Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD128
BGA2022
MMIC mixer
Product specification
Supersedes data of 2000 Jun 06
2000 Dec 04
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
FEATURES
PINNING
 Large frequency range:
PIN
DESCRIPTION
– Cellular band (900 MHz)
1
LO - GND
– PCS band (1900 MHz)
2
LO - signal
– WLAN band (2.4 GHz)
3
VS
 High isolation
4
IF - out
 High linearity
5
RF - feedback
 High conversion gain.
6
RF - signal
APPLICATIONS
Receiver side of wireless systems
that require high conversion gain and
high linearity at low supply current,
such as CDMA.
RF-signal
handbook, 4 columns
RF-feedback
6
6
5
IF-out
5
4
2
3
4
BIAS
CONTROL
DESCRIPTION
Silicon double poly MMIC mixer in a
6-lead SOT363 plastic package.
1
2
3
Top view
1
LO-GND
LO-signal
VS
MBL255
Marking code: A2p.
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA
VS = 2.8 V; IS = 6 mA; PLO = 0 dBm; fRF = 1800 MHz; fLO = 2080 MHz; fIF = 280 MHz.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
Gconv
conversion gain
4
6
8
dB
NF
noise figure (DSB)

12

dB
IP3
output third order intercept point

7

dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
2000 Dec 04
2
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VS
supply voltage

4
V
IS
supply current

10
mA
PLO
oscillator power
note 1

10
dBm
PRF
RF power
note 1

10
dBm
Ptot
total power dissipation
Ts  100 C; note 2

40
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature

150
C
Notes
1. LO and RF signals always AC coupled; 50  source; no external DC voltage supplied to pins 1, 2 and 6.
2. Ts is the temperature at the soldering point of the ground tab.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
thermal resistance from junction to solder point
VALUE
UNIT
375
K/W
CHARACTERISTICS
VS = 2.8 V; IS = 6 mA; Tj = 25 C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
IS
supply current
VS = 2.8 V
Gconv(p)
power conversion gain
PRF = 25 dBm; PLO = 0 dBm
IP3
VSWRLO
2000 Dec 04
TYP.
MAX.
UNIT
4
6
8
mA
880 MHz

5

dB
1800 MHz
4
6
8
dB
1950 MHz

5

dB

6

dB
880 MHz

9

dB
1800 MHz

12

dB
1950 MHz

9

dB
2450 MHz

9

dB
880 MHz

4

dBm
1800 MHz

7

dBm
1950 MHz

7

dBm
2450 MHz

10

dBm


2:1
2450 MHz
NF
MIN.
noise figure
intercept point third order input
return losses at LO port
DSB
output referred
PLO = 0 dBm; f = 0 to 3 GHz
3
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
APPLICATION INFORMATION
See application note number AN00059.
RF input
handbook, full pagewidth
C2
L1
C5
C1
C6
L3
IF output
RF- signal
RF- feedback
IF- out
6
5
4
BGA2022
BIAS
CONTROL
R1
1
2
3
LO - GND
LO - signal
VS
C4
C3
R2
LO input
Vsupply
L2
C7
C8
MGT575
Fig.2 Application diagram.
List of components (see Fig.2)
APPLICATION BOARD
COMPONENT
880 MHz
(IF = 80 MHz)
1800 MHz
(IF = 280 MHz)
1950 MHz
(IF = 80 MHz)
2450 MHz
(IF = 280 MHz)
R1
1.2 k
2.7 k
2.2 k
3.3 k
R2
22 
22 
22 
18 
C1
12 pF
1.2 pF
1.5 pF
1.0 pF
C2
390 pF
5.6 pF
1.5 nF
82 pF
C3, C4
39 pF
6.8 pF
6.8 pF
2.7 pF
C5
27 pF
2 pF
15 pF
2.2 pF
C6
100 pF
100 pF
10 pF
100 pF
C7
22 nF
22 nF
22 nF
22 nF
C8
56 pF
8.2 pF
10 pF
6.8 pF
L1
10 nH
2.7 nH
2.7 nH
1.8 nH
L2
220 nH
110 nH
150 nH
220 nH
L3
470 nH
120 nH

120 nH
2000 Dec 04
4
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
MGT576
400
−200
104
handbook, halfpage
RRF
jX
(Ω)
Z IF
handbook, halfpage
(Ω)
MGT577
(Ω)
−150
300
103
−jX
jX
−100
200
102
R
−50
100
0
0
1000
R
10
0
3000
2000
0
100
200
300
400
f (MHz)
500
600
f (MHz)
ZS = ZL = 50 ; VS = 2.8 V; PRF = 25 dBm; Tamb = 25 C.
ZS = ZL = 50 ; AC coupled; no signal; Tamb = 25 C.
Fig.3
Fig.4
RF input impedance as a function of
frequency; typical values.
IF output impedance as a function
frequency; typical values.
MGT579
MGT578
8
10
handbook, halfpage
handbook,
G halfpage
C
(dB)
6
IS
(mA)
8
4
6
2
4
0
2
−2
−4
−20
−15
−10
−5
0
0
5
0
1
2
3
4
5
VS (V)
PLO (dBm)
ZS = ZL = 50 ; VS = 2.8 V; PRF = 0 dBm; f = 1800 MHz;
Tamb = 25 C.
ZS = ZL = 50 ; AC coupled; no signal; Tamb = 25 C.
Fig.5
Fig.6
Conversion gain as a function of oscillator
power; typical values.
2000 Dec 04
5
Supply current as a function of the supply
voltage; typical values.
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
PACKAGE OUTLINE
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
2000 Dec 04
REFERENCES
IEC
JEDEC
JEITA
SC-88
6
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes  NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification  The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use  NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability  Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications  Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
2000 Dec 04
7
NXP Semiconductors
Product specification
MMIC mixer
BGA2022
Export control  This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Quick reference data  The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products  Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values  Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Terms and conditions of commercial sale  NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license  Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
2000 Dec 04
8
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/06/pp9
Date of release: 2000 Dec 04
Similar pages