AT25080B and AT25160B SPI Serial EEPROMs 8K (1,024 x 8) and 16K (2,048 x 8) DATASHEET Features Serial Peripheral Interface (SPI) Compatible Supports SPI Modes 0 (0,0) and 3 (1,1) ̶ Datasheet Describes Mode 0 Operation Low-voltage and Standard-voltage Operation ̶ 1.8 (VCC = 1.8V to 5.5V) 20MHz Clock Rate (5V) 32-byte Page Mode Block Write Protection ̶ Protect 1/4, 1/2, or Entire Array Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection Self-timed Write Cycle (5ms max) High Reliability ̶ ̶ Endurance: 1,000,000 Write Cycles Data Retention: 100 Years Green (Pb/Halide-free/RoHS Compliant) Packaging Options Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers Description The Atmel® AT25080B/160B provides 8,192/16,384 bits of Serial ElectricallyErasable Programmable Read-Only Memory (EEPROM) organized as 1,024/2,048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25080B/160B is available in space-saving 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 8-ball VFBGA, and 8-ball WLCSP packages. The AT25080B/160B is enabled through the Chip Select pin (CS) and accessed via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). All programming cycles are completely self-timed, and no separate erase cycle is required before write. Block Write protection is enabled by programming the status register with one of four blocks of write protection. Separate program enable and program disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts to the status register. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 1. Pin Configurations and Pinouts Table 1. Pin Configurations Pin Name Function CS Chip Select GND Ground HOLD Suspends Serial Input SCK Serial Data Clock SO Serial Data Output SI Serial Data Input WP Write Protect VCC Power Supply 8-lead SOIC 8-lead TSSOP (Top View) (Top View) CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI CS SO WP GND 1 2 3 4 8 7 6 5 VCC HOLD SCK SI 8-ball VFBGA 8-pad UDFN/XDFN (Top View) (Top View) CS SO WP GND 1 2 3 4 8 7 6 5 VCC HOLD SCK SI CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI 8-ball WLSCP (Top View) GND SI WP SO SCK HOLD CS Note: 2. Drawings are not to scale. Absolute Maximum Ratings* Operating Temperature . . . . . . . . . . .-55C to +125C Storage Temperature . . . . . . . . . . . . .-65°C to +150°C Voltage on Any Pin with Respect to Ground . . . . . . . . . . . . -1.0V to +7.0V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA 2 VCC AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3. Block Diagram Figure 3-1. Block Diagram VCC Status Register GND Memory Array 1,024/2,048 x 8 Address Decoder Data Register SI CS WP SCK Output Buffer Mode Decode Logic Clock Generator SO HOLD AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 3 4. Memory Organization 4.1 Pin Capacitance Table 4-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = +5.0V (unless otherwise noted). Symbol Test Conditions COUT CIN Note: 4.2 1. Max Units Conditions Output Capacitance (SO) 8 pF VOUT = 0V Input Capacitance (CS, SCK, SI, WP, HOLD) 6 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Table 4-2. DC Characteristics Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 4.5 5.5 V ICC1 Supply Current VCC = 5.0V at 20MHz, SO = Open and Read 7.5 10.0 mA ICC2 Supply Current VCC = 5.0V at 20MHz, SO = Open, Read, and Write 4.0 10.0 mA ICC3 Supply Current VCC = 5.0V at 5MHz, SO = Open, Read, and Write 4.0 6.0 mA ISB1 Standby Current VCC = 1.8V, CS = VCC < 0.1 6.0(2) μA ISB2 Standby Current VCC = 2.5V, CS = VCC 0.3 7.0(2) μA ISB3 Standby Current VCC = 5.0V, CS = VCC 2.0 10.0(2) μA IIL Input Leakage VIN = 0V to VCC -3.0 3.0 μA IOL Output Leakage VIN = 0V to VCC, TAC = 0°C to 70°C -3.0 3.0 μA VIL(1) Input Low-voltage -0.6 VCC x 0.3 V VIH(1) Input High-voltage VCC x 0.7 VCC + 0.5 V VOL1 Output Low-voltage 0.4 V VOH1 Output High-voltage VOL2 Output Low-voltage VOH2 Output High-voltage Notes: 4 1. 2. Test Condition 3.6V VCC 5.5V 1.8V VCC 3.6V Min IOL = 3.0mA IOH = 1.6mA VIL min and VIH max are reference only and are not tested. Worst case measured at 85C. AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 VCC - 0.8 IOL = 0.15mA IOH = 100μA Typ V 0.2 VCC - 0.2 V V 4.3 AC Characteristics Table 4-3. AC Characteristics Applicable over recommended operating range from TAI = -40C to +85C, VCC = as specified, CL = 1 TTL gate and 100pF (unless otherwise noted). Symbol Parameter Voltage Min Max Units fSCK SCK Clock Frequency 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 0 0 0 20 10 5 MHz tRI Input Rise Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 2 2 2 μs tFI Input Fall Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 2 2 2 μs tWH SCK High Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 20 40 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 20 40 tWL SCK Low Time ns 80 ns 80 tCS CS High Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 25 50 100 ns tCSS CS Setup Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 25 50 100 ns tCSH CS Hold Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 25 50 100 ns tSU Data In Setup Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 5 10 20 ns tH Data In Hold Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 5 10 20 ns tHD HOLD Setup Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 5 10 20 tCD HOLD Hold Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 5 10 20 Output Valid 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 0 0 0 tV ns 20 40 ns 80 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 5 Table 4-3. AC Characteristics (Continued) Applicable over recommended operating range from TAI = -40C to +85C, VCC = as specified, CL = 1 TTL gate and 100pF (unless otherwise noted). Symbol Parameter Voltage Min tHO Output Hold Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 0 0 0 tLZ HOLD to Output Low Z 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 0 0 0 tHZ HOLD to Output High Z tDIS Units ns 25 50 100 ns 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 40 80 200 ns Output Disable Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 40 80 200 ns tWC Write Cycle Time 4.5 to 5.5 2.5 to 5.5 1.8 to 5.5 5 5 5 ms Endurance(1) 3.3V, 25°C, Page Mode Note: 6 Max 1. This parameter is characterized and is not 100% tested. AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 1M Write Cycles 5. Serial Interface Description Table 5-1. Serial Interface Description Interface Description Master The device that generates the Serial Clock. Slave Because the Serial Clock pin (SCK) is always an input, the AT25080B/160B always operates as a slave. Transmitter/Receiver The AT25080B/160B has separate pins designated for data transmission (SO) and reception (SI). MSB The Most Significant Bit (MSB) is the first bit transmitted and received. Serial Opcode After the device is selected with CS going low, the first byte will be received. This byte contains the opcode that defines the operations to be performed. Invalid Opcode If an invalid opcode is received, no data will be shifted into the AT25080B/160B, and the serial output pin (SO) will remain in a high-impedance state until the falling edge of CS is detected. This will reinitialize the serial communication. Chip Select The AT25080B/160B is selected when the CS pin is low. When the device is not selected, data will not be accepted via the SI pin, and the Serial Output pin (SO) will remain in a high-impedance state. Hold The HOLD pin is used in conjunction with the CS pin to select the AT25080B/160B. When the device is selected and a serial sequence is underway, Hold can be used to pause the serial communication with the master device without resetting the serial sequence. To pause, the HOLD pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK may still toggle during Hold). Inputs to the SI pin will be ignored while the SO pin is in the high impedance state. Write Protect The Write Protect pin (WP) allows normal Read and Write operations when held high. When the WP pin is brought low and WPEN bit is one, all write operations to the status register are inhibited. When the WP is low while CS is low, it will interrupt a Write to the status register. If the internal write cycle has already been initiated, WP going low will have no effect on any Write operation to the status register. The WP pin function is blocked when the WPEN bit in the status register is zero. This will allow the user to install the AT25080B/160B in a system with the WP pin tied to ground, and it will be able to write to the status register. All WP pin functions are enabled when the WPEN bit is set to one. AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 7 Figure 5-1. SPI Serial Interface Master: Microcontroller Data Out (MOSI) Data In (MISO) Serial Clock (SPI CK) SS0 SS1 SS2 SS3 Slave: AT25080B/160B SI SO SCK CS SI SO SCK CS SI SO SCK CS SI SO SCK CS 8 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 6. Functional Description The AT25080B/160B is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of the 6805 and 68HC11 microcontroller series. The AT25080B/160B utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in the table below. All instructions, addresses, and data are transferred with the MSB first and starts with a high-to-low CS transition. Table 6-1. Instruction Set for the AT25080B/160B Instruction Name Instruction Format Operation WREN 0000 X110 Set Write Enable Latch WRDI 0000 X100 Reset Write Enable Latch RDSR 0000 X101 Read Status Register WRSR 0000 X001 Write Status Register Read 0000 X011 Read Data from Memory Array Write 0000 X010 Write Data to Memory Array Write Enable (WREN): The device will power up in the Write Disable state when VCC is applied. All programming instructions must therefore be preceded by a Write Enable instruction. Write Disable (WRDI): To protect the device against inadvertent writes, the WRDI instruction disables all programming modes. The WRDI instruction is independent of the status of the WP pin. Read Status Register (RDSR): The RDSR instruction provides access to the status register. The Ready/Busy and Write Enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction. Table 6-2. Status Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 WPEN X X X BP1 BP0 WEN RDY Table 6-3. Bit Bit 0 (RDY) Bit 1 (WEN) Read Status Register Bit Definition Definition If zero, it indicates the device is ready. If one, it indicates the write cycle is in progress. If zero, it indicates the device is not write enabled. If one, it indicates the device is write enabled. Bit 2 (BP0) See Table 6-4 on page 10. Bit 3 (BP1) See Table 6-4. Bits 4 to 6 These are zeros when device is not in an internal write cycle. Bit 7 (WPEN) See Table 6-5 on page 10 Bits 0 to 7 These are ones during an internal write cycle. AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 9 Write Status Register (WRSR): The WRSR instruction allows the user to select one of four levels of protection. The AT25080B/160B is divided into four array segments. One-quarter (1/4), one-half (1/2), or all of the memory segments can be protected. Any of the data within any selected segment will be read-only. The block write protection levels and corresponding status register control bits are shown in Table 6-4. The three bits BP0, BP1, and WPEN are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, tWC, RDSR). Table 6-4. Block Write Protect Bits Status Register Bits Level Array Addresses Protected BP1 BP0 AT25080B AT25160B 0 0 0 None None 1(1/4) 0 1 0300 03FF 0600 07FF 2(1/2) 1 0 0200 03FF 0400 07FF 3(All) 1 1 0000 03FF 0000 07FF The WRSR instruction allows the user to enable or disable the Write Protect (WP) pin through the use of the Write Protect Enable (WPEN) bit. Hardware Write protection is enabled when the WP pin is low and the WPEN bit is one. Hardware Write protection is disabled when either the WP pin is high or the WPEN bit is zero. When the device is hardware write protected, writes to the status register, including the block protect bits and the WPEN bit, and the block-protected sections in the memory array are disabled. Writes are only allowed to sections of the memory that are not block-protected. Note: When the WPEN bit is Hardware Write protected, it cannot be changed back to zero as long as the WP pin is held low. Table 6-5. 10 WPEN Operation WPEN WP WEN Protected Blocks Unprotected Blocks Status Register 0 X 0 Protected Protected Protected 0 X 1 Protected Writeable Writeable 1 Low 0 Protected Protected Protected 1 Low 1 Protected Writeable Protected X High 0 Protected Protected Protected X High 1 Protected Writeable Writeable AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 Read Sequence (Read): Reading the AT25080B/160B via the Serial Output (SO) pin requires the following sequence. After the CS line is pulled low to select a device, the read opcode is transmitted via the SI line followed by the byte address to be read (A15 to A0, see Table 6-6). Upon completion, any data on the SI line will be ignored. The data (D7 to D0) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CS line should be driven high after the data comes out. The read sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll-over to the lowest address allowing the entire memory to be read in one continuous read cycle. Write Sequence (Write): In order to program the AT25080B/160B, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction, and then a Write instruction can be executed. The address of the memory location(s) to be programmed must be outside the protected address field location selected by the block write protection level. During an internal write cycle, all commands will be ignored except the RDSR instruction. A Write instruction requires the following sequence. After the CS line is pulled low to select the device, the Write opcode is transmitted via the SI line followed by the byte address (A15 to A0) and the data (D7 to D0) to be programmed (see Table 6-6). Programming will start after the CS pin is brought high. The low-to-high transition of the CS pin must occur during the SCK low-time immediately after clocking in the D0 (LSB) data bit. The Ready/Busy status of the device can be determined by initiating a RDSR instruction. If Bit 0 is one, the write cycle is still in progress. If Bit 0 is zero, the write cycle has ended. Only the RDSR instruction is enabled during the write programming cycle. The AT25080B/160B is capable of a 32-byte Page Write operation. After each byte of data is received, the five low-order address bits are internally incremented by one; the high-order bits of the address will remain constant. If more than 32 bytes of data are transmitted, the address counter will roll-over and the previously written data will be overwritten. The AT25080B/160B is automatically returned to the write disable state at the completion of a write cycle. Note: If the device is not write-enabled (WREN), the device will ignore the Write instruction and will return to the standby state when CS is brought high. A new CS falling edge is required to reinitiate the serial communication. Table 6-6. Address Key Address AT25080B AT25160B AN A9 – A0 A10 – A0 Don’t Care Bits A15 – A10 A15 – A11 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 11 7. Timing Diagrams Figure 7-1. Synchronous Data Timing (for Mode 0) tCS VIH CS VIL tCSS tCSH VIH tWH SCK tWL VIL tSU tH VIH SI Valid In VIL tV tHO tDIS VOH HI-Z HI-Z SO VOL Figure 7-2. WREN Timing CS SCK SI WREN Opcode HI-Z SO Figure 7-3. WRDI Timing CS SCK SI SO 12 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 WRDI Opcode HI-Z Figure 7-4. RDSR Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK SI Instruction Data Out High-impedance SO 7 6 5 4 3 2 1 0 8 9 10 11 12 13 14 15 MSB Figure 7-5. WRSR Timing CS 0 1 2 3 4 5 6 7 SCK Data In SI 6 5 4 3 2 1 0 High-impedance SO Figure 7-6. 7 Instruction Read Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31 SCK Byte Address SI Instruction 15 14 13 ... 3 2 1 0 Data Out SO High-impedance 7 6 5 4 3 2 1 0 MSB AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 13 Figure 7-7. Write Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31 SCK Byte Address SI SO Figure 7-8. 15 14 13 ... 3 Instruction 2 Data In 1 0 7 6 5 4 High-impedance HOLD Timing CS t CD t CD SCK t HD HOLD t HD t HZ SO tLZ 14 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 3 2 1 0 8. Ordering Code Detail AT2 5 0 8 0 B - S S H L x x - B Atmel Designator Product Family 25 = Standard SPI Serial EEPROM Shipping Carrier Option B T E Product Variation xx Device Density 080 = 8-kilobit 160 = 16-kilobit = Bulk (Tubes) = Tape and Reel, Standard Quantity Option = Tape and Reel, Expanded Quantity Option = Applies to select packages only. See ordering code table for variation details. Operating Voltage L = 1.8V to 5.5V Device Revision Packaged Device Grade or Wafer/Die Thickness H U 11 = Green, NiPdAu Lead Finish Temperature Range -40°C to +85°C = Green, Matte Sn Lead Finish Temperature Range -40°C to +85°C = 11mil Wafer Thickness Package Option SS = X = MA = ME = C = U = WWU = WDT = JEDEC SOIC TSSOP UDFN XDFN VFBGA WLCSP Wafer Unsawn Die in Tape and Reel AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 15 9. Part Markings AT25080B and AT25160B: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-pad UDFN 2.0 x 3.0 mm Body ### H%@ YXX ATHYWW ###% @ AAAAAAA ATMLHYWW ###% @ AAAAAAAA 8-pad XDFN 8-ball VFBGA 1.8 x 2.2 mm Body 1.5 x 2.0 mm Body ### YXX 8-ball WLCSP ###U YMXX @U ### YXX PIN 1 Note 1: designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT25080B Truncation Code ###: 58B AT25160B Truncation Code ###: 5AB Date Codes Y = Year 4: 2014 5: 2015 6: 2016 7: 2017 8: 2018 9: 2019 0: 2020 1: 2021 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code Voltages % = Minimum Voltage L: 1.8V min Grade/Lead Finish Material H: Industrial/NiPdAu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 6/10/14 TITLE Package Mark Contact: [email protected] 16 25080-160BSM, AT25080B and AT25160B Package Marking Information AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 DRAWING NO. REV. 25080-160BSM B 10. Ordering Information Delivery Information Atmel Ordering Code Lead Finish Form Quantity Bulk (Tubes) 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8ME1 Tape and Reel 5,000 per Reel SnAgCu 8U3-1 Tape and Reel 5,000 per Reel AT25080B-UUL0B-T(1) (Lead-free/Halogen-free) 8U-12 Tape and Reel 5,000 per Reel AT25080B-WWU11L(2) N/A Wafer Sale AT25080B-SSHL-B 8S1 AT25080B-SSHL-T AT25080B-XHL-B NiPdAu AT25080B-XHL-T 8MA2 AT25080B-MAHL-E AT25080B-MEHL-T AT25080B-CUL-T AT25160B-SSHL-B AT25160B-XHL-B NiPdAu AT25160B-XHL-T Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8ME1 Tape and Reel 5,000 per Reel (Lead-free/Halogen-free) AT25160B-MAHL-T 8MA2 AT25160B-MAHL-E AT25160B-MEHL-T AT25160B-CUL-T (1) AT25160B-UUL0B-T AT25160B-WWU11L(2) 2. 100 per Tube 8X Operation Range Industrial Temperature (-40 to 85C) Note 2 Bulk (Tubes) 8S1 AT25160B-SSHL-T 1. 8X (Lead-free/Halogen-free) AT25080B-MAHL-T Notes: Package SnAgCu 8U3-1 Tape and Reel 5,000 per Reel (Lead-free/Halogen-free) 8U-12 Tape and Reel 5,000 per Reel N/A Wafer Sale Industrial Temperature (-40 to 85C) Note 2 WLCSP Package: This device includes a backside coating to increase product robustness. CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells. Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light does not occur. Contact Atmel Sales for Wafer sales. Package Type 8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.0mm x 3.0mm x 0.6mm body, Thermally Enhanced Plastic Ultra Thin Dual Flat Dual No Lead (UDFN) 8ME1 8-pad 1.8mm x 2.2mm body, Extra Thin DFN (XDFN) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array (VFBGA) 8U-12 8-ball, 5 x 3 grid array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP) AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 17 11. Packaging Information 11.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: [email protected] 18 TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 GPC SWB DRAWING NO. REV. 8S1 G 11.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E NOTE 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) GPC TNR DRAWING NO. 8X AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 REV. E 19 11.3 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C TOP VIEW A2 SIDE VIEW A A1 E2 b (8x) 8 7 1 D2 6 3 5 4 e (6x) K L (8x) BOTTOM VIEW Notes: COMMON DIMENSIONS (Unit of Measure = mm) 2 Pin#1 ID 1. This drawing is for general information only. Refer to Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. 3. Dimensions b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. SYMBOL MIN NOM MAX A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 D 1.90 2.00 2.10 D2 1.40 1.50 1.60 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 b 0.18 0.25 0.30 C L 3 1.52 REF 0.30 e K NOTE 0.35 0.40 0.50 BSC 0.20 - - 11/26/14 Package Drawing Contact: [email protected] 20 TITLE 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 GPC DRAWING NO. REV. YNZ 8MA2 G 11.4 8ME1 — 8-pad XDFN D 7 8 6 5 E PIN #1 ID 2 1 3 4 A1 Top View A Side View e1 b L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 0.10 PIN #1 ID 0.15 b e End View MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 1.20 REF L 0.26 0.30 NOTE 0.35 9/10/2012 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. REV. 8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN (XDFN) DTP 8ME1 B AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 21 11.5 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 1 2 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 Package Drawing Contact: [email protected] 22 TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 REV. F 11.6 8U-12 — 8-ball WLCSP TOP VIEW 1 A1 CORNER BALL SIDE 2 3 3 1 2 A1 CORNER e2 A A e1 B B C E C D D E E d2 -BD -A- k db (4X) d1 0.015 (4X) d 0.015 C vd 0.05 C A B SIDE VIEW A3 A2 A -C- SEATING PLANE A1 PIN ASSIGNMENT MATRIX k 0.075 C COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN TYP MAX A 0.313 0.334 0.355 A1 0.094 - 0.124 1 2 3 A2 0.175 0.200 0.225 A GND n/a SI A3 0.025 REF B n/a WP n/a D Contact Atmel for details d1 0.693 C SO n/a SCK D n/a HOLD n/a E CS n/a V cc d2 0.400 E Contact Atmel for details e1 0.400 e2 0.400 b 0.148 0.168 NOTE 0.188 9/15/14 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. REV. 8U-12, 8-ball, 0.40 mm Pitch, 5 x 3 Array, Wafer Level Chip Scale Package (WLCSP) with BSC GZA 8U-12 B AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 23 12. Revision History Doc. Rev. Date 5228G 01/2015 Comments Add the AT25080B-MAHL-E and AT25160B-MAHL-E package options. Update the 8MA2 and 8U-12 package drawings and the ordering information. Add WLSCP package option. 5228F 07/2014 Update 8X, 8MA2, 8ME1, and 8U3-1 package drawings. Update template, Atmel logos, disclaimer page. 24 5228E 03/2012 Update 8A2 to 8X and 8S1, 8MA2, 8U3-1 package drawings. 5228D 04/2010 Update Ordering Code Detail and Ordering Information. 5228C 08/2009 Change Catalog Scheme and add Marking Details. 5228B 07/2008 Change ‘Endurance’ parameter on page 6. 5228A 09/2007 Initial document release. AT25080B/160B [DATASHEET] Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. 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