Data Sheet

BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo
and Compass
Rev. 5 — 29 March 2012
Product data sheet
1. Product profile
1.1 General description
The BGU7005 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic
leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one
external matching inductor and one external decoupling capacitor.
The BGU7005 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise
figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits















Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure (NF) = 0.85 dB
Gain 16.5 dB
High input 1 dB compression point Pi(1dB) of 11 dBm
High out of band IP3i of 9 dBm
Supply voltage 1.5 V to 3.1 V
Power-down mode current consumption < 1 A
Optimized performance at low supply current of 4.5 mA
Integrated matching for the output
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated temperature stabilized bias for easy design
Small 6-pin leadless package 1 mm  1.45 mm  0.5 mm
110 GHz transit frequency - SiGe:C technology
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
1.3 Applications
 LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature
phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video
Cameras, RF Front End modules, complete GPS chipset modules and theft protection
(laptop, ATM).
1.4 Quick reference data
Table 1.
Quick reference data
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using
a 5.6 nH inductor; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
1.5
-
3.1
V
Pi < 40 dBm
3.2
4.5
5.7
mA
Pi = 20 dBm
8.1
11.6 14.4 mA
Pi < 40 dBm, no jammer
14
16.5 19
dB
Pi = 20 dBm, no jammer
15
17.5 20
dB
Pi < 40 dBm, no jammer
[1]
-
0.85 1.2
dB
Pi < 40 dBm, no jammer
[2]
-
0.9
1.3
dB
-
1.2
1.6
dB
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE  0.8 V
power gain
Gp
NF
noise figure
Pi = 20 dBm, no jammer
Pi(1dB)
f = 1575 MHz
VCC = 1.5 V
15 12
-
dBm
VCC = 1.8 V
14 11
-
dBm
VCC = 2.85 V
11 8
-
dBm
input third-order intercept point f = 1.575 GHz
IP3i
[1]
input power at 1 dB
gain compression
VCC = 1.5 V
[3]
5
8
-
dBm
VCC = 1.8 V
[3]
5
9
-
dBm
VCC = 2.85 V
[3]
5
12
-
dBm
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm.
2. Pinning information
Table 2.
BGU7005
Product data sheet
Pinning
Pin
Description
1
GND
2
GND
3
RF_IN
4
VCC
5
ENABLE
6
RF_OUT
Simplified outline
Graphic symbol
4
5
3
6
2
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Rev. 5 — 29 March 2012
1
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BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
3. Ordering information
Table 3.
Ordering information
Type number
BGU7005
Package
Name
Description
Version
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1  1.45  0.5 mm
4. Marking
Table 4.
Marking codes
Type number
Marking code
BGU7005
AC
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
0.5
+5.0
V
[2]
0.5
+5.0
V
DC; VRF_IN < VCC + 0.6
[2][3]
0.5
+5.0
V
DC; VRF_OUT < VCC + 0.6
[2][3]
0.5
+5.0
V
-
0
dBm
55
mW
65
+150
C
VENABLE
VRF_IN
voltage on pin ENABLE
voltage on pin RF_IN
VRF_OUT
voltage on pin RF_OUT
Pi
input power
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
VESD
electrostatic discharge
voltage
VENABLE < VCC + 0.6
Tsp  130 C
[1]
-
150
C
Human Body Model (HBM);
According JEDEC standard
22-A114E
-
4
kV
Charged
Device Model (CDM);
According JEDEC standard
22-C101B
-
1
kV
[1]
Tsp is the temperature at the soldering point of the emitter lead.
[2]
Warning: due to internal ESD diode proctection, the applied DC voltage should not exceed VCC + 0.6 and
shall not exceed 5.0 V in order to avoid excess current.
[3]
The RF input and RF output are AC coupled through internal DC blocking capacitor.
6. Thermal characteristics
BGU7005
Product data sheet
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 March 2012
Typ
Unit
225
K/W
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BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
7. Characteristics
Table 7.
Characteristics
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE  0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using a 5.6 nH
inductor; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max Unit
1.5
-
3.1
V
Pi < 40 dBm
3.2
4.5
5.7
mA
Pi = 20 dBm
8.1
11.6 14.4 mA
-
-
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE  0.8 V
VENABLE  0.35 V
Tamb
ambient temperature
Gp
power gain
40 +25
1
A
+85
C
Tamb = 25 C
Pi < 40 dBm, no jammer
14
16.5 19
Pi = 20 dBm, no jammer
15
17.5 20
dB
Pjam = 20 dBm; fjam = 850 MHz
15
17.5 20
dB
Pjam = 20 dBm; fjam = 1850 MHz
15
17.5 20
dB
dB
40 C  Tamb  +85 C
RLin
RLout
input return loss
output return loss
ISL
isolation
NF
noise figure
Pi < 40 dBm, no jammer
13
-
20
dB
Pi = 20 dBm, no jammer
14
-
21
dB
Pjam = 20 dBm; fjam = 850 MHz
14
-
21
dB
Pjam = 20 dBm; fjam = 1850 MHz
14
-
21
dB
Pi < 40 dBm
5
8
-
dB
Pi = 20 dBm
6
10
-
dB
Pi < 40 dBm
10
20
-
dB
Pi = 20 dBm
10
14
-
dB
20
23
-
dB
Tamb = 25 C
Pi < 40 dBm, no jammer
[1]
-
0.85 1.2
dB
Pi < 40 dBm, no jammer
[2]
-
0.9
1.3
dB
Pi = 20 dBm, no jammer
-
1.2
1.6
dB
Pjam = 20 dBm; fjam = 850 MHz
-
1.1
1.5
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
1.3
1.7
dB
40 C  Tamb  +85 C
BGU7005
Product data sheet
Pi < 40 dBm, no jammer
-
-
1.7
dB
Pi = 20 dBm, no jammer
-
-
1.9
dB
Pjam = 20 dBm; fjam = 850 MHz
-
-
1.8
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
-
2.0
dB
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
4 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Table 7.
Characteristics …continued
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE  0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50  using a 5.6 nH
inductor; unless otherwise specified.
Symbol Parameter
Pi(1dB)
Conditions
Min Typ
Max Unit
input power at 1 dB gain compression f = 1575 MHz
VCC = 1.5 V
15 12
-
dBm
VCC = 1.8 V
14 11
-
dBm
VCC = 2.85 V
11 8
-
dBm
f = 806 MHz to 928 MHz
VCC = 1.5 V
[3]
15 12
-
dBm
VCC = 1.8 V
[3]
14 11
-
dBm
VCC = 2.85 V
[3]
14 11
-
dBm
VCC = 1.5 V
[3]
13 10
-
dBm
VCC = 1.8 V
[3]
12 9
-
dBm
VCC = 2.85 V
[3]
10 7
-
dBm
VCC = 1.5 V
[4]
5
8
-
dBm
VCC = 1.8 V
[4]
5
9
-
dBm
VCC = 2.85 V
[4]
5
12
-
dBm
turn-on time
[5]
-
-
2
s
toff
turn-off time
[5]
s
K
Rollett stability factor
f = 1612 MHz to 1909 MHz
input third-order intercept point
IP3i
ton
[1]
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
Out of band.
f = 1.575 GHz
[4]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 =30 dBm.
[5]
Within 10 % of the final gain.
-
-
1
1
-
-
Table 8.
ENABLE (pin 5)
40 C  Tamb  +85 C; 1.5 V  VCC  3.1 V
BGU7005
Product data sheet
VENABLE (V)
State
 0.35
OFF
 0.8
ON
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
5 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
8. Application information
8.1 GNSS LNA
Ven Vcc
C1
RF input
5
L1
3
IC1
4
RF output
6
1
2
001aak685
For a list of components see Table 9.
Fig 1.
Schematics GNSS LNA evaluation board
Table 9.
List of components
For schematics see Figure 1.
Component
Description
Value
Supplier
C1
decoupling capacitor
1 nF
various
IC1
BGU7005
-
NXP
L1
high quality matching inductor
5.6 nH
Murata LQW15A
001aak688
6
ICC
(mA)
Remarks
001aak689
6
ICC
(mA)
(1)
(2)
5
5
(3)
(3)
(2)
(1)
4
4
3
1.0
1.5
2.0
2.5
3
−55
3.0
3.5
VCC (V)
Pi = 45 dBm.
−15
(1) VCC = 1.5 V
(2) Tamb = +25 C
(2) VCC = 1.8 V
(3) Tamb = +85 C
(3) VCC = 2.85 V
Supply current as a function of supply voltage;
typical values
BGU7005
Product data sheet
65
105
Tamb (°C)
Pi = 45 dBm.
(1) Tamb = 40 C
Fig 2.
25
Fig 3.
Supply current as a function of ambient
temperature; typical values
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Rev. 5 — 29 March 2012
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6 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak690
20
001aak691
20
Gp
(dB)
Gp
(dB)
16
16
12
12
(1)
(4)
(2)
8
(3)
8
(3)
(2)
(1)
4
4
0
500
1000
1500
2000
0
500
2500
3000
f (MHz)
VCC = 1.8 V; Pi = 45 dBm.
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 C.
(1) Tamb = 40 C
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Pi = 15 dBm
Fig 4.
Power gain as a function of frequency;
typical values
Fig 5.
001aak692
18
Power gain as a function of frequency;
typical values
001aak693
20
Gp
Gp
(dB)
Gp
(dB)
12
ICC
(mA)
(3)
(2)
(1)
17
(3)
20
15
(3)
(2)
(2)
(1)
(1)
10
14
ICC
6
5
11
0
500
1000
1500
2000
8
−50
2500
3000
f (MHz)
Pi = 45 dBm; Tamb = 25 C.
−40
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Power gain as a function of frequency;
typical values
BGU7005
Product data sheet
−20
−10
0
Pi (dBm)
0
Tamb = 25 C; f = 1575 MHz.
(1) VCC = 1.5 V
Fig 6.
−30
Fig 7.
Power gain as a function of input power;
typical values
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
7 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aao101
1.6
NF
(dB)
001aak694
1.6
NF
(dB)
1.2
1.2
0.8
0.8
0.4
0.4
0
1550
1564
1578
1592
0
1.2
1606
1620
f (MHz)
f = 1575 MHz; Tamb = 25 C; no jammer.
Fig 8.
2.0
2.4
2.8
3.2
VCC (V)
f = 1575 MHz; Tamb = 25 C; no jammer.
Noise figure as a function of frequency;
typical values
Fig 9.
001aak695
1.6
1.6
Noise figure as a function of supply voltage;
typical values
001aak696
4
NF
(dB)
NF
(dB)
1.2
3
0.8
2
0.4
1
(3)
(2)
(1)
0
−50
−20
10
40
70
100
Tamb (°C)
f = 1575 MHz; VCC = 1.8 V; no jammer.
0
-50
-40
-30
-20
-10
0
Pjam (dBm)
fjam= 850 MHz; Tamb = 25 C; f = 1575 MHz.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
Fig 10. Noise figure as a function of ambient
temperature; typical values
BGU7005
Product data sheet
Fig 11. Noise figure as a function of jamming power;
typical values
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
8 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak697
4
001aak698
0
RLin
(dB)
NF
(dB)
−3
3
−6
2
−9
(3)
(2)
1
(1)
−12
(1)
(2)
(3)
0
-50
-40
-30
-20
-10
0
Pjam (dBm)
−15
500
fjam= 1850 MHz; Tamb = 25 C; f = 1575 MHz.
1000
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
Fig 12. Noise figure as a function of jamming power;
typical values
Fig 13. Input return loss as a function of frequency;
typical values
001aak699
0
1500
RLin
(dB)
001aak700
0
RLin
(dB)
-3
-3
(1)
(2)
-6
-6
(3)
(4)
-9
-9
-12
-12
(1)
(2)
(3)
-15
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 C.
-15
500
1000
1500
2000
2500
3000
f (MHz)
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 14. Input return loss as a function of frequency;
typical values
BGU7005
Product data sheet
Fig 15. Input return loss as a function of frequency;
typical values
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Rev. 5 — 29 March 2012
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9 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak701
0
RLin
(dB)
001aak702
0
(1)
RLout
(dB)
-3
−4
-6
−8
(1)
(2)
(3)
-9
(2)
(3)
−12
−16
-12
-15
-50
-40
-30
-20
-10
0
Pi (dBm)
−20
500
Tamb = 25 C; f = 1575 MHz.
1000
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
Fig 16. Input return loss as a function of input power;
typical values
001aak703
0
1500
RLout
(dB)
Fig 17. Output return loss as a function of frequency;
typical values
001aak704
0
RLout
(dB)
-4
-4
-8
-8
-12
-12
(4)
(3)
-16
-16
(2)
(1)
(1)
(2)
(3)
-20
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 C.
-20
500
1000
1500
2000
2500
3000
f (MHz)
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 18. Output return loss as a function of frequency;
typical values
BGU7005
Product data sheet
Fig 19. Output return loss as a function of frequency;
typical values
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
10 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak705
0
RLout
(dB)
001aak706
0
ISL
(dB)
-4
−10
(1)
-8
(2)
(3)
−20
(1)
-12
(2)
(3)
−30
-16
-20
-50
-40
-30
-20
-10
0
Pi (dBm)
−40
500
Tamb = 25 C; f = 1575 MHz.
1000
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
Fig 20. Output return loss as a function of input
power; typical values
Fig 21. Isolation as a function of frequency; typical
values
001aak707
0
1500
ISL
(dB)
001aak708
0
ISL
(dB)
-10
-10
(4)
(1)
(3)
(2)
(2)
-20
(3)
-20
(1)
-30
-30
-40
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 C.
-40
500
1000
1500
2000
2500
3000
f (MHz)
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 22. Isolation as a function of frequency; typical
values
BGU7005
Product data sheet
Fig 23. Isolation as a function of frequency; typical
values
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
11 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak709
0
001aak710
0
Pi(1dB)
(dBm)
ISL
(dB)
−4
-10
(1)
(3)
(2)
−8
(2)
(3)
-20
(1)
−12
-30
−16
-40
-50
-40
-30
-20
-10
0
Pi (dBm)
−20
1.2
Tamb = 25 C; f = 1575 MHz.
1.6
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
Fig 24. Isolation as a function of input power;
typical values
001aak711
−4
Fig 25. Input power at 1 dB gain compression as a
function of supply voltage; typical values
001aak716
0
−4
(3)
(2)
(1)
(3)
(2)
(1)
−8
−8
−12
−12
−16
−16
1.6
2.0
2.4
2.8
3.2
VCC (V)
−20
1.2
1.6
f = 1850 MHz.
f = 1575 MHz.
(1) Tamb = 40 C
(1) Tamb = 40 C
(2) Tamb = +25 C
(2) Tamb = +25 C
(3) Tamb = +85 C
(3) Tamb = +85 C
Fig 26. Input power at 1 dB gain compression as a
function of supply voltage; typical values
BGU7005
Product data sheet
2.8
3.2
VCC (V)
Pi(1dB)
(dBm)
Pi(1dB)
(dBm)
−20
1.2
2.4
f = 850 MHz.
(1) VCC = 1.5 V
0
2.0
2.0
2.4
2.8
3.2
VCC (V)
Fig 27. Input power at 1 dB gain compression as a
function of supply voltage; typical values
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NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
001aak717
20
IMD3,
PL
(dBm) 0
PL of 1713 MHz signal
001aak718
20
IMD3,
PL
(dBm) 0
PL of 1713 MHz signal
(1)
(2)
(3)
−20
-20
(1)
(2)
-40
−40
(3)
IMD3 of 1575 MHz signal
-60
−60
IMD3 of 1575 MHz signal
(1)
−80
-80
(2)
(1)
-100
(3)
−100
(2)
(3)
-120
-40
-35
-30
-25
-20
-15
Pi (dBm)
−120
−40
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
Tamb = 25 C.
−35
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
001aak719
102
−25
−20
−15
Pi (dBm)
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
VCC = 1.8 V.
(1) VCC = 1.5 V
Fig 28. Third order intermodulation distortion and
output power as function of input power;
typical values
−30
Fig 29. Third order intermodulation distortion and
output power as function of input power;
typical values
001aak720
102
(3)
(2)
K
K
(1)
(3)
10
10
(2)
(1)
1
1
10−1
10-1
0
2000
4000
6000
8000
10000
f (MHz)
Tamb = 25 C; Pi = 45 dBm.
0
2000
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
8000
10000
f (MHz)
(3) Tamb = +85 C
(3) VCC = 2.85 V
Fig 30. Rollett stability factor as a function of
frequency; typical values
Product data sheet
6000
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
BGU7005
4000
Fig 31. Rollett stability factor as a function of
frequency; typical values
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NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
8.2 GPS front-end
The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit
and its characteristics is provided here.
Ven Vcc
C1
RFin
5
BPF1
L1
3
IC1
4
BPF2
6
RFout
1
2
001aak721
For a list of components see Table 10.
Fig 32. Schematics GPS front-end evaluation board
Table 10. List of components
For schematics see Figure 32.
Component
Description
Value
Supplier
Remarks
BPF1, BPF2
GPS SAW filter
-
Murata SAFEA1G57KE0F00
Alternatives from Epcos:
•
B9444
Alternatives from Murata:
•
•
SAFEA1G57KH0F00
SAFEA1G57KB0F00
Alternatives from Fujitsu:
•
•
C1
decoupling capacitor
1 nF
Various
IC1
BGU7005
-
NXP
L1
high quality matching inductor
5.6 nH Murata LQW15A
FAR-F6KA-1G5754-L4AA
FAR-F6KA-1G5754-L4AJ
8.3 Characteristics GPS front-end
Table 11. Characteristics GPS front-end
f = 1575 MHz; VCC = 1.8 V; VENABLE  0.8 V; power at LNA input Pi < 40 dBm; Tamb = 25 C; input and output matched to
50 ; unless otherwise specified.
Symbol Parameter
VCC
supply voltage
Conditions
Min Typ
Max
Unit
RF input AC coupled
1.5
-
2.85
V
4.5
-
mA
+85
C
ICC
supply current
-
Tamb
ambient temperature
40 +25
Gp
power gain
RLin
RLout
input return loss
output return loss
BGU7005
Product data sheet
power at LNA input Pi < 40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = 20 dBm
[1]
-
15.5 -
dB
power at LNA input Pi < 40 dBm
[1]
-
8.5
-
dB
power at LNA input Pi = 20 dBm
[1]
-
10.5 -
dB
power at LNA input Pi < 40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = 20 dBm
[1]
-
12.5 -
dB
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BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Table 11. Characteristics GPS front-end …continued
f = 1575 MHz; VCC = 1.8 V; VENABLE  0.8 V; power at LNA input Pi < 40 dBm; Tamb = 25 C; input and output matched to
50 ; unless otherwise specified.
Symbol Parameter
Conditions
NF
noise figure
Pi(1dB)
input power at 1 dB gain compression
IP3i
input third-order intercept point

attenuation
ton
toff
Min Typ
Max
Unit
power at LNA input Pi < 40 dBm
[1]
-
1.8
-
dB
power at LNA input Pi = 20 dBm
[1]
-
1.9
-
dB
8.2
dBm
f = 806 MHz to 928 MHz
[2]
31
dBm
f = 1612 MHz to 1909 MHz
[2]
40
dBm
f = 1575 MHz
[3]
64
dBm
f = 850 MHz
[4]
95
-
-
dBc
f = 1850 MHz
[4]
90
-
-
dBc
turn-on time
[5]
-
-
2
s
turn-off time
[5]
-
-
1
s
[1]
Power at GPS front-end input = power at LNA input + attenuation BPF1.
[2]
Out of band.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = +10 dBm.
[4]
Relative to f = 1575 MHz.
[5]
Within 10 % of the final gain.
BGU7005
Product data sheet
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BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
9. Package outline
SOT886
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
b
1
2
3
4x
(2)
L
L1
e
6
5
e1
4
e1
6x
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A(1)
0.5
A1
b
D
E
0.04 0.25 1.50 1.05
0.20 1.45 1.00
0.17 1.40 0.95
e
e1
0.6
0.5
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
Outline
version
SOT886
sot886_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
04-07-22
12-01-05
MO-252
Fig 33. Package outline SOT886 (XSON6)
BGU7005
Product data sheet
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Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
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BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
10. Abbreviations
Table 12.
Abbreviations
Acronym
Description
AC
Alternating Current
ATM
Automated Teller Machine (cash dispenser)
DC
Direct Current
GLONASS
GLObal NAvigation Satellite System
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
HBM
Human Body Model
MMIC
Monolithic Microwave Integrated Circuit
PC
Personal Computer
PCB
Printed Circuit Board
RF
Radio Frequency
SAW
Surface Acoustic Wave
SiGe:C
Silicon Germanium Carbon
11. Revision history
Table 13.
Revision history
Document ID Release date
Data sheet status
Change notice
Supersedes
BGU7005 v.5
Product data sheet
-
BGU7005 v.4
Modifications:
20120329
•
•
•
•
•
•
•
•
•
Added ‘Compass’ to descriptive title
Section 1.2 on page 1: row 6, changed 2.85 V to 3.1 V
Section 1.3 on page 2: updated
Table 1 on page 2: changed max.value VCC from 2.85 V to 3.1 V
Table 7 on page 4: changed max.value VCC from 2.85 V to 3.1 V
Table 8 on page 5: changed max.value VCC from 2.85 V to 3.1 V
Table 5 on page 3: several additions and changes
Figure 8 on page 8: corrected figure titles
Figure 9 on page 8: corrected figure titles
BGU7005 v.4
20110506
Product data sheet
-
BGU7005 v.3
BGU7005 v.3
20100623
Product data sheet
-
BGU7005_2
BGU7005_2
20100304
Product data sheet
-
BGU7005_1
BGU7005_1
20091028
Preliminary data sheet
-
-
BGU7005
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 March 2012
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NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU7005
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
18 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU7005
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 March 2012
© NXP B.V. 2012. All rights reserved.
19 of 20
BGU7005
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics GPS front-end . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 March 2012
Document identifier: BGU7005
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