Features • Fast read access time – 90ns • Low-power CMOS operation • • • • • • • • – 100µA max standby – 40mA max active at 5MHz JEDEC standard packages – 32-lead PLCC – 32-lead PDIP 5V 10% supply High-reliability CMOS technology – 2,000V ESD protection – 200mA latchup immunity Rapid programming algorithm – 50µs/byte (typical) CMOS- and TTL-compatible inputs and outputs Integrated product identification code Industrial temperature range Green (Pb/halide-free) packaging option 1. 8Mb (1M x 8) One-time Programmable, Read-only Memory Atmel AT27C080 Description The Atmel® AT27C080 is a low-power, high-performance 8,388,608-bit, one-time programmable, read-only memory (OTP EPROM) organized as 1M by 8 bits. The AT27C080 requires only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 90ns, eliminating the need for speed reducing WAIT states on highperformance microprocessor systems. The Atmel scaled CMOS technology provides low active power consumption and fast programming. Power consumption is typically 10mA in active mode and less than 10µA in standby mode. The AT27C080 is available in a choice of industry standard, JEDEC-approved, one-time programmable (OTP) PLCC and PDIP packages. All devices feature two-line control (CE, OE) to give designers the flexibility to prevent bus contention. With high-density, 8Mb storage capability, the AT27C080 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. The AT27C080 has additional features to ensure high quality and efficient production use. The rapid programming algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 50µs/byte. The integrated product identification code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. 0360N–EPROM–042015 Pin configurations Addresses O0 - O7 Outputs CE Chip enable OE/VPP Output enable/Program supply 3. 32-lead PDIP Top view A12 A15 A16 A19 VCC A18 A17 A0 - A19 32-lead PLCC Top view A7 A6 A5 A4 A3 A2 A1 A0 O0 4 3 2 1 32 31 30 Function 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 Pin name O1 O2 GND O3 O4 O5 O6 2. A14 A13 A8 A9 A11 OE/VPP A10 CE O7 A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A18 A17 A14 A13 A8 A9 A11 OE/VPP A10 CE O7 O6 O5 O4 O3 System considerations Switching between active and standby conditions via the chip enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device nonconformance. At a minimum, a 0.1µF, high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7µF bulk electrolytic capacitor should be utilized, again connected between the VCC and ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. Figure 3-1. 2 Block diagram Atmel AT27C080 0360N–EPROM–042015 Atmel AT27C080 4. Absolute maximum ratings* Temperature under bias . . . . . . . . . . . . . .-55°C to +125°C *NOTICE: Storage temperature . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on any pin with respect to ground . . . . . . . . . . . . . . . . . . . -2.0V to +7.0V(1) Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on A9 with respect to ground . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1) VPP supply voltage with respect to ground . . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1) Integrated UV erase dose . . . . . . . . . . . . . . . 7258W•s/cm2 Note: 5. 1. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to +7.0V for pulses of less than 20ns. DC and AC characteristics Table 5-1. Operating modes Mode/Pin CE OE/VPP Ai Outputs Read VIL VIL Ai DOUT Output disable X VIH X(1) High Z VIH X X High Z Rapid program VIL VPP Ai DIN PGM verify VIL VIL Ai DOUT PGM inhibit VIH VPP X High Z Standby (2) VH(3) Product identification(4) Notes: VIL VIL A9 = A0 = VIH or VIL A1 - A19 = VIL Identification code 1. X can be VIL or VIH. 2. Refer to programming characteristics. 3. VH = 12.0 ± 0.5V. 4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the manufacturer’s identification byte and high (VIH) to select the device code byte. Table 5-2. DC and AC operating conditions for read operation Atmel AT27C080-90 Industrial operating temperature (case) VCC power supply -40C - 85C 5V 10% 3 0360N–EPROM–042015 Table 5-3. DC and operating characteristics for read operation Symbol Parameter Condition ILI Input load current ILO Output leakage current ISB VCC(1) standby current ICC VCC active current VIL Input low voltage VIH Input high voltage VOL Output low voltage IOL = 2.1mA VOH Output high voltage IOH = -400µA Note: Min Max Units VIN = 0V to VCC (Com., Ind.) ±1.0 A VOUT = 0V to VCC (Com., Ind.) ±5.0 A ISB1 (CMOS), CE = VCC 0.3V 100 A ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1.0 mA f = 5MHz, IOUT = 0mA, CE = VIL 40 mA -0.6 0.8 V 2.0 VCC + 0.5 V 0.4 V 2.4 V 1. VCC must be applied simultaneously or before OE/ VPP , and removed simultaneously or after OE/VPP Table 5-4. AC characteristics for read operation Atmel AT27C080-90 4 Symbol Parameter Condition tACC(4) Address to output delay tCE(3) Min Max Units CE = OE/VPP = VIL 90 ns CE to output delay OE = VIL 90 ns tOE(3)(4) OE to output delay CE = VIL 20 ns tDF(2)(5) OE or CE high to output float, whichever occurred first 30 ns tOH Output hold from address, CE or OE/VPP, whichever occurred first 0 ns Atmel AT27C080 0360N–EPROM–042015 Atmel AT27C080 Figure 5-1. Notes: AC waveforms for read operation(1) 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. tDF is specified form OE/VPP or CE, whichever occurs first. Output float is defined as the point when data is no longer driven. 3. OE/VPP may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 4. OE/VPP may be delayed up to tACC- tOE after the address is valid without impact on tACC. 5. This parameter is only sampled and is not 100% tested. Figure 5-2. Input test waveform and measurement levels tR, tF < 20ns (10% to 90%) Figure 5-3. Output test load 1.3V (1N914) OUTPUT PIN 3.3K CL Note: CL = 100pF including jig capacitance. 5 0360N–EPROM–042015 Table 5-5. Pin capacitance f = 1MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 8 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. Figure 5-4. Notes: Programming waveforms 1. The input timing reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device, but must be accommodated by the programmer. 6 Atmel AT27C080 0360N–EPROM–042015 Atmel AT27C080 Table 5-6. DC programming characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input load current VIN = VIL, VIH VIL Input low level VIH Input high level VOL Output low voltage IOL = 2.1mA VOH Output high voltage IOH = -400µA ICC2 VCC supply current (program and verify) IPP2 OE/VPP supply current VID A9 product identification voltage Table 5-7. Min Max Units 10 µA -0.6 0.8 V 2.0 VCC + 1.0 V 0.4 V 2.4 V 40 mA 25 mA 12.5 V CE = VIL 11.5 AC programming characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V Limits (1) Symbol Parameter Test conditions tAS Address setup time 2.0 µs tOES OE/VPP setup time 2.0 µs tOEH OE/VPP hold time 2.0 µs tDS Data setup time 2.0 µs tAH Address hold time 0.0 µs tDH Data hold time 2.0 µs Input rise and fall times: (10% to 90%) 20ns Input pulse levels: 0.45V to 2.4V (2) CE high to output float delay tDFP VCC setup time tPW CE program pulse width(3) Max 0.0 Input timing reference level: 0.8V to 2.0V tVCS 130 tVR OE/VPP recovery time tPRT OE/VPP pulse rise time during programming ns µs 47.5 Data valid from CE Units 2.0 Output timing reference level: 0.8V to 2.0V tDV Notes: Min 52.5 µs 1.0 µs 2.0 ns 50 ns 1. VCC must be applied simultaneously with or before OE/VPP and removed simultaneously with or after OE/VPP. 2. This parameter is only sampled, and is not 100% tested. Output float is defined as the point where data is no longer driven. See timing diagram. 3. Program pulse width tolerance is 50µs ± 5%. Table 5-8. The Atmel AT27C080 integrated product identification code Pins Codes A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex data Manufacturer 0 0 0 0 1 1 1 1 0 1E Device type 1 1 0 0 0 1 0 1 0 8A 7 0360N–EPROM–042015 6. Rapid programming algorithm A 50µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and OE/VPP is raised to 13.0V. Each address is first programmed with one 50µs CE pulse without verification. Then a verification reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 50µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. OE/VPP is then lowered to VIL and VCC to 5.0V. All bytes are read again and compared with the original data to determine if the device passes or fails. Figure 6-1. 8 Rapid programming algorithm Atmel AT27C080 0360N–EPROM–042015 Atmel AT27C080 7. Ordering information Green package (Pb/halide-free) ICC (mA) tACC (ns) Active Standby Atmel ordering code Package Lead finish Operation range 90 40 0.1 AT27C080-90JU AT27C080-90PU 32J 32P6 Matte tin Matte tin Industrial (-40C to 85C) Package type 32J 32-lead, plastic, J-leaded chip carrier (PLCC) 32P6 32-lead, 0.600" wide, plastic, dual inline package (PDIP) 9 0360N–EPROM–042015 8. Package information 32J – PLCC 1.14(0.045) X 45° PIN NO. 1 IDENTIFIER 1.14(0.045) X 45° 0.318(0.0125) 0.191(0.0075) E1 E2 B1 E B e A2 D1 A1 D A COMMON DIMENSIONS (Unit of Measure = mm) 0.51(0.020)MAX 45° MAX (3X) D2 Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 TITLE Package Drawing Contact: packagedrawings atmel.com 10 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 32J B Atmel AT27C080 0360N–EPROM–042015 Atmel AT27C080 32P6 – PDIP 17 32 E1 1 16 D e A BASE PLANE -CSEATING PLANE A1 L b2 .015 b j E GAGE PLANE 0.10 m C See Lead Detail Z Z COMMON DIMENSIONS (UNIT OF MEASURE=MM) C L eC Lead Detail eA eB Notes: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). c Symbol A A1 b Min. 0.381 0.356 Nom. - Max. 4.826 0.558 b2 c D E E1 1.041 0.203 41.783 15.240 13.462 - 1.651 0.381 42.291 15.875 13.970 L e eA eB eC 3.048 2.54 BSC 15.24 BSC - 3.556 0.000 Note Note 1 Note 1 17.78 1.524 11/28/11 Package Drawing Contact: firstname.lastname@example.org TITLE 32P6, 32-lead, 0.600”/15.24 mm Wide Plastic Dual Inline Package (PDIP) GPC DRAWING NO. REV. PLU 32P6 C 11 0360N–EPROM–042015 9. 12 Revision history Doc. Rev. Date Comments 0360N 04/2015 Correct PDIP and PLCC pinouts. Update the 32P6 package outline drawing and the Atmel logos. 0360M 04/2011 Remove TSOP package Add lead finish to ordering information 0360L 12/2007 Atmel AT27C080 0360N–EPROM–042015 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-0360N-EPROM-AT27C080-Datasheet_042015. 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