ATA8210/ATA8215 UHF ASK/FSK Receiver DATASHEET Features ● AVR® microcontroller core with 1Kbyte SRAM and 24Kbyte RF library in firmware (ROM) ● Atmel® ATA8210: 20Kbyte of user Flash ● Atmel ATA8215: No user memory — RF library in firmware only ● Supported frequency ranges ● Low-band 310MHz to 318MHz, 418MHz to 477MHz ● High-band 836MHz to 956MHz ● 315.00MHz/433.92MHz/868.30MHz and 915.00MHz with one 24.305MHz crystal ● Low current consumption ● 9.8mA for RXMode (Low-band), 1.2mA for 21ms cycle three-channel polling ● Typical OFFMode current of 5nA (maximum 600nA at Vs = 3.6V and T = 85°C) ● Supports the 0dBm class of ARIB STD-T96 ● Input 1dB compression point ● –48dBm (full sensitivity level) ● –20dBm (active antenna damping) ● Programmable channel frequency with fractional-N PLL ● 93Hz resolution for Low-band ● 185Hz resolution for High-band ● FSK deviation ±0.375kHz to ±93kHz ● FSK sensitivity (Manchester coded) at 433.92MHz ● ● ● ● –108.5dBm at 20Kbit/s –111dBm at 10Kbit/s –114dBm at 5Kbit/s –122.5dBm at 0.75Kbit/s f = ±20kHz f = ±10kHz f = ±5kHz f = ±0.75kHz BWIF = 165kHz BWIF = 165kHz BWIF = 165kHz BWIF = 25kHz ● ASK sensitivity (Manchester coded) at 433.92MHz ● –110.5dBm at 20Kbit/s ● –125dBm at 0.5Kbit/s ● ● ● BWIF = 80kHz BWIF = 25kHz Programmable Rx-IF bandwidth 25kHz to 366kHz (approximately 10% steps) Blocking (BWIF = 165kHz): 64dBc at frequency offset = 1MHz and 48dBc at 225kHz High image rejection: 55dB at 315MHz/433.92MHz and 47dB at 868.3MHz/915MHz without calibration ● Supported data rate in buffered mode 0.5Kbit/s to 80Kbit/s (120Kbit/s NRZ) 9344E-INDCO-11/15 ● ● Supports pattern-based wake-up and start of frame identification Flexible service configuration concept with on-the-fly (OTF) modification (in IDLEMode) of SRAM service parameters (data rate, …) ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 2 Each service consists of ● One service-specific configuration part ● Three channel-specific configuration parts ● Three service configurations are located in EEPROM ● Two service configurations are located in SRAM and can be modified via SPI or embedded application software Digital RSSI with very high relative accuracy of ±1dB thanks to digitized IF processing Programmable clock output derived from crystal frequency 1024byte EEPROM data memory for receiver configuration SPI interface for Rx data access and receiver configuration 500Kbit SPI data rate for short periods on SPI bus and host controller On demand services (SPI or API) without polling or telegram reception Integrated temperature sensor Self check and calibration with temperature measurement Configurable EVENT signal indicates the status of the IC to an external microcontroller Automatic low-power channel polling Flexible polling configuration concerning timing, order and participating channels Fast reaction time Power-up (typical 1.5ms, OFFMode -> RXMode) Supports mixed ASK/FSK telegrams Non-byte aligned data reception Software customization Antenna diversity with external switch via GPIO control Antenna diversity with internal SPDT switch Supply voltage range 1.9V to 3.6V Temperature range –40°C to +85°C ESD protection at all pins (±4kV HBM, ±200V MM, ±750V FCDM) Small 55mm QFN32 package/pitch 0.5mm Suitable for applications governed by EN 300 220 and FCC part 15, title 47 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 1. General Product Description 1.1 Introduction The Atmel® ATA8210/15 is a highly integrated, low-power UHF ASK/FSK RF receiver with an integrated AVR® microcontroller. The Atmel ATA8210/15 is partitioned into three sections; an RF front end, a digital baseband and the low-power 8-bit AVR microcontroller. The product is designed for the ISM frequency bands in the ranges of 310MHz to 318MHz, 418MHz to 477MHz and 836MHz to 956MHz. The external part count is kept to a minimum due to the very high level of integration in this device. By combining outstanding RF performance with highly sophisticated baseband signal processing, robust wireless communication can be easily achieved. The receive path uses a low-IF architecture with an integrated double quadrature receiver and digitized IF processing. This results in high image rejection and excellent blocking performance. In addition, highly flexible and configurable baseband signal processing allows the receiver to operate in several scanning, wake-up and automatic self-polling scenarios. For example, during polling the IC can scan for specific message content (IDs) and save valid telegram data in the FIFO buffer for later retrieval. The device integrates two receive paths that enable a parallel search for two telegrams with different modulations, data rates, wake-up conditions, etc. The Atmel ATA8210/15 implements a flexible service configuration concept and supports up to 15 channels. The channels are grouped into five service configurations with three channels each. Three service configurations are located in the EEPROM. Two service configurations are located in the SRAM to allow on-the-fly modifications during IDLEMode via SPI commands or application software. The application software is located in the Flash for Atmel ATA8210. Highly configurable and autonomous scanning capability enables flexible polling scenarios with up to 15 channels. The configuration of the receiver is stored in a 1024byte EEPROM. The SPI interface enables external control and device reconfiguration. Table 1-1. Program Memory Comparison of Atmel ATA8210/15 Devices Device Atmel Firmware ROM User Flash User ROM Atmel ATA8210 24Kbyte 20Kbyte - Atmel ATA8215 24Kbyte - - In the Atmel ATA8210 the internal microcontroller with 20Kbyte user Flash can be used to add custom extensions to the Atmel firmware. The Atmel ATA8215 embeds only the firmware ROM without user memory. The debugWIRE and ISP interface are available for programming purposes. Compatibility to the Atmel ATA8510/15 The Atmel ATA8210/15 is pin-to-pin compatible with the Atmel ATA8510/15 transceivers. The Rx performance of the receivers matches that of the transceivers. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 3 1.2 System Overview Figure 1-1. Circuit Overview SRC, FRC Oscillators Supply Reset EEPROM Flash Rx DSP ROM RF Front End SRAM RFIN AVR Peripherals AVR CPU DATA BUS XTO XTAL Port B (8) Port C (6) PB[7..0] (SPI) PC[5..0] Figure 1-1 shows an overview of the main functional blocks of the Atmel® ATA8210/15. External control of the Atmel ATA8210/15 is performed through the SPI pins SCK, MOSI, MISO, and NSS on port B. The configuration of the Atmel ATA8210/15 is stored in the EEPROM and a large portion of the functionality is defined by the firmware located in the ROM and processed by the AVR®. An SPI command can trigger the AVR to configure the hardware according to settings that are stored in the EEPROM and start up a given system mode (e.g., RXMode, or PollingMode). Internal events such as “Start of Telegram” or “FIFO empty” are signaled to an external microcontroller on pin 28 (PB6/EVENT). During the start-up of a service, the relevant part of the EEPROM content is copied to the SRAM. This allows faster access by the AVR during the subsequent processing steps and eliminates the need to write to the EEPROM during runtime because parameters can be modified directly in the SRAM. As a consequence the user does not need to observe the EEPROM read/write cycle limitations. It is important to note that all PWRON and NPWRON pins (PC1..5, PB4, PB7) are active in OFFMode. This means that even if the Atmel ATA8210/15 is in OFFMode and the DVCC voltage is switched off, the power management circuitry within the Atmel ATA8210/15 biases these pins with VS. AVR ports can be used as button inputs, external LNA supply voltage (RX_ACTIVE), LED drivers, EVENT pin, switching control for additional SPDT switches, general purpose digital inputs, or wake-up inputs, etc. Some functionality of these ports is already implemented in the firmware and can be activated by adequate EEPROM configurations. Other functionality is available only through custom software residing in the 20Kbyte Flash program memory (Atmel ATA8210). 4 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 Pinning RFIN_LB ATEST_IO1 ATEST_IO2 AGND PB7 PB6 PB5 PB4 PB3 Figure 1-2. Pin Diagram 32 31 30 29 28 27 26 25 1 RFIN_HB 2 SPDT_RX 3 exposed die pad Atmel ATA8210 ATA8215 24 PB2 23 PB1 22 PB0 21 DGND 20 DVCC PC5 NC 7 18 PC4 VS_SPDT 8 17 PC3 9 10 11 12 13 14 15 16 PC2 19 PC1 6 PC0 SPDT_RX2 VS 5 AVCC NC XTAL2 4 XTAL1 SPDT_ANT TEST_EN 1.3 Note: The exposed die pad is connected to the internal die. Table 1-2. Pin Description Pin No. Pin Name Type 1 RFIN_LB Analog Equivalent Circuit Description RFIN_LB (Pin 1) LNA input for Low-band frequency range (< 500MHz) GND 2 RFIN_HB Analog RFIN_HB (Pin 2) LNA input for High-band frequency range (> 500MHz) GND ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 5 Table 1-2. Pin Description (Continued) Pin No. Pin Name Type 3 SPDT_RX Analog Equivalent Circuit Description SPDT_ANT (Pin 4) SPDT_RX (Pin 3) 800kΩ 4 SPDT_ANT 85Ω GND NC Antenna input (RXMode) of the SPDT switch Analog 75Ω 5 Rx switch output (damped signal output) 75Ω GND GND – Open in application See also circuit pin 3 and pin 4 6 SPDT_RX2 Analog 7 NC – 8 VS_SPDT Analog SPDT_RX2 (Pin 6) SPDT_ANT (Pin 4) Rx switch output 2 Open in application SPDT supply connect to GND TEST_EN (Pin 9) AVCC (Pin 12) DVCC (Pin 20) VS (Pin 13) 20kΩ 9 TEST_EN 20kΩ – Test enable, connected to GND in application 100kΩ GND 10 XTAL1 GND XTAL1 (Pin 10) Analog DGND DGND GND XTAL2 (Pin 11) Crystal oscillator pin 1 (input) 180kΩ 11 XTAL2 14pF Analog GND 6 14pF GND Crystal oscillator pin 2 (output) GND 12 AVCC Analog See Section 4.1 on page 20 RF front end supply regulator output 13 VS Analog See Section 4.1 on page 20 and pins 7, 8, and 9 Main supply voltage input 14 PC0 Digital ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 Main : AVR Port C0 Alternate : PCINT8 / NRESET / DebugWIRE Table 1-2. Pin No. Pin Description (Continued) Pin Name Type 15 PC1 Digital 16 PC2 Digital 17 PC3 Digital 18 PC4 Digital Equivalent Circuit Description Main : AVR Port C1 Alternate : NPWRON1 / PCINT9 / EXT_CLK Main : AVR Port C2 Alternate : NPWRON2 / PCINT10 / TRPA Main : AVR Port C3 Alternate : NPWRON3 / PCINT11 / TMDO Main : AVR Port C4 Alternate : NPWRON4 / PCINT12 / INT0 Main : AVR Port C5 Alternate : NPWRON5 / PCINT13 / TRPB / TMDO_CLK 19 PC5 Digital 20 DVCC – See Section 4.1 on page 20 Digital supply voltage regulator output 21 DGND – See Section 4.1 on page 20 Digital ground 22 PB0 Digital 23 PB1 Digital 24 25 PB2 PB3 Digital Digital 26 PB4 Digital 27 PB5 Digital 28 PB6 Digital Main : AVR Port B0 Alternate : PCINT0 / CLK_OUT Main : AVR Port B1 Alternate : PCINT1 / SCK Main : AVR Port B2 Alternate : PCINT2 / MOSI (SPI Master Out Slave In) Main : AVR Port B3 Alternate : PCINT3 / MISO (SPI Master In Slave Out) Main : AVR Port B4 Alternate : PWRON / PCINT4 / LED1 (strong high side driver) Main : AVR Port B5 Alternate : PCINT5 / INT1 / NSS Main : AVR Port B6 Alternate : PCINT6 / EVENT (firmware controlled external microcontroller event flag) ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 7 Table 1-2. Pin No. Pin Description (Continued) Pin Name Type Equivalent Circuit Description Main Alternate 1.4 : NPWRON6/ PCINT7/ RX_ACTIVE (strong high side driver) / LED0 (strong low side driver) 29 PB7 Digital 30 AGND – 31 ATEST_IO2 – RF front end test I/O 2 connected to GND in application 32 ATEST_IO1 – RF front end test I/O 1 connected to GND in application GND – See Section 4.1 on page 20 See Section 4.1 on page 20 Typical Applications The receiver is designed to be used in the following application areas: ● Remote control systems, e.g., garage door openers ● ● ● ● ● 8 : AVR Port B7 Smart RF applications Telemetering systems Wireless alarm and security systems Home and building automation Weather stations ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 Analog ground Ground/backplane on exposed die pad Typical Application Circuit with External Microcontroller Figure 1-3. Typical Application Circuit with External Microcontroller IRQ NSS VS RFIN_LB 26 MISO 25 PB3 27 PB4 28 PB5 ATEST ATEST _IO1 _IO2 29 PB6 30 PB7 1 31 AGND 32 24 PB2 23 2 RFIN_HB PB1 22 3 SPDT_RX PB0 Atmel ATA8210 ATA8215 4 SPDT_ANT RFIN 5 NC 20 DVCC SPDT_RX2 PC5 19 NC PC4 18 PC3 17 9 10 11 12 13 14 CLK_IN 15 Microcontroller PC2 PC1 PC0 VS AVCC TEST _EN XTAL2 VS_SPDT SCK DGND 7 8 MOSI 21 6 XTAL1 1.4.1 16 VS = 3V VDD Figure 1-3 shows a typical application circuit with an external host microcontroller running from a 3V voltage regulator. The pin PB4 (PWRON) is directly connected to VS and the Atmel ATA8210/15 enters the IDLEMode after power-on. In this configuration the Atmel ATA8210/15 can work autonomously and the microcontroller stays powered down to keep current consumption low while remaining sensitive to RF telegrams. To achieve a low current in IDLEMode the Atmel ATA8210/15 can be configured in the EEPROM to work with the RC oscillator. The Atmel ATA8210/15 can also be configured for autonomous multi-channel and multi-application PollingMode. The external microcontroller is notified by an event on pin 28 (EVENT) if an appropriate RF message is received. Until this event, the Atmel ATA8210/15 periodically switches to RXMode, checks the different services and channels configured in the EEPROM, and returns to power-down while the external host microcontroller is still in deep sleep mode to keep average current low. Once a valid RF message is detected, it can be buffered inside of the Atmel ATA8210/15 to enable a microcontroller wake-up and retrieval of buffered data. RF_IN is matched to SPDT_RX by absorbing the parasitics of the SPDT switch into the matching network, hence the SPDT_ANT is a 50 RX port. An external crystal, together with the fractional-N PLL within the Atmel® ATA8210/15 is used to fix the RX frequency. Accurate load capacitors for this crystal are integrated, to reduce system part count and cost. Only three supply blocking capacitors are needed to decouple the different supply voltages AVCC, DVCC and VS of the Atmel ATA8210/15. The exposed die pad is the RF and analog ground of the Atmel ATA8210/15. It is directly connected to AGND via a fused lead. For applications operating in the 868.3MHz or 915MHz frequency bands, a High-band RF input is supplied, RFIN_HB, and must be used instead of RFIN_LB. The Atmel ATA8210/15 is controlled using specific SPI commands via the SPI interface and an internal EEPROM for application specific configuration. This application is compatible to the Atmel ATA8510/15, therefore, the same application board can be used for both devices, just the population of the TX path is not required for the Atmel ATA8210/15. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 9 2. System Functional Description 2.1 Overview 2.1.1 Service-based Concept The Atmel® ATA8210/15 is a highly configurable UHF receiver. The configuration is stored in an internal 1024-byte EEPROM. The master system control is performed by firmware. General chip-wide settings are loaded from the EEPROM to hardware registers during system initialization. During start-up of a receive mode the specific settings are loaded from the EEPROM or SRAM to the current service in the SRAM and from there to the corresponding hardware registers. A complete configuration set of the receiver is called “service” and includes RF settings, demodulation settings, and telegram handling information. Each service contains three channels which differ in the RF receive frequencies. The Atmel ATA8210/15 supports five services which can be configured in various ways to meet customer requirements. Three service configurations are located in the EEPROM space. They are fixed configurations which should not be changed during runtime. Two service configurations are located in the SRAM space and can be modified by USER SW in a Flash application or by an SPI command during IDLEMode. A service consists of ● One service-specific configuration part ● Three channel-specific configuration parts Further configurations for PollingMode and RSSI are available and can be modified in IDLEMode via an SPI command and/or User SW. Figure 2-1 gives an overview on the service based-concept. Figure 2-1. Service-based Concept Overview EEPROM SRAM EEPROM Polling Configuration eepPollLoopConf System Initialization SRAM Polling Configuration pollConfig Service 0 eepServices  Channel 0 Channel 1 Service 3 sramServices  Channel 0 Channel 2 Service 1 eepServices  Channel 0 Channel 1 Channel 1 Channel 2 Channel 0 Channel 2 Channel Atmel ATA8210/15 Hardware ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 Channel 1 Channel 2 RSSI Threshold Configuration for Each Channel rssiThreshold  Service S currentService 10 Channel 2 Service 4 sramServices  Service 2 eepServices  Channel 0 Channel 1 SPI 2.1.2 Supported Telegrams 22.214.171.124 Telegram Structure The Atmel® ATA8210/15 supports the reception of a wide variety of telegrams and protocols. Generally no special structure is required from a telegram to be received by the Atmel ATA8210/15. However, designated hardware and software features are built in for the blocks that are depicted in Figure 2-2. Using this structure or parts of it can increase the sensitivity and robustness of the broadcast. Figure 2-2. Telegram Structure Desync Preamble Data Payload Checksum Stop Sequence Desync: The de-synchronization is usually a coding violation with a length of several symbols that should provoke a defined restart of the receiver. The use of a de-synchronization leads to more deterministic receiver behavior, reducing the required preamble length. This can be favorable in timing-critical and energy-critical applications. Preamble: The preamble is a pattern that is sent before the actual data payload to synchronize the receiver and provide the starting point of the payload. A very regular pattern (e.g., 1-0-1-0...) is recommended for synchronization (“wake-up pattern, WUP”, sometimes also called “pre-burst”) while a unique, well-defined pattern of up to 32 symbols is required to mark the start of the data payload (“start frame identifier, SFID” or “start bit”). In polling scenarios the WUP can be tens or hundreds of ms long. Data Payload: The data payload contains the actual information content of the telegram. It can be NRZ or Manchester-coded. The length of the payload is application dependent, typically 1..64 bytes. Checksum: A checksum can be calculated across the data payload to verify that the data have been received correctly. A typical example is an 8-bit CRC checksum. Data bits at the beginning of the payload can be excluded from the CRC calculation. Stop Sequence: The stop sequence is a short data pattern (typically 2 to 6 symbols) to mark the end of the telegram. A coding violation can be used to prevent additional (non-deterministic) data from being received. 126.96.36.199 NRZ and Manchester Coding Within this document the following wording is used: The expression data “bit” describes the real information content that is to be broadcast. This information can be coded in “symbols” (sometimes also called “chips”) which are then physically transmitted from sender to receiver. The receiver has to decode the “symbols” back into data “bits” to access the information. The “symbol rate” is therefore always greater or equal to the “bit rate”. The Atmel ATA8210/15 supports two coding modes: Manchester coding and non-return-to-zero (NRZ) coding. NRZ coding is implemented in a straightforward manner: One bit is represented by one symbol. Manchester coding implements two symbols per data bit. There is always a transition between the two symbols of one data bit so that one data bit always consists of a “0” and a “1”. The polarity can be either way as shown in Figure 2-3 on page 12. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 11 Figure 2-3. Manchester Code Clock Data 1 0 1 1 0 0 0 1 0 1 0 0 Manchester (e.g., IEEE 802.3) Manchester (inverse) Manchester coding has many advantages such as simple clock recovery, no DC component, and error detection by code violation. Drawbacks are the coding/decoding effort and the increased symbol rate which is twice the data rate. 2.2 Operating Modes Overview This section gives an overview of the operating modes supported by the Atmel® ATA8210/15 as shown in Figure 2-4. Figure 2-4. Operating Modes Overview OFFMode Power-on Invalid wake-up WDR EXTR System Initialization Init fails Init done System Error Loop IDLEMode PollingMode 12 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 TCMode RXMode After connecting the supply voltage to the VS pin, the Atmel ATA8210/15 always starts in OFFMode. All internal circuits are disconnected from the power supply. Therefore, no SPI communication is supported. The Atmel ATA8210/15 can be woken up by activating the PWRON pin or one of the NPWRONx pins. This triggers the power-on sequence. After the system initialization the Atmel ATA8210/15 reaches the IDLEMode. The IDLEMode is the basic system mode supporting SPI communication and transitions to all other operating modes. There are two options of the IDLEMode requiring configuration in the EEPROM settings: ● IDLEMode(RC) with low power consumption using the fast RC (FRC) oscillator for processing ● IDLEMode(XTO) with active crystal oscillator for high accuracy clock output or timing measurements The receive mode (RXMode) provides data reception on the selected service/channel configuration. The precondition for data reception is a valid preamble. The receiver continuously scans for a valid telegram and receives the data if all preconfigured checks are successful. The RXMode is usually enabled by the SPI command “Set System Mode”, or directly after power-on, when selected in the EEPROM setting. In PollingMode the receiver is activated for a short period of time to check for a valid telegram on the selected service/channel configurations. The receiver is deactivated if no valid telegram is found and a sleep period with very low power consumption elapses. This process is repeated periodically in accordance with the polling configuration. The initial settings are stored in the EEPROM and copied during firmware initialization to the SRAM. This allows modification of the PollingMode timing and service/channel configuration during IDLEMode. The tune and check mode (TCMode) offers calibration and self-checking functionality for the VCO and FRC oscillators as well as for temperature measurement, and polling cycle accuracy. This mode is activated via the SPI command “Calibrate and Check”. When selected in the EEPROM settings, tune and check tasks are also used during system initialization after power-on. Furthermore, they can also be activated periodically during PollingMode. Table 2-1 shows the relations between the operating modes and their corresponding power supplies, clock sources, and sleep mode settings. Table 2-1. Operating Modes versus Power Supplies and Oscillators Operation Mode AVR Sleep Mode DVCC AVCC XTO SRC FRC OFFMode - off off off off off IDLEMode(RC) Active mode Power-down(1) off off off off on on on off IDLEMode(XTO) Active mode Power-down(1) on on on on on on off off RXMode Active mode on on on off on PollingMode(RC) - Active period - Sleep period Active mode Power-down(1) on off on off on on on off PollingMode(XTO) - Active period - Sleep period Active mode Power-down(1) on on on on on on off off Notes: 1. During IDLEMode(RC) and IDLEMode(XTO) the AVR® microcontroller enters sleep mode to reduce current consumption. The sleep mode of the microcontroller section can be defined in the EEPROM. The power-down mode is recommended for keeping current consumption low. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 13 3. Hardware 3.1 Overview The Atmel® ATA8210/15 consists of an analog front end, digital signal processing blocks (DSP), an 8-bit AVR® sub-system and various supply modules such as oscillators and power regulators. A hardware block diagram of the Atmel ATA8210/15 is shown in Figure 3-1. Figure 3-1. Block Diagram AVCC Sequencer State Machine RF Front End Front-end Registers RFIN_LB LNA, Mixer IF AMP SRC, FRC Oscillators Watchdog Timer VS DVCC Supplies and Reset Voltage Monitor Clock Management Debug Wire AVR SubSystem 16 Bit Sync Timer A Rx DSP RFIN_HB D Temp (ϑ) SPDT_RX SPDT SPDT_ANT Damping Support FIFO 8 Bit Async Timers 2x AVR CPU Data FIFO NVM Controller 16 Bit Async Timers 2x VS_SPDT SPDT_RX2 IRQ Fractional N-PLL ROM 24kB Flash 20kB(1) CRC Frequency Synthesizer EEPROM 1152B SRAM 1kByte DATA BUS XTO XTAL1 XTAL2 Port B (8) SPI PB[7:0] Port C (6) PC[5:0] (1) 20kByte Flash for Atmel ATA8210, no user memory for Atmel ATA8215 Together with the fractional-N PLL, the crystal oscillator (XTO) generates the local oscillator (LO) signal for the mixer in RXMode. The RF signal comes either from the Low-band input (RFIN_LB) or from the High-band input (RFIN_HB) and is amplified by the low-noise amplifier (LNA) and down-converted by the mixer to the intermediate frequency (IF) using the LO signal. A 10dB IF amplifier with low-pass filter characteristic is used to achieve enhanced system sensitivity without affecting blocking performance. After the mixer, the IF signal is sampled using a high-resolution analog-to-digital converter (ADC). Within the Rx digital signal processing (Rx DSP) the received signal from the ADC is filtered by a digital channel filter and demodulated. Two data receive paths, path A and path B, are included in the Rx DSP after the digital channel filter. In addition, the receive path can be configured to provide the digital output of the internal temperature sensor (Temp()). 14 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 With the single pole double throw (SPDT) switch the RF signal from the antenna is switched to RFIN in RXMode. The system is controlled by an AVR® CPU with 24KB firmware ROM and 20KB user Flash for the Atmel® ATA8210. 1024byte EEPROM, 1024-byte SRAM, and other peripherals are supporting the receiver handling. Two GPIO ports, PB[7:0] and PC[5:0], are available for external digital connections, for example, as an alternate function the SPI interface is connected to port B. The Atmel ATA8210/15 is controlled by the EEPROM configuration and SPI commands and the functional behavior is mainly determined by firmware in the ROM. Much of the configuration can be modified by the EEPROM settings. The firmware running on the AVR gives access to the hardware functionality of the Atmel ATA8210/15. Extensions to this firmware can be added in the 20KB of Flash memory for the Atmel ATA8210. The Rx DSP registers are addressed directly and accessible from the AVR. A set of sequencer state machines is included to perform Rx path operations (such as enable, disable, receive) which require a defined timing parallel to the AVR program execution. The power management contains low-dropout (LDO) regulators and reset circuits for the supply voltages VS, AVCC, and DVCC of the Atmel ATA8210/15. In OFFMode all the supply voltages AVCC and DVCC are switched off to achieve very low current consumption. The Atmel ATA8210/15 can be powered up by activating the PWRON pin or one of the NPWRON[6:1] pins because they are still active in OFFMode. The AVCC domain can be switched on and off independently from DVCC. The Atmel ATA8210/15 includes two idle modes. In IDLEMode(RC) only the DVCC voltage regulator, the FRC and SRC oscillators are active and the AVR uses a power-down mode to achieve low current consumption. The same power-down mode can be used during the inactive phases of the PollingMode. In IDLEMode(XTO) the AVCC voltage domain as well as the XTO are additionally activated. An integrated watchdog timer is available to restart the Atmel ATA8210/15 when it is not served within the configured timeout period. 3.2 Receive Path 3.2.1 Overview The receive path consists of a low-noise amplifier (LNA), mixer, IF amplifier, analog-to-digital converter (ADC), and an Rx digital signal processor (Rx DSP). The fractional-N PLL and the XTO deliver the local oscillator frequency in RXMode. The receive path is controlled by the RF front-end registers. Two separate LNA inputs, one for Low-band and one for High-band, are provided to obtain optimum performance matching for each frequency range and to allow multi-band applications. A radio frequency (RF) level detector at the LNA output and a switchable damping included into the single-pole double-trough (SPDT) switch is used in the presence of large blockers to achieve enhanced system blocking performance. The mixer converts the received RF signal to a low intermediate frequency (IF) of about 250kHz. A double-quadrature architecture is used for the mixer to achieve high image rejection. Additionally, the third-order suppression of the local oscillator (LO) harmonics makes receiving without a front-end SAW filter less critical, such as in a car key fob application. An IF amplifier provides additional gain and improves the receiver sensitivity by 2-3dB. Because of built-in filter function, the in-band compression is degraded by 10dB, while the out-of-band compression remains unchanged. The ADC converts the IF signal into the digital domain. Due to the high effective resolution of the ADC, the channel filter and received signal strength indicator (RSSI) can be realized in the digital signal domain. Therefore, no analog gain control (AGC) potentially leading to critical timing issues or analog filtering is required in front of the ADC. This leads to a receiver front end with excellent blocking performance up to the 1dB compression point of the LNA and mixer, and a steep digital channel filter can be used. The Rx DSP performs the channel filtering and converts the digital output signal of the ADC to the baseband for demodulation. Due to the digital realization of these functions the Rx DSP can be adapted to the needs of many different applications. Channel bandwidth, data rate, modulation type, wake-up criteria, signal checks, clock recovery, and many other properties are configurable. The RSSI value is realized completely in the digital signal domain, enabling very high relative and absolute accuracy that is only deteriorated by the gain errors of the LNA, mixer, and ADC. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 15 Two independent receive paths A and B are integrated in the Rx DSP after the channel filter and allow the use of different data rates, modulation types, and protocols without the need to power up the receive path more than once to decide which signal should be received. This results in a reduced polling current in several applications. The integration of remote keyless entry (RKE), passive entry and go (PEG) and tire-pressure monitoring systems (TPM) into one module is simplified because completely different protocols can be supported and a low polling current is achieved. It is even possible to configure different receive RF bands for different applications by using the two LNA inputs. For example, a TPM receiver can be realized at 433.92MHz while a PEG system uses the 868MHz ISM band with multi-channel communication. 3.2.2 Rx Digital Signal Processing (Rx DSP) The Rx digital signal processing (DSP) block performs the digital filtering, decoding, checking, and byte-wise buffering of the Rx samples that are derived from the ADC as shown in Figure 3-2. The Rx DSP provides the following outputs: ● Raw demodulated data at the TRPA/B pins ● ● ● Decoded data at the TMDO and TMDO_CLK pins Buffered data bytes toward the data FIFO and ID check block Auxiliary information about the signal such as the received signal strength indication (RSSI) and the frequency offset of the received signal from the selected center frequency (RXFOA/B) Figure 3-2. Rx DSP Overview RXFOA ADC Data Demod & Check Channel Filter TRPA TMDO_A TMDO_CLK_A Frame Sync A Path A Rx Buffer A Data Byte = Data FIFO Frame Sync B Path B Rx Buffer B Data Byte = RSSI RXFOB RSSI Buffer TRPB Support FIFO TMDO_B TMDO_CLK_B ID Check = The channel filter determines the receiver bandwidth. Its output is used for both receiving paths A and B, making it necessary to configure the filter to match both paths. The receiving paths A and B are identical and consist of an ASK/FSK demodulator with attached signal checks, a frame synchronizer which supports pattern-based searches for the telegram start and a 1-byte hardware buffer with integrated CRC checker for the received data. Depending on the signal checks, one path is selected which writes the received data to the data FIFO and optionally to the ID check block. The RSSI values are determined by the demodulator and written via the RSSI buffer to the support FIFO where the latest 16 values are stored for further processing. 16 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 3.3 AVR Controller 3.3.1 AVR Controller Sub-System The AVR® controller sub-system consists of the AVR CPU core, its program memory, and a data bus with data memory and peripheral blocks attached. The receive path also has its user interfaces connected to the data bus. CPU Core The main function of the CPU core is to ensure correct program execution. For this reason, the CPU core must be able to access memories, perform calculations, control peripherals, and handle interrupts. Figure 3-3. Overview of Architecture Data Bus 8-bit ROM Flash Program Memory Program Counter Status and Control 32 x 8 General Purpose Registers Instruction Register Interrupt Unit SPI Unit Instruction Decoder Control Lines Indirect Addressing Watchdog Timer Direct Addressing 3.3.2 ALU Clock Management I/O Module 1 Data SRAM I/O Module n EEPROM PortN In order to maximize performance and parallelism, the AVR uses a Harvard architecture—with separate memories and buses for program and data. Instructions in the program memory are executed with single-level pipelining. While one instruction is being executed, the next instruction is prefetched from the program memory. This concept enables instructions to be executed in every clock cycle. The program memory is in-system reprogrammable Flash memory and ROM. The fast-access register file contains 32 8-bit general purpose working registers with a single clock cycle access time. This allows a single-cycle arithmetic and logic unit (ALU) operation. In a typical ALU operation, two operands are output from the register file, the operation is executed, and the result is stored back in the register file—in one clock cycle. Six of the 32 registers can be used as three 16-bit indirect address register pointers for data space addressing, enabling efficient address calculations. One of these address pointers can also be used as an address pointer for lookup tables in the Flash program memory. Referred to as ‘X,’ ‘Y,’ and ‘Z’ registers, these higher 16-bit function registers are described later in this section. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 17 The ALU supports arithmetic and logic operations between registers or between a constant and a register. Single register operations can also be executed in the ALU. After an arithmetic operation, the status register is updated to reflect information about the result of the operation. The program flow is provided by conditional and unconditional jump and call instructions which are able to directly address the entire address space. Most AVR® instructions have a single 16-bit word format. Every program memory address contains a 16- or 32-bit instruction. The program memory space is divided in two sections, the boot program section and the application program section. Both sections have dedicated lock bits for write and read/write protection. The store program memory (SPM) instruction that writes into the application Flash memory section must reside in the boot program section. During interrupts and subroutine calls, the return address of the program counter (PC) is stored on the stack. The stack is effectively allocated in the general data SRAM—the stack size is thus only limited by the total SRAM size and the usage of the SRAM. All user programs must initialize the stack pointer (SP) in the reset routine before subroutines or interrupts are executed. The SP is read/write accessible in the I/O space. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR architecture. The memory spaces in the AVR architecture are all linear and regular memory maps. A flexible interrupt module has its control registers in the I/O space with an additional global interrupt enable bit in the status register. All interrupts have a separate interrupt vector in the interrupt vector table. The interrupts have priority in accordance with their interrupt vector position. The lower the interrupt vector address, the higher the priority. The I/O memory space contains 64 addresses for CPU peripheral functions as control registers, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the data space locations following those of the register file, 0x20 - 0x5F. In addition, the circuit has extended I/O space from 0x60 - 0x1FF and SRAM where only the ST/STS/STD and LD/LDS/LDD instructions can be used. 18 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 3.4 Power Management The IC has four power domains: 1. VS – Unregulated battery voltage input 2. DVCC – Internally regulated digital supply voltage. Typical value is 1.35V. 3. AVCC – Internally regulated RF front end and XTO supply. Typical value is 1.85V. 4. VS_SPDT – This is used to achieve full PCB and RF application compatibility with Atmel® ATA8510/15, in Atmel ATA8210/15 this supply is always switched off and connected externally to the battery in 3V applications: The Atmel ATA8210/15 can be operated from VS= 1.9V to 3.6V. Figure 3-4. Power Supply Management 2.2µF 220nF 22nF AVCC VS DVCC Power Management (common reference, Voltage Monitor) DVCC regulator AVCC regulator Data Bus RFIN_LB RFIN_HB AVR CPU, AVR peripherals, Memories, RxDSP and FRC/SRC SPDT_RX SPDT_ANT RF front end and XTO SPDT_RX2 Port B SPI Port C VS_SPDT 68nF PB7 XTAL1 ... Level shifter PB4 XTAL2 VS PC5 ... PC1 ... ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 19 4. Electrical Characteristics 4.1 ESD Protection Circuits GND is the exposed die pad of the Atmel® ATA8210/15 which is internally connected to AGND (pin 30). All Zener diodes shown in Figure 4-1 (marked as power clamps) are realized with dynamic clamping circuits and not physical Zener diodes. Therefore, DC currents are not clamped to the shown voltages. Figure 4-1. Atmel ATA8210/15 ESD Protection Circuit RFIN_LB (Pin 1) XTAL1 (Pin 10) RFIN_HB (Pin 2) XTAL2 (Pin 11) AVCC (Pin 12) VS (Pin 13) ATEST_IO2 (Pin 31) ATEST_IO1 (Pin 32) Power Clamp 1.8V AGND (Pin 30) GND GND GND GND GND VS_SPDT (Pin 8) SPDT_RX (Pin 3) VS (Pin 13) SPDT_ANT (Pin 4) SPDT_RX2 (Pin 6) Power Clamp 3.3V TEST_EN (Pin 9) GND VS (Pin 13) DVCC (Pin 20) Power Clamp 1.8V PC0 to PC5 (Pin 14 to Pin 19) DGND (Pin 21) 20 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 PB0 to PB7 (Pin 22 to Pin 29) Power Clamp 5.5V GND GND 4.2 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Symbol Junction temperature Min. Tj Max. Unit +150 °C Storage temperature Tstg –55 +125 °C Ambient temperature Tamb –40 +85 °C VVS –0.3 4.0 V +10 dBm Supply voltage Maximum input level (input matched to 50Ω) Pin_max ESD (Human Body Model) all pins HBM –4 +4 kV ESD (Machine Model) all pins MM –200 +200 V FCDM –750 +750 V ESD (Field Induced Charged Device Model) all pins 4.3 Thermal Resistance Parameters Thermal Resistance, Junction Ambient, Soldered according to JEDEC 4.4 Symbol Value Unit Rth_JA 35 K/W Supply Voltages and Current Consumption All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel® EEPROM settings are used unless marked with *1. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 1.00 Supply voltage range VS 3V application *1 13 VVS 1.9 3.0 3.6 V A 1.20 OFFMode Current consumption 3V application *1 Tamb = 25°C Tamb = 85°C 8, 13 IOFFMode_3V 5 150 600 nA nA B B 1.30 IDLEMode(RC) Current consumption SRC active, AVR in power-down mode, temperature range –40°C to +65°C 13 IIDLEMode(RC) 50 90 μA B 1.40 IDLEMode(XTO) Current consumption XTO active, AVR in power-down mode 13 IIDLEMode(XTO) 250 400 μA B IDLEMode(XTO) Current consumption With active CLK_OUT fXTO/6 = 4.05MHz CLOAD_CLK_OUT = 10pF VVS = 3.6V AVR running with fXTO/4 = 6.076MHz 13, 22 IIDLEMode(XTO)_ 1.3 2.5 mA B RXMode Current consumption AVR running with fXTO/4 fRF = 315MHz *1 fRF = 433.92MHz fRF = 868.3MHz *1 fRF = 915MHz *1 13 1.60 1.80 Note: CLK_OUT2 9.2 12.7 B mA 9.8 13.2 A 10.4 14.6 A 10.5 14.7 B *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. IRXMode1 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 21 4.5 RF Receiving Characteristics All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Frequency Ranges and Frequency Resolution of PLL for RXMode and PollingMode RF operating 3.00 frequency range 315MHz Low-band FECR.LBNHB = ’1’ FECR.S4N3 = ’0’ 1, 7 fRange_LB1_315 310 315 318 MHz A RF operating 3.10 frequency range 433MHz Low-band FECR.LBNHB = ’1’ FECR.S4N3 = ’1’ 1, 7 fRange_LB2_433 418 433.92 477 MHz B RF operating 3.30 frequency range High-band FECR.LBNHB = ’0’ FECR.S4N3 = ’0’ 2, 7 fRange_B4_868 836 868.3 956 MHz B Low-band fXTO/218 High-band fXTO/217 1, 2, 7 DFPLL Hz B B kHz B Kbit/s B B B B B B 3.40 Frequency resolution PLL 92.72 185.43 RXMode and PollingMode Receive Characteristics IF bandwidth specifications are examples usable for parameter extrapolation if other IF bandwidth values are used 4.00 Receiver 3dB bandwidth Programmable digital IF filter 1, 2 BWIF 25 366 7 14 20 50 80 80 at 25kHz IF-BW at 50kHz IF-BW ASK and FSK at 80kHz IF-BW 4.10 transparent mode data at 165kHz IF-BW rate Manchester mode at 237kHz IF-BW at 366kHz IF-BW 1, 2 DRTM 0.25 = frequency_deviation 4.20 Modulation index FSK / symbol_rate recommended 1, 2 0.5 0.75 1 360 1.25 B B Maximum usable frequency deviation is baseband clock dependant fDEV_Max = CLK_BB/8 4.30 Frequency deviation Note: 22 1, 2 ±0.375 ±9 B at 25kHz IF-BW ±0.75 ±18 B at 50kHz IF-BW fDEV ±1.2 ±26 B at 80kHz IF-BW kHz ±2.5 ±60 B at 165kHz IF-BW ±3.5 ±93 B at 237kHz IF-BW ±5.4 ±93 B at 366kHz IF-BW *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters ASK and FSK transparent mode 4.40 symbol rate NRZ mode 4.70 Data rate tolerance FSK and ASK Test Conditions Pin Symbol Min. Used to receive NRZ, Keyloq, PPM, 1/3 2/3 Coded telegrams at 25kHz IF-BW at 50kHz IF-BW at 80kHz IF-BW at 165kHz IF-BW at 237kHz IF-BW at 366kHz IF-BW 1, 2 SRTM_OPT 0.5 Loss of sensitivity <1dB 1, 2 DRTOL –10 +10 % B 1, 2 DRBuffered 0.25 0.5 80 120 Kbit/s Ksym/s B B TMDO output will be buffered internally and Buffered data rate readout via SPI 4.80 Manchester and NRZ interface mode Manchester mode NRZ mode FSK at 25kHz IF bandwidth Tamb = 25°C 0.75Kbit/s ± 0.75kHz 5Kbit/s ± 2.4kHz (1), 17, 19 FSK at 80kHz IF bandwidth Tamb = 25°C 2.4Kbit/s ± 2.4kHz 20Kbit/s ± 20kHz (1), 17, 19 FSK at 165kHz IF bandwidth Tamb = 25°C 5Kbit/s ± 5kHz 40Kbit/s ± 40kHz (1), 17, 19 FSK at 366kHz IF measured at TMDO bandwidth Tamb = 25°C 5.20 output or buffered via 20Kbit/s ± 20kHz SPI for DR < DRBuffered 80Kbit/s ± 80 kHz (1), 17, 19 4.90 FSK Sensitivity level 315MHz/ 433.92MHz 5.00 Manchester encoded Receiving 100bit Packets with 9 of 10 5.10 Packets Error Free or BER = 10^-3 Continuous RX Note: Typ. Max. 14 28 40 100 160 160 Unit Ksym/s Type* B B B B B B SFSKB25_R0.75 SFSKB25_R5_2.4 –3dB –122.5 –113.5 +3dB dBm B B SFSKB80_R2_4 SFSKB80_R20 –3B –117 –108.5 +3dB dBm B B SFSKB165_R5 SFSKB165_R40 –3dB –114 –105.5 +3dB dBm B B SFSKB366_R20 SFSKB366_R80 –3B –107.5 –100.5 +3dB dBm B B *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 23 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters 5.30 ASK Sensitivity level 315MHz/ 433.92MHz 5.40 Manchester encoded Receiving 100bit Packets with 9 of 10 Packets Error Free or 5.50 BER = 10^-3 Continuous RX Test Conditions Sensitivity change High-band Sensitivity change 5.80 Full ambient temperature range 5.90 Note: 24 Sensitivity change NRZ Symbol Min. Typ. Max. Unit Type* SASKB25_R0_5 SASKB25_R5 -3dB –125 –117.5 +3dB dBm B B SASKB80_R1 SASKB80_R20 –3dB –121.5 –110.5 +3dB dBm B B SASKB165_R1 SASKB165_R40 –3dB –120.5 –107.5 +3dB dBm B B SASKB366_R1 SASKB366_R80 –3dB –118.5 –103.5 +3dB dBm B B (2) SHB 1 1 1 dB B (1) (2) STamb_LB STamb_HB –1.5 –2 2 3 dB dB C C SNRZ –1 0 2 4 dB C C (1), 17, 19 ASK at 80kHz IF bandwidth (100% ASK level of carrier value) Tamb = 25°C 1Kbit/s 20Kbit/s (1), 17, 19 ASK at 165kHz IF bandwidth (100% ASK level of carrier value) Tamb = 25°C 1Kbit/s 40Kbit/s (1), 17, 19 measured at TMDO output or buffered via ASK at 366kHz IF SPI for DR < DRBuffered bandwidth (100% ASK level of carrier value) 5.60 Tamb = 25°C 1Kbit/s 80Kbit/s 5.70 Pin ASK at 25kHz IF bandwidth (100% ASK level of carrier value) Tamb = 25°C 0.5Kbit/s 5Kbit/s High-band 868.3MHz compared to Low-band sensitivity to be added to min/typ/max values of parameters no. 4.90 to 5.60 Tamb = –40°C to +85°C Low-band *1 High-band S = SFSK_ASK + S Compared to Machester NRZ using no more than 8 succeeding ‘0’ or ‘1’ symbols FSK ASK S = SFSK_ASK + S (1), 17, 19 (1, 2) 0 2 *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. 6.00 Parameters Test Conditions Sensitivity change TRPA/B raw data Compared to matched filter TMDO signal on pin 17, Manchester encoded ASK FSK S = SFSK_ASK + S Pin (1, 2), 16, 17, 19 Symbol Min. Typ. dB C 6 6 dB D dBc C C C C C C C dBc C C C C C C dBc C C C C C (1, 2) OOK (1, 2) fdist. ≥ 50kHz fdist. ≥ 100kHz fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist. ≥ 10MHz 40 46 58 64 73 78 78 (1, 2) fdist. ≥ 150kHz fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist. ≥ 10MHz 45 52 58 67 71 71 (1, 2) fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist. ≥ 10MHz 48 54 64 68 68 Manchester encoded useful signal level increased 3dB above sensitivity level 7.00 blocking measured relative to useful signal level Receiving 100bit Packets with 9 of 10 7.10 Packets Error Free or BER = 10^-3 Continuous RX At 80kHz IF bandwidth, FSK, Tamb = 25°C 10Kbit/s ± 10kHz At 165kHz IF bandwidth, FSK, Tamb = 25°C 20Kbit/s ± 20kHz B B 3 To calculate OOK values from ASK 100% level of carrier values Example: 2.4Kbit at 165kHz IF bandwidth ASK: 100% level of Carrier –117dBm = OOK: –111dBm SOOK = SASK + 6.90 dB 2 S:fdevM_3 At 25kHz IF bandwidth, FSK, Tamb = 25°C 2.4Kbit/s ± 2.4kHz Type* 2.5 1.5 (1, 2) 315MHz/ 433MHz blocking Unit SRAW_DATA Configured for maximum fDEVM. Sensitivity change for sensitivity degradation 6.20 frequency deviations at fDEVM / 3 compared to lower than configured fDEVM S = SFSK_ASK + S Value change from 6.30 ASK level to OOK level Max. 6 At 366kHz IF fdist. ≥ 500kHz 55 C bandwidth, FSK, fdist. ≥ 1MHz 64 C 7.20 Excluding spurious (1, 2) dBc Tamb = 25°C fdist. ≥ 4MHz 68 C receiving frequencies 20Kbit/s ± 20kHz fdist. ≥ 10MHz 68 C Note: *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 25 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters 868MHz/ 915MHz blocking 7.30 Manchester encoded useful signal level increased 3dB above unblocked sensitivity level 7.40 blocking measured relative to useful signal level Receiving 100 Bit Packets with 9 of 10 7.50 Packets Error Free or BER = 10^-3 Continuous RX 7.60 Excluding spurious receiving frequencies Test Conditions At 25kHz IF bandwidth, FSK, Tamb = 25°C 2.4Kbit/s ± 2.4kHz At 80kHz IF bandwidth, FSK, Tamb = 25°C 10Kbit/s ± 10kHz At 165kHz IF bandwidth, FSK, Tamb = 25°C 20Kbit/s ± 20kHz At 366kHz IF bandwidth, FSK, Tamb = 25°C 20Kbit/s ± 20kHz 7.70 Image rejection Low-band High-band no adaptive algorithm used, therefore, numbers valid if large disturber applied before useful signal 7.80 Blocking 3fLO, 5fLO Low-band: 3*fLO-fIF 5*fLO+fIF High-band 3*fLO-fIF 5*fLO+fIF Pin Symbol (1, 2) fdist. ≥ 50kHz fdist. ≥ 100kHz fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist.>10MHz 34 40 52 58 67 75 75 (1, 2) fdist. ≥ 150kHz fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist.>10MHz 39 46 52 62 68 68 (1, 2) fdist. ≥ 225kHz fdist. ≥ 450kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist.>10MHz 42 48 58 65 65 (1, 2) fdist. ≥ 500kHz fdist. ≥ 1MHz fdist. ≥ 4MHz fdist.>10MHz (1, 2) (1, 2) Typ. Max. Unit Type* dBc C C C C C C C dBc C C C C C C dBc C C C C C 49 58 65 65 dBc C C C C 45 38 55 47 dB dB A A 27 28 32 33 IMRED BLNfLO 37 38 dB 39 45 RxDSP property depends on nominal RF 7.90 Nominal IF frequency frequency and DIV_IF fIF = fRF / (DIV_IF*6) No AGC is used, therefore, the full System input referred 8.10 dynamic is available compression point receiving signals at sensitivity level on pin Min. fIF (1, 2) ICP1dB 242 251 –45 C C C C 276 kHz B dBm B System input referred 1MHz distance to 8.15 out-of band (1, 2) ICP1dB_1MHz –35 dBm C carrier compression point Note: *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. 26 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters Pin Symbol System input referred Low-band 8.20 3rd-order intercept High-band point (1, 2) IIP3 System works from Max, useful RX input sensitivity level up to 8.30 level without damping that level with BER = 10-3 (1, 2) PIn_max1 4 Max. useful RX input 8.40 level with damping Test Conditions System works from sensitivity level up to that level with BER = 10-3 Min. Typ. Max. Unit Type* –35 –37 dBm C –10 +10 dBm C PIn_max2 +5 +10 dBm C Zin –20% pF pF pF pF C C C C C C C C dBm B Measured on application board, RC parallel equivalent circuit 315MHz 1 8.50 Input impedance 8.60 8.70 433.92MHz 1 868.3MHz 2 915MHz 2 LNA amplitude detector switch level Firmware switches SPDT to damping on if a level above SGainswitch is present during start of RXMode (1, 2) PGainswitch SPDT switch RX insertion loss Damping off Sensitivity matching RF_IN with SPDT to 50 compared to matching RF_IN directly to 50 Low-band, 433.92MHz High-band, 868MHz (3, 4) ILSwitch_RX 870 2.9 400 2.9 340 1.4 330 1.4 +20% –39 0.7 1.0 1.1 1.4 dB dB C C 15 18 16 20 dB dB C C Same matching as parameter no. 8.70 8.80 SPDT switch RX damping ON This influences the blocking behavior if measured at pin 4 Low-band High-band 8.90 Note: (3, 4) Dswitch 14 17 LO spurious at LNA freq > 1GHz –60 –50 C (1, 2) PLO_LNA_IN dBm input freq < 1GHz –86 –60 C *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 27 4.5 RF Receiving Characteristics (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters 9.00 RSSI accuracy 9.10 RSSI relative accuracy 28 Pin Symbol Min. PRFIN_LB(HB) = –70dBm Low-band High-band (1, 2), 4 RSSIABS_ACCU Measurement range –100dBm to –50dBm (1, 2), 4 RSSIREL_ACCU Typ. Max. Unit Type* –5.0 –5.5 +5.0 +5.5 dB B –1 +1 dB B dB/ D value *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Pin number in brackets mean, that they are measured matched to 50 on the application board. 9.20 RSSI resolution Note: Test Conditions DSP property ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 (1, 2), 4 RSSIRES 0.5 4.6 Oscillators and CLK_OUT All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances, quartz parameters Cm = 4fF and C0 = 1pF unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. 13.00 Parameters Test Conditions Pin Symbol CLK_OUT equivalent internal capacitance Used for current calculation 13, 22 Supply current 13.10 increase CLK_OUT active Calculation can be applied to all operation modes except OFFMode 13.30 XTO frequency range Min. Typ. Max. Unit Type* CCLK 7.5 10 pF C 13 ICLK (CCLK + CLOAD_CLK_OUT) x VVS x fOUT A C 10, 11 fxto 23.8 26.2 MHz C 24.305 XTO pulling due to 13.40 internal capacitance and XTO tolerance Cm = 4fF, Tamb = 25°C 10, 11 FXTO1 –10 +10 ppm B XTO pulling due to 13.50 temperature and supply voltage Cm = 4fF Tamb = –40°C to +85°C 10, 11 FXTO2 –4 +4 ppm B 13.60 Maximum C0 of XTAL XTAL parameter 10, 11 C0_max 1 2 pF D XTAL parameter 10, 11 Cm 4 10 fF D 13.70 XTAL, Cm motional capacitance 13.80 XTAL, real part of XTO Cm = 4fF, C0 = 1pF impedance at start-up 10, 11 Rm_start1 950 B 13.90 XTAL, real part of XTO Cm = 4fF, C0 = 1pF, impedance at start-up Tamb < 85°C 10, 11 Re_start2 1100 B 14.00 XTAL, maximum Rm after start-up XTAL parameter 10, 11 Rm_max 110 D 14.10 Internal load capacitors Including ESD and package capacitance. XTAL has to be specified for 7.5pF load capacitance (incl. 1pF PCB capacitance per pin) 10, 11 CL1, CL2 13.3 14 14.7 pF B 14.20 Slow RC oscillator frequency Polling cycle can be calibrated ±2% accurate with fXTO 22 fSRC –10% 125 +10% kHz A 14.30 Fast RC oscillator frequency Note: FRC oscillator can be calibrated ±2% 22 fFRC –5% 6.36 +5% MHz A accurate with fXTO *) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = Characterized on samples, D = Design parameter ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 29 4.7 I/O Characteristics for Ports PB0 to PB7 and PC0 to PC5 All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM settings are used unless marked with *1. No. Parameters Test Conditions Pin Symbol Min. –0.3 Typ. Max. Unit Type* 0.2 x VVS V A –1 µA A VVS + 0.3 V A 15.00 Input low voltage PC0 to PC5 PB0 to PB7 14-19 22-29 VIL Input low leakage current I/O pin PC0 to PC5 PB0 to PB7 14-19 22-29 IIL 15.10 Input high voltage PC0 to PC5 PB0 to PB7 14-19 22-29 VIH Input high leakage current I/O pin PC0 to PC5 PB0 to PB7 14-19 22-29 IIH 1 µA A 15.20 Output low voltage IOL = 0.2mA 14-19 22-29 VOL_3V 0.1 x VVS V A 15.30 Output high voltage IOH = –0.2mA 14-19 22-29 VOH_3V 0.9 x VVS V A 15.40 I/O pin pull-up resistor OFFMode: see port B and port C 14-19 22-29 RPU 30 70 k A Output low voltage for Configurable on pin 15.50 strong LED low-side PB7 driver (PB7) ILOAD = 1.5mA 29 VOL_STR1 0.1 x VVS V A Output high voltage for Configurable on pin 15.60 strong LED/LNA high- PB7 and PB4 side driver (PB7, PB4) ILOAD = –1.5mA 26, 29 VOH_STR1 V A Activated in ISP mode Output low voltage for IOL = 1.7mA, 15.70 strong ISP low-side VVs > 2.5V driver (PB3) Tamb = –40°C to +65°C 25 VOL_STR2 V V B B Activated in ISP mode Output high voltage for IOH = –1.7mA, 15.80 strong ISP high-side VVs > 2.5V driver (PB3) Tamb = –40°C to +65°C 25 VOH_STR2 V V B B 22 fCLK_OUT MHz B 15.05 15.15 CLK_OUT output 15.90 frequency XTO, FRC or SRC related clock fCLK_OUT = fOSC/(2*CLKOD) 30 50 0.9 x VVS 0.1 x VVS 0.1 x VVS 0.9 x VVS 0.9 x VVS 4.5 CLOAD_CLK_OUT = 10pF 22 DTYCLK_OUT 45 55 % A fCLK_OUT = 4.5MHz *) Type means: A = 100% tested at voltage and temperature limits, B = 100 % correlation tested, C = Characterized on samples, D = Design parameter 16.00 CLK_OUT duty cycle Note: 0.8 x VVS ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 4.8 Hardware Timings All parameters refer to GND (backplane) and are valid for Tamb = –40°C to + 85°C, VVS =1.9V to 3.6V over all process tolerances. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Standard Atmel EEPROM Settings are used if marked with *1. No. Parameters Pin Symbol AVCC already enabled and ready C0 < 1.5pF 4fF < Cm < 15fF Rm < 110 Rm < 800 10, 11 TStart_XTO using ISP commands or SPI command “Write EEPROM” 14, 23, 24, 25 17.20 Erase Only EEPROM using ISP commands 17.30 Write Only EEPROM using ISP commands 17.00 Start-up Time XTO 17.10 Erase and Write EEPROM Test Conditions Min. Typ. Max. Unit Type* 90 130 250 1500 µs µs B C TEE_ER_WR 10 ms B 14, 23, 24, 25 TEE_ER 5 ms B 14, 23, 24, 25 TEE_WR 5 ms B PWRON = ‘1’ or NPWRON = ‘0’ to 13,20 TSYSINIT1 80 200 µs B INTERNAL RESET removal *) Type means: A = 100% tested at voltage and temperature limits, B = 100 % correlation tested, C = Characterized on samples, D = Design parameter System Initialisation 17.50 Startup Time Note: ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 31 5. Ordering Information Extended Type Number Package Remarks ATA8210-GHQW QFN32 5mm x 5mm, 6k tape and reel, PB-free, wettable flanks, with user flash ATA8215-GHQW QFN32 5mm x 5mm, 6k tape and reel, PB-free, wettable flanks 6. Package Information Top View D 32 1 E technical drawings according to DIN specifications PIN 1 ID Dimensions in mm 8 A Side View A3 A1 Two Step Singulation process Partially Plated Surface Bottom View D2 9 16 17 8 COMMON DIMENSIONS E2 (Unit of Measure = mm) 1 SYMBOL MIN 24 32 Z 25 e L Z 10:1 NOM MAX A 0.8 0.85 0.9 A1 A3 0 0.16 0.035 0.21 0.05 0.26 D 4.9 5 5.1 D2 3.5 3.6 3.7 E 4.9 5 5.1 E2 3.5 3.6 3.7 L 0.35 0.4 0.45 b 0.2 0.25 0.3 e NOTE 0.5 b 10/18/13 TITLE Package Drawing Contact: [email protected] 32 Package: VQFN_5x5_32L Exposed pad 3.6x3.6 ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 GPC DRAWING NO. REV. 6.543-5124.03-4 1 7. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 9344E-INDCO-11/15 Section 5 “Ordering Information” on page 32 updated 9344D-INDCO-08/15 Section 2.2 “Operating Modes Overview” on pages 12 to 13 updated 9344C-INDCO-09/14 9344B-INDCO-07/14 Section 1.1 “Introduction” on page 3 updated Section 4.5 “RF Receiving Characteristics” on pages 23 to 24 updated Features on page 2 updated Section 3.1 “Overview” on page 14 updated ATA8210/ATA8215 [DATASHEET] 9344E–INDCO–11/15 33 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: 9344E–INDCO–11/15 Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.