CGY888C 34 dB, 870 MHz GaAs push-pull forward amplifier Rev. 4 — 28 September 2010 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs MMIC. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits High gain Excellent linearity Superior levels of ESD protection Extremely low noise Excellent return loss properties Gain compensation over temperature Rugged construction Unconditionally stable Thermally optimized design Compliant with Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) Integrated ring wave surge protection 1.3 Applications CATV systems operating in the 40 MHz to 870 MHz frequency range CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 1.4 Quick reference data Table 1. Quick reference data Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gp power gain f = 45 MHz - 34 - dB 34.5 - 36.5 dB Itot total current 260 280 300 mA f = 870 MHz [1] [1] Direct Current (DC). 2. Pinning information Table 2. Pinning Pin Description 1 input 2, 3 common Simplified outline Graphic symbol 5 1 3 5 7 9 1 5 +VB 7, 8 common 9 output 9 2 3 7 8 sym095 3. Ordering information Table 3. Ordering information Type number CGY888C Package Name Description Version - rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VB supply voltage Vi(RF) RF input voltage VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E single tone Biased; According IEC61000-4-2 CGY888C Product data sheet Min Max Unit - 30 V - 70 dBmV - 2000 V - 2000 V Tstg storage temperature 40 +100 C Tmb mounting base temperature 20 +100 C All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 2 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 5. Characteristics Table 5. Characteristics Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 34 - dB Gp power gain f = 45 MHz 34.5 - 36.5 dB SLsl slope straight line f = 45 MHz to 870 MHz [1] - 1.5 - dB f = 45 MHz to 870 MHz [2] - 0.25 - dB 112 NTSC channels [3] - - 65 dBc 98 PAL channels [4] - 68 - dBc 112 NTSC channels [3] - - 63 dBc 98 PAL channels [4] - 66 - dBc [3] - 72 - dB f = 870 MHz FL flatness of frequency response CTB CSO composite triple beat composite second-order distortion Xmod cross modulation 112 NTSC channels RLin input return loss f = 45 MHz to 320 MHz 20 - - dB f = 320 MHz to 870 MHz 18 - - dB f = 45 MHz to 320 MHz 20 - - dB f = 320 MHz to 870 MHz 17 - - dB f = 50 MHz - 3.5 4.0 dB f = 870 MHz - 4.0 5.0 dB 260 280 300 mA RLout NF output return loss noise figure [5] total current Itot [1] Gp at 870 MHz minus Gp at 45 MHz. [2] Flatness straight line (peak to valley). [3] f = 55.25 MHz to 745.25 MHz; Vo = 44 dBmV, flat output level. [4] f = 49.75 MHz to 847.25 MHz; Vo = 44 dBmV, flat output level. [5] Direct Current (DC). CGY888C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 3 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J D E Z p A2 1 2 3 5 7 8 9 A L F S W c e b w M e1 d U2 q2 Q B y M B q1 x M B y M B p U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.5 OUTLINE VERSION b c D max. d E max. e e1 F L min. p 4.15 2.04 0.51 0.25 27.2 13.75 2.54 5.08 12.7 8.8 3.85 2.54 0.38 Q max. q q1 q2 JEDEC JEITA U2 W w x EUROPEAN PROJECTION y Z max. 0.1 3.8 ISSUE DATE 04-02-04 10-06-18 SOT115J Fig 1. U1 2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7 44.25 7.8 UNC REFERENCES IEC S Package outline SOT115J CGY888C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 7. Abbreviations Table 6. Abbreviations Acronym Description CATV Community Antenna TeleVision DC Direct Current GaAs Gallium-Arsenide MMIC Monolithic Microwave Integrated Circuit NTSC National Television Standard Committee PAL Phase Alternating Line RF Radio Frequency UNC UNified Coarse 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes CGY888C v.4 20100928 Product data sheet - CGY888C v.3 Modifications: CGY888C v.3 • • Package outline drawings have been updated to the latest version. Legal texts have been updated. 20091014 Product data sheet - CGY888C v.2 CGY888C v.2 20090921 Product data sheet - CGY888C v.1 CGY888C v.1 20080619 Product data sheet - - CGY888C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 5 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. CGY888C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] CGY888C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 28 September 2010 © NXP B.V. 2010. All rights reserved. 7 of 8 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 2 2 2 2 3 4 5 5 6 6 6 6 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 September 2010 Document identifier: CGY888C