AT24CM01 I2C-Compatible (2-wire) Serial EEPROM 1-Mbit (131,072 x 8) DATASHEET Features Low Voltage and Standard Voltage Operation Available ̶ ̶ Internally Organized 131,072 x 8 2-wire Serial Interface Schmitt Triggers, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 400kHz (1.7V) and 1MHz (5V, 2.5V) Compatibility Write Protect Pin for Hardware Data Protection 256-byte Page Write Mode ̶ 1.7V (VCC = 1.7V to 5.5V) 2.5V (VCC = 2.5V to 5.5V) Partial Page Writes Allowed Random and Sequential Read Modes Self-timed Write Cycle (5ms Max) High Reliability ̶ Endurance: 1,000,000 Write Cycles Data Retention: 40 Years ̶ Green Package Options (Pb/Halide-free/RoHS Compliant) Die Sale Options: Wafer Form and Tape and Reel Available ̶ 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and 8-ball WLCSP Description The Atmel® AT24CM01 provides 1,048,576 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 131,072 words of 8 bits each. The device’s cascadable feature allows up to four devices to share a common 2-wire bus. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The devices are available in space-saving 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, and 8-ball WLCSP. In addition, the entire family is available in 1.7V (1.7V to 5.5V) and 2.5V (2.5V to 5.5V) versions. Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 1. Pin Configurations and Pinouts Pin Name Function NC No Connect A1 Address Input A2 Address Input GND Ground SDA Serial Data SCL Serial Clock Input WP Write Protect VCC Power Supply 8-lead SOIC 8-lead TSSOP NC 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA NC A1 A2 GND 1 2 3 4 Top View 8 7 6 5 VCC WP SCL SDA Top View 8-ball WLSCP VCC WP A1 SCL SDA NC A2 GND Top View Note: 2. Absolute Maximum Ratings* Operating Temperature . . . . . . . . . . .-55C to +125C Storage Temperature . . . . . . . . . . . . .-65C to +150C Voltage on any pin with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA 2 Drawings are not to scale. AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3. Block Diagram VCC GND WP Start Stop Logic Serial Control Logic LOAD Device Address Comparator A2 A1 R/W EN H.V. Pump/Timing COMP LOAD Data Recovery INC Data Word Addr/counter Y DEC X DEC SCL SDA EEPROM Serial MUX DOUT/ACK Logic DIN DOUT 4. Pin Description Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be wire-ORed with any number of other open drain or open collector devices. Device Addresses (A2 and A1): The A2 and A1 pins are device address inputs that can be hardwired or left not connected for hardware compatibility with other Atmel AT24Cxx devices. When the A2 and A1 pins are hardwired, as many as four 1-Mbit devices may be addressed on a single bus system (See “Device Addressing” on page 9. for more details). If the A2 and A1 pins are left floating, the A2 and A1 pin will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the A2 and A1 pin to GND. Write Protect (WP): The Write Protect input, when connected to GND, allows normal write operations. When WP is connected high to VCC, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the pin to GND. Switching WP to VCC prior to a write operation creates a software write protect function. Table 4-1. Write Protect WP Pin Status Part of the Array Protected At VCC Full Array At GND Normal Read/Write Operations AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 3 5. Memory Organization AT24CM01, 1-Mbit Serial EEPROM: The 1-Mbit is internally organized as 512 pages of 256 bytes each. Random word addressing requires a 17-bit data word address. 5.1 Pin Capacitance Table 5-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 5.5V. Symbol Test Condition CI/O CIN Note: 5.2 1. Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (A2, A1, SCL) 6 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Table 5-2. DC Characteristics Applicable over recommended operating range from: TAI = -40C to +85C, VCC = 1.7V to 5.5V (unless otherwise noted). Symbol Parameter Test Condition VCC1 Supply Voltage, 1.7V Option VCC2 Supply Voltage, 2.5V Option ICC Supply Current VCC = 5.0V ICC Supply Current VCC = 5.0V VCC = 1.7V ISB Standby Current VCC = 2.5V VCC = 3.6V VCC = 5.5V Typ Max Units 1.7 5.5 V 2.5 5.5 V Read at 400kHz 2.0 mA Write at 400kHz 3.0 mA 1.0 μA 2.0 μA 3.0 μA 6.0 μA VIN = VCC or VSS VIN = VCC or VSS ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA VIL Input Low Level(1) -0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V (1) VIH Input High Level VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V Note: 4 Min 1. VIL min and VIH max are reference only and are not tested. AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 5.3 AC Characteristics Table 5-3. AC Characteristics Applicable over recommended operating range from TAI = -40C to +85C, VCC = 1.7V to 5.5V (where applicable), CL = 100pF (unless otherwise noted). Test conditions are listed in Note 2. 1.7V Min 2.5V, 5.0V Symbol Parameter Max Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1300 400 ns tHIGH Clock Pulse Width High 600 400 ns tI Noise Suppression Time(1) tAA Clock Low to Data Out Valid tBUF Time the bus must be free before a new transmission can start(1) 1300 500 ns tHD.STA Start Condition Hold Time 600 250 ns tSU.STA Start Condition Set-up Time 600 250 ns tHD.DAT Data In Hold Time 0 0 ns tSU.DAT Data In Set-up Time 100 100 ns tR Inputs Rise Time(1) 400 100 50 (1) 900 50 Max Units 1000 kHz 50 ns 550 ns 300 300 ns 300 100 ns tF Inputs Fall Time tSU.STO Stop Condition Set-up Time 600 250 ns tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time (1) Endurance Notes: 1. 2. 25°C, Page Mode, 3.3V 5 5 1,000,000 ms Write Cycles This parameter is ensured by characterization only. AC measurement conditions: RL (connects to VCC): 1.3 k (2.5V, 5V), 10 k (1.7V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: 50ns Input and output timing reference voltages: 0.5 VCC AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 5 6. Device Operation Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. Figure 6-1. Data Validity SDA SCL Data Stable Data Stable Data Change Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any other command. Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop condition will place the EEPROM in a standby power mode. Figure 6-2. Start and Stop Definition SDA SCL Start Condition 6 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 Stop Condition Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit words. The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word. Figure 6-3. Output Acknowledge 1 SCL 8 9 Data In Data Out Start Condition Acknowledge Standby Mode: The AT24CM01 features a low-power standby mode which is enabled: Upon power-up. After the receipt of the Stop condition and the completion of any internal operation. Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol reset by following these steps: 1. Create a Start condition (if possible). 2. 3. Clock nine cycles. Create another Start condition followed by Stop condition as in Figure 6-4. The device should be ready for the next communication after the above steps have been completed. In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device. Figure 6-4. Software Reset Dummy Clock Cycles SCL 1 Start Condition 2 3 8 9 Start Condition Stop Condition SDA AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 7 Figure 6-5. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT Figure 6-6. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th Bit AC WORDN (1) tWR Stop Condition Note: 8 1. Start Condition The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal clear/write cycle. AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 7. Device Addressing The 1-Mbit EEPROM requires an 8-bit device address word following a Start condition to enable the chip for a read or write operation (see Figure 7-1 below). The device address word consists of a mandatory ‘1010’ sequence for the first four most significant bits. This is common to all 2-wire EEPROM devices. The 1-Mbit uses the two device address bits, A2 and A1, to allow up to four devices on the same bus. These A2 and A1 bits must compare to the corresponding hardwired input pins, A2 and A1. The A2 and A1 pins uses an internal proprietary circuit that biases it to a logic low condition if the pin is allowed to float. The seventh bit (P0) of the device address is a memory page address bit. This memory page address bit is the most significant bit of the data word address that follows. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a valid compare is not made, the device will return to a standby state. Figure 7-1. 1Mb Device Address 1 0 1 0 A2 A1 P0 MSB 8. R/W LSB Write Operations Byte Write: To select a data word in the 1-Mbit memory requires a 17-bit word address. The word address field consists of the P0 bit in the device address byte, then the most significant word address followed by the least significant word address (Figure 8-1). A write operation requires the P0 bit and two 8-bit data word addresses following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then the part is to receive the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero. The addressing device, such as a microcontroller, then must terminate the write sequence with a Stop condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (Figure 8-1). Figure 8-1. Byte Write S T A R T Device Address W R I T E First Word Address Second Word Address S T O P Data SDA LINE M S B P R A 0 / C W K L A S C B K L A S C B K A C K AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 9 Page Write: The 1-Mbit EEPROM is capable of a 256-byte Page Write. A Page Write is initiated the same way as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to 255 more data words. The EEPROM will respond with an acknowledge after each data word is received. The microcontroller must terminate the page write sequence with a Stop condition (Figure 8-2) and the internally timed write cycle will begin. The data word address lower 8 bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the internally generated word address, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than 256 data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. The address “rollover” during write is from the last byte of the current page to the first byte of the same page. Figure 8-2. Page Write S T A R T W R I T E Device Address First Word Address Second Word Address Data (n) S T O P Data (n + x) SDA LINE M S B P R A 0 / C W K L A S C B K L A S C B K A C K A C K Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled, Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero, allowing a new read or write sequence to be initiated. Data Security: The AT24CM01 has a hardware data protection scheme that allows the user to write protect the entire memory when the WP pin is at VCC. 10 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 9. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: Current Address Read, Random Address Read, and Sequential Read. Current Address Read: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the VCC to the part is maintained. The address “rollover” during read is from the last byte of the last page, to the first byte of the first page of the memory. Once the device address with the read/write select bit set to one is input and acknowledged by the EEPROM, the current address data word is serially clocked out on the SDA line. The microcontroller does not respond with a zero but does generate a following Stop condition. Figure 9-1. Current Address Read S T A R T R E A D Device Address S T O P Data SDA LINE M S B P R A 0 / C W K N O A C K Random Read: A Random Read requires an initial byte write sequence to load in the data word address. This is known as a “dummy write” operation. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another Start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word on the SDA line. The microcontroller does not respond with a zero but does generate a following Stop condition. Figure 9-2. Random Read S T A R T Device Address W R I T E First Word Address S T A R T Second Word Address Device Address R E A D S T O P Data (n) SDA LINE M S B P R A 0 / C W A C L A S C B P R A 0 / C W N O A C Dummy Write AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 11 Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero, but does generate a following Stop condition. Figure 9-3. Sequential Read S T A R T Device Address W R I T E Second Word Address First Word Address ... SDA LINE M S B PR A 0 / C W K L A S C B K A C K Dummy Write S T A R T R E A D Device Address Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + x) ... P R A 0 / C K W 12 AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 A C K A C K A C K N O A C K 10. Ordering Code Detail AT24CM01-SSHM-B Atmel Designator Shipping Carrier Option B or blank = Bulk (Tubes) T = Tape and Reel Product Family 24C = Standard I2C Serial EEPROM Device Density M = Megabit Family 01 = 1 Megabit Operating Voltage M = 1.7V to 5.5V D = 2.5V to 5.5V Package Device Grade or Wafer/Die Thickness H = Green, NiPdAu Lead Finish Industrial Temperature Range (-40°C to +85°C) U = Green, Matte Sn Lead Finish Industrial Temperature Range (-40°C to +85°C) 11 = 11mil Wafer Thickness Package Option SS = JEDEC SOIC S = EIAJ SOIC X = TSSOP U = 3x5 Grid Array, WLCSP WWU = Wafer Unsawn AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 13 11. Part Markings AT24CM01: Package Marking Information 8-lead EIAJ 8-lead SOIC ATMLHYWW ###% @ AAAAAAAA 8-lead TSSOP 8-ball WLCSP ATHYWW ###% @ AAAAAAA Note 1: ATMLHYWW ###% @ AAAAAAAA %U ### YXX designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT24CM01 Truncation Code ###: 2G Date Codes Y = Year 4: 2014 5: 2015 6: 2016 7: 2017 Voltages 8: 2018 9: 2019 0: 2020 1: 2021 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code % = Minimum Voltage D: 2.5V min M: 1.7V min Grade/Lead Finish Material H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 12/12/14 TITLE Package Mark Contact: [email protected] 14 24CM01SM, AT24CM01 Package Marking Information AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 DRAWING NO. REV. 24CM01SM F 12. Ordering Information Delivery Information Atmel Ordering Code Lead Finish Package Voltage AT24CM01-SSHM-B Form Quantity Bulk (Tubes) 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 95 per Tube Tape and Reel 2,000 per Reel Bulk (Tubes) 95 per Tube Tape and Reel 2,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Operation Range 1.7V to 5.5V AT24CM01-SSHM-T 8S1 AT24CM01-SSHD-B 2.5V to 5.5V AT24CM01-SSHD-T AT24CM01-SHM-B 1.7V to 5.5V AT24CM01-SHM-T AT24CM01-SHD-B NiPdAu (Lead-free/Halogen-free) 8S2 2.5V to 5.5V AT24CM01-SHD-T AT24CM01-XHM-B Industrial Temperature (-40C to 85C) 1.7V to 5.5V AT24CM01-XHM-T 8X AT24CM01-XHD-B 2.5V to 5.5V AT24CM01-XHD-T AT24CM01-UUM-T(1) AT24CM01-WWU11M(2) Notes: SnAgCu (Lead-free/Halogen-free) N/A 8U-6 1.7V to 5.5V Wafer Sale Note 2 1. WLCSP Package — CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells. Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light does not occur. 2. For wafer sales, please contact Atmel Sales. Package Type 8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8S2 8-lead, 0.208” wide, Plastic Gull Wing Small Outline (EIAJ SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP) 8U-6 8-ball, 3x5 Grid Array, Wafer Level Chip Scale (WLCSP) AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 15 13. Packaging Information 13.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: [email protected] 16 TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 GPC SWB DRAWING NO. REV. 8S1 G 13.2 8S2 — 8-lead EIAJ SOIC TOP VIEW END VIEW C 1 E E1 L 8 q SIDE VIEW e b A COMMON DIMENSIONS (Unit of Measure = mm) A1 SYMBOL A D Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. 2. Mismatch of the upper and lower dies and resin burrs aren't included. 3. Determines the true geometric position. 4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. MIN MAX NOM 1.70 NOTE 2.16 A1 0.05 0.25 b 0.35 0.48 4 C 0.15 0.35 4 D 5.13 5.35 E1 5.18 5.40 E 7.70 8.26 L 0.51 0.85 q 0° e 2 8° 1.27 BSC 3 11/10/14 TITLE Package Drawing Contact: [email protected] 8S2, 8-lead, 0.208” Body, Plastic Small Outline Package (EIAJ) GPC DRAWING NO. REV. STN 8S2 G AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 17 13.3 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 4.40 4.50 3, 5 0.25 0.30 4 E 6.40 BSC E1 4.30 b 0.19 e L 0.65 BSC 0.45 L1 C NOTE 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] 18 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 GPC TNR DRAWING NO. 8X REV. E 13.4 8U-6 — 8-ball WLCSP — d 0.015 C 4X d 0.075 C A C D Pin 1 A B C D j n 0.015 m C j n 0.05 m C A B A1 E Øb E D C B A Pin 1 1 1 E 2 2 e 3 3 A2 e2 d2 d A TOP VIEW SIDE VIEW BALL SIDE * Dimensions are NOT to scale. COMMON DIMENSIONS (Unit of Measure = mm) Pin Assignment Matrix A 1 VCC C D SDA E NC WP SCL 2 3 B A1 A2 SYMBOL MIN TYP MAX A 0.460 0.499 0.538 A1 0.164 - 0.224 A2 0.280 0.305 0.330 E Contact Atmel for details e GND 0.866 e2 0.500 d 1.000 d2 D b NOTE 0.500 Contact Atmel for details 0.239 0.269 0.299 4/25/13 Package Drawing Contact: [email protected] TITLE 8U-6, 8-ball (3x5 Array) Wafer Level Chip Scale Package (WLCSP) GPC DRAWING NO. REV. GHZ 8U-6 B AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 19 14. Revision History Doc. No. Date 8821F 01/2015 Comments Update the ordering information section, part markings, and the 8X and 8S2 package outline drawings. Update document status from preliminary to complete. 8821E 03/2013 Correct WLCSP pinout. Update footers and disclaimer page. 8812D 01/2013 Correct TSSOP pin label 7 to WP. Add WLCSP package. Update part markings. 8812C 12/2012 Update pinout diagram. Update part markings. Correct Byte Write figure from second typo error to first word address. Update Sequential Read figure. 8812B 07/2012 Correct ordering code: - AT24CM01-WWU-11, Die Sale to AT24CM01-WWU11M, Wafer Sale. Update Atmel logos and disclaimer page. 8812A 20 05/2012 Initial document release. AT24CM01 [DATASHEET] Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-8812F-SEEPROM-AT24CM01-Datasheet_012015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. 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