ATxmega256A3B - Preliminary

Features
• High-performance, Low-power 8/16-bit Atmel® AVR® XMEGATM Microcontroller
• Non-volatile Program and Data Memories
•
•
•
•
•
– 256 KB of In-System Self-Programmable Flash
– 8 KB Boot Code Section with Independent Lock Bits
– 4 KB EEPROM
– 16 KB Internal SRAM
Peripheral Features
– Four-channel DMA Controller with support for external requests
– Eight-channel Event System
– Seven 16-bit Timer/Counters
Four Timer/Counters with 4 Output Compare or Input Capture channels
Three Timer/Counters with 2 Output Compare or Input Capture channels
High-Resolution Extension on all Timer/Counters
Advanced Waveform Extension on one Timer/Counter
– Six USARTs
IrDA modulation/demodulation for one USART
– Two Two-Wire Interfaces with dual address match (I2C and SMBus compatible)
– Two SPI (Serial Peripheral Interface) peripherals
– AES and DES Crypto Engine
– 32-bit Real Time Counter with separate Oscillator and Battery Backup System
– Two Eight-channel, 12-bit, 2 Msps Analog to Digital Converters
– One Two-channel, 12-bit, 1 Msps Digital to Analog Converters
– Four Analog Comparators with Window compare function
– External Interrupts on all General Purpose I/O pins
– Programmable Watchdog Timer with Separate On-chip Ultra Low Power Oscillator
Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal and External Clock Options with PLL
– Programmable Multi-level Interrupt Controller
– Sleep Modes: Idle, Power-down, Standby, Power-save, Extended Standby
– Advanced Programming, Test and Debugging Interfaces
JTAG (IEEE 1149.1 Compliant) Interface for test, debug and programming
PDI (Program and Debug Interface) for programming and debugging
I/O and Packages
– 49 Programmable I/O Lines
– 64-lead TQFP
– 64-pad QFN/MLF
Operating Voltage
– 1.6 – 3.6V
Speed performance
– 0 – 12 MHz @ 1.6 – 3.6V
– 0 – 32 MHz @ 2.7 – 3.6V
8/16-bit
XMEGA A3B
Microcontroller
ATxmega256A3B
Preliminary
Not recommended for
new designs - Use
ATxmega256A3BU
Typical Applications
•
•
•
•
•
Industrial control
Factory automation
Building control
Board control
White Goods
•
•
•
•
•
Climate control
ZigBee
Motor control
Networking
Optical
•
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•
•
Hand-held battery applications
Power tools
HVAC
Metering
Medical Applications
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XMEGA A3B
1. Ordering Information
Flash
E2
SRAM
Speed (MHz)
Power Supply
Package(1)(2)(3)
ATxmega256A3B-AU
256 KB + 8 KB
4 KB
16 KB
32
1.6 - 3.6V
64A
ATxmega256A3B-MH
256 KB + 8 KB
4 KB
16 KB
32
1.6 - 3.6V
64M2
Ordering Code
Notes:
Temp
-40C - 85C
1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
3. For packaging information, see ”Electrical Characteristics” on page 64.
Package Type
64A
64-Lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
64M2
64-Pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Micro Lead Frame Package (MLF)
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XMEGA A3B
2. Pinout/Block Diagram
Block diagram and pinout.
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
INDEXCORNER
PF6
VCC
GND
VBAT
PF4
PF3
PA2
PA1
PA0
AVCC
GND
PR1
PR0
RESET/PDI
PDI
PF7
Figure 2-1.
Port R
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DATA BU S
Port A
ADC A
Bat t Backup
OSC/CLK
Contro l
BOD
VREF
POR
TEMP
RTC
OCD
AC A0
Power
Contro l
AC A1
FLASH
CPU
ADC B
Reset
Contro l
DAC B
AC B0
E2PROM
Interrupt Controlle r
Watchdog
AC B1
Event System ctrl
DATA BU S
Port E
USART0
T/C0
TWI
USART0
T/C0:1
Port F
PF2
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PF1
PF0
VCC
GND
TOSC1
TOSC2
PE5
PE4
PE3
PE2
PE1
PE0
VCC
GND
PD7
PC2
PC3
PC4
PC5
PC6
PC7
GND
VCC
PD0
PD1
PD2
PD3
PD4
PD5
PD6
USART0:1
SPI
T/C0:1
Port D
48
27
28
29
30
31
32
Port C
SPI
TWI
USART0:1
T/C0:1
EVENTROUTING N
ETWORK
PC1
Notes:
RAM
DMA
17
18
19
20
21
22
23
24
25
26
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
GND
VCC
PC0
1
Port B
PA3
1. For full details on pinout and pin functions refer to ”Pinout and Pin Functions” on page 50.
2. The large center pad underneath the QFN/MLF package should be soldered to ground on the board to ensure good
mechanical stability.
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XMEGA A3B
3. Overview
The XMEGA™A3B is a family of low power, high performance and peripheral rich CMOS 8/16-bit
microcontrollers based on the AVR ® enhanced RISC architecture. By executing powerful
instructions in a single clock cycle, the XMEGA A3B achieves throughputs approaching 1 Million
Instructions Per Second (MIPS) per MHz allowing the system designer to optimize power consumption versus processing speed.
The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction, executed in one clock cycle. The resulting
architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers.
The XMEGA A3B devices provides the following features: In-System Programmable Flash with
Read-While-Write capabilities, Internal EEPROM and SRAM, four-channel DMA Controller,
eight-channel Event System, Programmable Multi-level Interrupt Controller, 49 general purpose
I/O lines, 32-bit Real Time Counter (RTC) with Battery Backup System, seven flexible 16-bit
Timer/Counters with compare modes and PWM, six USARTs, two Two Wire Serial Interfaces
(TWIs), two Serial Peripheral Interfaces (SPIs), AES and DES crypto engine, two 8-channel, 12bit ADCs with optional differential input with programmable gain, one 2-channel 12-bit DAC, four
analog comparators with window mode, programmable Watchdog Timer with separate Internal
Oscillator, accurate internal oscillators with PLL and prescaler and programmable Brown-Out
Detection.
The Program and Debug Interface (PDI), a fast 2-pin interface for programming and debugging,
is available. The devices also have an IEEE std. 1149.1 compliant JTAG test interface, and this
can also be used for On-chip Debug and programming.
The XMEGA A3B devices have five software selectable power saving modes. The Idle mode
stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and
all peripherals to continue functioning. The Power-down mode saves the SRAM and register
contents but stops the oscillators, disabling all other functions until the next TWI or pin-change
interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run,
allowing the application to maintain a timer base while the rest of the device is sleeping. In
Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is
sleeping. This allows very fast start-up from external crystal combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue
to run. To further reduce power consumption, the peripheral clock to each individual peripheral
can optionally be stopped in Active mode and Idle sleep mode.
The device is manufactured using Atmel's high-density nonvolatile memory technology. The program Flash memory can be reprogrammed in-system through the PDI or JTAG. A Bootloader
running in the device can use any interface to download the application program to the Flash
memory. The Bootloader software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an
8/16-bit RISC CPU with In-System Self-Programmable Flash, the Atmel XMEGA A3B is a powerful microcontroller family that provides a highly flexible and cost effective solution for many
embedded applications.
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XMEGA A3B
The XMEGA A3B devices are supported with a full suite of program and system development
tools including: C compilers, macro assemblers, program debugger/simulators, programmers,
and evaluation kits.
3.1
Block Diagram
Figure 3-1.
XMEGA A3B Block Diagram
PR[0..1]
XTAL1
PORT R (2)
XTAL2
Oscillator
Circuits/
Clock
Generation
Watchdog
Oscillator
Watchdog
Timer
DATA BUS
PA[0..7]
PORT A (8)
Event System
Controller
Oscillator
Control
ACA
VCC
Power
Supervision
POR/BOD &
RESET
GND
SRAM
DMA
Controller
ADCA
Sleep
Controller
RESET/
PDI_CLK
PDI
PDI_DATA
AREFA
BUS
Controller
VCC/10
Prog/Debug
Controller
JTAG
Int. Ref.
Tempref
DES
PORT B
OCD
AREFB
CPU
Interrupt
Controller
AES
ADCB
NVM Controller
PB[0..7]/
JTAG
USARTF0
PORT B (8)
TCF0
Flash
EEPROM
PORT F (7)
ACB
PF[0..4,6..7]
DACB
IRCOM
DATA BUS
PORT C (8)
PORT D (8)
PC[0..7]
PD[0..7]
TWIE
TCE0:1
USARTE0
SPID
USARTD0:1
TCD0:1
SPIC
TWIC
TCC0:1
USARTC0:1
EVENT ROUTING NETWORK
Real Time
Counter
Battery
Backup
Controller
32.768 kHz
XOSC
VBAT
Power
Supervision
PORT E (6)
VBAT
TOSC1
PE[0..5]
TOSC2
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XMEGA A3B
4. Resources
A comprehensive set of development tools, application notes and datasheets are available for
download on http://www.atmel.com/avr.
4.1
Recommended reading
• XMEGA A Manual
• XMEGA Application Notes
This device data sheet only contains part specific information and a short description of each
peripheral and module. The XMEGA A Manual describes the modules and peripherals in depth.
The XMEGA application notes contain example code and show applied use of the modules and
peripherals.
The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr.
5. Disclaimer
For devices that are not available yet, typical values contained in this datasheet are based on
simulations and characterization of other AVR XMEGA microcontrollers manufactured on the
same process technology. Min. and Max values will be available after the device is
characterized.
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XMEGA A3B
6. AVR CPU
6.1
Features
• 8/16-bit high performance AVR RISC Architecture
•
•
•
•
•
•
•
6.2
– 138 instructions
– Hardware multiplier
32x8-bit registers directly connected to the ALU
Stack in SRAM
Stack Pointer accessible in I/O memory space
Direct addressing of up to 16M Bytes of program and data memory
True 16/24-bit access to 16/24-bit I/O registers
Support for 8-, 16- and 32-bit Arithmetic
Configuration Change Protection of system critical features
Overview
The XMEGA A3B uses the 8/16-bit AVR CPU. The main function of the CPU is program execution. The CPU must therefore be able to access memories, perform calculations and control
peripherals. Interrupt handling is described in a separate section. Figure 6-1 on page 7 shows
the CPU block diagram.
Figure 6-1.
CPU block diagram
DATA BUS
Flash
Program
Memory
Program
Counter
OCD
Instruction
Register
STATUS/
CONTROL
Instruction
Decode
32 x 8 General
Purpose
Registers
ALU
Multiplier/
DES
DATA BUS
Peripheral
Module 1
Peripheral
Module 2
SRAM
EEPROM
PMIC
The AVR uses a Harvard architecture - with separate memories and buses for program and
data. Instructions in the program memory are executed with a single level pipeline. While one
instruction is being executed, the next instruction is pre-fetched from the program memory. This
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XMEGA A3B
concept enables instructions to be executed in every clock cycle. The program memory is InSystem Self-Programmable Flash memory.
6.3
Register File
The fast-access Register File contains 32 x 8-bit general purpose working registers with single
clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typical ALU cycle, the operation is performed on two Register File operands, and the result is stored
back in the Register File.
Six of the 32 registers can be used as three 16-bit address register pointers for data space
addressing - enabling efficient address calculations. One of these address pointers can also be
used as an address pointer for look up tables in Flash program memory.
6.4
ALU - Arithmetic Logic Unit
The high performance Arithmetic Logic Unit (ALU) supports arithmetic and logic operations
between registers or between a constant and a register. Single register operations can also be
executed. Within a single clock cycle, arithmetic operations between general purpose registers
or between a register and an immediate are executed. After an arithmetic or logic operation, the
Status Register is updated to reflect information about the result of the operation.
The ALU operations are divided into three main categories – arithmetic, logical, and bit-functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for easy
implementation of 32-bit arithmetic. The ALU also provides a powerful multiplier supporting both
signed and unsigned multiplication and fractional format.
6.5
Program Flow
When the device is powered on, the CPU starts to execute instructions from the lowest address
in the Flash Program Memory ‘0’. The Program Counter (PC) addresses the next instruction to
be fetched. After a reset, the PC is set to location ‘0’.
Program flow is provided by conditional and unconditional jump and call instructions, capable of
addressing the whole address space directly. Most AVR instructions use a 16-bit word format,
while a limited number uses a 32-bit format.
During interrupts and subroutine calls, the return address PC is stored on the Stack. The Stack
is effectively allocated in the general data SRAM, and consequently the Stack size is only limited
by the total SRAM size and the usage of the SRAM. After reset the Stack Pointer (SP) points to
the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory
space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can
easily be accessed through the five different addressing modes supported in the AVR CPU.
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XMEGA A3B
7. Memories
7.1
Features
• Flash Program Memory
– One linear address space
– In-System Programmable
– Self-Programming and Bootloader support
– Application Section for application code
– Application Table Section for application code or data storage
– Boot Section for application code or bootloader code
– Separate lock bits and protection for all sections
– Built in fast CRC check of a selectable flash program memory section
• Data Memory
– One linear address space
– Single cycle access from CPU
– SRAM
– EEPROM
Byte and page accessible
Optional memory mapping for direct load and store
– I/O Memory
Configuration and Status registers for all peripherals and modules
16 bit-accessible General Purpose Register for global variables or flags
– Bus arbitration
Safe and deterministic handling of CPU and DMA Controller priority
– Separate buses for SRAM, EEPROM, I/O Memory and External Memory access
Simultaneous bus access for CPU and DMA Controller
• Production Signature Row Memory for factory programmed data
Device ID for each microcontroller device type
Serial number for each device
Oscillator calibration bytes
ADC, DAC and temperature sensor calibration data
• User Signature Row
One flash page in size
Can be read and written from software
Content is kept after chip erase
7.2
Overview
The AVR architecture has two main memory spaces, the Program Memory and the Data Memory. In addition, the XMEGA A3B features an EEPROM Memory for non-volatile data storage. All
three memory spaces are linear and require no paging. The available memory size configurations are shown in ”Ordering Information” on page 2. In addition each device has a Flash
memory signature row for calibration data, device identification, serial number etc.
Non-volatile memory spaces can be locked for further write or read/write operations. This prevents unrestricted access to the application software.
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XMEGA A3B
7.3
In-System Programmable Flash Program Memory
The XMEGA A3B devices contain On-chip In-System Programmable Flash memory for program
storage, see Figure 7-1 on page 10. Since all AVR instructions are 16- or 32-bits wide, each
Flash address location is 16 bits.
The Program Flash memory space is divided into Application and Boot sections. Both sections
have dedicated Lock Bits for setting restrictions on write or read/write operations. The Store Program Memory (SPM) instruction must reside in the Boot Section when used to write to the Flash
memory.
A third section inside the Application section is referred to as the Application Table section which
has separate Lock bits for storage of write or read/write protection. The Application Table section can be used for storing non-volatile data or application software.
Figure 7-1.
Flash Program Memory (Hexadecimal address)
Word Address
0
Application Section
(256 KB)
...
1EFFF
1F000
1FFFF
20000
20FFF
Application Table Section
(8 KB)
Boot Section
(8 KB)
The Application Table Section and Boot Section can also be used for general application
software.
7.4
Data Memory
The Data Memory consists of the I/O Memory, EEPROM and SRAM memories, all within one
linear address space, see Figure 7-2 on page 10. To simplify development, the memory map for
all devices in the family is identical and with empty, reserved memory space for smaller devices.
Figure 7-2.
Data Memory Map (Hexadecimal address)
Byte Address
0
FFF
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ATxmega256A3B
I/O Registers
(4 KB)
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10
XMEGA A3B
Figure 7-2.
Data Memory Map (Hexadecimal address)
1000
EEPROM
(4 KB)
1FFF
2000
5FFF
7.4.1
Internal SRAM
(16 KB)
I/O Memory
All peripherals and modules are addressable through I/O memory locations in the data memory
space. All I/O memory locations can be accessed by the Load (LD/LDS/LDD) and Store
(ST/STS/STD) instructions, transferring data between the 32 general purpose registers in the
CPU and the I/O Memory.
The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F
directly.
I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and
CBI instructions. The value of single bits can be checked by using the SBIS and SBIC instructions on these registers.
The I/O memory address for all peripherals and modules in XMEGA A3B is shown in the
”Peripheral Module Address Map” on page 57.
7.4.2
SRAM Data Memory
The XMEGA A3B devices have internal SRAM memory for data storage.
7.4.3
EEPROM Data Memory
The XMEGA A3B devices have internal EEPROM memory for non-volatile data storage. It is
addressable either in a separate data space or it can be memory mapped into the normal data
memory space. The EEPROM memory supports both byte and page access.
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XMEGA A3B
7.5
Production Signature Row
The Production Signature Row is a separate memory section for factory programmed data. It
contains calibration data for functions such as oscillators and analog modules.
The production signature row also contains a device ID that identify each microcontroller device
type, and a serial number that is unique for each manufactured device. The device ID for the
available XMEGA A3 devices is shown in Table 7-1 on page 12. The serial number consist of
the production LOT number, wafer number, and wafer coordinates for the device.
The production signature row can not be written or erased, but it can be read from both application software and external programming.
Table 7-1.
.Device ID bytes for XMEGA A3B device.
Device
ATxmega256A3B
7.6
Device ID bytes
Byte 2
Byte 1
Byte 0
43
98
1E
User Signature Row
The User Signature Row is a separate memory section that is fully accessible (read and write)
from application software and external programming. The user signature row is one flash page
in size, and is meant for static user parameter storage, such as calibration data, custom serial
numbers or identification numbers, random number seeds etc. This section is not erased by
Chip Erase commands that erase the Flash, and requires a dedicated erase command. This
ensures parameter storage during multiple program/erase session and on-chip debug sessions.
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XMEGA A3B
7.7
Flash and EEPROM Page Size
The Flash Program Memory and EEPROM data memory are organized in pages. The pages are
word accessible for the Flash and byte accessible for the EEPROM.
Table 7-2 on page 13 shows the Flash Program Memory organization. Flash write and erase
operations are performed on one page at a time, while reading the Flash is done one byte at a
time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in
the address (FPAGE) give the page number and the least significant address bits (FWORD)
give the word in the page.
Table 7-2.
Devices
Flash Size
Number of words and Pages in the Flash.
Page Size
FWORD
FPAGE
Application
(words)
ATxmega256A3B
256 KB + 8 KB
256
Z[8:1]
Z[18:9]
Boot
Size
No of Pages
Size
No of Pages
256 KB
512
8 KB
16
Table 7-3 on page 13 shows EEPROM memory organization for the XMEGA A3B devices.
EEPROM write and erase operations can be performed one page or one byte at a time, while
reading the EEPROM is done one byte at a time. For EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) give
the page number and the least significant address bits (E2BYTE) give the byte in the page.
Table 7-3.
Devices
ATxmega256A3B
8116J–AVR–06/2013
Number of Bytes and Pages in the EEPROM.
EEPROM
Page Size
Size
(Bytes)
4 KB
32
E2BYTE
E2PAGE
No of Pages
ADDR[4:0]
ADDR[11:5]
128
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XMEGA A3B
8. DMAC - Direct Memory Access Controller
8.1
Features
• Allows High-speed data transfer
•
•
•
•
•
8.2
– From memory to peripheral
– From memory to memory
– From peripheral to memory
– From peripheral to peripheral
4 Channels
From 1 byte and up to 16M bytes transfers in a single transaction
Multiple addressing modes for source and destination address
– Increment
– Decrement
– Static
1, 2, 4, or 8 byte Burst Transfers
Programmable priority between channels
Overview
The XMEGA A3B has a Direct Memory Access (DMA) Controller to move data between memories and peripherals in the data space. The DMA controller uses the same data bus as the CPU
to transfer data.
It has 4 channels that can be configured independently. Each DMA channel can perform data
transfers in blocks of configurable size from 1 to 64K bytes. A repeat counter can be used to
repeat each block transfer for single transactions up to 16M bytes. Each DMA channel can be
configured to access the source and destination memory address with incrementing, decrementing or static addressing. The addressing is independent for source and destination address.
When the transaction is complete the original source and destination address can automatically
be reloaded to be ready for the next transaction.
The DMAC can access all the peripherals through their I/O memory registers, and the DMA may
be used for automatic transfer of data to/from communication modules, as well as automatic
data retrieval from ADC conversions, data transfer to DAC conversions, or data transfer to or
from port pins. A wide range of transfer triggers are available from the peripherals, Event System
and software. Each DMA channel has different transfer triggers.
To allow for continuous transfers, two channels can be interlinked so that the second takes over
the transfer when the first is finished and vice versa.
The DMA controller can read from memory mapped EEPROM, but it cannot write to the
EEPROM or access the Flash.
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XMEGA A3B
9. Event System
9.1
Features
•
•
•
•
•
•
•
•
9.2
Inter-peripheral communication and signalling with minimum latency
CPU and DMA independent operation
8 Event Channels allows for up to 8 signals to be routed at the same time
Events can be generated by
– Timer/Counters (TCxn)
– Real Time Counter (RTC)
– Analog to Digital Converters (ADCx)
– Analog Comparators (ACx)
– Ports (PORTx)
– System Clock (ClkSYS)
– Software (CPU)
Events can be used by
– Timer/Counters (TCxn)
– Analog to Digital Converters (ADCx)
– Digital to Analog Converters (DACx)
– Ports (PORTx)
– DMA Controller (DMAC)
– IR Communication Module (IRCOM)
The same event can be used by multiple peripherals for synchronized timing
Advanced Features
– Manual Event Generation from software (CPU)
– Quadrature Decoding
– Digital Filtering
Functions in Active and Idle mode
Overview
The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state in one peripheral to automatically trigger actions in one or more
peripherals. What changes in a peripheral that will trigger actions in other peripherals are configurable by software. It is a simple, but powerful system as it allows for autonomous control of
peripherals without any use of interrupts, CPU or DMA resources.
The indication of a change in a peripheral is referred to as an event, and is usually the same as
the interrupt conditions for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing Network. Figure 9-1 on page 16 shows a basic
block diagram of the Event System with the Event Routing Network and the peripherals to which
it is connected. This highly flexible system can be used for simple routing of signals, pin functions or for sequencing of events.
The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are triggered in one or more other peripherals.
The Event System is functional in both Active and Idle modes.
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XMEGA A3B
Figure 9-1.
Event system block diagram.
PORTx
ClkSYS
CPU
ADCx
RTC
Event Routing
Network
DACx
IRCOM
ACx
T/Cxn
DMAC
The Event Routing Network can directly connect together ADCs, DACs, Analog Comparators
(ACx), I/O ports (PORTx), the Real-time Counter (RTC), Timer/Counters (T/C) and the IR Communication Module (IRCOM). Events can also be generated from software (CPU).
All events from all peripherals are always routed into the Event Routing Network. This consist of
eight multiplexers where each can be configured in software to select which event to be routed
into that event channel. All eight event channels are connected to the peripherals that can use
events, and each of these peripherals can be configured to use events from one or more event
channels to automatically trigger a software selectable action.
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XMEGA A3B
10. System Clock and Clock options
10.1
Features
• Fast start-up time
• Safe run-time clock switching
• Internal Oscillators:
•
•
•
•
•
•
10.2
– 32 MHz run-time calibrated RC oscillator
– 2 MHz run-time calibrated RC oscillator
– 32.768 kHz calibrated RC oscillator
– 32 kHz Ultra Low Power (ULP) oscillator
External clock options
– 0.4 - 16 MHz Crystal Oscillator
– 32.768 kHz Crystal Oscillator
– External clock
PLL with internal and external clock options with 2 to 31x multiplication
Clock Prescalers with 2 to 2048x division
Fast peripheral clock running at 2 and 4 times the CPU clock speed
Automatic Run-Time Calibration of internal oscillators
Crystal Oscillator failure detection
Overview
XMEGA A3B has an advanced clock system, supporting a large number of clock sources. It
incorporates both integrated oscillators, external crystal oscillators and resonators. A high frequency Phase Locked Loop (PLL) and clock prescalers can be controlled from software to
generate a wide range of clock frequencies from the clock source input.
It is possible to switch between clock sources from software during run-time. After reset the
device will always start up running from the 2 Mhz internal oscillator.
A calibration feature is available, and can be used for automatic run-time calibration of the internal 2 MHz and 32 MHz oscillators. This reduce frequency drift over voltage and temperature.
A Crystal Oscillator Failure Monitor can be enabled to issue a Non-Maskable Interrupt and
switch to internal oscillator if the external oscillator fails. Figure 10-1 on page 18 shows the principal clock system in XMEGA A3B.
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XMEGA A3B
Figure 10-1. Clock system overview
clkULP
WDT/BOD
32 kHz ULP
Internal Oscillator
clkRTC
RTC
32.768 kHz
Calibrated Internal
Oscillator
PERIPHERALS
ADC
2 MHz
Run-Time Calibrated
Internal Oscillator
32 MHz
Run-time Calibrated
Internal Oscillator
DAC
CLOCK CONTROL
clkPER
UNIT
with PLL and
Prescaler
PORTS
...
DMA
INTERRUPT
32.768 KHz
Crystal Oscillator
EVSYS
RAM
0.4 - 16 MHz
Crystal Oscillator
CPU
clkCPU NVM MEMORY
FLASH
External
Clock Input
EEPROM
Each clock source is briefly described in the following sub-sections.
10.3
10.3.1
Clock Options
32 kHz Ultra Low Power Internal Oscillator
The 32 kHz Ultra Low Power (ULP) Internal Oscillator is a very low power consumption clock
source. It is used for the Watchdog Timer, Brown-Out Detection and as an asynchronous clock
source for the Real Time Counter. This oscillator cannot be used as the system clock source,
and it cannot be directly controlled from software.
10.3.2
32.768 kHz Calibrated Internal Oscillator
The 32.768 kHz Calibrated Internal Oscillator is a high accuracy clock source that can be used
as the system clock source or as an asynchronous clock source for the Real Time Counter. It is
calibrated during production to provide a default frequency which is close to its nominal
frequency.
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XMEGA A3B
10.3.3
32.768 kHz Crystal Oscillator
The 32.768 kHz Crystal Oscillator is a low power driver for an external watch crystal. It can be
used as system clock source or as asynchronous clock source for the Real Time Counter.
10.3.4
0.4 - 16 MHz Crystal Oscillator
The 0.4 - 16 MHz Crystal Oscillator is a driver intended for driving both external resonators and
crystals ranging from 400 kHz to 16 MHz.
10.3.5
2 MHz Run-time Calibrated Internal Oscillator
The 2 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated
during production to provide a default frequency which is close to its nominal frequency. The
oscillator can use the 32.768 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator
as a source for calibrating the frequency run-time to compensate for temperature and voltage
drift hereby optimizing the accuracy of the oscillator.
10.3.6
32 MHz Run-time Calibrated Internal Oscillator
The 32 MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated
during production to provide a default frequency which is close to its nominal frequency. The
oscillator can use the 32.768 kHz Calibrated Internal Oscillator or the 32 kHz Crystal Oscillator
as a source for calibrating the frequency run-time to compensate for temperature and voltage
drift hereby optimizing the accuracy of the oscillator.
10.3.7
External Clock input
The external clock input gives the possibility to connect a clock from an external source.
10.3.8
PLL with Multiplication factor 2 - 31x
The PLL provides the possibility of multiplying a frequency by any number from 2 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources.
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XMEGA A3B
11. Power Management and Sleep Modes
11.1
Features
• 5 sleep modes
– Idle
– Power-down
– Power-save
– Standby
– Extended standby
• Power Reduction registers to disable clocks to unused peripherals
11.2
Overview
The XMEGA A3B provides various sleep modes tailored to reduce power consumption to a minimum. All sleep modes are available and can be entered from Active mode. In Active mode the
CPU is executing application code. The application code decides when and what sleep mode to
enter. Interrupts from enabled peripherals and all enabled reset sources can restore the microcontroller from sleep to Active mode.
In addition, Power Reduction registers provide a method to stop the clock to individual peripherals from software. When this is done, the current state of the peripheral is frozen and there is no
power consumption from that peripheral. This reduces the power consumption in Active mode
and Idle sleep mode.
11.3
Sleep Modes
11.3.1
Idle Mode
In Idle mode the CPU and Non-Volatile Memory are stopped, but all peripherals including the
Interrupt Controller, Event System and DMA Controller are kept running. Interrupt requests from
all enabled interrupts will wake the device.
11.3.2
Power-down Mode
In Power-down mode all system clock sources, and the asynchronous Real Time Counter (RTC)
clock source, are stopped. This allows operation of asynchronous modules only. The only interrupts that can wake up the MCU are the Two Wire Interface address match interrupts, and
asynchronous port interrupts, e.g pin change.
11.3.3
Power-save Mode
Power-save mode is identical to Power-down, with one exception: If the RTC is enabled, it will
keep running during sleep and the device can also wake up from RTC interrupts.
11.3.4
Standby Mode
Standby mode is identical to Power-down with the exception that all enabled system clock
sources are kept running, while the CPU, Peripheral and RTC clocks are stopped. This reduces
the wake-up time when external crystals or resonators are used.
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XMEGA A3B
11.3.5
Extended Standby Mode
Extended Standby mode is identical to Power-save mode with the exception that all enabled
system clock sources are kept running while the CPU and Peripheral clocks are stopped. This
reduces the wake-up time when external crystals or resonators are used.
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XMEGA A3B
12. System Control and Reset
12.1
Features
• Multiple reset sources for safe operation and device reset
– Power-On Reset
– External Reset
– Watchdog Reset
The Watchdog Timer runs from separate, dedicated oscillator
– Brown-Out Reset
Accurate, programmable Brown-Out levels
– JTAG Reset
– PDI reset
– Software reset
• Asynchronous reset
– No running clock in the device is required for reset
• Reset status register
12.2
Resetting the AVR
During reset, all I/O registers are set to their initial values. The SRAM content is not reset. Application execution starts from the Reset Vector. The instruction placed at the Reset Vector should
be an Absolute Jump (JMP) instruction to the reset handling routine. By default the Reset Vector
address is the lowest Flash program memory address, ‘0’, but it is possible to move the Reset
Vector to the first address in the Boot Section.
The I/O ports of the AVR are immediately tri-stated when a reset source goes active.
The reset functionality is asynchronous, so no running clock is required to reset the device.
After the device is reset, the reset source can be determined by the application by reading the
Reset Status Register.
12.3
12.3.1
Reset Sources
Power-On Reset
The MCU is reset when the supply voltage VCC is below the Power-on Reset threshold voltage.
12.3.2
External Reset
The MCU is reset when a low level is present on the RESET pin.
12.3.3
Watchdog Reset
The MCU is reset when the Watchdog Timer period expires and the Watchdog Reset is enabled.
The Watchdog Timer runs from a dedicated oscillator independent of the System Clock. For
more details see ”WDT - Watchdog Timer” on page 23.
12.3.4
Brown-Out Reset
The MCU is reset when the supply voltage VCC is below the Brown-Out Reset threshold voltage
and the Brown-out Detector is enabled. The Brown-out threshold voltage is programmable.
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XMEGA A3B
12.3.5
JTAG reset
The MCU is reset as long as there is a logic one in the Reset Register in one of the scan chains
of the JTAG system. Refer to IEEE 1149.1 (JTAG) Boundary-scan for details.
12.3.6
PDI reset
The MCU can be reset through the Program and Debug Interface (PDI).
12.3.7
Software reset
The MCU can be reset by the CPU writing to a special I/O register through a timed sequence.
12.4
12.4.1
WDT - Watchdog Timer
Features
• 11 selectable timeout periods, from 8 ms to 8s.
• Two operation modes
– Standard mode
– Window mode
• Runs from the 1 kHz output of the 32 kHz Ultra Low Power oscillator
• Configuration lock to prevent unwanted changes
12.4.2
Overview
The XMEGA A3B has a Watchdog Timer (WDT). The WDT will run continuously when turned on
and if the Watchdog Timer is not reset within a software configurable time-out period, the microcontroller will be reset. The Watchdog Reset (WDR) instruction must be run by software to reset
the WDT, and prevents microcontroller reset.
The WDT has a Window mode. In this mode the WDR instruction must be run within a specified
period called a window. Application software can set the minimum and maximum limits for this
window. If the WDR instruction is not executed inside the window limits, the microcontroller will
be reset.
A protection mechanism using a timed write sequence is implemented in order to prevent
unwanted enabling, disabling or change of WDT settings.
For maximum safety, the WDT also has an Always-on mode. This mode is enabled by programming a fuse. In Always-on mode, application software can not disable the WDT.
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XMEGA A3B
13. Battery Backup System
13.1
Features
• Battery Backup voltage supply from dedicated VBAT power pin for:
– One Ultra Low-power 32-bit Real Time Counter
– One 32.768 kHz crystal oscillator with failure detection monitor
– Two Backup Registers
• Typical power consumption of 500nA with Real Time Counter (RTC) running
• Automatic switching from main power to battery backup power at:
– Brown-Out Detection (BOD) reset
• Automatic switching from battery backup power to main power:
– Device reset after Brown-Out Reset (BOR) is released
– Device reset after Power-On Reset (POR) and BOR is released
13.2
Overview
The AVR XMEGA family is already running in an ultra low leakage process with power-save current consumption below 2 µA with RTC, BOD and watchdog enabled. Still, for some applications
where time keeping is important, the system would have one main battery or power source used
for day to day tasks, and one backup battery power for the time keeping functionality. The Battery Backup System includes functionality that enable automatic power switching between main
power and a battery backup power. Figure 13-1 on page 25 shows an overview of the system.
The Battery Backup Module support connection of a backup battery to the dedicated VBAT power
pin. This will ensure power to the 32-bit Real Time Counter, a 32.768 kHz crystal oscillator with
failure detection monitor and two backup registers, when the main battery or power source is
unavailable.
Upon main power loss the device will automatically detect this and the Battery Backup Module
will switch to be powered from the VBAT pin. After main power has been restored and both main
POR and BOR are released, the Battery Backup Module will automatically switch back to be
powered from main power again.
The 32-bit Real Time Counter (RTC) must be clocked from the 1 Hz output of a 32.768 kHz crystal oscillator connected between the TOSC1 and TOSC2 pins when running from VBAT. For more
details on the 32-bit RTC refer to the “RTC32 - 32-bit Real Time Counter” section in the XMEGA
A Manual.
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XMEGA A3B
Figure 13-1. Battery Backup Module and its power domain implementation
VBAT
Power
supervisor
Power
switch
Watchdog w/
independent
RCOSC
(BBPOD,
BBBOD,
BBPWR)
Main
power
supervision
VCC
XTAL1
OCD &
Programming
Interface
Oscillator &
sleep
controller
XTAL2
Failure
Monitor
XOSC
TOSC2
RTC
Level shifters / Isolation
TOSC1
CPU
&
Peripherals
Internal
RAM
GPIO
FLASH,
EEPROM
& Fuses
Backup
Registers
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XMEGA A3B
14. PMIC - Programmable Multi-level Interrupt Controller
14.1
Features
• Separate interrupt vector for each interrupt
• Short, predictable interrupt response time
• Programmable Multi-level Interrupt Controller
– 3 programmable interrupt levels
– Selectable priority scheme within low level interrupts (round-robin or fixed)
– Non-Maskable Interrupts (NMI)
• Interrupt vectors can be moved to the start of the Boot Section
14.2
Overview
XMEGA A3B has a Programmable Multi-level Interrupt Controller (PMIC). All peripherals can
define three different priority levels for interrupts; high, medium or low. Medium level interrupts
may interrupt low level interrupt service routines. High level interrupts may interrupt both lowand medium level interrupt service routines. Low level interrupts have an optional round robin
scheme to make sure all interrupts are serviced within a certain amount of time.
The built in oscillator failure detection mechanism can issue a Non-Maskable Interrupt (NMI).
14.3
Interrupt vectors
When an interrupt is serviced, the program counter will jump to the interrupt vector address. The
interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for
specific interrupts in each peripheral. The base addresses for the XMEGA A3B devices are
shown in Table 14-1. Offset addresses for each interrupt available in the peripheral are
described for each peripheral in the XMEGA A manual. For peripherals or modules that have
only one interrupt, the interrupt vector is shown in Table 14-1. The program address is the word
address.
Table 14-1.
Reset and Interrupt Vectors
Program Address
(Base Address)
Source
0x000
RESET
0x002
OSCF_INT_vect
Crystal Oscillator Failure Interrupt vector (NMI)
0x004
PORTC_INT_base
Port C Interrupt base
0x008
PORTR_INT_base
Port R Interrupt base
0x00C
DMA_INT_base
DMA Controller Interrupt base
0x014
RTC32_INT_base
32-bit Real Time Counter Interrupt base
0x018
TWIC_INT_base
Two-Wire Interface on Port C Interrupt base
0x01C
TCC0_INT_base
Timer/Counter 0 on port C Interrupt base
0x028
TCC1_INT_base
Timer/Counter 1 on port C Interrupt base
0x030
SPIC_INT_vect
SPI on port C Interrupt vector
0x032
USARTC0_INT_base
USART 0 on port C Interrupt base
0x038
USARTC1_INT_base
USART 1 on port C Interrupt base
0x03E
AES_INT_vect
AES Interrupt vector
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XMEGA A3B
Table 14-1.
Reset and Interrupt Vectors (Continued)
Program Address
(Base Address)
Source
Interrupt Description
0x040
NVM_INT_base
Non-Volatile Memory Interrupt base
0x044
PORTB_INT_base
Port B Interrupt base
0x048
ACB_INT_base
Analog Comparator on Port B Interrupt base
0x04E
ADCB_INT_base
Analog to Digital Converter on Port B Interrupt base
0x056
PORTE_INT_base
Port E Interrupt base
0x05A
TWIE_INT_base
Two-Wire Interface on Port E Interrupt base
0x05E
TCE0_INT_base
Timer/Counter 0 on port E Interrupt base
0x06A
TCE1_INT_base
Timer/Counter 1 on port E Interrupt base
0x074
USARTE0_INT_base
USART 0 on port E Interrupt base
0x080
PORTD_INT_base
Port D Interrupt base
0x084
PORTA_INT_base
Port A Interrupt base
0x088
ACA_INT_base
Analog Comparator on Port A Interrupt base
0x08E
ADCA_INT_base
Analog to Digital Converter on Port A Interrupt base
0x09A
TCD0_INT_base
Timer/Counter 0 on port D Interrupt base
0x0A6
TCD1_INT_base
Timer/Counter 1 on port D Interrupt base
0x0AE
SPID_INT_vector
SPI on port D Interrupt vector
0x0B0
USARTD0_INT_base
USART 0 on port D Interrupt base
0x0B6
USARTD1_INT_base
USART 1 on port D Interrupt base
0x0D0
PORTF_INT_base
Port F INT base
0x0D8
TCF0_INT_base
Timer/Counter 0 on port F Interrupt base
0x0EE
USARTF0_INT_base
USART 0 on port F Interrupt base
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XMEGA A3B
15. I/O Ports
15.1
Features
• Selectable input and output configuration for each pin individually
• Flexible pin configuration through dedicated Pin Configuration Register
• Synchronous and/or asynchronous input sensing with port interrupts and events
•
•
•
•
•
•
•
•
•
•
15.2
– Sense both edges
– Sense rising edges
– Sense falling edges
– Sense low level
Asynchronous wake-up from all input sensing configurations
Two port interrupts with flexible pin masking
Highly configurable output driver and pull settings:
–
Totem-pole
–
Pull-up/-down
–
Wired-AND
–
Wired-OR
–
Bus-keeper
–
Inverted I/O
Optional Slew rate control
Configuration of multiple pins in a single operation
Read-Modify-Write (RMW) support
Toggle/clear/set registers for Output and Direction registers
Clock output on port pin
Event Channel 0 output on port pin 7
Mapping of port registers (virtual ports) into bit accessible I/O memory space
Overview
The XMEGA A3B devices have flexible General Purpose I/O Ports. A port consists of up to 8
pins, ranging from pin 0 to pin 7. The ports implement several functions, including synchronous/asynchronous input sensing, pin change interrupts and configurable output settings. All
functions are individual per pin, but several pins may be configured in a single operation.
15.3
I/O configuration
All port pins (Pn) have programmable output configuration. In addition, all port pins have an
inverted I/O function. For an input, this means inverting the signal between the port pin and the
pin register. For an output, this means inverting the output signal between the port register and
the port pin. The inverted I/O function can be used also when the pin is used for alternate functions. The port pins also have configurable slew rate limitation to reduce electromagnetic
emission.
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XMEGA A3B
15.3.1
Push-pull
Figure 15-1. I/O configuration - Totem-pole
DIRn
OUTn
Pn
INn
15.3.2
Pull-down
Figure 15-2. I/O configuration - Totem-pole with pull-down (on input)
DIRn
OUTn
Pn
INn
15.3.3
Pull-up
Figure 15-3. I/O configuration - Totem-pole with pull-up (on input)
DIRn
OUTn
Pn
INn
15.3.4
Bus-keeper
The bus-keeper’s weak output produces the same logical level as the last output level. It acts as
a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’.
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XMEGA A3B
Figure 15-4. I/O configuration - Totem-pole with bus-keeper
DIRn
OUTn
Pn
INn
15.3.5
Others
Figure 15-5. Output configuration - Wired-OR with optional pull-down
OUTn
Pn
INn
Figure 15-6. I/O configuration - Wired-AND with optional pull-up
INn
Pn
OUTn
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XMEGA A3B
15.4
Input sensing
•
•
•
•
Sense both edges
Sense rising edges
Sense falling edges
Sense low level
Input sensing is synchronous or asynchronous depending on the enabled clock for the ports,
and the configuration is shown in Figure 15-7 on page 31.
Figure 15-7. Input sensing system overview
Asynchronous sensing
EDGE
DETECT
Interrupt
Control
IREQ
Synchronous sensing
Pn
Synchronizer
INn
Q D
D
INVERTED I/O
R
Q
EDGE
DETECT
Event
R
When a pin is configured with inverted I/O the pin value is inverted before the input sensing.
15.5
Port Interrupt
Each port has two interrupts with separate priority and interrupt vector. All pins on the port can
be individually selected as source for each of the interrupts. The interrupts are then triggered
according to the input sense configuration for each pin configured as source for the interrupt.
15.6
Alternate Port Functions
In addition to the input/output functions on all port pins, most pins have alternate functions. This
means that other modules or peripherals connected to the port can use the port pins for their
functions, such as communication or pulse-width modulation. ”Pinout and Pin Functions” on
page 50 shows which modules on peripherals that enables alternate functions on a pin, and
what alternate functions that is available on a pin.
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XMEGA A3B
16. T/C - 16-bit Timer/Counter with PWM
16.1
Features
• Seven 16-bit Timer/Counters
•
•
•
•
•
•
•
•
•
•
•
•
16.2
– Four Timer/Counters of type 0
– Three Timer/Counters of type 1
Four Compare or Capture (CC) Channels in Timer/Counter 0
Two Compare or Capture (CC) Channels in Timer/Counter 1
Double Buffered Timer Period Setting
Double Buffered Compare or Capture Channels
Waveform Generation:
– Single Slope Pulse Width Modulation
– Dual Slope Pulse Width Modulation
– Frequency Generation
Input Capture:
– Input Capture with Noise Cancelling
– Frequency capture
– Pulse width capture
– 32-bit input capture
Event Counter with Direction Control
Timer Overflow and Timer Error Interrupts and Events
One Compare Match or Capture Interrupt and Event per CC Channel
Supports DMA Operation
Hi-Resolution Extension (Hi-Res)
Advanced Waveform Extension (AWEX)
Overview
XMEGA A3B has seven Timer/Counters, four Timer/Counter 0 and three Timer/Counter 1. The
difference between them is that Timer/Counter 0 has four Compare/Capture channels, while
Timer/Counter 1 has two Compare/Capture channels.
The Timer/Counters (T/C) are 16-bit and can count any clock, event or external input in the
microcontroller. A programmable prescaler is available to get a useful T/C resolution. Updates of
Timer and Compare registers are double buffered to ensure glitch free operation. Single slope
PWM, dual slope PWM and frequency generation waveforms can be generated using the Compare Channels.
Through the Event System, any input pin or event in the microcontroller can be used to trigger
input capture, hence no dedicated pins are required for this. The input capture has a noise canceller to avoid incorrect capture of the T/C, and can be used to do frequency and pulse width
measurements.
A wide range of interrupt or event sources are available, including T/C Overflow, Compare
match and Capture for each Compare/Capture channel in the T/C.
PORTC, PORTD and PORTE each has one Timer/Counter 0 and one Timer/Counter1. PORTF
has one Timer/Counter 0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1,
TCE0, TCE1 and TCF0, respectively.
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XMEGA A3B
Figure 16-1. Overview of a Timer/Counter and closely related peripherals
Timer/Counter
Base Counter
Prescaler
clkPER
Timer Period
Control Logic
Counter
Event
System
clkPER4
Buffer
Capture
Control
Waveform
Generation
DTI
Dead-Time
Insertion
Pattern
Generation
Fault
Protection
PORT
Comparator
AWeX
Hi-Res
Compare/Capture Channel D
Compare/Capture Channel C
Compare/Capture Channel B
Compare/Capture Channel A
The Hi-Resolution Extension can be enabled to increase the waveform generation resolution by
2 bits (4x). This is available for all Timer/Counters. See ”Hi-Res - High Resolution Extension” on
page 35 for more details.
The Advanced Waveform Extension can be enabled to provide extra and more advanced features for the Timer/Counter. This are only available for Timer/Counter 0. See ”AWEX - Advanced
Waveform Extension” on page 34 for more details.
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XMEGA A3B
17. AWEX - Advanced Waveform Extension
17.1
Features
•
•
•
•
•
•
•
•
17.2
Output with complementary output from each Capture channel
Four Dead Time Insertion (DTI) Units, one for each Capture channel
8-bit DTI Resolution
Separate High and Low Side Dead-Time Setting
Double Buffered Dead-Time
Event Controlled Fault Protection
Single Channel Multiple Output Operation (for BLDC motor control)
Double Buffered Pattern Generation
Overview
The Advanced Waveform Extension (AWEX) provides extra features to the Timer/Counter in
Waveform Generation (WG) modes. The AWEX enables easy and safe implementation of for
example, advanced motor control (AC, BLDC, SR, and Stepper) and power control applications.
Any WG output from a Timer/Counter 0 is split into a complimentary pair of outputs when any
AWEX feature is enabled. These output pairs go through a Dead-Time Insertion (DTI) unit that
enables generation of the non-inverted Low Side (LS) and inverted High Side (HS) of the WG
output with dead time insertion between LS and HS switching. The DTI output will override the
normal port value according to the port override setting. Optionally the final output can be
inverted by using the invert I/O setting for the port pin.
The Pattern Generation unit can be used to generate a synchronized bit pattern on the port it is
connected to. In addition, the waveform generator output from Compare Channel A can be distributed to, and override all port pins. When the Pattern Generator unit is enabled, the DTI unit is
bypassed.
The Fault Protection unit is connected to the Event System. This enables any event to trigger a
fault condition that will disable the AWEX output. Several event channels can be used to trigger
fault on several different conditions.
The AWEX is available for TCC0. The notation is AWEXC.
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XMEGA A3B
18. Hi-Res - High Resolution Extension
18.1
Features
• Increases Waveform Generator resolution by 2-bits (4x)
• Supports Frequency, single- and dual-slope PWM operation
• Supports the AWEX when this is enabled and used for the same Timer/Counter
18.2
Overview
The Hi-Resolution (Hi-Res) Extension is able to increase the resolution of the waveform generation output by a factor of 4. When enabled for a Timer/Counter, the Fast Peripheral clock running
at four times the CPU clock speed will be as input to the Timer/Counter.
The High Resolution Extension can also be used when an AWEX is enabled and used with a
Timer/Counter.
XMEGA A3B devices have four Hi-Res Extensions that each can be enabled for each
Timer/Counters pair on PORTC, PORTD, PORTE and PORTF. The notation of these are
HIRESC, HIRESD, HIRESE and HIRESF, respectively.
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XMEGA A3B
19. RTC32 - 32-bit Real-Time Counter
19.1
Features
•
•
•
•
•
•
32-bit resolution
One 32-bit Compare register
One 32-bit Period register
Clear Timer on overflow
Optional Interrupt/ Event on overflow and compare match
Selectable clock reference
– 1.024 kHz
– 1 Hz
• Isolated VBAT power domain with dynamic switch over from/to VCC power domain’
19.1.1
Overview
The 32-bit Real Time Counter (RTC) is a 32-bit counter, counting reference clock cycles and giving an event and/or an interrupt request when it reaches a configurable compare and/or top
value. The reference clock is generated from a high accuracy 32.768 kHz crystal, and the design
is optimized for low power consumption. The RTC typically operate in low power sleep modes,
keeping track of time and waking up the device at regular intervals.
The RTC input clock can be taken from a 1.024 kHz or 1 Hz prescaled output from the 32.768
kHz reference clock. The RTC will give a compare interrupt request and/or event when the counter value equals the Compare register value. The RTC will give an overflow interrupt request
and/or event when the counter value equals the Period register value. Counter overflow will also
reset the counter value to zero.
The 32-bit Real Time Counter (RTC) must be clocked from the 1 Hz output of a 32.768 kHz crystal oscillator connected between the TOSC1 and TOSC2 pins when running from VBAT. For more
details on the 32-bit RTC refer to the “32-bit Real Time Counter” section in the XMEGA A
Manual.
Figure 19-1. Real Time Counter Overview
3 2 - b it P e r io d
=
O v e r f lo w
1 Hz
3 2 - b it C o u n te r
1 .0 2 4 k H z
=
C o m p a re M a tc h
3 2 - b it C o m p a r e
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XMEGA A3B
20. TWI - Two Wire Interface
20.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
20.2
Two Identical TWI peripherals
Simple yet Powerful and Flexible Communication Interface
Both Master and Slave Operation Supported
Device can Operate as Transmitter or Receiver
7-bit Address Space Allows up to 128 Different Slave Addresses
Multi-master Arbitration Support
Up to 400 kHz Data Transfer Speed
Slew-rate Limited Output Drivers
Noise Suppression Circuitry Rejects Spikes on Bus Lines
Fully Programmable Slave Address with General Call Support
Address Recognition Causes Wake-up when in Sleep Mode
I2C and System Management Bus (SMBus) compatible
Overview
The Two-Wire Interface (TWI) is a bi-directional wired-AND bus with only two lines, the clock
(SCL) line and the data (SDA) line. The protocol makes it possible to interconnect up to 128 individually addressable devices. Since it is a multi-master bus, one or more devices capable of
taking control of the bus can be connected.
The only external hardware needed to implement the bus is a single pull-up resistor for each of
the TWI bus lines. Mechanisms for resolving bus contention are inherent in the TWI protocol.
PORTC and PORTE, each has one TWI. Notation of these peripherals are TWIC, and TWIE,
respectively.
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XMEGA A3B
21. SPI - Serial Peripheral Interface
21.1
Features
•
•
•
•
•
•
•
•
•
21.2
Two Identical SPI peripherals
Full-duplex, Three-wire Synchronous Data Transfer
Master or Slave Operation
LSB First or MSB First Data Transfer
Seven Programmable Bit Rates
End of Transmission Interrupt Flag
Write Collision Flag Protection
Wake-up from Idle Mode
Double Speed (CK/2) Master SPI Mode
Overview
The Serial Peripheral Interface (SPI) allows high-speed full-duplex, synchronous data transfer
between different devices. Devices can communicate using a master-slave scheme, and data is
transferred both to and from the devices simultaneously.
PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID,
respectively.
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XMEGA A3B
22. USART
22.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
22.2
Six Identical USART peripherals
Full Duplex Operation (Independent Serial Receive and Transmit Registers)
Asynchronous or Synchronous Operation
Master or Slave Clocked Synchronous Operation
High-resolution Arithmetic Baud Rate Generator
Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits
Odd or Even Parity Generation and Parity Check Supported by Hardware
Data OverRun Detection
Framing Error Detection
Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter
Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete
Multi-processor Communication Mode
Double Speed Asynchronous Communication Mode
Master SPI mode for SPI communication
IrDA support through the IRCOM module
Overview
The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is a
highly flexible serial communication module. The USART supports full duplex communication,
and both asynchronous and clocked synchronous operation. The USART can also be set in
Master SPI mode to be used for SPI communication.
Communication is frame based, and the frame format can be customized to support a wide
range of standards. The USART is buffered in both direction, enabling continued data transmission without any delay between frames. There are separate interrupt vectors for receive and
transmit complete, enabling fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity
generation and parity check can also be enabled.
One USART can use the IRCOM module to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2 kbps.
PORTC and PORTD each has two USARTs, while PORTE and PORTF each has one USART.
Notation of these peripherals are USARTC0, USARTC1, USARTD0, USARTD1, USARTE0 and
USARTF0, respectively.
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XMEGA A3B
23. IRCOM - IR Communication Module
23.1
Features
• Pulse modulation/demodulation for infrared communication
• Compatible to IrDA 1.4 physical for baud rates up to 115.2 kbps
• Selectable pulse modulation scheme
– 3/16 of baud rate period
– Fixed pulse period, 8-bit programmable
– Pulse modulation disabled
• Built in filtering
• Can be connected to and used by one USART at a time
23.2
Overview
XMEGA A3B contains an Infrared Communication Module (IRCOM) for IrDA communication
with baud rates up to 115.2 kbps. This supports three modulation schemes: 3/16 of baud rate
period, fixed programmable pulse time based on the Peripheral Clock speed, or pulse modulation disabled. There is one IRCOM available which can be connected to any USART to enable
infrared pulse coding/decoding for that USART.
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XMEGA A3B
24. Crypto Engine
24.1
Features
• Data Encryption Standard (DES) CPU instruction
• Advanced Encryption Standard (AES) Crypto module
• DES Instruction
– Encryption and Decryption
– Single-cycle DES instruction
– Encryption/Decryption in 16 clock cycles per 8-byte block
• AES Crypto Module
– Encryption and Decryption
– Support 128-bit keys
– Support XOR data load mode to the State memory for Cipher Block Chaining
– Encryption/Decryption in 375 clock cycles per 16-byte block
24.2
Overview
The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used encryption standards. These are supported through an AES peripheral module and
a DES CPU instruction. All communication interfaces and the CPU can optionally use AES and
DES encrypted communication and data storage.
DES is supported by a DES instruction in the AVR XMEGA CPU. The 8-byte key and 8-byte
data blocks must be loaded into the Register file, and then DES must be executed 16 times to
encrypt/decrypt the data block.
The AES Crypto Module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key.
The key and data must be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral clock cycles before the encryption/decryption is
done and decrypted/encrypted data can be read out, and an optional interrupt can be generated.
The AES Crypto Module also has DMA support with transfer triggers when encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully
loaded.
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XMEGA A3B
25. ADC - 12-bit Analog to Digital Converter
25.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
25.2
Two ADCs with 12-bit resolution
2 Msps sample rate for each ADC
Signed and Unsigned conversions
4 result registers with individual input channel control for each ADC
8 single ended inputs for each ADC
8x4 differential inputs for each ADC
4 internal inputs:
–
Integrated Temperature Sensor
–
DAC Output
–
VCC voltage divided by 10
–
Bandgap voltage
Software selectable gain of 2, 4, 8, 16, 32 or 64
Software selectable resolution of 8- or 12-bit.
Internal or External Reference selection
Event triggered conversion for accurate timing
DMA transfer of conversion results
Interrupt/Event on compare result
Overview
XMEGA A3B devices have two Analog to Digital Converters (ADC), see Figure 25-1 on page 43.
The two ADC modules can be operated simultaneously, individually or synchronized.
The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 2 million samples per second. The input selection is flexible, and both
single-ended and differential measurements can be done. For differential measurements an
optional gain stage is available to increase the dynamic range. In addition several internal signal
inputs are available. The ADC can provide both signed and unsigned results.
This is a pipeline ADC. A pipeline ADC consists of several consecutive stages, where each
stage convert one part of the result. The pipeline design enables high sample rate at low clock
speeds, and remove limitations on samples speed versus propagation delay. This also means
that a new analog voltage can be sampled and a new ADC measurement started while other
ADC measurements are ongoing.
ADC measurements can either be started by application software or an incoming event from
another peripheral in the device. Four different result registers with individual input selection
(MUX selection) are provided to make it easier for the application to keep track of the data. Each
result register and MUX selection pair is referred to as an ADC Channel. It is possible to use
DMA to move ADC results directly to memory or peripherals when conversions are done.
Both internal and external analog reference voltages can be used. An accurate internal 1.0V
reference is available.
An integrated temperature sensor is available and the output from this can be measured with the
ADC. The output from the DAC, VCC/10 and the Bandgap voltage can also be measured by the
ADC.
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XMEGA A3B
Figure 25-1. ADC overview
Channel C MUX selection
Channel D MUX selection
Configuration
Reference selection
Pin inputs
Channel A
Register
Channel B
Register
Pin inputs
Internal inputs
Channel A MUX selection
Channel B MUX selection
ADC
Channel C
Register
1-64 X
Event
Trigger
Channel D
Register
Each ADC has four MUX selection registers with a corresponding result register. This means
that four channels can be sampled within 1.5 µs without any intervention by the application other
than starting the conversion. The results will be available in the result registers.
The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5 µs for 12-bit to 2.5 µs for 8-bit result.
ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This
eases calculation when the result is represented as a signed integer (signed 16-bit number).
PORTA and PORTB each have one ADC. Notation of these peripherals are ADCA and ADCB,
respectively.
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XMEGA A3B
26. DAC - 12-bit Digital to Analog Converter
26.1
Features
•
•
•
•
•
•
•
•
26.2
One DAC with 12-bit resolution
Up to 1 Msps conversion rate for each DAC
Flexible conversion range
Multiple trigger sources
1 continuous output or 2 Sample and Hold (S/H) outputs for each DAC
Built-in offset and gain calibration
High drive capabilities
Low Power Mode
Overview
The XMEGA A3B devices features one two-channel, 12-bit, 1 Msps DACs with built-in offset and
gain calibration, see Figure 26-1 on page 44.
A DAC converts a digital value into an analog signal. The DAC may use an internal 1.0 voltage
as the upper limit for conversion, but it is also possible to use the supply voltage or any applied
voltage in-between. The external reference input is shared with the ADC reference input.
Figure 26-1. DAC overview
Configuration
Reference selection
Channel A
Register
Channel A
DAC
Channel B
Channel B
Register
Event
Trigger
The DAC has one continuous output with high drive capabilities for both resistive and capacitive
loads. It is also possible to split the continuous time channel into two Sample and Hold (S/H)
channels, each with separate data conversion registers.
A DAC conversion may be started from the application software by writing the data conversion
registers. The DAC can also be configured to do conversions triggered by the Event System to
have regular timing, independent of the application software. DMA may be used for transferring
data from memory locations to DAC data registers.
The DAC has a built-in calibration system to reduce offset and gain error when loading with a
calibration value from software.
PORTB has one DAC. Notation of this is DACB.
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XMEGA A3B
27. AC - Analog Comparator
27.1
Features
• Four Analog Comparators
• Selectable Power vs. Speed
• Selectable hysteresis
– 0, 20 mV, 50 mV
• Analog Comparator output available on pin
• Flexible Input Selection
– All pins on the port
– Output from the DAC
– Bandgap reference voltage.
– Voltage scaler that can perform a 64-level scaling of the internal VCC voltage.
• Interrupt and event generation on
– Rising edge
– Falling edge
– Toggle
• Window function interrupt and event generation on
– Signal above window
– Signal inside window
– Signal below window
27.2
Overview
XMEGA A3B features four Analog Comparators (AC). An Analog Comparator compares two
voltages, and the output indicates which input is largest. The Analog Comparator may be configured to give interrupt requests and/or events upon several different combinations of input
change.
Both hysteresis and propagation delays may be adjusted in order to find the optimal operation
for each application.
A wide range of input selection is available, both external pins and several internal signals can
be used.
The Analog Comparators are always grouped in pairs (AC0 and AC1) on each analog port. They
have identical behavior but separate control registers.
Optionally, the state of the comparator is directly available on a pin.
PORTA and PORTB each have one AC pair. Notations are ACA and ACB, respectively.
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XMEGA A3B
Figure 27-1. Analog comparator overview
Pin inputs
Internal inputs
+
Pin 0 output
AC0
Pin inputs
-
Internal inputs
VCC scaled
Interrupt
sensitivity
control
Pin inputs
Interrupts
Events
Internal inputs
+
AC1
Pin inputs
-
Internal inputs
VCC scaled
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XMEGA A3B
27.3
Input Selection
The Analog comparators have a very flexible input selection and the two comparators grouped
in a pair may be used to realize a window function. One pair of analog comparators is shown in
Figure 27-1 on page 46.
• Input selection from pin
– Pin 0, 1, 2, 3, 4, 5, 6 selectable to positive input of analog comparator
– Pin 0, 1, 3, 5, 7 selectable to negative input of analog comparator
• Internal signals available on positive analog comparator inputs
– Output from 12-bit DAC
• Internal signals available on negative analog comparator inputs
– 64-level scaler of the VCC, available on negative analog comparator input
– Bandgap voltage reference
– Output from 12-bit DAC
27.4
Window Function
The window function is realized by connecting the external inputs of the two analog comparators
in a pair as shown in Figure 27-2.
Figure 27-2. Analog comparator window function
+
AC0
Upper limit of window
Interrupt
sensitivity
control
Input signal
Interrupts
Events
+
AC1
Lower limit of window
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XMEGA A3B
28. OCD - On-chip Debug
28.1
Features
• Complete Program Flow Control
– Go, Stop, Reset, Step into, Step over, Step out, Run-to-Cursor
Debugging on C and high-level language source code level
Debugging on Assembler and disassembler level
1 dedicated program address or source level breakpoint for AVR Studio / debugger
4 Hardware Breakpoints
Unlimited Number of User Program Breakpoints
Unlimited Number of User Data Breakpoints, with break on:
– Data location read, write or both read and write
– Data location content equal or not equal to a value
– Data location content is greater or less than a value
– Data location content is within or outside a range
– Bits of a data location are equal or not equal to a value
• Non-Intrusive Operation
– No hardware or software resources in the device are used
• High Speed Operation
– No limitation on debug/programming clock frequency versus system clock frequency
•
•
•
•
•
•
28.2
Overview
The XMEGA A3B has a powerful On-Chip Debug (OCD) system that - in combination with
Atmel’s development tools - provides all the necessary functions to debug an application. It has
support for program and data breakpoints, and can debug an application from C and high level
language source code level, as well as assembler and disassembler level. It has full Non-Intrusive Operation and no hardware or software resources in the device are used. The ODC system
is accessed through an external debugging tool which connects to the JTAG or PDI physical
interfaces. Refer to ”Program and Debug Interfaces” on page 49.
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XMEGA A3B
29. Program and Debug Interfaces
29.1
Features
•
•
•
•
•
29.2
PDI - Program and Debug Interface (Atmel proprietary 2-pin interface)
JTAG Interface (IEEE std. 1149.1 compliant)
Boundary-scan capabilities according to the IEEE Std. 1149.1 (JTAG)
Access to the OCD system
Programming of Flash, EEPROM, Fuses and Lock Bits
Overview
The programming and debug facilities are accessed through the JTAG and PDI physical interfaces. The PDI physical uses one dedicated pin together with the Reset pin, and no general
purpose pins are used. JTAG uses four general purpose pins on PORTB.
29.3
JTAG interface
The JTAG physical layer handles the basic low-level serial communication over four I/O lines
named TMS, TCK, TDI, and TDO. It complies to the IEEE Std. 1149.1 for test access port and
boundary scan.
29.4
PDI - Program and Debug Interface
The PDI is an Atmel proprietary protocol for communication between the microcontroller and
Atmel’s development tools.
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XMEGA A3B
30. Pinout and Pin Functions
The pinout of XMEGA A3B is shown in ”Pinout/Block Diagram” on page 3. In addition to general
I/O functionality, each pin may have several functions. This will depend on which peripheral is
enabled and connected to the actual pin. Only one of the alternate pin functions can be used at
time.
30.1
Alternate Pin Function Description
The tables below shows the notation for all pin functions available and describes its function.
30.1.1
30.1.2
30.1.3
30.1.4
30.1.5
Operation/Power Supply
VCC
Digital supply voltage
AVCC
Analog supply voltage
VBAT
Battery Backup Module supply voltage
GND
Ground
Port Interrupt functions
SYNC
Port pin with full synchronous and limited asynchronous interrupt function
ASYNC
Port pin with full synchronous and full asynchronous interrupt function
Analog functions
ACn
Analog Comparator input pin n
AC0OUT
Analog Comparator 0 Output
ADCn
Analog to Digital Converter input pin n
DACn
Digital to Analog Converter output pin n
AREF
Analog Reference input pin
Timer/Counter and AWEX functions
OCnx
Output Compare Channel x for Timer/Counter n
OCnx
Inverted Output Compare Channel x for Timer/Counter n
OCnxLS
Output Compare Channel x Low Side for Timer/Counter n
OCnxHS
Output Compare Channel x High Side for Timer/Counter n
Communication functions
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SCL
Serial Clock for TWI
SDA
Serial Data for TWI
SCLIN
Serial Clock In for TWI when external driver interface is enabled
SCLOUT
Serial Clock Out for TWI when external driver interface is enabled
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XMEGA A3B
30.1.6
30.1.7
SDAIN
Serial Data In for TWI when external driver interface is enabled
SDAOUT
Serial Data Out for TWI when external driver interface is enabled
XCKn
Transfer Clock for USART n
RXDn
Receiver Data for USART n
TXDn
Transmitter Data for USART n
SS
Slave Select for SPI
MOSI
Master Out Slave In for SPI
MISO
Master In Slave Out for SPI
SCK
Serial Clock for SPI
Oscillators, Clock and Event
TOSCn
Timer Oscillator pin n
XTALn
Input/Output for inverting Oscillator pin n
CLKOUT
Peripheral Clock Output
EVOUT
Event Channel 0 Output
Debug/System functions
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RESET
Reset pin
PDI_CLK
Program and Debug Interface Clock pin
PDI_DATA
Program and Debug Interface Data pin
TCK
JTAG Test Clock
TDI
JTAG Test Data In
TDO
JTAG Test Data Out
TMS
JTAG Test Mode Select
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XMEGA A3B
30.2
Alternate Pin Functions
The tables below show the primary/default function for each pin on a port in the first column, the
pin number in the second column, and then all alternate pin functions in the remaining columns.
The head row shows what peripheral that enable and use the alternate pin functions.
Port A - Alternate functions
Table 30-1.
PORT A
PIN #
INTERRUPT
ADCA
POS
ADCA
NEG
ADCA
GAINPOS
SYNC
ADC0
ADC0
ADC0
ADCA
GAINNEG
ACA
POS
ACA
NEG
AC0
AC0
AC1
GND
60
AVCC
61
PA0
62
PA1
63
SYNC
ADC1
ADC1
ADC1
AC1
PA2
64
SYNC/ASYNC
ADC2
ADC2
ADC2
AC2
PA3
1
SYNC
ADC3
ADC3
ADC3
PA4
2
SYNC
ADC4
PA5
3
SYNC
ADC5
ADC5
ADC5
AC5
PA6
4
SYNC
ADC6
ADC6
ADC6
AC6
PA7
5
SYNC
ADC7
ADC7
ADC7
ADC4
AREF
AC3
AC4
AC5
AC7
PIN #
INTERRUPT
PB0
6
SYNC
PB1
7
SYNC
PB2
8
SYNC/ASYNC
ADC2
PB3
9
SYNC
ADC3
PB4
10
SYNC
ADC4
ADC4
ADC4
AC4
PB5
11
SYNC
ADC5
ADC5
ADC5
AC5
PB6
12
SYNC
ADC6
ADC6
ADC6
AC6
PB7
13
SYNC
ADC7
ADC7
ADC7
AC0OUT
ADCB
POS
ADCB
NEG
ADCB
GAINPOS
ADC0
ADC0
ADC1
ADC1
ADCB
GAINNEG
ACB
POS
ACB
NEG
ADC0
AC0
AC0
ADC1
AC1
AC1
ADC2
ADC2
AC2
ADC3
ADC3
AC3
ACB
OUT
DACB
REFB
JTAG
AREF
DAC0
AC3
DAC1
TMS
AC5
TDI
TCK
AC7
AC0OUT
TDO
Port C - Alternate functions
Table 30-3.
PORT C
REFA
Port B - Alternate functions
Table 30-2.
PORT B
AC3
ADC4
ACA
OUT
PIN #
INTERRUPT
TCC0
AWEXC
SYNC
OC0A
OC0ALS
TCC1
USARTC0
USARTC1
SPIC
TWIC
GND
14
VCC
15
PC0
16
PC1
17
SYNC
OC0B
OC0AHS
XCK0
SCL/SCL_IN
PC2
18
SYNC/ASYNC
OC0C
OC0BLS
RXD0
SDA_OUT
PC3
19
SYNC
OC0D
OC0BHS
TXD0
SCL_OUT
PC4
20
SYNC
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OC0CLS
CLOCKOU
T
EVENTOUT
SDA/SDA_IN
OC1A
SS
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XMEGA A3B
Port C - Alternate functions (Continued)
Table 30-3.
PORT C
PIN #
INTERRUPT
PC5
21
SYNC
PC6
22
SYNC
PC7
23
SYNC
AWEXC
TCC1
OC0CHS
OC1B
USARTC0
USARTC1
SPIC
XCK1
MOSI
OC0DLS
RXD1
MISO
OC0DHS
TXD1
SCK
TWIC
PIN #
INTERRUPT
TCD0
TCD1
USARTD0
USARTD1
SPID
XCK1
MOSI
GND
24
VCC
25
PD0
26
SYNC
OC0A
PD1
27
SYNC
OC0B
XCK0
PD2
28
SYNC/ASYNC
OC0C
RXD0
PD3
29
SYNC
OC0D
TXD0
PD4
30
SYNC
OC1A
PD5
31
SYNC
OC1B
PD6
32
SYNC
RXD1
MISO
PD7
33
SYNC
TXD1
SCK
EVENTOUT
CLKOUT
EVOUT
CLOCKOUT
EVENTOUT
CLKOUT
EVOUT
SS
Port E - Alternate functions
Table 30-5.
PORT E
CLOCKOU
T
Port D - Alternate functions
Table 30-4.
PORT D
TCC0
PIN #
INTERRUPT
TCE0
TCE1
USARTE0
TWIE
GND
34
VCC
35
PE0
36
SYNC
OC0A
PE1
37
SYNC
OC0B
XCK0
SCL/SCL_IN
PE2
38
SYNC/ASYNC
OC0C
RXD0
SDA_OUT
PE3
39
SYNC
OC0D
TXD0
SCL_OUT
PE4
40
SYNC
OC1A
PE5
41
SYNC
OC1B
TOSC2
42
TOSC1
43
Port F - Alternate functions
Table 30-6.
PORT F
SDA/SDA_IN
PIN #
INTERRUPT
TCF0
USARTF0
GND
44
VCC
45
PF0
46
SYNC
OC0A
PF1
47
SYNC
OC0B
XCK0
PF2
48
SYNC/ASYNC
OC0C
RXD0
PF3
49
SYNC
OC0D
TXD0
PF4
50
SYNC
OC0A
VBAT
51
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
53
XMEGA A3B
Port F - Alternate functions (Continued)
Table 30-6.
PORT F
PIN #
INTERRUPT
GND
52
SYNC
VCC
53
SYNC
PF6
54
PF7
55
Table 30-7.
PORT R
TCF0
USARTF0
Port R- Alternate functions
PIN #
INTERRUPT
PDI
XTAL
PDI
56
PDI_DATA
RESET
57
PRO
58
SYNC
XTAL2
PR1
59
SYNC
XTAL1
PDI_CLK
Table 30-8.
Bit Number
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
8116J–AVR–06/2013
ATxmega256A3B Boundary Scan Order
Signal Name
PQ3.Bidir
PQ3.Control
PQ2.Bidir
PQ2.Control
PQ1.Bidir
PQ1.Control
PQ0.Bidir
PQ0.Control
PK7.Bidir
PK7.Control
PK6.Bidir
PK6.Control
PK5.Bidir
PK5.Control
PK4.Bidir
PK4.Control
PK3.Bidir
PK3.Control
PK2.Bidir
PK2.Control
PK1.Bidir
PK1.Control
PK0.Bidir
PK0.Control
Module
PORT Q
PORT K
Not recommended for new designs Use ATxmega256A3BU
54
XMEGA A3B
Bit Number
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
8116J–AVR–06/2013
Signal Name
PJ7.Bidir
PJ7.Control
PJ6.Bidir
PJ6.Control
PJ5.Bidir
PJ5.Control
PJ4.Bidir
PJ4.Control
PJ3.Bidir
PJ3.Control
PJ2.Bidir
PJ2.Control
PJ1.Bidir
PJ1.Control
PJ0.Bidir
PJ0.Control
PH7.Bidir
PH7.Control
PH6.Bidir
PH6.Control
PH5.Bidir
PH5.Control
PH4.Bidir
PH4.Control
PH3.Bidir
PH3.Control
PH2.Bidir
PH2.Control
PH1.Bidir
PH1.Control
PH0.Bidir
PH0.Control
PF7.Bidir
PF7.Control
PF6.Bidir
PF6.Control
PF5.Bidir
PF5.Control
PF4.Bidir
PF4.Control
PF3.Bidir
PF3.Control
PF2.Bidir
PF2.Control
PF1.Bidir
PF1.Control
PF0.Bidir
PF0.Control
PE7.Bidir
PE7.Control
PE6.Bidir
PE6.Control
PE5.Bidir
PE5.Control
PE4.Bidir
PE4.Control
PE3.Bidir
PE3.Control
PE2.Bidir
PE2.Control
PE1.Bidir
PE1.Control
PE0.Bidir
PE0.Control
Module
PORT J
PORT H
PORT F
PORT E
Not recommended for new designs Use ATxmega256A3BU
55
XMEGA A3B
Bit Number
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
8116J–AVR–06/2013
Signal Name
PD7.Bidir
PD7.Control
PD6.Bidir
PD6.Control
PD5.Bidir
PD5.Control
PD4.Bidir
PD4.Control
PD3.Bidir
PD3.Control
PD2.Bidir
PD2.Control
PD1.Bidir
PD1.Control
PD0.Bidir
PD0.Control
PC7.Bidir
PC7.Control
PC6.Bidir
PC6.Control
PC5.Bidir
PC5.Control
PC4.Bidir
PC4.Control
PC3.Bidir
PC3.Control
PC2.Bidir
PC2.Control
PC1.Bidir
PC1.Control
PC0.Bidir
PC0.Control
PB3.Bidir
PB3.Control
PB2.Bidir
PB2.Control
PB1.Bidir
PB1.Control
PB0.Bidir
PB0.Control
PA7.Bidir
PA7.Control
PA6.Bidir
PA6.Control
PA5.Bidir
PA5.Control
PA4.Bidir
PA4.Control
PA3.Bidir
PA3.Control
PA2.Bidir
PA2.Control
PA1.Bidir
PA1.Control
PA0.Bidir
PA0.Control
PR1.Bidir
PR1.Control
PR0.Bidir
PR0.Control
RESET.Observe_Only
PDI_DATA.Observe_Only
Module
PORT D
PORT C
PORT B
PORT A
PORT R
RESET
PDI Data
Not recommended for new designs Use ATxmega256A3BU
56
XMEGA A3B
31. Peripheral Module Address Map
The address maps show the base address for each peripheral and module in XMEGA A3B. For
complete register description and summary for each peripheral module, refer to the XMEGA A
Manual.
Base Address
0x0000
0x0010
0x0014
0x0018
0x001C
0x0030
0x0040
0x0048
0x0050
0x0060
0x0068
0x0070
0x0078
0x0080
0x0090
0x00A0
0x00B0
0x00C0
0x00F0
0x0100
0x0180
0x01C0
0x0200
0x0240
0x0320
0x0380
0x0390
0x0420
0x0480
0x04A0
0x0600
0x0620
0x0640
0x0660
0x0680
0x06A0
0x07E0
0x0800
0x0840
0x0880
0x0890
0x08A0
0x08B0
0x08C0
0x08F8
0x0900
0x0940
0x0990
0x09A0
0x09B0
0x09C0
0x0A00
0x0A40
0x0A80
0x0A90
0x0AA0
0x0B00
0x0B90
0x0BA0
8116J–AVR–06/2013
Name
Description
GPIO
VPORT0
VPORT1
VPORT2
VPORT3
CPU
CLK
SLEEP
OSC
DFLLRC32M
DFLLRC2M
PR
RST
WDT
MCU
PMIC
PORTCFG
AES
VBAT
DMA
EVSYS
NVM
ADCA
ADCB
DACB
ACA
ACB
RTC32
TWIC
TWIE
PORTA
PORTB
PORTC
PORTD
PORTE
PORTF
PORTR
TCC0
TCC1
AWEXC
HIRESC
USARTC0
USARTC1
SPIC
IRCOM
TCD0
TCD1
HIRESD
USARTD0
USARTD1
SPID
TCE0
TCE1
AWEXE
HIRESE
USARTE0
TCF0
HIRESF
USARTF0
General Purpose IO Registers
Virtual Port 0
Virtual Port 1
Virtual Port 2
Virtual Port 2
CPU
Clock Control
Sleep Controller
Oscillator Control
DFLL for the 32 MHz Internal RC Oscillator
DFLL for the 2 MHz RC Oscillator
Power Reduction
Reset Controller
Watch-Dog Timer
MCU Control
Programmable Multilevel Interrupt Controller
Port Configuration
AES Module
VBAT Battery Backup Module
DMA Controller
Event System
Non Volatile Memory (NVM) Controller
Analog to Digital Converter on port A
Analog to Digital Converter on port B
Digital to Analog Converter on port B
Analog Comparator pair on port A
Analog Comparator pair on port B
32-bit Real Time Counter
Two Wire Interface on port C
Two Wire Interface on port E
Port A
Port B
Port C
Port D
Port E
Port F
Port R
Timer/Counter 0 on port C
Timer/Counter 1 on port C
Advanced Waveform Extension on port C
High Resolution Extension on port C
USART 0 on port C
USART 1 on port C
Serial Peripheral Interface on port C
Infrared Communication Module
Timer/Counter 0 on port D
Timer/Counter 1 on port D
High Resolution Extension on port D
USART 0 on port D
USART 1 on port D
Serial Peripheral Interface on port D
Timer/Counter 0 on port E
Timer/Counter 1 on port E
Advanced Waveform Extension on port E
High Resolution Extension on port E
USART 0 on port E
Timer/Counter 0 on port F
High Resolution Extension on port F
USART 0 on port F
Not recommended for new designs Use ATxmega256A3BU
57
XMEGA A3B
32. Instruction Set Summary
Mnemonics
Operands
Description
Operation
Flags
#Clocks
Arithmetic and Logic Instructions
Rd, Rr
Add without Carry
Rd

Rd + Rr
Z,C,N,V,S,H
1
ADC
Rd, Rr
Add with Carry
Rd

Rd + Rr + C
Z,C,N,V,S,H
1
ADIW
Rd, K
Add Immediate to Word
Rd

Rd + 1:Rd + K
Z,C,N,V,S
2
SUB
Rd, Rr
Subtract without Carry
Rd

Rd - Rr
Z,C,N,V,S,H
1
SUBI
Rd, K
Subtract Immediate
Rd

Rd - K
Z,C,N,V,S,H
1
SBC
Rd, Rr
Subtract with Carry
Rd

Rd - Rr - C
Z,C,N,V,S,H
1
SBCI
Rd, K
Subtract Immediate with Carry
Rd

Rd - K - C
Z,C,N,V,S,H
1
SBIW
Rd, K
Subtract Immediate from Word
Rd + 1:Rd

Rd + 1:Rd - K
Z,C,N,V,S
2
ADD
AND
Rd, Rr
Logical AND
Rd

Rd  Rr
Z,N,V,S
1
ANDI
Rd, K
Logical AND with Immediate
Rd

Rd  K
Z,N,V,S
1
OR
Rd, Rr
Logical OR
Rd

Rd v Rr
Z,N,V,S
1
ORI
Rd, K
Logical OR with Immediate
Rd

Rd v K
Z,N,V,S
1
EOR
Rd, Rr
Exclusive OR
Rd

Rd  Rr
Z,N,V,S
1
COM
Rd
One’s Complement
Rd

$FF - Rd
Z,C,N,V,S
1
NEG
Rd
Two’s Complement
Rd

$00 - Rd
Z,C,N,V,S,H
1
SBR
Rd,K
Set Bit(s) in Register
Rd

Rd v K
Z,N,V,S
1
CBR
Rd,K
Clear Bit(s) in Register
Rd

Rd  ($FFh - K)
Z,N,V,S
1
INC
Rd
Increment
Rd

Rd + 1
Z,N,V,S
1
DEC
Rd
Decrement
Rd

Rd - 1
Z,N,V,S
1
TST
Rd
Test for Zero or Minus
Rd

Rd  Rd
Z,N,V,S
1
CLR
Rd
Clear Register
Rd

Rd  Rd
Z,N,V,S
1
SER
Rd
Set Register
Rd

$FF
None
1
MUL
Rd,Rr
Multiply Unsigned
R1:R0

Rd x Rr (UU)
Z,C
2
MULS
Rd,Rr
Multiply Signed
R1:R0

Rd x Rr (SS)
Z,C
2
MULSU
Rd,Rr
Multiply Signed with Unsigned
R1:R0

Rd x Rr (SU)
Z,C
2
FMUL
Rd,Rr
Fractional Multiply Unsigned
R1:R0

Rd x Rr<<1 (UU)
Z,C
2
FMULS
Rd,Rr
Fractional Multiply Signed
R1:R0

Rd x Rr<<1 (SS)
Z,C
2
FMULSU
Rd,Rr
Fractional Multiply Signed with Unsigned
R1:R0

Rd x Rr<<1 (SU)
Z,C
2
DES
K
Data Encryption
if (H = 0) then R15:R0
else if (H = 1) then R15:R0


Encrypt(R15:R0, K)
Decrypt(R15:R0, K)
PC

PC + k + 1
None
2
1/2
Branch Instructions
RJMP
k
Relative Jump
IJMP
Indirect Jump to (Z)
PC(15:0)
PC(21:16)


Z,
0
None
2
EIJMP
Extended Indirect Jump to (Z)
PC(15:0)
PC(21:16)


Z,
EIND
None
2
JMP
k
Jump
PC

k
None
3
RCALL
k
Relative Call Subroutine
PC

PC + k + 1
None
2 / 3(1)
ICALL
Indirect Call to (Z)
PC(15:0)
PC(21:16)


Z,
0
None
2 / 3(1)
EICALL
Extended Indirect Call to (Z)
PC(15:0)
PC(21:16)


Z,
EIND
None
3(1)
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
58
XMEGA A3B
Mnemonics
Operands
Description
CALL
k
call Subroutine
PC

RET
Subroutine Return
PC
RETI
Interrupt Return
CPSE
Rd,Rr
Compare, Skip if Equal
CP
Rd,Rr
Compare
CPC
Rd,Rr
Compare with Carry
CPI
Rd,K
Compare with Immediate
Operation
Flags
#Clocks
k
None
3 / 4(1)

STACK
None
4 / 5(1)
PC

STACK
I
4 / 5(1)
if (Rd = Rr) PC

PC + 2 or 3
None
1/2/3
Rd - Rr
Z,C,N,V,S,H
1
Rd - Rr - C
Z,C,N,V,S,H
1
Rd - K
Z,C,N,V,S,H
1
SBRC
Rr, b
Skip if Bit in Register Cleared
if (Rr(b) = 0) PC

PC + 2 or 3
None
1/2/3
SBRS
Rr, b
Skip if Bit in Register Set
if (Rr(b) = 1) PC

PC + 2 or 3
None
1/2/3
SBIC
A, b
Skip if Bit in I/O Register Cleared
if (I/O(A,b) = 0) PC

PC + 2 or 3
None
2/3/4
SBIS
A, b
Skip if Bit in I/O Register Set
If (I/O(A,b) =1) PC

PC + 2 or 3
None
2/3/4
BRBS
s, k
Branch if Status Flag Set
if (SREG(s) = 1) then PC

PC + k + 1
None
1/2
BRBC
s, k
Branch if Status Flag Cleared
if (SREG(s) = 0) then PC

PC + k + 1
None
1/2
BREQ
k
Branch if Equal
if (Z = 1) then PC

PC + k + 1
None
1/2
BRNE
k
Branch if Not Equal
if (Z = 0) then PC

PC + k + 1
None
1/2
BRCS
k
Branch if Carry Set
if (C = 1) then PC

PC + k + 1
None
1/2
BRCC
k
Branch if Carry Cleared
if (C = 0) then PC

PC + k + 1
None
1/2
BRSH
k
Branch if Same or Higher
if (C = 0) then PC

PC + k + 1
None
1/2
BRLO
k
Branch if Lower
if (C = 1) then PC

PC + k + 1
None
1/2
BRMI
k
Branch if Minus
if (N = 1) then PC

PC + k + 1
None
1/2
BRPL
k
Branch if Plus
if (N = 0) then PC

PC + k + 1
None
1/2
BRGE
k
Branch if Greater or Equal, Signed
if (N  V= 0) then PC

PC + k + 1
None
1/2
BRLT
k
Branch if Less Than, Signed
if (N  V= 1) then PC

PC + k + 1
None
1/2
BRHS
k
Branch if Half Carry Flag Set
if (H = 1) then PC

PC + k + 1
None
1/2
BRHC
k
Branch if Half Carry Flag Cleared
if (H = 0) then PC

PC + k + 1
None
1/2
BRTS
k
Branch if T Flag Set
if (T = 1) then PC

PC + k + 1
None
1/2
BRTC
k
Branch if T Flag Cleared
if (T = 0) then PC

PC + k + 1
None
1/2
BRVS
k
Branch if Overflow Flag is Set
if (V = 1) then PC

PC + k + 1
None
1/2
BRVC
k
Branch if Overflow Flag is Cleared
if (V = 0) then PC

PC + k + 1
None
1/2
BRIE
k
Branch if Interrupt Enabled
if (I = 1) then PC

PC + k + 1
None
1/2
BRID
k
Branch if Interrupt Disabled
if (I = 0) then PC

PC + k + 1
None
1/2
MOV
Rd, Rr
Copy Register
Rd

Rr
None
1
MOVW
Rd, Rr
Copy Register Pair
Rd+1:Rd

Rr+1:Rr
None
1
LDI
Rd, K
Load Immediate
Rd

K
None
1
LDS
Rd, k
Load Direct from data space
Rd

(k)
None
2(1)(2)
LD
Rd, X
Load Indirect
Rd

(X)
None
1(1)(2)
LD
Rd, X+
Load Indirect and Post-Increment
Rd
X


(X)
X+1
None
1(1)(2)
LD
Rd, -X
Load Indirect and Pre-Decrement
X  X - 1,
Rd  (X)


X-1
(X)
None
2(1)(2)
LD
Rd, Y
Load Indirect
Rd  (Y)

(Y)
None
1(1)(2)
LD
Rd, Y+
Load Indirect and Post-Increment
Rd
Y


(Y)
Y+1
None
1(1)(2)
Data Transfer Instructions
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
59
XMEGA A3B
Mnemonics
Operands
Description
Flags
#Clocks
LD
Rd, -Y
Load Indirect and Pre-Decrement
Y
Rd


Y-1
(Y)
None
2(1)(2)
LDD
Rd, Y+q
Load Indirect with Displacement
Rd

(Y + q)
None
2(1)(2)
LD
Rd, Z
Load Indirect
Rd

(Z)
None
1(1)(2)
LD
Rd, Z+
Load Indirect and Post-Increment
Rd
Z


(Z),
Z+1
None
1(1)(2)
LD
Rd, -Z
Load Indirect and Pre-Decrement
Z
Rd


Z - 1,
(Z)
None
2(1)(2)
LDD
Rd, Z+q
Load Indirect with Displacement
Rd

(Z + q)
None
2(1)(2)
STS
k, Rr
Store Direct to Data Space
(k)

Rd
None
2(1)
ST
X, Rr
Store Indirect
(X)

Rr
None
1(1)
ST
X+, Rr
Store Indirect and Post-Increment
(X)
X


Rr,
X+1
None
1(1)
ST
-X, Rr
Store Indirect and Pre-Decrement
X
(X)


X - 1,
Rr
None
2(1)
ST
Y, Rr
Store Indirect
(Y)

Rr
None
1(1)
ST
Y+, Rr
Store Indirect and Post-Increment
(Y)
Y


Rr,
Y+1
None
1(1)
ST
-Y, Rr
Store Indirect and Pre-Decrement
Y
(Y)


Y - 1,
Rr
None
2(1)
STD
Y+q, Rr
Store Indirect with Displacement
(Y + q)

Rr
None
2(1)
ST
Z, Rr
Store Indirect
(Z)

Rr
None
1(1)
ST
Z+, Rr
Store Indirect and Post-Increment
(Z)
Z


Rr
Z+1
None
1(1)
ST
-Z, Rr
Store Indirect and Pre-Decrement
Z

Z-1
None
2(1)
STD
Z+q,Rr
Store Indirect with Displacement
(Z + q)

Rr
None
2(1)
Load Program Memory
R0

(Z)
None
3
LPM
Operation
LPM
Rd, Z
Load Program Memory
Rd

(Z)
None
3
LPM
Rd, Z+
Load Program Memory and Post-Increment
Rd
Z


(Z),
Z+1
None
3
Extended Load Program Memory
R0

(RAMPZ:Z)
None
3
ELPM
ELPM
Rd, Z
Extended Load Program Memory
Rd

(RAMPZ:Z)
None
3
ELPM
Rd, Z+
Extended Load Program Memory and PostIncrement
Rd
Z


(RAMPZ:Z),
Z+1
None
3
Store Program Memory
(RAMPZ:Z)

R1:R0
None
-
(RAMPZ:Z)
Z


R1:R0,
Z+2
None
-
Rd

I/O(A)
None
1
I/O(A)

Rr
None
1
STACK

Rr
None
1(1)
Rd

STACK
None
2(1)
Rd(n+1)
Rd(0)
C



Rd(n),
0,
Rd(7)
Z,C,N,V,H
1
Rd(n)
Rd(7)
C



Rd(n+1),
0,
Rd(0)
Z,C,N,V
1
SPM
SPM
Z+
Store Program Memory and Post-Increment
by 2
IN
Rd, A
In From I/O Location
OUT
A, Rr
Out To I/O Location
PUSH
Rr
Push Register on Stack
POP
Rd
Pop Register from Stack
Bit and Bit-test Instructions
LSL
Rd
Logical Shift Left
LSR
Rd
Logical Shift Right
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
60
XMEGA A3B
Mnemonics
Operands
Description
Operation
ROL
Rd
Rotate Left Through Carry
ROR
Rd
ASR
Flags
#Clocks
Rd(0)
Rd(n+1)
C



C,
Rd(n),
Rd(7)
Z,C,N,V,H
1
Rotate Right Through Carry
Rd(7)
Rd(n)
C



C,
Rd(n+1),
Rd(0)
Z,C,N,V
1
Rd
Arithmetic Shift Right
Rd(n)

Rd(n+1), n=0..6
Z,C,N,V
1
SWAP
Rd
Swap Nibbles
Rd(3..0)

Rd(7..4)
None
1
BSET
s
Flag Set
SREG(s)

1
SREG(s)
1
BCLR
s
Flag Clear
SREG(s)

0
SREG(s)
1
SBI
A, b
Set Bit in I/O Register
I/O(A, b)

1
None
1
CBI
A, b
Clear Bit in I/O Register
I/O(A, b)

0
None
1
BST
Rr, b
Bit Store from Register to T
T

Rr(b)
T
1
BLD
Rd, b
Bit load from T to Register
Rd(b)

T
None
1
SEC
Set Carry
C

1
C
1
CLC
Clear Carry
C

0
C
1
SEN
Set Negative Flag
N

1
N
1
CLN
Clear Negative Flag
N

0
N
1
SEZ
Set Zero Flag
Z

1
Z
1
CLZ
Clear Zero Flag
Z

0
Z
1
SEI
Global Interrupt Enable
I

1
I
1
CLI
Global Interrupt Disable
I

0
I
1
SES
Set Signed Test Flag
S

1
S
1
CLS
Clear Signed Test Flag
S

0
S
1
SEV
Set Two’s Complement Overflow
V

1
V
1
CLV
Clear Two’s Complement Overflow
V

0
V
1
SET
Set T in SREG
T

1
T
1
CLT
Clear T in SREG
T

0
T
1
SEH
Set Half Carry Flag in SREG
H

1
H
1
CLH
Clear Half Carry Flag in SREG
H

0
H
1
MCU Control Instructions
BREAK
Break
NOP
No Operation
SLEEP
Sleep
WDR
Watchdog Reset
Notes:
8116J–AVR–06/2013
(See specific descr. for BREAK)
None
1
None
1
(see specific descr. for Sleep)
None
1
(see specific descr. for WDR)
None
1
1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid
for accesses via the external RAM interface.
2. One extra cycle must be added when accessing Internal SRAM.
Not recommended for new designs Use ATxmega256A3BU
61
XMEGA A3B
33. Packaging information
33.1
64A
PIN 1
B
e
PIN 1 IDENTIFIER
E1
E
D1
D
C
0°~7°
A1
A2
A
L
COMMON DIMENSIONS
(Unit of measure = mm)
Notes:
1.This package conforms to JEDEC reference MS-026, Variation AEB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
15.75
16.00
16.25
D1
13.90
14.00
14.10
E
15.75
16.00
16.25
E1
13.90
14.00
14.10
B
0.30
–
0.45
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.80 TYP
2010-10-20
R
2325 Orchard Parkway
San Jose, CA 95131
8116J–AVR–06/2013
TITLE
DRAWING NO.
REV.
64A
C
64A, 64-lead, 14 x 14mm Body Size, 1.0mm Body Thickness,
0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
Not recommended for new designs Use ATxmega256A3BU
62
XMEGA A3B
33.2
64M2
D
Marked pin# 1 I D
E
C
SEATING PLANE
A1
TOP VIEW
A3
A
K
0.08 C
L
Pin #1 Corner
D2
1
2
3
SIDE VIEW
Pin #1
Triangle
Option A
COMMON DIMENSIONS
(Unit of measure = mm)
E2
Option B
Pin #1
Chamfer
(C 0.30)
SYMBOL
MIN
NOM
MAX
A
0.80
0.90
1.00
A1
–
0.02
0.05
A3
K
Option C
b
e
Pin #1
Notch
(0.20 R)
BOTTOM VIEW
0.20 REF
b
0.18
0.25
0.30
D
8.90
9.00
9.10
D2
7.50
7.65
7.80
E
8.90
9.00
9.10
E2
7.50
7.65
7.80
e
Notes: 1. JEDEC Standard MO-220, (SAW Singulation) fig . 1, VMMD.
2. Dimension and tolerance conform to ASMEY14.5M-1994.
NOTE
0.50 BSC
L
0.35
0.40
0.45
K
0.20
0.27
0.40
2010-10-20
R
2325 Orchard Parkway
San Jose, CA 95131
8116J–AVR–06/2013
TITLE
64M2, 64-pad, 9 x 9 x 1.0mm Bod y, Lead Pitch 0.50mm ,
7.65mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
Not recommended for new designs Use ATxmega256A3BU
64M2
REV.
E
63
XMEGA A3B
34. Electrical Characteristics
34.1
Absolute Maximum Ratings*
Operating Temperature.................................. -55C to +125C
*NOTICE:
Storage Temperature ..................................... -65C to +150C
Voltage on any Pin with respect to Ground..-0.5V to VCC+0.5V
Maximum Operating Voltage ............................................ 3.6V
DC Current per I/O Pin ............................................... 20.0 mA
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
DC Current VCC and GND Pins................................ 200.0 mA
34.2
DC Characteristics
Table 34-1.
Symbol
Current Consumption
Parameter
Condition
Min
25
VCC = 3.0V
71
VCC = 1.8V
317
VCC = 3.0V
697
VCC = 1.8V
613
800
VCC = 3.0V
1340
1800
VCC = 3.0V
15.7
18
VCC = 1.8V
3.6
VCC = 3.0V
6.9
VCC = 1.8V
112
VCC = 3.0V
215
VCC = 1.8V
224
350
VCC = 3.0V
430
650
VCC = 3.0V
6.9
8
All Functions Disabled
VCC = 3.0V
0.1
3
All Functions Disabled, T = 85°C
VCC = 3.0V
1.75
5
VCC = 1.8V
1
VCC = 3.0V
1
6
ULP, WDT, Sampled BOD, T=85°C
VCC = 3.0V
2.7
10
RTC 1 kHz from Low Power 32 kHz
TOSC
VCC = 1.8V
0.55
VCC = 3.0V
0.65
RTC from Low Power 32 kHz TOSC
VCC = 3.0V
1.16
without Reset pull-up resistor current
VCC = 3.0V
1300
1 MHz, Ext. Clk
Active
2 MHz, Ext. Clk
32 MHz, Ext. Clk
Power Supply Current(1)
32 kHz, Ext. Clk
1 MHz, Ext. Clk
Idle
2 MHz, Ext. Clk
32 MHz, Ext. Clk
Power-down mode
ULP, WDT, Sampled BOD
Power-save mode
Reset Current
Consumption
8116J–AVR–06/2013
Max
VCC = 1.8V
32 kHz, Ext. Clk
ICC
Typ
Units
µA
mA
µA
Not recommended for new designs Use ATxmega256A3BU
mA
µA
64
XMEGA A3B
Table 34-1.
Symbol
Current Consumption
Parameter
Condition
Min
Typ
Max
Units
(2)
Module current consumption
RC32M
RC32M w/DFLL
460
Internal 32.768 kHz oscillator as DFLL source
RC2M
RC2M w/DFLL
101
Internal 32.768 kHz oscillator as DFLL source
RC32K
PLL
ICC
594
134
27
Multiplication factor = 10x
202
Watchdog normal mode
1
BOD Continuous mode
128
BOD Sampled mode
1
Internal 1.00 V ref
80
Temperature reference
74
RTC with int. 32 kHz RC
as source
No prescaling
27
RTC with ULP as source
No prescaling
1
ADC
250 kS/s - Int. 1V Ref
2.9
DAC Normal Mode
1000 kS/s, Single channel, Int. 1V Ref
1.8
DAC Low-Power Mode
1000 KS/s, Single channel, Int. 1V Ref
0.95
DAC S/H Normal Mode
Int.1.1V Ref, Refresh 16CLK
2.9
DAC Low-Power Mode
S/H
Int.1.1V Ref, Refresh 16CLK
1.1
AC High-speed
195
AC Low-power
103
USART
Rx and Tx enabled, 9600 BAUD
µA
mA
5.4
µA
DMA
Timer/Counter
128
Prescaler DIV1
AES
Flash/EEPROM
Programming
Note:
20
223
Vcc = 2V
25
mA
Vcc = 3V
33
1. All Power Reduction Registers set. Typical numbers measured at T = 25°C if nothing else is specified.
2. All parameters measured as the difference in current consumption between module enabled and disabled. All data at
VCC = 3.0V, ClkSYS = 1 MHz External clock with no prescaling, T = 25°C.
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
65
XMEGA A3B
34.3
Operating Voltage and Frequency
Table 34-2.
Symbol
ClkCPU
Operating voltage and frequency
Parameter
CPU clock frequency
Condition
Min
Typ
Max
VCC = 1.6V
0
12
VCC = 1.8V
0
12
VCC = 2.7V
0
32
VCC = 3.6V
0
32
Units
MHz
The maximum CPU clock frequency of the XMEGA A3B devices is depending on VCC. As shown
in Figure 34-1 on page 66 the Frequency vs. VCC curve is linear between 1.8V < VCC < 2.7V.
Figure 34-1. Maximum Frequency vs. Vcc
MHz
32
Safe Operating Area
12
1.6 1.8
8116J–AVR–06/2013
2.7
3.6
Not recommended for new designs Use ATxmega256A3BU
V
66
XMEGA A3B
34.4
Flash and EEPROM Memory Characteristics
Table 34-3.
Symbol
Endurance and Data Retention
Parameter
Condition
Min
25°C
10K
85°C
10K
25°C
100
55°C
25
25°C
80K
85°C
30K
25°C
100
55°C
25
Typ
Max
Write/Erase cycles
Units
Cycle
Flash
Data retention
Year
Write/Erase cycles
Cycle
EEPROM
Data retention
Table 34-4.
Symbol
Programming time
Parameter
Condition
Chip Erase
(2)
Flash
EEPROM
Notes:
Year
Flash, EEPROM
Min
and SRAM Erase
Typ(1)
Max
Units
40
Page Erase
6
Page Write
6
Page Write Automatic Page Erase and Write
12
Page Erase
6
Page Write
6
Page Write Automatic Page Erase and Write
12
ms
1. Programming is timed from the internal 2 MHz oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
67
XMEGA A3B
34.5
ADC Characteristics
Table 34-5.
ADC Characteristics
Symbol
Parameter
Condition
Min
Typ
Max
Units
RES
Resolution
Programmable: 8/12
8
12
12
Bits
INL
Integral Non-Linearity
500 ksps
±2
DNL
Differential Non-Linearity
500 ksps
< ±1
LSB
Gain Error
< ±10
Offset Error
< ±2
mV
ADCclk
ADC Clock frequency
Max is 1/4 of Peripheral Clock
Conversion rate
Conversion time
(propagation delay)
(RES+2)/2+GAIN
RES = 8 or 12, GAIN = 0 or 1
Sampling Time
1/2 ADCclk cycle
Analog Supply Voltage
VREF
Reference voltage
kHz
2000
ksps
8
ADCclk
cycles
7
0.25
Conversion range
AVCC
5
2000
uS
0
VREF
Vcc-0.3
Vcc+0.3
1.0
Vcc-0.6V
Input bandwidth
INT1V
kHz
Internal 1.00V reference
1.00
INTVCC
Internal VCC/1.6
VCC/1.6
SCALEDVCC
Scaled internal VCC/10 input
VCC/10
Reference input resistance
> 10
RAREF
Start-up time
Internal input sampling speed
Table 34-6.
Symbol
12
Temp. sensor, VCC/10, Bandgap
V
M
24
ADCclk
cycles
100
ksps
ADC Gain Stage Characteristics
Parameter
Gain error
Condition
Min
1 to 64 gain
Noise level at input
Clock rate
8116J–AVR–06/2013
Typ
Max
< ±1
Offset error
Vrms
V
Units
%
< ±1
VREF = Int. 1V
0.12
VREF = Ext. 2V
0.06
mV
64x gain
Same as ADC
1000
Not recommended for new designs Use ATxmega256A3BU
kHz
68
XMEGA A3B
34.6
DAC Characteristics
Table 34-7.
Symbol
DAC Characteristics
Parameter
Condition
INL
Integral Non-Linearity
VCC = 1.6-3.6V
DNL
Differential Non-Linearity
VCC = 1.6-3.6V
Fclk
Min
Typ
VREF = Ext. ref
5
VREF = Ext. ref
<±1
External reference voltage
1.1
Reference input impedance
34.7
LSB
1000
ksps
AVCC-0.6
V
>10
Max output voltage
Rload=100k
AVCC*0.98
Min output voltage
Rload=100k
0.015
Offset factory calibration accuracy
Continues mode, VCC=3.0V,
VREF = Int 1.00V, T=85°C
±0.5
Gain factory calibration accuracy
Units
VREF= AVCC
Conversion rate
AREF
Max
M
V
LSB
±2.5
Analog Comparator Characteristics
Table 34-8.
Symbol
Analog Comparator Characteristics
Parameter
Condition
Input Offset Voltage
VCC = 1.6 - 3.6V
<±10
mV
Input Leakage Current
VCC = 1.6 - 3.6V
< 1000
pA
Vhys1
Hysteresis, No
VCC = 1.6 - 3.6V
0
mV
Vhys2
Hysteresis, Small
VCC = 1.6 - 3.6V
mode = HS
20
Vhys3
Hysteresis, Large
VCC = 1.6 - 3.6V
mode = HS
40
VCC = 3.0V, T= 85°C
mode = HS
VCC = 1.6 - 3.6V
mode = HS
110
VCC = 1.6 - 3.6V
mode = LP
175
Voff
Ilk
tdelay
34.8
Propagation delay
Min
Typ
Max
Units
mV
100
ns
Bandgap Characteristics
Table 34-9.
Symbol
Bandgap Voltage Characteristics
Parameter
Condition
As reference for ADC or DAC
Min
Typ
Max
Units
1 Clk_PER + 2.5µs
Bandgap
µs
As input to AC or ADC
1.5
Bandgap voltage
1.1
T= 85°C, After calibration
0.99
1
1.01
V
ADC/DAC ref
1
Variation over voltage and temperature
8116J–AVR–06/2013
VCC = 1.6 - 3.6V, T = -40C to 85C
±5
Not recommended for new designs Use ATxmega256A3BU
%
69
XMEGA A3B
34.9
Brownout Detection Characteristics
Table 34-10. Brownout Detection Characteristics(1)
Symbol
Parameter
Condition
Min
Typ
BOD level 0 falling Vcc
1.62
BOD level 1 falling Vcc
1.9
BOD level 2 falling Vcc
2.17
BOD level 3 falling Vcc
2.43
BOD level 4 falling Vcc
2.68
BOD level 5 falling Vcc
2.96
BOD level 6 falling Vcc
3.22
BOD level 7 falling Vcc
3.49
Max
Units
V
Hysteresis
Note:
BOD level 0-5
1
%
1. BOD is calibrated on BOD level 0 at 85C.
34.10 PAD Characteristics
Table 34-11. PAD Characteristics
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
VOL
VOH
Output Low Voltage GPIO
Output High Voltage GPIO
Condition
Min
Typ
Max
VCC = 2.4 - 3.6V
0.7*VCC
VCC+0.5
VCC = 1.6 - 2.4V
0.8*VCC
VCC+0.5
VCC = 2.4 - 3.6V
-0.5
0.3*VCC
VCC = 1.6 - 2.4V
-0.5
0.2*VCC
IOH = 15 mA, VCC = 3.3V
0.4
0.76
IOH = 10 mA, VCC = 3.0V
0.3
0.64
IOH = 5 mA, VCC = 1.8V
0.2
0.46
V
IOH = -8 mA, VCC = 3.3V
2.6
2.9
IOH = -6 mA, VCC = 3.0V
2.1
2.7
IOH = -2 mA, VCC = 1.8V
1.4
1.6
IIL
Input Leakage Current I/O pin
<0.001
1
IIH
Input Leakage Current I/O pin
<0.001
1
RP
I/O pin Pull/Buss keeper Resistor
20
Reset pin Pull-up Resistor
20
Input hysteresis
0.5
RRST
Units
µA
k
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
V
70
XMEGA A3B
34.11 POR Characteristics
Table 34-12. Power-on Reset Characteristics
Symbol
Parameter
Condition
Min
Typ
VPOT-
POR threshold voltage falling Vcc
1
VPOT+
POR threshold voltage rising Vcc
1.45
Max
Units
V
34.12 Reset Characteristics
Table 34-13. Reset Characteristics
Symbol
Parameter
Condition
Min
Minimum reset pulse width
Reset threshold voltage
Typ
Max
90
VCC = 2.7 - 3.6V
0.45*VCC
VCC = 1.6 - 2.7V
0.42*VCC
Units
ns
V
34.13 Oscillator Characteristics
Table 34-14. Internal 32.768 kHz Oscillator Characteristics
Symbol
Parameter
Accuracy
Condition
Min
T = 85C, VCC = 3V,
After production calibration
Typ
-0.5
Max
Units
0.5
%
Max
Units
Table 34-15. Internal 2 MHz Oscillator Characteristics
Symbol
Parameter
Accuracy
DFLL Calibration step size
Condition
Min
T = 85C, VCC = 3V,
After production calibration
Typ
-1.5
1.5
%
T = 25C, VCC = 3V
0.15
Table 34-16. Internal 32 MHz Oscillator Characteristics
Symbol
Parameter
Accuracy
DFLL Calibration stepsize
Condition
Min
T = 85C, VCC = 3V,
After production calibration
Typ
-1.5
Max
Units
1.5
%
T = 25C, VCC = 3V
0.2
Table 34-17. Internal 32 kHz, ULP Oscillator Characteristics
Symbol
Parameter
Output frequency 32 kHz ULP OSC
8116J–AVR–06/2013
Condition
T = 85C, VCC = 3.0V
Min
Typ
26
Not recommended for new designs Use ATxmega256A3BU
Max
Units
kHz
71
XMEGA A3B
Table 34-18. Maximum load capacitance (CL) and ESR recommendation for 32.768 kHz Crystal
Crystal CL [pF]
Max ESR [k]
6.5
60
9
35
Table 34-19. Device wake-up time from sleep
Symbol
Parameter
Condition (1)
Int. 32.768 kHz RC
Idle Sleep, Standby and
Extended Standby sleep mode
Min
Typ(2)
Max
Units
130
Int. 2 MHz RC
2
Ext. 2 MHz Clock
2
Int. 32 MHz RC
0.17
Int. 32.768 kHz RC
320
Int. 2 MHz RC
10.3
Ext. 2 MHz Clock
4.5
Int. 32 MHz RC
5.8
µS
Power-save and Power-down
Sleep mode
Notes:
1. Non-prescaled System Clock source.
2. Time from pin change on external interrupt pin to first available clock cycle. Additional interrupt response time is minimum 5
system clock source cycles.
8116J–AVR–06/2013
Not recommended for new designs Use ATxmega256A3BU
72
XMEGA A3B
34.14 VBAT and Battery Backup Characteristics
Table 34-20. VBAT and Battery Backup Characteristics
Symbol
Parameter
Condition
Min
Vbat supply voltage range
Typ
Vbbbod
Vbat power-on slope rate
Monotonic rising
Vcc Power-loss slope range
Monotonic falling
Max
3.6
0.2
V
V/ms
0.1
main BOD threshold voltage
Units
1.8
V/ms
V
BBBOD required voltage change
1.2
BBBOD threshold voltage
1.7
2.1
V
BBBOD detection speed
1
2
s
Battery Backup System current
consumption
VBAT pin leackage
Delay from setting XOSCFDEN to
setting XOSCEN
Missing crystal oscillator cycles
before XOSCFAIL is set
8116J–AVR–06/2013
V
RTC enabled from 1 Hz TOSC with XOSC
Failure Monitor enabled
530
nA
RTC enabled from 1 Hz Hi ESR mode
and XOSC Failure Monitor enabled
680
nA
Powering Battery Backup module from
Vcc
50
200
nA
µS
32
Not recommended for new designs Use ATxmega256A3BU
cycles
73
XMEGA A3B
35. Typical Characteristics
35.1
Active Supply Current
Figure 35-1. Active Supply Current vs. Frequency
fSYS = 0 - 1.0 MHz External clock, T = 25°C
ICC [uA]
900
800
3.3 V
700
3.0 V
600
2.7 V
500
2.2 V
400
1.8 V
300
200
100
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Frequency [MHz]
Figure 35-2. Active Supply Current vs. Frequency
fSYS = 1 - 32 MHz External clock, T = 25°C
ICC [mA]
20
18
3.3 V
16
3.0 V
14
2.7 V
12
10
8
2.2 V
6
4
1.8 V
2
0
0
4
8
12
16
20
24
28
32
Frequency [MHz]
8116J–AVR–06/2013
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XMEGA A3B
Figure 35-3. Active Supply Current vs. Vcc
fSYS = 1.0 MHz External Clock
85 °C
25 °C
-40 °C
1000
900
800
ICC [uA]
700
600
500
400
300
200
100
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-4. Active Supply Current vs. VCC
fSYS = 32.768 kHz internal RC
140
-40 °C
25 °C
85 °C
120
ICC [uA]
100
80
60
40
20
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-5. Active Supply Current vs. Vcc
fSYS = 2.0 MHz internal RC
2000
-40 °C
25 °C
85 °C
1800
1600
ICC [uA]
1400
1200
1000
800
600
400
200
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-6. Active Supply Current vs. Vcc
fSYS = 32 MHz internal RC prescaled to 8 MHz
8
-40 °C
25 °C
85 °C
7
6
ICC [mA]
5
4
3
2
1
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-7. Active Supply Current vs. Vcc
fSYS = 32 MHz internal RC
25
-40 °C
25 °C
85 °C
ICC [mA]
20
15
10
5
0
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
3.6
VCC [V]
35.2
Idle Supply Current
Figure 35-8. Idle Supply Current vs. Frequency
fSYS = 0 - 1.0 MHz, T = 25°C
250
3.3 V
3.0 V
200
ICC [uA]
2.7 V
150
2.2 V
1.8 V
100
50
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Frequency [MHz]
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XMEGA A3B
Figure 35-9. Idle Supply Current vs. Frequency
fSYS = 1 - 32 MHz, T = 25°C
8
3.3 V
7
3.0 V
6
2.7 V
ICC [mA]
5
4
3
2.2 V
2
1.8 V
1
0
0
4
8
12
16
20
24
28
32
Frequency [MHz]
Figure 35-10. Idle Supply Current vs. Vcc
fSYS = 1.0 MHz External Clock
300
85 °C
25 °C
-40 °C
250
ICC [uA]
200
150
100
50
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-11. Idle Supply Current vs. Vcc
fSYS = 32.768 kHz internal RC
40
85 °C
-40 °C
25 °C
35
30
ICC [uA]
25
20
15
10
5
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-12. Idle Supply Current vs. Vcc
fSYS = 2.0 MHz internal RC
700
-40 °C
25 °C
85 °C
600
ICC [uA]
500
400
300
200
100
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-13. Idle Supply Current vs. Vcc
fSYS = 32 MHz internal RC prescaled to 8 MHz
3.5
-40 °C
25 °C
85 °C
3.0
ICC [mA]
2.5
2.0
1.5
1.0
0.5
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-14. Idle Supply Current vs. Vcc
fSYS = 32 MHz internal RC
10
-40 °C
25 °C
85 °C
ICC [mA]
8
6
4
2
0
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
3.6
VCC [V]
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XMEGA A3B
35.3
Power-down Supply Current
Figure 35-15. Power-down Supply Current vs. Temperature
2
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
1.8
1.6
ICC [uA]
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
Temperature [°C]
Figure 35-16. Power-down Supply Current vs. Temperature
With WDT and sampled BOD enabled.
3.3 V
3.0 V
2.7 V
2.2 V
1.8 V
3
2.5
ICC [uA]
2
1.5
1
0.5
0
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
Temperature [°C]
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XMEGA A3B
35.4
Power-save Supply Current
Figure 35-17. Power-save Supply Current vs. Temperature
With WDT, sampled BOD and RTC from ULP enabled
3
3.3 V
3.0 V
2.7 V
1.8 V
2.2 V
2.5
ICC [uA]
2
1.5
1
0.5
0
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
Temperature [°C]
35.5
Pin Pull-up
Figure 35-18. Reset Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 1.8V
100
IRESET [uA]
80
60
40
20
-40 °C
25 °C
85 °C
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
VRESET [V]
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XMEGA A3B
Figure 35-19. Reset Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 3.0V
160
140
IRESET [uA]
120
100
80
60
40
-40 °C
25 °C
85 °C
20
0
0
0.5
1
1.5
2
2.5
3
VRESET [V]
Figure 35-20. Reset Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 3.3V
180
160
140
IRESET [uA]
120
100
80
60
40
-40 °C
25 °C
85 °C
20
0
0
0.5
1
1.5
2
2.5
3
VRESET [V]
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XMEGA A3B
35.6
Pin Output Voltage vs. Sink/Source Current
Figure 35-21. I/O Pin Output Voltage vs. Source Current
Vcc = 1.8V
2
-40 °C
25 °C
85 °C
1.8
1.6
VPIN [V]
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-12
-10
-8
-6
-4
-2
0
IPIN [mA]
Figure 35-22. I/O Pin Output Voltage vs. Source Current
Vcc = 3.0V
3.5
-40 °C
25 °C
85 °C
3
VPIN [V]
2.5
2
1.5
1
0.5
0
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
IPIN [mA]
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XMEGA A3B
Figure 35-23. I/O Pin Output Voltage vs. Source Current
Vcc = 3.3V
3.5
-40 °C
25 °C
85 °C
3
VPIN [V]
2.5
2
1.5
1
0.5
0
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
IPIN [mA]
Figure 35-24. I/O Pin Output Voltage vs. Sink Current
Vcc = 1.8V
85°C 25°C
1.8
1.6
1.4
VPIN [V]
1.2
-40 °C
1
0.8
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
16
18
20
IPIN [mA]
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XMEGA A3B
Figure 35-25. I/O Pin Output Voltage vs. Sink Current
Vcc = 3.0V
0.7
85 °C
0.6
25 °C
-40 °C
VPIN [V]
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10
12
14
16
18
20
IPIN [mA]
Figure 35-26. I/O Pin Output Voltage vs. Sink Current
Vcc = 3.3V
VPIN [V]
0.7
0.6
85 °C
0.5
25 °C
-40 °C
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10
12
14
16
18
20
IPIN [mA]
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XMEGA A3B
35.7
Pin Thresholds and Hysteresis
Figure 35-27. I/O Pin Input Threshold Voltage vs. VCC
VIH - I/O Pin Read as “1”
2.5
-40 °C
25 °C
85 °C
Vthreshold [V]
2
1.5
1
0.5
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-28. I/O Pin Input Threshold Voltage vs. VCC
VIL - I/O Pin Read as “0”
1.8
85 °C
25 °C
-40 °C
1.6
1.4
Vthreshold [V]
1.2
1
0.8
0.6
0.4
0.2
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-29. I/O Pin Input Hysteresis vs. VCC
0.7
0.6
Vthreshold [V]
0.5
85 °C
25 °C
-40 °C
0.4
0.3
0.2
0.1
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-30. Reset Input Threshold Voltage vs. VCC
VIH - I/O Pin Read as “1”
1.8
-40 °C
25 °C
85 °C
1.6
VTHRESHOLD [V]
1.4
1.2
1
0.8
0.6
0.4
0.2
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
Figure 35-31. Reset Input Threshold Voltage vs. VCC
VIL - I/O Pin Read as “0”
1.8
-40 °C
25 °C
85 °C
1.6
VTHRESHOLD [V]
1.4
1.2
1
0.8
0.6
0.4
0.2
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
35.8
Bod Thresholds
Figure 35-32. BOD Thresholds vs. Temperature
BOD Level = 1.6V
VBOT [V]
1.67
1.66
Rising Vcc
1.65
Falling Vcc
1.64
1.63
1.62
1.61
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
Temperature [°C]
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XMEGA A3B
Figure 35-33. BOD Thresholds vs. Temperature
BOD Level = 2.9V
3.06
3.04
Rising Vcc
3.02
VBOT [V]
3
2.98
Falling Vcc
2.96
2.94
2.92
2.9
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
Temperature [°C]
35.9
35.9.1
Oscillators and Wake-up Time
Internal 32.768 kHz Oscillator
Figure 35-34. Internal 32.768 kHz Oscillator Calibration Step Size
T = -40 to 85C, VCC = 3V
0.80 %
Step size: f [kHz]
0.65 %
0.50 %
0.35 %
0.20 %
0.05 %
0
32
64
96
128
160
192
224
256
RC32KCAL[7..0]
8116J–AVR–06/2013
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90
XMEGA A3B
35.9.2
Internal 2 MHz Oscillator
Figure 35-35. Internal 2 MHz Oscillator CALA Calibration Step Size
T = -40 to 85C, VCC = 3V
0.50 %
0.40 %
Step size: f [MHz]
0.30 %
0.20 %
0.10 %
0.00 %
-0.10 %
-0.20 %
-0.30 %
0
16
32
48
64
80
96
112
128
56
64
DFLLRC2MCALA
Figure 35-36. Internal 2 MHz Oscillator CALB Calibration Step Size
T = -40 to 85C, VCC = 3V
3.00 %
Step size: f [MHz]
2.50 %
2.00 %
1.50 %
1.00 %
0.50 %
0.00 %
0
8
16
24
32
40
48
DFLLRC2MCALB
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XMEGA A3B
35.9.3
Internal 32 MHZ Oscillator
Figure 35-37. Internal 32 MHz Oscillator CALA Calibration Step Size
T = -40 to 85C, VCC = 3V
0.60 %
0.50 %
Step size: f [MHz]
0.40 %
0.30 %
0.20 %
0.10 %
0.00 %
-0.10 %
-0.20 %
0
16
32
48
64
80
96
112
128
56
64
DFLLRC32MCALA
Figure 35-38. Internal 32 MHz Oscillator CALB Calibration Step Size
T = -40 to 85C, VCC = 3V
3.00 %
Step size: f [MHz]
2.50 %
2.00 %
1.50 %
1.00 %
0.50 %
0.00 %
0
8
16
24
32
40
48
DFLLRC32MCALB
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XMEGA A3B
35.10 Module current consumption
Figure 35-39. AC current consumption vs. Vcc
Low-power Mode
Module current consumption [uA]
120
85 °C
25 °C
100
-40 °C
80
60
40
20
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
Figure 35-40. Power-up current consumption vs. Vcc
-40 °C
25 °C
85 °C
700
600
ICC [uA]
500
400
300
200
100
0
0.4
0.6
0.8
1
1.2
1.4
1.6
VCC [V]
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XMEGA A3B
35.11 Reset Pulsewidth
Figure 35-41. Minimum Reset Pulse Width vs. Vcc
120
100
85 °C
25 °C
-40 °C
tRST [ns]
80
60
40
20
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
35.12 PDI Speed
Figure 35-42. PDI Speed vs. Vcc
35
25 °C
30
fMAX [MHz]
25
20
15
10
5
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VCC [V]
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XMEGA A3B
36. Errata
36.1
36.1.1
ATxmega256A3B
rev. C
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Bandgap voltage input for the ACs can not be changed when used for both ACs simultaneously
VCC voltage scaler for AC is non-linear
ADC has increased INL error for some operating conditions
ADC gain stage non-functional
ADC Event on compare match non-functional
Bandgap measurement with the ADC is non-functional when VCC is below 2.7V
Configuration of PGM and CWCM not as described in XMEGA A Manual
PWM is not restarted properly after a fault in cycle-by-cycle mode
BOD will be enabled at any reset
DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V
DAC has increased INL or noise for some operating conditions
DAC refresh may be blocked in S/H mode
Conversion lost on DAC channel B in event triggered mode
EEPROM page buffer always written when NVM DATA0 is written
Pending full asynchronous pin change interrupts will not wake the device
Pin configuration does not affect Analog Comparator Output
NMI Flag for Crystal Oscillator Failure automatically cleared
Crystal start-up time required after power-save even if crystal is source for RTC
TWI Transmit collision flag not cleared on repeated start
Clearing TWI Stop Interrupt Flag may lock the bus
TWI START condition at bus timeout will cause transaction to be dropped
TWI Data Interrupt Flag (DIF) erroneously read as set
WDR instruction inside closed window will not issue reset
Pending asynchronous RTC32-interrupts will not wake up device
XOSCDFD can not be cleared by writing one to bit location
Maximum operating frequency below 1.76V is 8 MHz
1. Bandgap voltage input for the ACs cannot be changed when used for both ACs
simultaneously
If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then
selected/deselected as input for another AC, the first comparator will be affected for up to
1 µs and could potentially give a wrong comparison result.
Problem fix/Workaround
If the Bandgap is required for both ACs simultaneously, configure the input selection for both
ACs before enabling any of them.
2. VCC voltage scaler for AC is non-linear
The 6-bit VCC voltage scaler in the Analog Comparators is non-linear.
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XMEGA A3B
Figure 36-1. Analog Comparator Voltage Scaler vs. Scalefac
T = 25°C
3.5
3.3 V
3
2.7 V
VSCALE [V]
2.5
2
1.8 V
1.5
1
0.5
0
0
5
10
15
20
25
30
35
40
45
50
55
60
65
SCALEFAC
Problem fix/Workaround
Use external voltage input for the analog comparator if accurate voltage levels are needed
3. ADC has increased INL error for some operating conditions
Some ADC configurations or operating condition will result in increased INL error.
In signed mode INL is increased to:
– 6 LSB for sample rates above 1 Msps, and up to 8 LSB for 2 Msps sample rate.
– 6 LSB for reference voltage below 1.1V when VCC is above 3.0V.
– 20 LSB for ambient temperature below 0 degree C and reference voltage below 1.3V.
In unsigned mode, the INL is increased up to a factor of 3 for the conditions above.
Problem fix/Workaround
None, avoid using the ADC in the above configurations in order to prevent increased INL
error.
4. ADC gain stage non-functional
The ADC gain stage is non-functional.
Problem fix/Workaround
None.
5. ADC Event on compare match non-functional
ADC signalling event will be given at every conversion complete even if Interrupt mode (INTMODE) is set to BELOW or ABOVE.
Problem fix/Workaround
Enable and use interrupt on compare match when using the compare function.
6. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V
The ADC can not be used to do bandgap measurements when VCC is below 2.7V.
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XMEGA A3B
Problem fix/Workaround
None.
7. Configuration of PGM and CWCM not as described in XMEGA A Manual
Enabling Common Waveform Channel Mode will enable Pattern generation mode (PGM),
but not Common Waveform Channel Mode.
Enabling Pattern Generation Mode (PGM) and not Common Waveform Channel Mode
(CWCM) will enable both Pattern Generation Mode and Common Waveform Channel Mode.
Problem fix/Workaround
Table 36-1. Configure PWM and CWCM according to this table:
PGM
CWCM
Description
0
0
PGM and CWCM disabled
0
1
PGM enabled
1
0
PGM and CWCM enabled
1
1
PGM enabled
8. PWM is not restarted properly after a fault in cycle-by-cycle mode
When the AWeX fault restore mode is set to cycle-by-cycle, the waveform output will not
return to normal operation at first update after fault condition is no longer present.
Problem fix/Workaround
Do a write to any AWeX I/O register to re-enable the output.
9. BOD will be enabled after any reset
If any reset source goes active, the BOD will be enabled and keep the device in reset if the
VCC voltage is below the programmed BOD level. During Power-On Reset, reset will not be
released until VCC is above the programmed BOD level even if the BOD is disabled.
Problem fix/Workaround
Do not set the BOD level higher than VCC even if the BOD is not used.
10. DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V
Using the DAC with a reference voltage above 2.4V or VCC - 0.6V will give inaccurate output when converting codes that give below 0.75V output:
– ±10 LSB for continuous mode
– ±200 LSB for Sample and Hold mode
Problem fix/Workaround
None.
11. DAC has increased INL or noise for some operating conditions
Some DAC configurations or operating condition will result in increased output error.
– Continous mode: ±5 LSB
– Sample and hold mode: ±15 LSB
– Sample and hold mode for reference above 2.0v: up to ±100 LSB
Problem fix/Workaround
None.
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12. DAC refresh may be blocked in S/H mode
If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is
done at maximum rate (i.e. the DAC is always busy doing conversion for this channel), this
will block refresh signals to the second channel.
Problem fix/Workaround
When using the DAC in S/H mode, ensure that none of the channels is running at maximum
conversion rate, or ensure that the conversion rate of both channels is high enough to not
require refresh.
13. Conversion lost on DAC channel B in event triggered mode
If during dual channel operation channel 1 is set in auto trigged conversion mode, channel 1
conversions are occasionally lost. This means that not all data-values written to the
Channel 1 data register are converted.
Problem fix/Workaround
Keep the DAC conversion interval in the range 000-001 (1 and 3 CLK), and limit the Peripheral clock frequency so the conversion internal never is shorter than 1.5 µs.
14. EEPROM page buffer always written when NVM DATA0 is written
If the EEPROM is memory mapped, writing to NVM DATA0 will corrupt data in the EEPROM
page buffer.
Problem fix/Workaround
Before writing to NVM DATA0, for example when doing software CRC or flash page buffer
write, check if EEPROM page buffer active loading flag (EELOAD) is set. Do not write NVM
DATA0 when EELOAD is set.
15. Pending full asynchronous pin change interrupts will not wake the device
Any full asynchronous pin-change Interrupt from pin 2, on any port, that is pending when the
sleep instruction is executed, will be ignored until the device is woken from another source
or the source triggers again. This applies when entering all sleep modes where the System
Clock is stopped.
Problem fix/Workaround
None.
16. Pin configuration does not affect Analog Comparator output
The Output/Pull and inverted pin configuration does not affect the Analog Comparator
output.
Problem fix/Workaround
None for Output/Pull configuration.
For inverted I/O, configure the Analog Comparator to give an inverted result (i.e. connect
positive input to the negative AC input and vice versa), or use and external inverter to
change polarity of Analog Comparator output.
17. NMI Flag for Crystal Oscillator Failure automatically cleared
NMI flag for Crystal Oscillator Failure (XOSCFDIF) will be automatically cleared when executing the NMI interrupt handler.
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Problem fix/Workaround
This device revision has only one NMI interrupt source, so checking the interrupt source in
software is not required.
18. Crystal start-up time required after power-save even if crystal is source for RTC
Even if 32.768 kHz crystal is used for RTC during sleep, the clock from the crystal will not be
ready for the system before the specified start-up time. See "XOSCSEL[3:0]: Crystal Oscillator Selection" in XMEGA A Manual. If BOD is used in active mode, the BOD will be on during
this period (0.5s).
Problem fix/Workaround
If faster start-up is required, go to sleep with internal oscillator as system clock.
19. TWI Transmit collision flag not cleared on repeated start
The TWI transmit collision flag should be automatically cleared on start and repeated start,
but is only cleared on start.
Problem fix/Workaround
Clear the flag in software after address interrupt.
20. Clearing TWI Stop Interrupt Flag may lock the bus
If software clears the STOP Interrupt Flag (APIF) on the same Peripheral Clock cycle as the
hardware sets this flag due to a new address received, CLKHOLD is not cleared and the
SCL line is not released. This will lock the bus.
Problem fix/Workaround
Check if the bus state is IDLE. If this is the case, it is safe to clear APIF. If the bus state is
not IDLE, wait for the SCL pin to be low before clearing APIF.
Code:
/* Only clear the interrupt flag if within a "safe zone". */
while ( /* Bus not IDLE: */
((COMMS_TWI.MASTER.STATUS & TWI_MASTER_BUSSTATE_gm) !=
TWI_MASTER_BUSSTATE_IDLE_gc)) &&
/* SCL not held by slave: */
!(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm)
)
{
/* Ensure that the SCL line is low */
if ( !(COMMS_PORT.IN & PIN1_bm) )
if ( !(COMMS_PORT.IN & PIN1_bm) )
break;
}
/* Check for an pending address match interrupt */
if ( !(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm) )
{
/* Safely clear interrupt flag */
COMMS_TWI.SLAVE.STATUS |= (uint8_t)TWI_SLAVE_APIF_bm;
}
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21. TWI START condition at bus timeout will cause transaction to be dropped
If Bus Timeout is enabled and a timeout occurs on the same Peripheral Clock cycle as a
START is detected, the transaction will be dropped.
Problem fix/Workaround
None.
22. TWI Data Interrupt Flag (DIF) erroneously read as set
When issuing the TWI slave response command CMD=0b11, it takes 1 Peripheral Clock
cycle to clear the data interrupt flag (DIF). A read of DIF directly after issuing the command
will show the DIF still set.
Problem fix/Workaround
Add one NOP instruction before checking DIF.
23. WDR instruction inside closed window will not issue reset
When a WDR instruction is execute within one ULP clock cycle after updating the window
control register, the counter can be cleared without giving a system reset.
Problem fix/Workaround
Wait at least one ULP clock cycle before executing a WDR instruction.
24. Pending asynchronous RTC32-interrupts will not wake up device
Asynchronous Interrupts from the 32-bit Real-Time-Counter that is pending when the sleep
instruction is executed, will be ignored until the device is woken from another source or the
source triggers again.
Problem fix/Workaround
None.
25. XOSCDFD can not be cleared by writing one to bit location
The Crystal Oscillator Failure Detection Flag (XOSCFDF) can not be cleared by writing one
to its bit location. The bit can only be cleared by issuing a reset to the VBAT domain.
Problem fix/Workaround
None.
26. Maximum operating frequency below 1.76V is 8 MHz
To ensure correct operation, the maximum operating frequency below 1.76V VCC is 8 MHz.
Problem fix/Workaround
None, avoid running the device outside this frequency and voltage limitation.
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37. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
37.1
37.2
37.3
37.4
8116J - 06/13
1.
Not recommended for new designs - Use ATxmega256A3BU
1.
Updated ”Errata” on page 95.
1.
Updated Footnote 2 of Figure 2-1 on page 3.
2.
Updated ”Features” on page 28. Event Channel 0 output on port pin 7.
3.
Updated ”Timer/Counter and AWEX functions” on page 50.
4.
Updated ”Alternate Pin Functions” on page 52.
5.
Updated Table 30-3 on page 52. Pin 15 is VCC.
6.
Updated ”DC Characteristics” on page 64 by adding Icc for Flash/EEPROM Programming.
7.
Added AVCC in ”ADC Characteristics” on page 68.
8.
Updated Start up time in ”ADC Characteristics” on page 68.
9.
Updated ”DAC Characteristics” on page 69. Removed DC output impedence.
10
Updated ”VBAT and Battery Backup Characteristics” on page 73.
11.
Updated Figure 35-6 on page 76. Replaced the figure by a correct one.
12.
Fixed typo in “Errata” section.
13.
Editorial updates.
1.
Updated the device pin-out Figure 2-1 on page 3. PDI_CLK and PDI_DATA renamed only PDI.
2.
Deleted page with duplicated information on Production Signature Row in ”Production Signature
Row” on page 12.
3.
Changed value for Crystal Oscillator from 32 kHz to 32.768 kHz in ”Clock Options” on page 18.
4.
Updated ”DAC - 12-bit Digital to Analog Converter” on page 44. DAC uses internal 1.0 voltage.
5.
Updated ”Timer/Counter and AWEX functions” on page 50.
8116I - 09/10
8116H - 08/10
8116G - 05/10
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37.5
37.6
37.7
37.8
6.
Updated ”Alternate Pin Functions” on page 52.
7.
Updated ”Operating voltage and frequency” on page 66 by replacing SYS to CPU.
8.
Replaced Table 34-3 on page 67.
9.
Updated Table 34-3 on page 67, Endurance and Data Retention.
11.
Updated ”PAD Characteristics” on page 70. Input hysteresis is in V and not in mV.
12.
Added new table ”Maximum load capacitance (CL) and ESR recommendation for 32.768 kHz
Crystal” on page 72.
13.
Added new table ”Device wake-up time from sleep” on page 72.
14.
Updated Table 34-20 on page 73.
15.
Changed Internal Oscillator Speed to ”Oscillators and Wake-up Time” on page 90.
16.
Added characterization for PDI speed in Figure 35-42 on page 94.
17.
Updated ”Errata” on page 95.
1.
Updated ”DC Characteristics” on page 64.
2.
Added ”Flash and EEPROM Memory Characteristics” on page 67.
3.
Added ”” on page 72.
4.
Upddated ”Errata” on page 95.
1.
Updated ”Electrical Characteristics” on page 64.
2.
Added ”Typical Characteristics” on page 74.
3.
Updated ”Errata” on page 95.
1.
Updated ”Ordering Information” on page 2.
2.
Editorial updates.
1.
Added ”Errata” on page 95 for ATxmega256A3B rev B.
8116F - 09/09
8116E - 06/09
8116D - 04/09
8116C - 02/09
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37.9
8116B - 12/08
1.
Added ”Errata” on page 95 for ATxmega256A3B rev A.
1.
Initial version.
37.10 8116A - 11/08
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Table of Contents
Features ..................................................................................................... 1
Typical Applications ................................................................................ 1
1
Ordering Information ............................................................................... 2
2
Pinout/Block Diagram .............................................................................. 3
3
Overview ................................................................................................... 4
3.1Block Diagram ...........................................................................................................5
4
Resources ................................................................................................. 6
4.1Recommended reading .............................................................................................6
5
Disclaimer ................................................................................................. 6
6
AVR CPU ................................................................................................... 7
6.1Features ....................................................................................................................7
6.2Overview ...................................................................................................................7
6.3Register File ..............................................................................................................8
6.4ALU - Arithmetic Logic Unit .......................................................................................8
6.5Program Flow ............................................................................................................8
7
Memories .................................................................................................. 9
7.1Features ....................................................................................................................9
7.2Overview ...................................................................................................................9
7.3In-System Programmable Flash Program Memory .................................................10
7.4Data Memory ...........................................................................................................10
7.5Production Signature Row .......................................................................................12
7.6User Signature Row ................................................................................................12
7.7Flash and EEPROM Page Size ...............................................................................13
8
DMAC - Direct Memory Access Controller .......................................... 14
8.1Features ..................................................................................................................14
8.2Overview .................................................................................................................14
9
Event System ......................................................................................... 15
9.1Features ..................................................................................................................15
9.2Overview .................................................................................................................15
10 System Clock and Clock options ......................................................... 17
10.1Features ................................................................................................................17
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10.2Overview ...............................................................................................................17
10.3Clock Options ........................................................................................................18
11 Power Management and Sleep Modes ................................................. 20
11.1Features ................................................................................................................20
11.2Overview ...............................................................................................................20
11.3Sleep Modes .........................................................................................................20
12 System Control and Reset .................................................................... 22
12.1Features ................................................................................................................22
12.2Resetting the AVR .................................................................................................22
12.3Reset Sources .......................................................................................................22
12.4WDT - Watchdog Timer .........................................................................................23
13 Battery Backup System ......................................................................... 24
13.1Features ................................................................................................................24
13.2Overview ...............................................................................................................24
14 PMIC - Programmable Multi-level Interrupt Controller ....................... 26
14.1Features ................................................................................................................26
14.2Overview ...............................................................................................................26
14.3Interrupt vectors ....................................................................................................26
15 I/O Ports .................................................................................................. 28
15.1Features ................................................................................................................28
15.2Overview ...............................................................................................................28
15.3I/O configuration ....................................................................................................28
15.4Input sensing .........................................................................................................31
15.5Port Interrupt .........................................................................................................31
15.6Alternate Port Functions ........................................................................................31
16 T/C - 16-bit Timer/Counter with PWM ................................................... 32
16.1Features ................................................................................................................32
16.2Overview ...............................................................................................................32
17 AWEX - Advanced Waveform Extension ............................................. 34
17.1Features ................................................................................................................34
17.2Overview ...............................................................................................................34
18 Hi-Res - High Resolution Extension ..................................................... 35
18.1Features ................................................................................................................35
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18.2Overview ...............................................................................................................35
19 RTC32 - 32-bit Real-Time Counter ........................................................ 36
19.1Features ................................................................................................................36
20 TWI - Two Wire Interface ....................................................................... 37
20.1Features ................................................................................................................37
20.2Overview ...............................................................................................................37
21 SPI - Serial Peripheral Interface ............................................................ 38
21.1Features ................................................................................................................38
21.2Overview ...............................................................................................................38
22 USART ..................................................................................................... 39
22.1Features ................................................................................................................39
22.2Overview ...............................................................................................................39
23 IRCOM - IR Communication Module .................................................... 40
23.1Features ................................................................................................................40
23.2Overview ...............................................................................................................40
24 Crypto Engine ........................................................................................ 41
24.1Features ................................................................................................................41
24.2Overview ...............................................................................................................41
25 ADC - 12-bit Analog to Digital Converter ............................................. 42
25.1Features ................................................................................................................42
25.2Overview ...............................................................................................................42
26 DAC - 12-bit Digital to Analog Converter ............................................. 44
26.1Features ................................................................................................................44
26.2Overview ...............................................................................................................44
27 AC - Analog Comparator ....................................................................... 45
27.1Features ................................................................................................................45
27.2Overview ...............................................................................................................45
27.3Input Selection .......................................................................................................47
27.4Window Function ...................................................................................................47
28 OCD - On-chip Debug ............................................................................ 48
28.1Features ................................................................................................................48
28.2Overview ...............................................................................................................48
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29 Program and Debug Interfaces ............................................................. 49
29.1Features ................................................................................................................49
29.2Overview ...............................................................................................................49
29.3JTAG interface ......................................................................................................49
29.4PDI - Program and Debug Interface ......................................................................49
30 Pinout and Pin Functions ...................................................................... 50
30.1Alternate Pin Function Description ........................................................................50
30.2Alternate Pin Functions .........................................................................................52
31 Peripheral Module Address Map .......................................................... 57
32 Instruction Set Summary ...................................................................... 58
33 Packaging information .......................................................................... 62
33.164A ........................................................................................................................62
33.264M2 .....................................................................................................................63
34 Electrical Characteristics ...................................................................... 64
34.1Absolute Maximum Ratings* .................................................................................64
34.2DC Characteristics ................................................................................................64
34.3Operating Voltage and Frequency ........................................................................66
34.4Flash and EEPROM Memory Characteristics .......................................................67
34.5ADC Characteristics ..............................................................................................68
34.6DAC Characteristics ..............................................................................................69
34.7Analog Comparator Characteristics .......................................................................69
34.8Bandgap Characteristics .......................................................................................69
34.9Brownout Detection Characteristics ......................................................................70
34.10PAD Characteristics ............................................................................................70
34.11POR Characteristics ............................................................................................71
34.12Reset Characteristics ..........................................................................................71
34.13Oscillator Characteristics .....................................................................................71
34.14VBAT and Battery Backup Characteristics ..........................................................73
35 Typical Characteristics .......................................................................... 74
35.1Active Supply Current ............................................................................................74
35.2Idle Supply Current ................................................................................................77
35.3Power-down Supply Current .................................................................................81
35.4Power-save Supply Current ..................................................................................82
35.5Pin Pull-up .............................................................................................................82
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35.6Pin Output Voltage vs. Sink/Source Current .........................................................84
35.7Pin Thresholds and Hysteresis ..............................................................................87
35.8Bod Thresholds .....................................................................................................89
35.9Oscillators and Wake-up Time ..............................................................................90
35.10Module current consumption ...............................................................................93
35.11Reset Pulsewidth .................................................................................................94
35.12PDI Speed ...........................................................................................................94
36 Errata ....................................................................................................... 95
36.1ATxmega256A3B ..................................................................................................95
37 Datasheet Revision History ................................................................ 101
37.18116J - 06/13 ......................................................................................................101
37.28116I - 09/10 .......................................................................................................101
37.38116H - 08/10 ......................................................................................................101
37.48116G - 05/10 .....................................................................................................101
37.58116F - 09/09 ......................................................................................................102
37.68116E - 06/09 ......................................................................................................102
37.78116D - 04/09 ......................................................................................................102
37.88116C - 02/09 ......................................................................................................102
37.98116B - 12/08 ......................................................................................................103
37.108116A - 11/08 ....................................................................................................103
Table of Contents....................................................................................... i
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8116J–AVR–06/2013
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