View detail for Atmel AVR2080: REB231FE2 - Hardware User's Manual

APPLICATION NOTE
Atmel AVR2080: REB231FE2 – Hardware User’s Manual
8-bit Atmel AVR Microcontrollers
Features
•
High-performance, 2.4GHz, RF-CMOS Atmel AT86RF231 radio transceiver
targeted for IEEE 802.15.4, ZigBee, and ISM applications
• Industry leading 104dB link budget
• Ultra-low current consumption
• Ultra-low supply voltage (1.8V to 3.6V)
•
•
•
•
•
High-performance, fully integrated 2.4GHz RF Front End Module SE2431L
Hardware supported antenna diversity
RF reference design and high-performance evaluation platform
Interfaces to various Atmel microcontroller development platforms
Board information EEPROM
• MAC address
• Board identification, features, and serial number
• Crystal calibration values
Introduction
This manual describes the Atmel REB231FE2 radio extender board supporting
increased TX output power and RX sensitivity as well as antenna diversity. The board
is designed using the AT86RF231 radio transceiver in combination with the Skyworks
SE2431L RF front end module (FEM). Detailed information is given in the individual
sections about the board functionality, the board interfaces and the board design.
The REB231FE2 connects directly to the REB controller base board (REB-CBB), or
can be used as an RF interface in combination with an Atmel microcontroller
development platform. The REB231FE2 together with a microcontroller forms a fully
functional wireless node.
Figure 1.
Top and bottom view of the REB231FE2.
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Table of Contents
1. Disclaimer ............................................................................................ 3 2. Overview .............................................................................................. 3 3. Functional description .......................................................................... 4 3.1 Interface connector specification ....................................................................... 4 3.1.1 REB-CBB (Atmel ATxmega256A3) and Atmel STK501 (Atmel
ATxmega1281) configuration .............................................................. 5 3.1.2 Atmel ATmega644 configuration ......................................................... 5 3.2 ID EEPROM ...................................................................................................... 6 3.3 Supply current sensing...................................................................................... 7 3.4 Radio transceiver reference clock ..................................................................... 8 3.5 RF section ......................................................................................................... 9 4. PCB layout description ....................................................................... 10 4.1 PCB detail 1 – balanced RF pin fan out .......................................................... 11 4.2 PCB detail 2 – crystal routing .......................................................................... 12 4.3 PCB – analog GND routing ............................................................................. 12 4.4 PCB – digital GND routing .............................................................................. 13 4.5 PCB – GND plane ........................................................................................... 13 4.6 Ceramic antenna design and tuning................................................................ 13 5. Mechanical description ...................................................................... 14 6. Electrical characteristics .................................................................... 15 6.1 Absolute maximum ratings .............................................................................. 15 6.2 Recommended operating range ...................................................................... 15 6.3 Current consumption ....................................................................................... 15 6.4 Transmitter characteristics .............................................................................. 16 6.5 Receiver characteristics .................................................................................. 16 7. Abbreviations ..................................................................................... 17 Appendix A. PCB design data ........................................................... 18 A.1 Schematic ....................................................................................................... 18 7.2 Assembly drawing ........................................................................................... 19 A.2 Bill of materials ................................................................................................ 20 Appendix B. Radio certification .......................................................... 21 B.1 United States (FCC) ........................................................................................ 21 B.2 Europe ............................................................................................................ 21 Appendix C. References .................................................................... 23 Appendix D. Revision history ............................................................. 24 Appendix E. EVALUATION BOARD/KIT IMPORTANT NOTICE....... 25 Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
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1.
Disclaimer
Typical values contained in this application note are based on simulations and testing of individual examples.
Any information about third-party materials or parts was included in this document for convenience. The vendor may
have changed the information that has been published. Check the individual vendor information for the latest changes.
2.
Overview
The radio extender board is assembled with an Atmel AT86RF231 radio transceiver [1], a Skyworks SE2431L FEM [9]
and two ceramic antennas, demonstrating an increased link budget together with hardware-based antenna diversity,
improving radio link robustness in harsh environments significantly [3].
The radio extender board was designed to interface to an Atmel microcontroller development platform. The
microcontroller board in combination with the REB provides an ideal way to:
•
Evaluate the outstanding radio transceiver performance, such as the excellent receiver sensitivity achieved at
ultra-low current consumption
•
•
Test the radio transceiver’s comprehensive hardware support of the IEEE 802.15.4 standard
Test the radio transceiver’s enhanced feature set, which includes antenna diversity, AES, high data rate
modes and other functions
The photograph in Figure 2-1 shows a development and evaluation setup using the REB-CBB [2] in combination with
the Atmel REB231FE2 radio extender board.
Figure 2-1. The REB231F2 connected to a REB-CBB.
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3.
Functional description
The block diagram of the Atmel REB231FE2 radio extender board is shown in Figure 3-1. The power supply pins and all
digital I/Os of the radio transceiver are routed to the 2 × 20-pin expansion connector to interface to a power supply and
a microcontroller.
The Atmel AT86RF231 antenna diversity (AD) feature supports the control of two antennas (ANT0/ANT1). A digital
control pin (DIG1) is used to control an external RF switch selecting one of the two antennas. During the RX listening
period, the radio transceiver switches between the two antennas autonomously, without the need for microcontroller
interaction, if the AD algorithm is enabled. Once an IEEE 802.15.4 synchronization header is detected, an antenna
providing sufficient signal quality is selected to receive the remaining frame. This ensures reliability and robustness,
especially in harsh environments with strong multipath fading effects.
Board-specific information such as board identifier, the node MAC address, and production calibration values are stored
in an ID EEPROM. The SPI bus of the EEPROM is shared with the radio transceiver’s interface.
Figure 3-1. REB231FE2 block diagram.
TP7
VDD
DIG3
ANT2
TP6
VDD
AT86RF231
CLKM
DIG2
DIG1
XTAL2
XTAL1
ANT1
IRQ
SLPTR
RFN
4
SPI
EXPAND1
LPF
DIG2
RFP
50R
X2
Protection
VSS
RSTN
LPF
SE2431L
X3
VDD
DIG4
ID
EEPROM
XTAL
3.1
Interface connector specification
The REB is equipped with a 2 × 20-pin, 100mil expansion connector. The pin assignment enables a direct interface to
the REB-CBB [2]. Further, the interface connects to the Atmel STK®500/501 microcontroller development platform to
enable support for various Atmel 8-bit AVR® microcontrollers.
The REB is preconfigured to interface to the REB-CBB and STK501 with an Atmel ATmega1281.
If an Atmel ATmega644 is used as the microcontroller, the 0Ω resistors R10 through R18 must be removed and reinstalled on the board manually as resistors R20 through R28 (see Appendix A.1).
Other microcontroller development platforms need to be interfaced using dedicated adapter boards.
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3.1.1
REB-CBB (Atmel ATxmega256A3) and Atmel STK501 (Atmel ATxmega1281) configuration
Table 3-1.
Pin#
3.1.2
Default expansion connector mapping.
Function
Pin#
Function
1
GND
2
GND
3
n.c.
4
n.c.
5
n.c.
6
n.c.
7
n.c.
8
n.c.
9
n.c.
10
n.c.
11
n.c.
12
n.c.
13
n.c.
14
n.c.
15
n.c.
16
n.c.
17
XT1 (MCLK)
18
n.c.
19
VCC
20
VCC
21
GND
22
GND
23
PB7 (open)
24
PB6 (open)
25
PB5 (RSTN)
26
PB4 (SLPTR)
27
PB3 (MISO)
28
PB2 (MOSI)
29
PB1 (SCLK)
30
PB0 (SEL)
31
PD7 (TP1)
32
PD6 (MCLK)
33
PD5 (TP2)
34
PD4 (DIG2)
35
PD3 (TP3)
36
PD2 (open)
37
PD1 (TP4)
38
PD0 (IRQ)
39
GND
40
EE#WP (write protect EEPROM)
Atmel ATmega644 configuration
Table 3-2.
Pin#
Expansion connector mapping when assembled for ATmega644.
Function
Pin#
Function
1
GND
2
GND
3
n.c.
4
n.c.
5
n.c.
6
n.c.
7
n.c.
8
n.c.
9
n.c.
10
n.c.
11
n.c.
12
n.c.
13
n.c.
14
n.c.
15
n.c.
16
n.c.
17
XT1 (MCLK)
18
n.c.
19
VCC
20
VCC
21
GND
22
GND
23
PB7 (SCLK)
24
PB6 (MISO)
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Pin#
3.2
Function
Pin#
Function
25
PB5 (MOSI)
26
PB4 (SEL)
27
PB3 (open)
28
PB2 (RSTN)
29
PB1 (MCLK)
30
PB0 (open)
31
PD7 (SLPTR)
32
PD6 (DIG2)
33
PD5 (TP2)
34
PD4 (open)
35
PD3 (TP3)
36
PD2 (IRQ)
37
PD1 (TP4)
38
PD0 (open)
39
GND
40
EE#WP (write protect EEPROM)
ID EEPROM
To identify the board type by software, an optional identification (ID) EEPROM is populated. Information about the
board, the node MAC address and production calibration values are stored here. An Atmel AT25010B [8] with 128 × 8bit organization and SPI bus is used because of its small package and low-voltage / low-power operation.
The SPI bus is shared between the EEPROM and the transceiver. The select signal for each SPI slave (EEPROM,
radio transceiver) is decoded with the reset line of the transceiver, RSTN. Therefore, the EEPROM is addressed when
the radio transceiver is held in reset (RSTN = 0) (see Figure 3-2).
Figure 3-2. EEPROM access decoding logic (Atmel ATmega1281 configuration).
PB5 (RSTN)
PB0 (SEL)
RSTN
>1
PB1..3 (SPI)
SEL#
/RST
/SEL
Transceiver
AT86RF231
SPI
>1
#CS
On-Board
EEPROM
The EEPROM data are written during board production testing. A unique serial number, the MAC address (1), and
calibration values are stored. These can be used to optimize system performance.
Final products do not require this external ID EEPROM. All data can be stored directly within the
microcontroller’s internal EEPROM.
Note:
Note:
1.
MAC addresses used for this package are Atmel property. The use of these MAC addresses for
development purposes is permitted.
Figure 3-3 shows a detailed description of the EEPROM data structure.
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Table 3-3.
ID EEPROM mapping.
Address
Name
Type
Description
0x00
MAC address
uint64
MAC address for the 802.15.4 node, little endian byte order
0x08
Serial number
uint64
Board serial number, little endian byte order
0x10
Board family
uint8
Internal board family identifier
0x11
Revision
uint8[3]
Board revision number ##.##.##
0x14
Feature
uint8
Board features, coded into seven bits
7
Reserved
6
Reserved
5
External LNA
4
External PA
3
Reserved
2
Diversity
1
Antenna
0
SMA connector
0x15
Cal OSC 16MHz
uint8
RF231 XTAL calibration value, register XTAL_TRIM
0x16
Cal RC 3.6V
uint8
Atmel ATmega1281 internal RC oscillator calibration value @ 3.6V, register
OSCCAL
0x17
Cal RC 2.0V
uint8
Atmel ATmega1281 internal RC oscillator calibration value @ 2.0V, register
OSCCAL
0x18
Antenna gain
Int8
Antenna gain [resolution 1/10dBi].
For example, 15 will indicate a gain of 1.5dBi.
The values 00h and FFh are per definition invalid. Zero or
-0.1dBi has to be indicated as 01h or FEh
0x20
Board name
char[30]
Textual board description
0x3E
CRC
uint16
16-bit CRC checksum, standard ITU-T generator polynomial G16(x) = x16 + x12
+ x5 + 1
Figure 3-3. Example EEPROM dump.
-----| EEPROM dump |-------------0000 - 49 41 17 FF FF 25 04 00 D6 11
0010 - 02 04 01 01 06 02 A8 A9 01 FF
0020 - 52 61 64 69 6F 45 78 74 65 6E
0030 - 46 45 32 00 00 00 00 00 00 00
0040 - FF FF FF FF FF FF FF FF FF FF
0050 - FF FF FF FF FF FF FF FF FF FF
0060 - FF FF FF FF FF FF FF FF FF FF
0070 - FF FF FF FF FF FF FF FF FF FF
----------------------------------
3.3
00
FF
64
00
FF
FF
FF
FF
00
FF
65
00
FF
FF
FF
FF
2A
FF
72
00
FF
FF
FF
FF
00
FF
32
00
FF
FF
FF
FF
00
FF
33
8D
FF
FF
FF
FF
00
FF
31
9B
FF
FF
FF
FF
IA...%......*...
................
RadioExtender231
FE2.............
................
................
................
................
Supply current sensing
A jumper, JP1, is placed in the supply voltage trace to offer an easy way for current sensing of active components one
the Atmel REB231FE2, see Figure 3-4.
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The power supply pins of the radio transceiver and FEM are protected against overvoltage stress and reverse polarity at
the EXPAND1 pins (net CVTG, net DGND) using a Zener diode (D1) and a thermal fuse (F1) (see Appendix A.1). This
is required because the Atmel STK500 will provide 5V as default voltage, and the board can also be mounted with
reverse polarity.
Depending on the actual supply voltage, the diode D1 can consume several milliamperes. This has to be considered
when the current consumption of the whole system is measured. In such a case, D1 should be removed from the board.
To achieve the best RF performance, the analog (EVDD, AGND) and digital (DEVDD, DGND) supply are separated
from each other by a CLC PI-element. Digital and analog ground planes are connected together on the bottom layer,
underneath the radio transceiver IC. Further details are described in Chapter 4, page 10.
All components connected to nets DEVDD/EVDD contribute to the total current consumption.
Note:
While in radio transceiver SLEEP state, most of the supply current is drawn by the 1MΩ pull-up resistor, R9, connected
to the ID EEPROM and the EEPROM standby current.
Figure 3-4. Power supply routing.
CVTG
F1
L1
JP1
MICROSMD035F
DEVDD
EVDD
[email protected]
X4
D1
BZG05C3V9
C18
4.7uF
C30
100n
C31
100n
C26
4.7uF
DGND
DGND
3.4
DGND
Radio transceiver reference clock
The integrated radio transceiver is clocked by a 16MHz reference crystal. The 2.4GHz modulated signal is derived from
this clock. Operating the node according to IEEE 802.15.4 [4], the reference frequency must not exceed a deviation of
±40ppm. The absolute frequency is mainly determined by the external load capacitance of the crystal, which depends
on the crystal type and is given in its datasheet.
The radio transceiver reference crystal, Q1, shall be isolated from fast switching digital signals and surrounded by a
grounded guard trace to minimize disturbances of the oscillation. Detailed layout considerations can be found in
Section 4.2.
The REB uses a Siward CX4025 crystal with load capacitors of 10pF and 12pF. The imbalance between the load
capacitors was chosen to be as close as possible to the desired resonance frequency with standard components. To
compensate for fabrication and environment variations, the frequency can be further tuned using the radio transceiver
register XOSC_CTRL (0x12) (refer to [1]). The REB production test guarantees a tolerance of within +20ppm and 5ppm. The correction value, to be applied to TRX register XOSC_CTRL (0x12), is stored in the onboard EEPROM (see
Section 3.2).
The reference frequency is also available at pin CLKM of the radio transceiver and, depending on the related register
setting; it is divided by an internal prescaler. CLKM clock frequencies of 16MHz, 8MHz, 4MHz, 2MHz, 1MHz, 250kHz or
62.5kHz are programmable (refer to [1]). The CLKM signal is filtered by a low-pass filter to reduce harmonic emissions
within the 2.4GHz ISM band. The filter is designed to provide a stable 1MHz clock signal with correct logic level to a
microcontroller pin with sufficiently suppressed harmonics. CLKM frequencies above 1MHz require a redesign of R8
and C36. In case of RC cut-off frequency adjustments, depending on the specific load and signal routing conditions, one
may observe performance degradation of channel 26.
Note:
Channel 26 (2480MHz) is affected by the following harmonics: 155 × 16MHz or 310 × 8MHz.
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By default, CLKM is routed to a microcontroller timer input; check the individual configuration resistors in the schematic
drawing. To connect CLKM to the microcontroller main clock input, assemble R3 with a 0Ω resistor.
RF section
The Atmel AT86RF231 radio transceiver incorporates all RF and BB critical components necessary to transmit and
receive signals according to IEEE 802.15.4 or proprietary ISM data rates.
To further improve system TX output power and RX sensitivity a FEM is connected to the radio transceiver.
The Skyworks SE2431L FEM [9] is a high performance, fully integrated module in a 3 × 4 × 0.9mm³ 24 pin QFN
package. It incorporates a transmit power amplifier (PA) with harmonic filtering, a receive low noise amplifier (LNA) with
optional bypass switch, transmit/receive (TR) switching and an antenna diversity switch. A block diagram of the
SE2431L is shown in Figure 3-5.
ANT_SEL
CTX
CSD
Figure 3-5. SE2431L block diagram.
CPS
3.5
Logic
control
PA
ANT1
TR
ANT2
LNA
SE2431L
In transmit mode, nominal antenna port transmit output power is +20dBm for Atmel AT86RF231 sub-register setting
TX_PWR = 0x0A at EVDD = 3.0V nominal supply voltage. Second and third harmonics levels are less than 42dBm/MHz. Transmit output power level is adjusted using the AT86RF231 TX output power, controlled via register bits
TX_PWR.
The supply voltage can be increased to 3.6V to further increase transmit output power. There is provision on the PCB
for C-L-C low pass filtering at the antenna ports to reduce harmonic levels at these higher output powers.
In receive mode, conducted sensitivity is better than -104dBm for 1% packet error rate. The SE2431L has a typical
receive noise figure of 2dB which includes all RF switch input losses.
Referring to the Atmel REB231FE2 schematic in Appendix A.1, the RF interface consists of two antenna ports. By
default two on-board ceramic antennas are connected allowing radiated measurements. Solder pads located along the
tuning line allow for the optimization of antenna matching without the need for redesigning the PCB. Detailed
information about the antenna diversity feature is given in [1] and [3].
Optionally two switched in-line MS-147 RF connectors, which disconnect the on-board antennas, allow conducted
measurements. The SE2431L antenna ports are controlled by AT86RF231 pin DIG1 connected to SE2431L pin
ANT_SEL.
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The SE2431L operating mode is determined by control lines CTX, CPS and CSD. The default configuration connects
CPS pin to EVDD via R31. This means that in receive mode the LNA will always be enabled for maximum sensitivity.
Enabling low power RX bypass mode requires removing R31 and R32 populated with 0R resistor.
The PA is enabled when CTX is high and the LNA is enabled when CTX is low. When CSD, CTX and CPS pins are low,
the SE2431L goes into low current standby mode (<1µA current consumption). CSD is connected to the AT86RF231
analog LDO regulator output (AVDD). AVDD is 1.8V for all AT86RF231 states except P_ON, SLEEP, RESET, and
TRX_OFF. To enable/disable the SE2431L immediately and independently from individual radio transceiver states, an
additional GPIO control line from the microcontroller is required.
The SE2431L has two analog power supply pins, VCC1 and VCC2, which power the internal analog circuitry. This
supply is connected to the REB231FE2 EVDD supply voltage.
The interface between the AT86RF231 and the Skyworks SE2431L is single-ended 50Ω, optimized for high
performance and low cost applications. The unused AT86RF231 RFN pin is terminated to ground with a 50Ω resistor
and DC block.
Avoiding a balun helps minimizing the bill of materials cost. In transmit mode, the AT86RF231 transmit output power
needs to be set higher compared to a differential TRX-FEM interface using a balun. In receive mode, the effective gain
ahead of the AT86RF231 is 3dB less than the specified SE2431L LNA gain (12.5dB). The resulting loss in sensitivity is
about 0.3…0.4dB.
Note:
4.
The latest revision of SE2431L FEM [9] does not require resistor R30 connected to SE2431L pin 5, leave
this pin unconnected as stated in the datasheet.
PCB layout description
This section describes critical layout details to be carefully considered during a PCB design. The PCB design requires
an optimal solution for the following topics:
•
Create a solid ground plane for the antenna. The PCB has to be considered as a part of the antenna; it
interacts with the radiated electromagnetic wave
•
Around the SE2431L front end module layout, ensure good RF grounding, good thermal conduction, effective
decoupling and correct microstrip impedances for RF tracks
•
•
Isolate digital noise from the antenna and the radio transceiver to achieve optimum range and RF performance
•
Isolate digital noise from the 16MHz reference crystal to achieve optimum transmitter and receiver
performance
Reduce any kind of spurious emissions below the limits set by the individual regulatory organizations
The Atmel REB231FE2 PCB design further demonstrates a low-cost, two-layer PCB solution without the need of an
inner ground plane.
The drawing in Figure 4-1 show critical sections using numbered captions. Each caption number has its own subsection
below with detailed information.
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Figure 4-1. Board layout – RF section.
4.1
PCB detail 1 – balanced RF pin fan out
Figure 4-2. Board layout – SE2431L layout.
The SE2431L (U1) and associated circuitry follow a standard Skyworks Solutions recommended layout to achieve
specified RF performance. The SE2431L requires a central PCB ground pad which is completely relieved of solder
resist and has a grid of 15 ground vias [9]. This is essential to achieve good RF performance and adequate thermal
conduction, especially in transmit mode. The solder paste mask has limited coverage for assembly purposes.
The RF tracks to SE2431L TR, ANT1 and ANT2 pins, and tracking to the antennas, are all 50Ω microstrip.
The 10pF decoupling capacitors C38 and C39 are placed close to the respective power supply pins. Grounded pins on
the SE2431L are routed directly to the central ground pad.
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4.2
PCB detail 2 – crystal routing
The reference crystal PCB area requires optimization to minimize external interference and to keep any radiation of
16MHz harmonics low.
The reference crystal and load capacitors C34/35 form the resonator circuit. These capacitors are to be placed close to
the crystal. The ground connection in between the capacitors should be the crystal housing contact, resulting in a
compact, robust and stable resonator.
The resonator block is enclosed within ground traces around it and a plane on the bottom side. Do not connect the
resonator directly to the plane beneath the block. The only ground connection for the resonator block should be a trace
in parallel with the two crystal lines that connects to TRX pin 27 or the paddle.
Based on recent experiments, the bottom ground connection shall be routed directly to the paddle or pin 27. The loop is
not required. In addition, the open space underneath the crystal can be filled with copper. A small keep out trace next to
the bottom ground connection can help to keep this connection separate and prevent the layout tool from flooding
across this trace.
Figure 4-3. Board layout – XTAL section.
When designing applications for very harsh environments, for example where the radio transceiver is close to mains
power lines and burst and surge requirements already dictate special provisions in the design, the above reference
crystal design might not work well. In this case, the reference crystal ground is to be directly connected to top and
bottom layers.
4.3
PCB – analog GND routing
Analog ground pins (3, 6, 27, 30, 31 and 32) and pin 7 are to be routed to the paddle underneath the IC. The trace width
has to be similar to the pad width when connecting the pads, and increase, if possible, some distance from the pad.
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Figure 4-4. Board layout – transceiver GND.
7
6
3
32
31
30
12
27
16
18
21
Each ground pin should be connected to the bottom plane with at least one via. Move the vias as close to the IC as
possible. It is always desired to integrate the single-pin ground connections into polygon structures after a short
distance. Top, bottom, and, on multilayer boards, the inner ground planes, should be tied together with a grid of vias.
When ground loops are smaller than one tenth of the wavelength, it is safe to consider this as a solid piece of metal.
The soldering technology used allows the placement of small vias (0.15mm drill) within the ground paddle underneath
the chip. During reflow soldering, the vias get filled with solder, having a positive effect on the connection cross section.
The small drill size keeps solder losses within an acceptable limit. During the soldering process vias should be open on
the bottom side to allow enclosed air to expand.
4.4
PCB – digital GND routing
Digital ground pins (12, 16, 18 and 21) are not directly connected to the paddle. Digital ground pins may carry digital
noise from I/O pad cells or other digital processing units within the chip.
In case of a direct paddle connection, impedances of the paddle ground vias could cause a small voltage drop for this
noise and may result in an increased noise level transferred to the analog domain.
4.5
PCB – GND plane
Besides the function to provide supply ground to the individual parts, the ground plane has to be considered as a
counterpart for the antenna. Such an antenna base plate is considered a continuous metal plane.
For that reason, any unused surface should be filled with a copper plane and connected to the other ground side using
sufficient through holes. Larger copper areas should also be connected to the other side layer with a grid of vias. This
way, for an external electromagnetic field the board will behave like a coherent piece of metal.
When a trace is cutting the plane on one side, the design should contain vias along this trace to bridge the interrupted
ground on the other side. Place vias especially close to corners and necks to connect lose polygon ends.
4.6
Ceramic antenna design and tuning
The antenna section follows an already existing similar implementation as described in Atmel AVR2043; REB231ED
Radio Extender Board – Hardware User Manual; Rev. 8345A-AVR-05/11; Atmel Corporation. [10] application note. The
application note provides detailed information about a design study, design-in and tuning.
3
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Mechanical description
The Atmel REB231FE2 is manufactured using a low-cost, two-layer printed circuit board. All components and
connectors are mounted on the top side of the board.
The format was defined to fit the EXPAND1 connector on the REB-CBB and Atmel AVR STK500 / STK501
microcontroller evaluation board. The upright position is chosen for best antenna performance.
Figure 5-1. Mechanical outline.
57.00mm
C
C1
2
C7
C8
C9
C10
C20
C21
C22
A2
C3
C4
C5
C6
C13
C14
C15
A1
X2
SH1
X3
C12
C
L 25
C 3
40
C11
C39
C42
R31
R32
C38
R19
R29
R30 R6 C43
C27
L2
C41
C18
C34
JP1
1
Q1
D1
R2
F1
eg. ATmega 644
C30
R12 R22
R10 R20
R16 R26
R15 R25
R7
R17 R27
C35
U6
U4
R1
C37
R9
R3
R28
U3
R8
U5
1
R14 R24
R13 R23
C26
C31
1
L1
C33
C36
R11 R21
TP7
C28
63.00mm
U1
TP6
TP5
C29
C32
TP4
TP3
TP2
TP1
R18
5.
eg. ATmega 1281
40
X1
2
1
6.50mm
Table 5-1.
REB231FE2 mechanical dimensions.
Dimension
Value
Width x
57mm
Height y
63mm
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
14
6.
Electrical characteristics
6.1
Absolute maximum ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the board. This is a
stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of this manual are not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability. For more details about these parameters, refer to individual datasheets of the
components used.
Table 6-1.
No.
Parameter
7.1.1
Storage temperature range
7.1.2
Humidity
7.1.3
Supply voltage
7.1.4
EXT I/O pin voltage
7.1.5
Supply current from batteries
7.1.6
Note:
6.2
Condition
1.
Minimum
Typical
Maximum
Unit
+85
°C
90
% r.H.
-0.3
+3.6
V
-0.3
VCC + 0.3
-40
Non-considerating
Battery charge current
Sum over all power pins
-0.5
A
(1)
mA
Keep power switch off or remove battery from REB-CBB when external power is supplied.
Recommended operating range
Table 6-2.
No.
Recommended operating range.
Parameter
Condition
Minimum
(1)
7.2.1
Operating temperature range
Note
-20
7.2.2
Supply voltage (VCC)
REB231FE2 and REB-CBB
0.2
Note:
6.3
Absolute maximum rating.
1.
Typical
3.0
Maximum
Unit
+70
°C
3.6
V
Temperature range limited by crystal Q1, otherwise -40 … +85degC.
Current consumption
Test conditions (unless otherwise stated):
VDD = 3.0V, fRF = 2.45GHz, TOP = 25°C, TX_PWR=0xA, X2 conducted
Table 6-3 lists typical Atmel REB231FE2 current consumption values for different operating modes. Current
measurement is taken by replacing REB231FE2 jumper ‘JP1’ with an amperemeter, for REB-CBB figures refer to [2].
Table 6-3.
Current consumption of REB231FE2 (JP1).
No.
Parameter
Condition
7.3.1
Supply current IDD,TRX_OFF
CLKM off
0.44
7.3.2
Supply current IDD,PLL_ON
SE2431L enabled, RX mode
10.8
7.3.3
Supply current IDD,RX_ON
SE2431L LNA high gain
17.6
7.3.4
Supply current IDD,TX_Pmin
BUSY_TX (+5dBm)
7.3.5
Supply current IDD,TX_Pdefault
BUSY_TX (+20dBm)
7.3.6
Note:
Supply current IDD,TX_Pmax
1.
Minimum
Typical
Maximum
Unit
mA
40
(1)
BUSY_TX (+23dBm)
116
205
VDD = 3.6V, AT86RF231 sub-register TX_PWR = 0x0.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
15
6.4
Transmitter characteristics
Test conditions (unless otherwise stated):
VDD = 3.0V, fRF = 2.45GHz, TOP = 25°C, TX_PWR=0xA, X2 conducted
Table 6-4.
No.
Transmitter characteristics.
Parameter
Condition
7.4.1
TX Output Power
7.4.2
Output Power Range
7.4.3
Harmonics
7.4.4
Spurious Emissions
Notes:
Ch11 … 25, Ch26 (1)
Minimum
+5
average, worst case 4f0
Typical
+20
Maximum
(2)
+23.5
Unit
dBm
15
18
dB
-50
-44
dBm/MHz
tbd.
dBm
1.
Ch26 requires TX output power back-off and duty cycle operation, see Notes for details.
2.
VDD = 3.6V, AT86RF231 sub-register TX_PWR = 0x0.
Notes:
6.5
•
The Atmel REB231FE2 setup has been tested for compliance with FCC and ETSI, see Appendix B. To ensure
compliance, the following regional specific settings are to be ensured
•
FCC: Operating the transmitter at channel 26 requires limitation of TX output power to max. +13dBm and to
ensure a duty cycle ≤25%
•
FCC: Operating the setup at maximum possible TX output power for all other channels requires either an
adjustment of the lowpass filters (C25, L3, C40 and C27, L2, C41), or alignment of the TX duty cycle
•
ETSI: Operating the setup in Europe requires setting the Atmel AT86RF231 register TX_PWR to 0x0E
maximum for all channels. This setting ensures compliance with ETSI EN 300 228 clause 4.3.2.2 Maximum
Power Spectral Density (refer to [6])
Receiver characteristics
Test conditions (unless otherwise stated):
VDD = 3.0V, fRF = 2.45GHz , TOP = 25°C, X2 conducted
Table 6-5.
Receive characteristics.
No.
Parameter
Condition
7.5.1
Receiver Sensitivity
PER ≤1%, PSDU length 20 octets
7.5.2
Maximum RX input level
-5(1)
7.5.3
Spurious Emissions
-70
7.5.4
Notes:
RSSI/ED offset
(2)(3)
SE2431L LNA in high gain mode
Minimum
Typical
Maximum
Unit
-104
dBm
13
dB
1.
Calculated, based on AT86RF231 maximum RX input level – SE2431L maximum RX gain.
2.
AT86RF231 RSSI value indicates RF input power PRF[dBm] = (RSSI_BASE_VAL-13) + 3×(RSSI-1),
see [1] in Chapter References.
3.
AT86RF231 ED value indicates RF input power PRF[dBm] = -104 + ED, see [1] in Chapter References.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
16
7.
Abbreviations
AD
-
AES
BB
Antenna diversity
-
-
Advanced encryption standard
Baseband
REB-CBB
-
REB-Controller base board
ETSI
-
European Telecommunications Standards Institute
FCC
-
Federal Communications Commission
FEM
-
Front end module
ISM
-
Industrial, scientific and medical (frequency band)
LDO
-
Low-dropout
LNA
-
Low-noise amplifier
MAC
-
Medium access control
MCU
-
Microcontroller unit
PA
-
PCB
PDI
Power amplifier
-
-
Printed Circuit Board
Program/debug interface
PER
-
Packet error rate
R&TTE
-
Radio and Telecommunications Terminal Equipment
(Directive of the European Union)
REB
-
Radio extender board
RF
-
RSSI
Radio frequency
-
Received signal strength indicator
RX
-
Receiver
SPI
-
Serial peripheral interface
TX
-
Transmitter
XTAL
-
Crystal
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
17
S/N
S/N1
1
DEVDD
R2
nc
SLPTR
RSTN
TP
TP
TP4
TP
TP3
TP
TP2
TP1
nc
R3
R7
1M00
DEVDD
350mA
F1
nc
R28
nc
R27
nc
R26
nc
R25
nc
R24
nc
R23
nc
R22
nc
R21
nc
R20
DGND
DEVDD
U6B
GND
VCC
4
2
NC7WV04P6X_NL
3
2
5
6
U6A
NC7WV04P6X_NL
1
BZG05C3V9
D1
IRQ
SEL
MOSI
MISO
SCK
MCLK
SLPTR
DIG2
RSTN
JP1
XT1
CVTG
DGND
PB7
PB5
PB3
PB1
PD7
PD5
PD3
PD1
DGND
1001-121-002
RST
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
CVTG
DGND
PB6
PB4
PB2
PB0
PD6
PD4
PD2
PD0
EE#WP
DGND
PD0
PB0
PB2
PB3
PB1
PD6
PB4
PD4
PB5
1
6
1
5
U4B
GND
VCC
1
1
2
3
7
NC7WP32K8X_NL
5
6
4
8
2
3
SEL_TRX
74279263
Inductor_Iron
U4A
NC7WP32K8X_NL
C30
100nF
C18
4.7uF
L1
0R00
R18
0R00
R17
0R00
R16
0R00
R15
0R00
R14
0R00
R13
0R00
R12
0R00
R11
0R00
R10
4
3
2
MISO
EE#WP
1
DGND
DGND
4.7uF
C26
SEL_EE
100nF
C31
EVDD
IRQ
SEL
MOSI
MISO
SCK
MCLK
SLPTR
DIG2
RSTN
ATmega1281 config
1007-121-040
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
X1
DEVDD
DGND
DEVDD
DGND
Jumper
X4
3
STK501 - EXPAND1
4
1M00
R9
SI
SCK
#HOLD
AT25010B-MAHL-T
GND
#WP
SO
VCC
AT25010B
#CS
U5
4
5
6
7
8
3.3p
0
Net Class
i
R31
1.5k
1.2k
R19
R29
nc
R32
0R00
DGND
100nF
C37
DEVDD
DGND
EVDD
DGND
nc
C13
nc
5
1uF
C29
B1
B2
BOUT
CTX
CPS
CSD
ANT_SEL
T/R
Route DVSS pins to
plane on top and not
directly to the paddle
underneath the IC
R6
RSTN
49.9R
DGND
DNC
DNC
DNC
DNC
DNC
GND
GND
GND
GND
GND
GND
VDD
VCC1
VCC2
ANT2
DIG1
DIG2
SLP_TR
DVSS
DVDD
DVDD
DEVDD
DVSS
2.2pF
DGND
MCLK
R8
470R
C36
22pF
C43
3
4
7
8
17
9
10
11
12
14
18
5
22
19
13
15
AT86RF231-ZU
AVSS
U3
AVSS
AT86RF231
AVSS
AVDD
EVDD
AVSS
XTAL1
XTAL2
6
AVSS
DGND
DGND
Size: A3
Date: 7/5/2011
File:
Title
DGND
EVDD
10pF
1
A
C34
EVDD
CSD
TP7
TP6
DGND
10pF
DGND DGND
1uF
C33
DGND
DIG4
DIG3
DGND
100nF
EVDD
C38
C42
EVDD
MS-147
GND
7
nc
nc
Project:
Revision:
1
Sheet
7
Q1
1
DGND
3
DGND
1uF
C28
16MHz
1 of
DGND
3.3p
8
FIDUCIAL 1.5mm
FIDUCIAL 1.5mm
mm
0
RF2
DGND
A2
2.45GHz
C2
Net Class
i
8
RF1
LT08AD4303F
ATMEL Automotive GmbH
MCU Wireless
01099 Dresden
Koenigsbruecker Landstrasse 61
Germany
DGND
12pF
C35
SH1
incl. A08-0961
PCB
PCB1
5.5
C21
nc
nc
C22
DGND
10.3 9.5 8.7 7.9 7.1 6.3
Antenna Tuning Line Scale
DGND
C10
nc
nc
C20
DGND
DGND
C9
C7
C8
nc
DGND
DGND
RadioExtender231FE2
32
31
30
29
28
27
26
25
33
DGND
10pF
C39
R30 113k
i Net Class
C41
2.7nH
L2
1.0pF DGND
2.7nH
L3
i
Net Class
22pF
X3
GND
C
IN
DGND
1.0pF DGND DGND
C27
Net Class
C12
i
DGND 1.0pF
C40
i
Net Class
Net Class i
ANT1
DGND
9
10
11
12
13
14
15
16
22pF
Net Class C25
i
C11
6
DGND DGND 1.0pF
C
DGND
SE2431L-R
DGND
DIG1
DIG2
SLPTR
2
1
23
24
21
20
16
6
U1
MS-147
GND
IN
X2
GND
DGND DGND DGND
1uF
C32
TP
A
C15
nc
TP5
DIG3
CSD
DIG1
DEVDD
DGND
nc
C5
nc
nc
C14
DGND
DGND
mm
5.5 6.3 7.1 7.9 8.7 9.5 10.3
Antenna Tuning Line Scale
C3
nc
C6
DGND
C4
DGND
DGND
MOSI
SCK
A1
2.45GHz
C1
5
2
RSTN
SEL
DGND
CVTG
PD2
PB4
PB5
PB6
PB7
PB1
PD7
PD6
PB2
ATmega644 config
R1
nc
MCLK
DGND
2
1
4
D
C
B
A
To make use of BOD,
assemble resistors with
1M0 to avoid radio
wake up in case of a
BOD reset condition.
2
Paddle (GND)
25
1
8
7
6
5
4
3
2
1
1
SCK
MISO
2
1
RST
TST
AVSS
RFN
RFP
AVSS
DIG4
DIG3
1
CLKM
DVSS
SCLK
MISO
DVSS
MOSI
SEL
IRQ
2
17
18
19
20
21
22
23
24
D
C
B
A
A.1
MOSI
SEL_TRX
IRQ
Appendix A.
PCB design data
Schematic
Figure 7-1. Atmel REB231FE2 schematic.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
18
Assembly drawing
Figure 7-2. Atmel REB231FE2 assembly drawing.
1
C
C
2
C7
C8
C9
C10
C20
C21
C22
A2
C3
C4
C5
C6
C13
C14
C15
A1
X2
SH1
X3
C12
C
L 25
C 3
40
C11
C27
L2
C41
TP6
L1
R9
D1
F1
eg. ATmega 644
C30
R12 R22
R10 R20
R16 R26
R15 R25
R7
R17 R27
JP1
U6
U4
R2
R3
Q1
1
U5
1
R14 R24
R13 R23
R28
R11 R21
R8
R1
C37
C36
C34
C33
U3
C35
C18
TP5
C29
C32
40
TP7
C28
C26
C31
U1
1
C39
C42
R31
R32
C38
R19
R29
R30 R6 C43
TP4
TP3
TP2
TP1
R18
7.2
eg. ATmega 1281
X1
2
1
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
19
A.2
Bill of materials
Table 7-1.
Qty.
Bill of materials.
Designator
Description
Footprint
Manuf. Part#
Manufacturer
Comment
2
X2, X3
RF connector MS147
SMA
CL358-150-5-06
Hirose
MS147
1
X1
Pin header 2×20 90
degree
JP_2x20_90°_
Top_Invers
1007-121-40
CAB
HEADER-20X2
1
U5
EEPROM
MiniMap-8-2X3
AT25010B-MAHL-T
Atmel
AT25010B
1
U4
Logic gate
MO-187
NV7WP32K8X
Fairchild
NC7WP32K8X
1
U3
802.15.4 2.4GHz
radio transceiver
MLF-32
AT86RF231
Atmel
AT86RF231
1
U6
Dual INV, ULP
SC-70/6
NC7WV04P6X
Fairchild
NC7WV04
1
U1
RFFE
QFN24
SE2431L
Skyworks
SE2431L
9
R10, R11, R12,
R13, R14, R15,
R16, R17, R18
Resistor
0603H0.4
Generic
0Ω
1
R31
Resistor
0402
Generic
0Ω
1
R8
Resistor
0402A
Generic
470Ω
2
R7, R9
Resistor
0402A
Generic
1MΩ
1
R19
Resistor
0402A
Generic
1.5kΩ
1
R29
Resistor
0402A
Generic
1.2kΩ
1
R30
Resistor
0402A
Generic
113kΩ
1
R6
Resistor
0201A
Generic
49.9Ω
1
Q1
Crystal 16MHz
XTAL_4X2_5_
small
XTL551150NLE16MHz-9.0R
Siward
CX-4025 16MHz
1
L1
SMT ferrite bead
0603H0.8
74279263
Würth
220Ω@100MHz
2
L2, L3
Chip Inductor
0402 (32306)
L0075S0083LQG15
HN
Murata
±0.3nH
1
JP1
Jumper 2-pol.
JP_2x1
1001-121-002
CAB
JP-2
1
F1
PTC fuse
1210
MICROSMD035F
Tyco
MICROSMD035F
1
D1
Z-Diode
DO-214AC
BZG05C3V9
Vishay
BZG05C3V9
1
C35
Capacitor
0402A
Generic C0G
12pF/5%
3
C34, C38, C39
Capacitor
0402A
Generic C0G
10pF/5%
4
C28, C29, C32, C33
Capacitor
0603H0.8
Generic X5R
1µF
4
C30, C31, C37, C42
Capacitor
0402A
Generic X7R
100n
3
C11, C12, C43
Capacitor
0402A
Generic C0G
22pF
1
C36
Capacitor
0402A
Generic C0G
2.2pF
2
C1, C2
Capacitor
0402A
Generic C0G
3.3pF
2
C18, C26
Capacitor
0603A
GRM1555C1H1R0
CA01
Generic X5R
4.7µF
4
C25, C27, C40, C41
Capacitor
0402A
2450AT45A100
Murata
1.0pF ±0.25pF
2
A1, A2
Ceramic antenna
ANT_AT45_45
deg
Johanson
2.45GHz
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
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20
Appendix B.
Radio certification
The Atmel REB231FE2, mounted on a REB controller base board (REB-CBB), has received regulatory approvals for
modular devices in the United States and ensures compliance in European countries.
B.1
United States (FCC)
Compliance Statement (Part 15.19)
The device complies with Part 15 of the FCC rules. To fulfill FCC Certification requirements, an Original Equipment
Manufacturer (OEM) must comply with the following regulations:
•
The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when
the module is installed inside another device, then the outside of the device into which the module is installed
must also display a label referring to the enclosed module
•
This exterior label can use wording such as the following. Any similar wording that expresses the same
meaning may be used
Contains FCC-ID: VNR-E31F2-X5B-00
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization. Modifications not
expressly approved by this company could void the user's authority to operate this equipment (FCC Section 15.21).
Compliance Statement (Part 15.105(b))
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help
Warning (Part 15.21)
Changes or modifications not expressly approved by this company could void the user’s authority to operate the
equipment.
B.2
Europe
If the device is incorporated into a product, the manufacturer must ensure compliance of the final product to the
European harmonized EMC and low-voltage/safety standards. A Declaration of Conformity must be issued for each of
these standards and kept on file as described in Annex II of the R&TTE Directive.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
21
The manufacturer must maintain a copy of the device documentation and ensure the final product does not exceed the
specified power ratings, and/or installation requirements as specified in the user manual. If any of these specifications
are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required
standards. The “CE“ marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the
initials "CE" taking the following form:
•
If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be
respected
•
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature
of the apparatus
•
The CE marking must be affixed visibly, legibly, and indelibly
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at Section 12.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
8479B−AVR−07/2012
22
Appendix C.
References
[1] AT86RF231: Low Power, 2.4GHz Transceiver for ZigBee, IEEE 802.15.4, 6LoWPAN, RF4CE, SP100,
WirelessHART and ISM Applications; Datasheet; Rev. 8111B-MCU Wireless-02/09; Atmel Corporation.
[2] Atmel AVR2042: REB Controller Base Board – Hardware User Guide; Application Note; Rev. 8334A-AVR05/11; Atmel Corporation.
[3] AVR2021: AT86RF231 Antenna Diversity; Application Note; Rev. 8158B-AVR-07/08; Atmel Corporation.
[4] IEEE Std 802.15.4™-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications
for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[5] FCC Code of Federal Register (CFR); Part 47; Section 15.35, Section 15.205, Section 15.209, Section 15.231,
Section 15.247, and Section 15.249. United States.
[6] ETSI EN 300 328, Electromagnetic Compatibility and Radio Spectrum Matters (ERM); Wideband Transmission
Systems; Data transmission equipment operating in the 2.4GHz ISM band and using spread spectrum
modulation techniques; Part 1-3.
[7] ARIB STD-T66, Second Generation Low Power Data Communication System/Wireless LAN System
2003.03.26 (H11.12.14) Version 2.1.
[8] AT25010B: SPI Serial EEPROM; Datasheet; Rev. 8707C-SEEPR-6/11; Atmel Corporation.
[9] SE2431L: 2.4GHz ZigBee/802.15.4 Front End Module; SiGe Semiconductor; Datasheet; Rev 1.8; Aug-082010; Skyworks Solutions, Inc.
[10] Atmel AVR2043; REB231ED Radio Extender Board – Hardware User Manual; Rev. 8345A-AVR-05/11; Atmel
Corporation.
Atmel AVR2080: REB231FE2 – Hardware User’s Manual [APPLICATION NOTE]
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Appendix D.
Revision history
Version
Description
A08-1170/1
Initial release
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Appendix E.
EVALUATION BOARD/KIT IMPORTANT NOTICE
This evaluation board/kit is intended for use for FURTHER ENGINEERING, DEVELOPMENT, DEMONSTRATION, OR
EVALUATION PURPOSES ONLY. It is not a finished product and may not (yet) comply with some or any technical or
legal requirements that are applicable to finished products, including, without limitation, directives regarding
electromagnetic compatibility, recycling (WEEE), FCC, CE or UL (except as may be otherwise noted on the board/kit).
Atmel supplied this board/kit “AS IS,” without any warranties, with all faults, at the buyer’s and further users’ sole risk.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies
Atmel from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the
user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge and any other
technical or legal concerns.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER USER NOR ATMEL SHALL BE
LIABLE TO EACH OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
No license is granted under any patent right or other intellectual property right of Atmel covering or relating to any
machine, process, or combination in which such Atmel products or services might be or are used.
Mailing Address: Atmel Corporation, 2325 Orchard Parkway, San Jose, CA 95131
Copyright © 2012, Atmel Corporation
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© 2012 Atmel Corporation. All rights reserved. / Rev.: 8479B−AVR−07/2012
Atmel®, Atmel logo and combinations thereof, AVR®, Enabling Unlimited Possibilities®, STK®, and others are registered trademarks or trademarks of Atmel
Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this
document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES
NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED
WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT,
CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
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