev
-22.2
dB
Power Gain
@ 2.4 GHz
Gp
-5.6
dB
(bypass mode)
@ 2.5 GHz
Gp
-5.6
dB
Input Return Loss
@ 2.4 GHz
IRL
14.5
dB
(bypass mode)
@ 2.5 GHz
IRL
14.3
dB
Output Return Loss
@ 2.4 GHz
ORL
17.9
dB
(bypass mode)
@ 2.5 GHz
ORL
16.5
dB
Input Third Order Intercept Point
Two Tones:
@ 2.4 GHz
IIP3
34.8
dBm
@ 2.5 GHz
IIP3
34.6
dBm
@ 2.4 GHz
OIP3
29.2
dBm
@ 2.5 GHz
OIP3
29.0
dBm
@ 2.4 GHz
iP1dB
-2.9
dBm
@ 2.5 GHz
iP1dB
-2.5
dBm
@ 2.4 GHz
oP1dB
11.5
dBm
@ 2.5 GHz
oP1dB
11.4
dBm
@2.4 GHz
EVM
1.2
%
5 MHz Tone Spacing
Power: 0 dBm/tone
(bypass mode)
Output Third Order Intercept Point
Two Tones:
5 MHz Tone Spacing
Power: 0 dBm/tone
(bypass mode)
Input 1dB Gain Compression Point
Output 1dB Gain Compression Point
Error Vector Magnitude
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
25 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
Parameter
Symbol
Value
Unit
Pout = 0dBm (256 QAM, MSC9-40)
@ 2.5 GHz
EVM
1.4
%
Input Third Order Intercept Point
@ 2.4 GHz
IIP3
6.1
dBm
@ 2.5 GHz
IIP3
6.3
dBm
@ 2.4 GHz
OIP3
21.5
dBm
@ 2.5 GHz
OIP3
21.2
dBm
-1
dBm
Two Tones:
5 MHz Tone Spacing
power: -25 dBm/tone
Output Third Order Intercept Point
Two Tones:
5 MHz Tone Spacing
power: -25 dBm/tone
1dB input/output cross-compression
with jammer
@2462 MHz
with 5180 MHz
Jammer
Harmonics generated at RF input
Pin = 7 dBm (2.447 GHz)
2.H. @ 4.894
GHz
H2
-50
dBm
CW signal input
3.H. @ 7.341
GHz
H3
-59
dBm
Stability ( 1 - 20 GHz)
K
>1
LNA Turn ON/OFF Time
Ton
120
nS
Toff
20
nS
(bypass mode)
[1]
AN11390
Application note
PCB and connector losses excluded.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
26 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
5. Thermal info
The following temperature simulations are done based on the BGU7224 soldered onto
the NXP evaluation board (see Fig. 22) in still air and 85 C ambient temperature.
Part
number
BGU7224
JCbot
[1]
250 K/W
JB
[2]
274 K/W
JC
[3]
Maximum Junction
Temperature
Ta
101 C
85 C
180 K/W
[1] Thermal resistance from junction to exposed diepad
[2] Thermal resistance from junction to board
[3] Thermal characterization parameter junction to package top
Fig 22. BGU7224 reference position board temperature
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
27 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
6. Legal information
6.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
6.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express,
implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire
risk as to the quality, or arising out of the use or performance, of this product
remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be
liable to customer for any special, indirect, consequential, punitive or
incidental damages (including without limitation damages for loss of
business, business interruption, loss of use, loss of data or information, and
the like) arising out the use of or inability to use the product, whether or not
based on tort (including negligence), strict liability, breach of contract, breach
of warranty or any other theory, even if advised of the possibility of such
damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by
customer for the product or five dollars (US$5.00). The foregoing limitations,
exclusions and disclaimers shall apply to the maximum extent permitted by
applicable law, even if any remedy fails of its essential purpose.
6.3 Licenses
Purchase of NXP <xxx> components
<License statement text>
6.4 Patents
Notice is herewith given that the subject device uses one or more of the
following patents and that each of these patents may have corresponding
patents in other jurisdictions.
<Patent ID> — owned by <Company name>
6.5 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are property of their respective owners.
<Name> — is a trademark of NXP B.V.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
28 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
7. List of figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
BGU7224 Block Diagram .................................. 3
BGU7224 Evaluation Board 2.4 GHz WiFi LNA
EVB ................................................................... 5
BGU7224 Evaluation Board: Schematic .......... 6
BGU7224 Evaluation Board ............................. 7
BGU7224 Stack of the PCB material ............... 7
BGU7224 Broadband S-Parameters VCC =
3.3V 25C ambient .......................................... 9
BGU7224 Narrowband S-Parameters VCC =
3.3V 25C ambient ........................................ 10
BGU7224 Broadband K Factor (Rollett Stability
Factor) VCC = 3.3V 25C ambient............... 11
BGU7224 Broadband S-Parameters Bypass
Mode Vcc = 3.3V 25C ambient ................... 12
BGU7224 Narrowband S-Parameters Bypass
Mode Vcc = 3.3V 25C ambient ................... 13
BGU7224 Noise Figure VCC = 3.3V 25C
ambient ........................................................... 14
BGU7224 Swept input-IP3 5MHz Tone Spacing
Pin=-25dBm/Tone VCC = 3.3V 25C ambient15
BGU7224 input-P1dB vs. frequency
VCC =
3.3V 25C ambient ........................................ 16
BGU7224 EVM vs. burst average output power
MCS9-VHT40 VCC = 3.3V 25C ambient ..... 17
Out-of-band suppression test setup ................ 18
BGU7224 5180 MHz Jammer Level at Output,
2718 MHz IMD2 and 2462 MHz Gain vs.
Jammer Input Power
VCC
2.462 GHz input at = 3.3V 25C ambient
30 dBm............................................................ 19
Harmonic test setup ........................................ 20
BGU7224 (Bypass Mode) 2nd and 3rd Reflected
Harmonic Levels 2.447 GHz Fundamental ..... 21
LNA Turn On and Turn Off time test setup ..... 22
BGU7224 Turn On Time ................................. 23
BGU7224 Turn Off Time ................................. 24
BGU7224 reference position board temperature
........................................................................ 27
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
29 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
8. List of tables
Table 1.
Table 2.
BGU7224 2.4 GHz WiFi LNA Part List ............. 8
Typical results measured on the BGU7224 2.4
GHz WiFi LNA Evaluation Board with 8.2 nH
matching inductor at the RF_IN ...................... 25
AN11390
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 16 March 2016
© NXP B.V. 2016. All rights reserved.
30 of 31
AN11390
NXP Semiconductors
BGU7224 Low Noise Amplifier (256 QAM) 2.4 GHz WiFi LNA MMIC
with Bypass
9. Contents
1.
2.
2.1
2.2
2.3
2.4
3.
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.6
3.1.7
3.1.8
3.1.8.1
3.1.8.2
4.
5.
6.
6.1
6.2
6.3
6.4
6.5
7.
8.
9.
Introduction ......................................................... 3
Design and Application....................................... 4
Application Circuit Schematic ............................. 6
PCB Layout ........................................................ 6
Board Layout ...................................................... 7
Application Board Bill-Of-Material ...................... 8
Typical Application Board Test Result .............. 8
S-Parameters ..................................................... 8
S-Parameters in Bypass Mode......................... 12
Noise Figure ..................................................... 14
Small Signal Linearity in Gain mode ................ 15
Large Signal Linearity in Gain mode ................ 16
Out-of-band spurious ....................................... 18
Harmonics ........................................................ 20
LNA Turn ON-OFF Time .................................. 22
LNA Turn ON Time .......................................... 23
LNA Turn OFF Time ......................................... 24
Summary of the Typical Evaluation Board Test
Result ................................................................. 25
Thermal info ....................................................... 27
Legal information .............................................. 28
Definitions ........................................................ 28
Disclaimers....................................................... 28
Licenses ........................................................... 28
Patents ............................................................. 28
Trademarks ...................................................... 28
List of figures..................................................... 29
List of tables ...................................................... 30
Contents ............................................................. 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP B.V. 2016.
All rights reserved.
For more information, visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 March 2016
Document identifier: AN11390
Similar pages