Analog Mixed Signal Products Group
Reliability Report
Revision C
April 2016
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
2
Reliability Program Overview
Product Porfolio
Accelerated Reliability Testing
3.1
FIT Rate Calculation and Assumptions
Silicon Reliability Summary
4.1
ESD Summary
-------
03
04
05
05
06
07
Non Volatile Reliability Summary
Package Reliablity Summary
6.1
Package Level
6.2
Product Level
Revision Summary
------
09
10
10
15
23
Reliability Report
1.0
Reliability Program Overview
Reliability is defined as product performance to specification over time in response to varied (specified)
environmental stress conditions.
The reliability function “R(t)” indicates the ratio of the conforming products that can function properly when the
time “t” elapses after starting use.
Microsemi - AMS publishes this report to provide customers with the intent to notify about the reliability of our
product portfolio.
Some of the important features of our program are,
• Product qualifications are performed per internal procedures aligned to the industry standards mentioned
above.
• Product reliability is measured periodically to ensure that the product performance meets or exceeds
requirements.
• Reliability tests are executed in response to internal requirements.
• Report is published annually.
1.1
Qualification
Reliability tests used in the qualification of new devices (wafer process and package) are designed to ensure that
Microsemi – AMS’s products satisfy applicable industry standards as part of new product introduction process.
Products are required to be qualified based on applicable following standards before they are released to
production,
• Automotive products
-- AECQ100
• Commerical products
-- JEDEC
• Hi Reliability/Space products
-- MIL PRF 38535
(Applicable test methods from MIL STD 883 for QML Q & V)
1.2
Ongoing Reliability Monitor (ORM) Program
•
•
•
•
•
3
The reliability monitor program is based on the maturity of the wafer process, existing data (tied to the
number of device hours, FIT rate) and current run rate.
Reliability data shown in this report is based on products/product families (based upon the same logic
elements, embedded storage elements, interconnect technology, etc).
Product families are qualified based upon the internal requirements and usually include products with a
range of densities, package types, and package lead counts.
The tests used as part of ORM test suite are determined per internal requirements.
Units that are planned for ORM use are tested using production test equipment to data sheet limits
before being stressed. Post test measurements are also done on the same production test equipment to
data sheet limits. Any unit that does not meet the data sheet specification is considered a reject.
Reliability Report
2.0
Product Portfolio
Microsemi AMS Group’s products are categorized primarily into the following product families,
Product Family
Sensors
Product/Product Family
AA 51X, AA 54X, AA 55X, AA 56X, AA 57X, AA58X, AA 61X, AA66X, AAP 1XX, AAP 2XX, AAP
6XX & AAP 8XX
LX 19XX & LX 33XX
P 31X
AAC 2XX, AA 6XX & AA 7XX
Backlighting
LX 22XXX, LX 24XXX, LX 27XXX & LX 95XX
LXE 19XX, LXM16XX, LXMG 19XX & 22XX
SGE 13XXX, SGE 23XX, SGE 24XX & SGE 25XX
AAHS2XX
LX 45XX & LX 77XX
Hi Rel
SG 07XXX, SG 109X, SG 117XXX, SG 120 XXX, SG 137 XXX, SG 140 XXX, SG 143 XXX, SG150
XXX, SG15XX XXX, SG16XX XXX, SG 17XX XXX, SG 18XX XXX, SG 20XX XXX, SG 22XX XXX,
SG 28XX XXX, SG 32XX, SG 35 XX, SG55XX XXX, SG 7XX XXX, SG 78XX XXX & SG 79XX XXX
SGR 11X XXX & SGR 18XX XXX
UC 18XXXX & UC 28XXXX
AAX 2XX
Power
Management
IPS 10XX, IPS 18XX & IPS 21X
LX12 XXX, LX16 XX, LX 17XX, LX 18XX, LX 22XX, LX 24XX & LX 27XX,
LX 71XX, LX 73XX, LX 82XX, LX 83XX, LX 85XX & LX 95XX
LXE 16XX, LXE 17XX, LXE 18XX, LXE 9XXX, NX 2XXX, NX 4XXX, NX 7XXX & NX 9XXX
SG 2XXX, SG 3XXX & SG 7XXX
UC 28XXX & UC 38XXX
4
Reliability Report
3.0
Accelerated Reliability Testing
Microsemi AMS Group performs accelerated testing to assess reliability of its devices,
•
Overstresses are used to produce the same failure mechanisms that would be seen under normal
conditions but in a much shorter period of time.
•
Acceleration factors (Temperature and Voltage) are used by Microsemi AMS to estimate failure rates
based on the results of accelerated testing.
•
The objective of accelerated testing is to identify the failure mechanisms and eliminate them as a cause of
failure during the useful life of our products.
3.1
FIT Rate Calculation and Assumptions
Microsemi uses exponential distribution of failures in time and predicts constant failure rate at operating
conditions,
•
Extrapolation uses thermal and voltage acceleration factors based on JEDEC formulas (JEP122).
•
FIT rate is calculated using JESD85 (Methods for Calculating Failure Rates in Units of FITs) standard.
•
All of the FIT (Failure in Time) rate and MTTF (Mean Time to Failure) numbers reported here use a base
set of assumptions.
o
The failure rate is calculated using Chi-square distribution at 60% confidence interval from the
small number of failures and limited sample size of the population tested.
o
The Chi-squared value is calculated from the inverse Chi-squared distribution using the desired
probability level and degrees of freedom.
o
The failure rate is then calculated from the Chi-square value:
x2 109
Failure Rate =
2 (A.F. * Device Hours)
2
where x = Chi-Squared value at 60% confidence level and (2f + 2) degrees of freedom,
where f is the number of failures, Device Hours = (No. of Devices) * (No. of Hours)
•
The Acceleration Factor (A.F.) is calculated using Arrhenius relationship.
Acceleration Factor
=
Exp {(Ea/k) × (1/Tuse – 1/Tstress)}
Where:
Ea = Activation Energy (eV), assumed 0.7 eV
k = Boltzmann’s constant (8.617 × 10–5 eV/ºK)
Tstress = Temperature at accelerated conditions in degrees Kelvin (°K = 125°C + 273.16)
Tuse = Temperature at normal use conditions in degrees Kelvin (°K = 55°C + 273.16)
A.F. = Acceleration Factor
5
Reliability Report
4.0
Silicon Reliability Summary
Using the above mentioned methodology, summary of failure rates for various process nodes (with active
products) are as shown below,
Table 4.0.1: High Temperature Operational Life Test/Burn In (HTOL/BI)
Foundry Process
(Global Foundries)
(Jazz)
(Dongbu)
(Magnachip)
(XFAB)
(Magnachip)
(Excel Power)
(Jazz)
(XFAB)
(XFAB)
(Excel Power)
(XFAB)
(Microsemi GG)
(Microsemi GG)
(Microsemi GG)
(Microsemi GG)
0.18um
0.18um
0.35um
0.35um
0.35um
0.50um
0.5um
0.5um
0.6um
0.8um
1.0um
1.0um
1.4um
2.0um
3.0um
6.0um
Total Units
743
154
750
3526
1340
796
150
450
1927
879
200
446
200
50
349
400
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Total Device Hours
1942816
438946
2965434
2925027
1816133
656364
68935
379996
1648937
593872
164916
1095000
150213
30738
88399
408490
FIT Rate
6.0511
26.7828
3.9644
4.0191
6.4732
17.9111
170.5413
30.9377
7.1296
19.7958
71.2862
10.7363
78.2638
382.4603
132.9911
28.7797
Notes:
1.
FIT rates are calculated based on 0.7ev, 60% confidence level & Tj = 55C
2.
Total device hours are normalized to Tj = 125C
Table 4.0.2: Early Life Failure Rate (ELFR)
Process
Product
Foundry
Node
LX82XX
Global Foundries
0.18um
LX82XX
Global Foundries
0.18um
Total =
6
Conditions
Units
Failures
Device Hours
125C @ 48hrs
2400
0
115200
150C @ 48hrs
2400
0
115200
4800
0
230400
Reliability Report
Table 4.0.3: High Temperature Storage Life (HTSL) – Wafer level
Product
Package
Condition
Hours
Wafers
Failures
Wafer Hours
AAP8XX
8 pin SB
150C
1000
1
0
1000
AAP8XX
8 pin SB
150C
1000
1
0
1000
AAP1XX
Bump Die
150C
1000
Total =
1
0
1000
3
0
3000
Additional wafer level reliability data (like GOI, TDDB, EM, etc) is maintained by the foundry as applicable per
their internal ongoing monitoring program.
4.1
ESD Summary
Table 4.1.1: ESD Summary (Data from HBM, CDM & MM models as applicable)
Process/Foundry
Product
HBM
CDM
MM
0.18um Global Foundries
LX82XX
4000V
2000V
150V
0.18um Global Foundries
LX82XX
2000V
2000V
0.18um Global Foundries
LX24XX
8000V
2000V
LX24XXAVIG
8000V
2000V
2000V
0.35um Dongbu
LX65XX
5000V
700V
200V
0.35um Dongbu
LX19XX
5000V
1500V
250V
0.35um Magnachip
LX71XX
500V
0.35um Magnachip
LX13XXX
1000V
0.35um Magnachip
LX22XX
1000V
500V
150V
0.35um Magnachip
LX23XXX
3000V
1500V
200V
0.35um Magnachip
LX23XXX
4000V
2000V
350V
0.35um Magnachip
LX24XXX
5000V
2000V
250V
0.35um Magnachip
LX24XXX
6000V
2000V
250V
0.35um Magnachip
LX65XX
3000V
2000V
300V
0.35um Magnachip
LX71XX
600V
2000V
0.35um Magnachip
LX71XX
1000V
750V
25V
0.35um Magnachip
LX71XX
2000V
2000V
250V
0.35um Magnachip
LX71XX
2500V
2000V
200V
0.35um Magnachip
LX71XX
1500V
1500V
100V
0.35um Magnachip
LX71XX
1500V
2000V
75V
0.35um Magnachip
LX71XX
2000V
2000V
50V
0.35um Magnachip
LX73XX
1000V
2000V
100V
0.35um Magnachip
LX82XX
5000V
2000V
150V
0.35um Magnachip
LX27XXX
3000V
2000V
AA6XX
1000
0.18um Jazz
0.35um XFAB
7
Reliability Report
0.35um XFAB
AA5XX
1000V
0.35um XFAB
LX23XXX
1500V
1500V
350V
0.50um Excel Power
LX82XX
2000V
200
0.35um XFAB
AAP8XX
1500V
150V (i/p to gnd; 2000V
(FB1, FB2 & HPF to gnd)
& 7500V (o/p to gnd)
0.35um XFAB
LX33XX
2000V
0.50um Jazz
LX13XXX
5500V
750V corner
pins, 500V all
other pins
1500
500V
0.50um Jazz
LX73XX
1500V
1000V
100V
0.50um Jazz
LX96XX
3500V
2000V
200V
0.50um Magnachip
NX41XX
1000V
500V
0.60um XFAB
LX27XX
1000V
0.60um XFAB
NX95XX
500V
2000V
50V
0.60um XFAB
LX65XX
3500V
1500V
250V
0.60um XFAB
LX17XX
0.60um XFAB
LX27XXX
5000V
2000V
200V
0.60um XFAB
LX27XXX
4000V
2000V
150V
0.80um XFAB
LX65XX
4000V
1500V
250V
1.0um Excel Power
LX65XX
3500V
1500V
250V
6.0um Microsemi GG
LX23XXX
4000V
6.0um Microsemi GG
LX23XXX
4000V
8
1000V
Reliability Report
5.0
Non-Volatile Memory Reliability Summary
Exiting data on non-volatile memory is listed below,
Table 5.1: Program/Erase Endurance Cycling – High temperature
Product
Process
Node
LX33XX
0.35um
Package
16QSOP
Total =
Temperature
# of Cycles
Units
Failures
Device Hours
85C
100
231
231
0
0
23100
23100
Temperature
# of Hrs
Units
Failures
Device Hours
-55C
1000
231
231
0
0
231000
231000
Temperature
# of Hrs
Units
Failures
Device Hours
150C
1000
231
231
0
0
231000
231000
Table 5.2: Low Temperature Data Retention
Product
Process
Node
LX33XX
0.35um
Package
16QSOP
Total =
Table 5.3: High Temperature Storage
9
Product
Process
Node
LX33XX
0.35um
Package
16QSOP
Total =
Reliability Report
6.0
Package Reliability Summary
Package level data is provided below in the following categories
6.1
-
By package
-
By products (currently supported)
Package Reliability (By Package)
Table 6.1.1: Power Temp Cycles (PTC)
Package
Conditions
Cycles
Units
Failures
Device Cycles
LGA
LFGA
QFN
Module
QFN
-65 to 150C
2000
50
0
100000
-40 to 125C
1000
50
0
50000
-65 to 150C
1000
50
0
50000
-65 to 150C
1000
50
0
50000
-40 to 85C
1000
25
0
25000
225
0
275000
130
150
150
Hours
100
1000
1000
1000
1000
Units
25
477
75
45
50
Failures
0
0
0
0
0
Device Hours
2500
477000
75000
45000
50000
150
1000
45
0
45000
150
150
150
175
150
150
150
175
Total =
1000
1000
1000
1000
1000
1000
1000
1000
170
404
50
231
75
50
50
45
1792
0
0
0
0
0
0
0
0
0
170000
404000
50000
231000
75000
50000
50000
45000
1769500
Total =
Table 6.1.2: High Temperature Storage Life (HTSL)
Package
Temperature
DFN
150
LFGA
LGA
Microphone Carrier
Board
QFN
QFN (FC)
QSOP
SOIC (NB)
SOIC (WB)
WLCSP
TSSOP
Table 6.1.3: UnBiased Highly Accelerated Stress Test (UHAST)
10
Package
Condition
Hours
Unit
Failures
Device Hours
SOIC (NB)
110C/85RH
96
25
0
2400
MSOP
110C/85RH
264
50
0
13200
Reliability Report
QSOP
110C/85RH
96
75
0
7200
QSOP
130C/85RH
96
46
0
4416
196
0
27216
Total =
Table 6.1.4: Highly Accelerated Stress Test (HAST)
Package
Condition
Hours
Units
Failures
Device Hours
DFN
130C/85RH
96
50
0
4800
LFGA
130C/85RH
96
100
0
9600
QFN (FC)
130C/85RH
96
250
0
24000
400
0
38400
Total =
Table 6.1.5: High Temperature Reverse Bias (HTRB)
Package
Conditions
Hours
Units
Failures
Device Hours
LGA
150
1000
50
0
50000
Module
150
1000
50
0
50000
LFGA
132
2000
154
0
308000
254
0
408000
Total =
Table 6.1.6: Thermal Shock (TS)
Package
Conditions
Cycles
Units
Failures
Device Cycles
Ceramic SOIC
-55C to +125C
15
30
0
450
CERDIP
-55C to +125C
100
150
0
15000
100
549
0
54900
1000
700
0
700000
1000
77
0
77000
1000
50
0
50000
2000
150
0
300000
DFN
-55C to +125C
LFGA
-55C to +125C
LGA
-55C to +125C
Module
-55C to +125C
1000
50
0
50000
-40C to +100C
100
400
0
40000
MSOP
11
-55C to +125C
100
50
0
5000
PDIP
-55C to +125C
100
50
0
5000
Plastic 1206
-40C to +100C
100
46
0
4600
PLCC
-55C to +125C
100
50
0
5000
QFN
-55C to +125C
100
1045
0
104500
1000
149
0
149000
QFN (FC)
-55C to +125C
1000
199
0
199000
QSOP
-55C to +125C
100
98
0
9800
1000
100
0
100000
SC70
-55C to +125C
100
50
0
5000
SOIC (NB)
-55C to +125C
100
1050
0
105000
1000
50
0
50000
Reliability Report
100
300
0
30000
1000
50
0
50000
-55C to +125C
100
50
0
5000
SSOP
-55C to +125C
100
100
0
10000
TO 220
-55C to +125C
100
100
0
10000
SOIC (WB)
-55C to +125C
SOT 23
TSOT
-55C to +125C
100
100
0
10000
TSOT 23
-55C to +125C
100
150
0
15000
TSSOP
-55C to +125C
100
298
0
29800
UDFN
-55C to +125C
100
50
0
5000
6341
0
2194050
Hours
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
Units
150
1397
50
50
50
50
1199
250
253
200
50
998
50
350
77
50
100
100
100
149
531
50
6254
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Hours
14400
134112
4800
4800
4800
4800
110304
24000
24288
19200
4800
95808
4800
33600
7392
4800
9600
9600
9600
14304
50976
4800
595584
Cycles
Units
Failures
Device Cycles
100
30
0
3000
100
150
0
15000
Total =
Table 6.1.7: Auto Clave (AC)
Package
CERDIP
DFN
MSOP
PDIP
PLCC
QFN
QFN (FC)
QSOP
SC70
SOIC (NB)
SOIC (WB)
SOT
SOT 23
SSOP
TO 220
TSOT
TSOT 23
TSSOP
UDFN
Conditions
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C
121C, 15 psig
121C, 15 psig
121C
121C, 15 psig
121C, 15 psig
121C, 15 psig
130C, 85%RH
121C, 15 psig
121C
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
Total =
Table 6.1.8: Temperature Cycles (TC)
Package
Ceramic SOIC
CERDIP
12
Conditions
method 1010,
condition C
-65C to +150C
Reliability Report
CQFP
method 1010,
condition C
DFN
-65C to +150C
LFGA
-65C to +150C
LGA
-65C to +150C
Module
-65C to +150C
-40C to +100C
-65C to +150C
-65C to +150C
-40C to +100C
-65C to +150C
-55C to + 125C
MSOP
PDIP
Plastic 1206
PLCC
QFN
QFN (FC)
-65C to +150C
-65C to +150C
-65C to +150C
QSOP
SC70
JESD22-A104-B
-65C to 175C
-65C to +150C
SOIC (NB)
-65C to +150C
SOIC (WB)
-65C to +150C
SOT 23
SSOP
TO 220
TSOT
TSOT 23
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +175C
-65C to +150C
-40C to +125C
-65C to +150C
Total =
TSSOP
UDFN
WLCSP
13
100
15
0
1500
100
500
1000
500
500
1000
500
100
100
100
100
100
700
100
500
100
500
1000
100
500
100
500
500
100
100
250
500
100
500
100
100
100
100
100
100
500
100
500
500
700
700
77
154
50
150
50
400
50
50
49
50
75
898
224
50
300
231
100
100
22
45
231
50
1050
25
50
300
50
50
101
100
100
149
300
231
50
100
50
7707
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
70000
350000
77000
77000
25000
150000
25000
40000
5000
5000
4900
5000
52500
89800
112000
5000
150000
231000
10000
50000
2200
22500
115500
5000
105000
6250
25000
30000
25000
5000
10100
10000
10000
14900
30000
115500
5000
50000
25000
2165650
Reliability Report
Table 6.1.9: Temperature Humidity Bias (THB)
Package
DFN
LGA
Module
QFN
QFN (FC)
QSOP
SOIC (WB)
SOT
TO
WLCSP
TSSOP
14
Conditions
85C/85RH
85C/85RH
85C/85RH
130C/85RH
85C/85RH
130C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
Total =
Hours
2000
2025
1000
116
1000
96
3000
1000
1000
160
1000
1000
1000
Units
198
50
50
75
50
25
150
281
50
77
50
50
231
1337
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Hours
198000
101250
50000
8700
50000
2400
150000
281000
50000
12320
50000
50000
231000
1234670
Reliability Report
6.2
Package Reliability (By Product)
Table 6.2.1: Power Temp Cycles (PTC)
Product
Package
LX24XX
LD68-2
LX96XX
QFN1515-MCP
LG-2
LXM24XX
Module
NX95XX
LQ55-32
Total =
Conditions
-40 to 125C
-40 to 85C
-65 to 150C
-65 to 150C
-65 to 150C
Cycles
1000
1000
2000
1000
1000
Units
50
25
50
50
50
225
Failures
0
0
0
0
0
0
Device Cycles
50000
25000
100000
50000
50000
275000
150
150
150
150
150
150
150
150
150
150
Hours
1000
1000
1000
1000
1000
1000
100
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
Units
50
75
45
50
50
25
25
125
50
100
50
50
100
50
50
45
102
177
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Hours
50000
75000
45000
50000
50000
25000
2500
125000
50000
100000
50000
50000
100000
50000
50000
45000
102000
177000
150
1000
77
0
77000
150
150
150
1000
1000
1000
50
75
50
0
0
0
50000
75000
50000
150
1000
45
0
45000
175
1000
45
0
45000
1561
0
1538500
Table 6.2.2: High Temperature Storage Life (HTSL)
Product
LX22XX
Package
DB-36
LX24XX
LD68-2
LX27XXX
LX27XXX
LX27XXX
D-16
DW-24
D-14
Condition
150
130
150
150
150
150
LX71XX
LD335-12
150
LX71XX
LX71XX
LX71XX
LX71XX
LX71XX
LX71XX
LX73XX
LX73XX
LX82XX
LX82XX
LX82XX
LX82XX
LX96XX
LXM24XX
AA6XX
LX33XX
15
CSP216-20
LD22-8
LD335-12
LD33-10
LQ22-12
LQ22-12
LQ44-24
LQ44-24
LD33-10
LQ32-12
LQ 3.5x4.5-24
vQFN-Fcol
LD32-8
QFN1515-MCP
LG-2
Microphone
Carrier Board
14-pin TSSOP
(RoHS)
Total =
Reliability Report
Table 6.2.3: UnBiased Highly Accelerated Stress Test (UHAST)
Product
Package
Conditions
Hours
Units
Failures
Device Hours
LX19XX
PL-8
110C/85RH
264
50
0
13200
110C/85RH
96
25
0
2400
130C/85RH
96
46
0
4416
121
0
20016
Hours
96
96
96
Units
100
50
175
Failures
0
0
0
Device Hours
9600
4800
16800
96
75
0
7200
400
0
38400
Hours
1000
1000
2000
Units
50
50
154
254
Failures
0
0
0
0
Device Hours
50000
50000
308000
408000
Cycles
100
100
100
100
1000
100
100
100
100
100
100
100
100
100
100
100
1000
100
100
100
Units
150
50
50
197
50
50
50
98
50
100
50
46
50
200
50
50
100
50
50
50
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Cycles
15000
5000
5000
19700
50000
5000
5000
9800
5000
10000
5000
4600
5000
20000
5000
5000
100000
5000
5000
5000
LX27XXX
AA6XX
D-14
16 pin QSOP
(RoHS)
Total =
Table 6.2.4: Highly Accelerated Stress Test (HAST)
Product
Package
Condition
LX24XX
LD68-2
130C/85RH
LX82XX
LD33-10
130C/85RH
LX82XX
LQ32-12
130C/85RH
LQ 3.5x4.5-24
LX82XX
130C/85RH
vQFN-Fcol
Total =
Table 6.2.5: High Temperature Reverse Bias (HTRB)
Product
Package
Conditions
LG-2
150
LXM24XX
Module
150
LX24XX
LD68-2
132
Total =
Table 6.2.6: Thermal Shock (TS)
Product
Package
LX19XX
DU-8
LU-6
LX71XX
SG-5
LX13XXX
LQ54-34
LX13XXX
LQ54-34
LX13XXX
LD33-10
LX16XX
LQ57-38
LX16XX
PW-24
LX16XX
PW-20
DB-20
LX16XX
DW-20
LX19XX
BC
DU-8
LX19XX
DU-8-C
LX19XX
DU-10
LX19XX
LQ44-24
DB-36
LX22XX
LQ57-38
LX23XXX
LQ55-32
LX23XXX
DB-48
16
Conditions
-40C to +100C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-40C to +100C
-40C to +100C
-40C to +100C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
Reliability Report
LQ77-48
DB-36
LQ66-36
LG-2
LD68-2
LQ88-56
LQ33-16
D-16
DW-24
SC-3
DW-28
PW-28
D-16
DW-20
D-16
PW-16
D-16
D-14
D-14
LD335-12
LQ33-12
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
LX71XX
LD335-12
-55C to +125C
LX71XX
LD22-8
-55C to +125C
LX71XX
LD335-12
-55C to +125C
LX71XX
LX71XX
LX72XX
LX73XX
LX73XX
LX82XX
LX8XX
LD33-10
LQ22-12
SM-6
LQ33-20
LQ44-24
SE-5
SE-5
LG-2
Module
LQ44-24
SE-5
LQ55-32
N-16
N-18
Q-20
P-5
M-8
N-18
20 pin ceramic
SOIC
24L 4x4x0.5
QFN (RoHS)
LX23XXX
LX24XX
LX24XX
LX24XXX
LX27XX
LX27XXX
LX27XXX
LX43XX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX71XX
LXM24XX
NX24XX
NX41XX
NX95XX
SG15XX
SG15XX
SG28XX
SG29XXX
SG34XX
SG35XX
AAHS2XX
AA6XX
17
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
-55C to +125C
100
100
100
1000
1000
100
100
100
1000
100
100
100
100
100
100
100
100
100
100
100
100
100
1000
1000
100
1000
1000
1000
100
100
1000
100
100
2000
1000
100
100
100
100
100
100
100
100
100
100
48
50
50
77
50
50
100
50
50
50
50
300
100
250
50
50
150
200
200
50
50
200
300
100
150
50
199
50
150
149
50
50
150
50
48
50
50
50
50
50
100
50
50
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
10000
4800
5000
50000
77000
5000
5000
10000
50000
5000
5000
5000
30000
10000
25000
5000
5000
15000
20000
20000
5000
5000
200000
300000
10000
150000
50000
199000
5000
15000
149000
5000
5000
300000
50000
4800
5000
5000
5000
5000
5000
10000
5000
5000
-55C to +125C
15
15
0
225
-55C to +125C
100
50
0
5000
Reliability Report
Total =
5877
0
2153925
Units
50
50
200
50
50
50
100
50
100
50
50
50
50
100
50
50
50
100
50
50
50
50
150
50
50
50
50
249
100
250
50
49
100
50
200
200
50
249
300
249
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Hours
4800
4800
19200
4800
4800
4800
9600
4800
9600
4800
4800
4800
4800
9600
4800
4800
4800
9600
4800
4800
4800
4800
14400
4800
4800
4800
4800
23904
9600
24000
4800
4704
9600
4800
19200
19200
4800
23904
28800
23904
Table 6.2.7: Auto Clave (AC)
Product
LX65XX
Package
LU-6
SG-5
LQ54-34
LQ54-34
LD33-10
LQ57-38
PW-24
PW-20
DB-20
DW-20
LD33-8
DU-10
LQ44-24
DB-36
LQ57-38
LQ55-32
DB-48
LQ77-48
DB-36
LQ66-36
LQ88-56
LQ33-16
D-16
DW-24
SC-3
DW-28
PW-28
D-16
DW-20
D-16
PW-16
D-16
LX65XX
D-14
LX65XX
D-14
LD335-12
LQ33-12
LD335-12
LD22-8
LD335-12
71XX
LX13XXX
LX13XXX
LX13XXX
LX16XX
LX16XX
LX16XX
LX16XX
LX19XX
LX19XX
LX19XX
LX22XX
LX23XXX
LX23XXX
LX23XXX
LX24XXX
LX27XX
LX27XXX
LX27XXX
LX43XX
LX65XX
LX65XX
LX65XX
LX65XX
LX71XX
LX71XX
LX71XX
LX71XX
18
Conditions
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
130C, 85%RH
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
Hours
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
Reliability Report
LX71XX
LX71XX
LX71XX
LX72XX
LX73XX
LX73XX
LX82XX
LX82XX
LX82XX
NX24XX
NX41XX
NX95XX
SG15XX
SG15XX
SG28XX
SG29XXX
SG34XX
SG35XX
AA55X
AA6XX
AA594C
AA594D
LX33XX
LD33-10
LQ22-12
LQ22-12
SM-6
LQ33-20
LQ44-24
SE-5
SE-5
LD32-8
LQ44-24
SE-5
LQ55-32
N-16
N-18
Q-20
P-5
M-8
N-18
4LD SOT143
24L 4x4x0.5
QFN (RoHS)
16 pin QSOP
(RoHS)
16 pin QSOP
(RoHS)
14-pin TSSOP
(RoHS)
Total =
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C, 15 psig
121C
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
50
200
50
50
150
149
50
49
50
50
50
50
50
50
50
100
50
50
77
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4800
19200
4800
4800
14400
14304
4800
4704
4800
4800
4800
4800
4800
4800
4800
9600
4800
4800
7392
121C
96
50
0
4800
121C
96
11
0
1056
121C
96
11
0
1056
121C, 15 psig
96
231
0
22176
5574
0
535104
Units
150
50
50
149
50
50
50
100
50
101
50
50
49
50
Failures
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Device Cycles
15000
5000
5000
14900
25000
5000
5000
10000
5000
10100
5000
5000
4900
5000
Table 6.2.8: Temperature Cycles (TC)
Product
LX19XX
LX71XX
LX13XXX
LX13XXX
LX13XXX
LX16XX
LX16XX
LX16XX
LX16XX
LX19XX
LX19XX
LX19XX
19
Package
DU-8
LU-6
SG-5
LQ54-34
LQ54-34
LD33-10
LQ57-38
PW-24
PW-20
DB-20
DW-20
LD33-8
BC
DU-8
Conditions
-40C to +100C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-40C to +100C
-40C to +100C
Cycles
100
100
100
100
500
100
100
100
100
100
100
100
100
100
Reliability Report
LX24XX
LX24XX
LX24XXX
LX27XX
DU-8-C
DU-10
LQ44-24
DB-36
LQ57-38
LQ55-32
DB-48
LQ77-48
DB-36
LQ66-36
LG-2
LD68-2
LQ88-56
LQ33-16
-40C to +100C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
LX27XXX
D-16
-65C to +150C
LX27XXX
LX27XXX
LX43XX
DW-24
D-14
SC-3
DW-28
PW-28
D-16
DW-20
D-16
PW-16
D-16
D-14
D-14
LD335-12
LQ33-12
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
LX71XX
LD335-12
-65C to +150C
LX71XX
CSP216-20
LX71XX
LD22-8
-40C to +125C
-65C to +150C
-65C to +150C
LX71XX
LD335-12
-65C to +150C
LX71XX
LX71XX
LX71XX
LX72XX
LX73XX
LX73XX
LX73XX
LD33-10
LQ22-12
LQ22-12
SM-6
LQ33-20
LQ44-24
LQ44-24
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-65C to +150C
-55C to + 125C
LX19XX
LX19XX
LX22XX
LX23XXX
LX23XXX
LX23XXX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX65XX
LX71XX
20
100
100
100
500
100
100
100
100
100
100
500
500
100
100
100
500
500
250
100
100
100
100
100
100
100
100
100
100
100
100
100
500
500
500
500
100
500
500
500
500
100
100
500
700
200
50
49
100
50
50
50
100
50
50
50
154
50
50
100
50
50
25
50
50
50
300
100
250
50
50
150
200
200
50
50
200
100
50
301
100
149
50
200
50
50
150
149
75
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
20000
5000
4900
50000
5000
5000
5000
10000
5000
5000
25000
77000
5000
5000
10000
25000
25000
6250
5000
5000
5000
30000
10000
25000
5000
5000
15000
20000
20000
5000
5000
100000
50000
25000
150500
10000
74500
25000
100000
25000
5000
15000
74500
52500
Reliability Report
LX82XX
LX82XX
LX82XX
LD33-10
SE-5
SE-5
-65C to +150C
-65C to +150C
-65C to +150C
LX82XX
LQ32-12
-65C to +150C
LX82XX
LX82XX
LX96XX
LXM24XX
NX24XX
NX41XX
NX95XX
SG15XX
SG15XX
SG28XX
SG29XXX
SG34XX
SG35XX
AA594C
AA594D
AA6XX
AA6XX
AAHS2XX
LX33XX
LQ 3.5x4.5-24
-65C to +150C
vQFN-Fcol
LD32-8
-65C to +150C
QFN1515-MCP
-65C to +150C
LG-2
-65C to +150C
Module
-65C to +150C
LQ44-24
-65C to +150C
SE-5
-65C to +150C
LQ55-32
-65C to +150C
N-16
-65C to +150C
N-18
-65C to +150C
Q-20
-65C to +150C
P-5
-65C to +150C
M-8
-65C to +150C
N-18
-65C to +150C
16 pin QSOP
-65 to 150C
(RoHS)
16 pin QSOP
-65 to 150C
(RoHS)
24L 4x4x0.5
-65 to 150C
QFN (RoHS)
16 pin QSOP
JESD22-A104-B
(RoHS)
Condition C
20 pin ceramic
method 1010,
SOIC
condition C
14-pin TSSOP
-65C to +175C
(RoHS)
Total =
1000
100
100
500
1000
77
50
50
50
154
0
0
0
0
0
77000
5000
5000
25000
154000
1000
77
0
77000
100
500
1000
500
100
100
100
100
100
100
100
100
100
50
75
150
50
50
49
50
50
50
50
100
50
50
0
0
0
0
0
0
0
0
0
0
0
0
0
5000
37500
150000
25000
5000
4900
5000
5000
5000
5000
10000
5000
5000
100
11
0
1100
100
11
0
1100
100
50
0
5000
500
45
0
22500
100
15
0
1500
500
231
0
115500
7096
0
2032150
Units
50
50
100
50
98
100
50
50
25
75
Failures
0
0
0
0
0
0
0
0
0
0
Device Hours
50000
50000
100000
50000
98000
100000
50000
50000
2400
8700
Table 6.2.9: Temperature Humidity Bias (THB)
Product
LX22XX
LX27XXX
LX71XX
LX71XX
LX71XX
LX71XX
LX71XX
LX73XX
LX82XX
LX96XX
21
Package
DB-36
DW-24
LD335-12
CSP216-20
LD22-8
LQ22-12
LQ22-12
LQ44-24
LQ32-12
QFN1515-MCP
Conditions
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
85C/85RH
130C/85RH
130C/85RH
Hours
1000
1000
2000
1000
2000
2000
1000
1000
96
116
Reliability Report
LXM24XX
AA550
LX3301
22
LG-2
Module
4LD SOT143
14-pin TSSOP
(RoHS)
Total =
85C/85RH
85C/85RH
85C/85RH
2025
1000
160
50
50
77
0
0
0
101250
50000
12320
85C/85RH
1000
231
0
231000
1056
0
953670
Reliability Report
Revision History
23
ECO
Revision
Description of change
Date of Revision
01897
A
Initial Release (covering qualification data since January 2008 till
August 2015)
10/23/2015
01939
B
Updated tables (4.0.1, 4.1.1, 6.1.2, 6.1.7, 6.1.8, 6.1.9, 6.2.2,
6.2.7, 6.2.8, 6.2.9) based on additional qualification data (from
September 2015 thru December 2015)
12/17/2015
XXXXX
C
Updated tables HTOL Table 4.0.1 with qualification data from
March RTP and split 0.6um and 1.0um product from previous
data.
4/01/2016
Reliability Report