Features • Medium-voltage and Standard-voltage Operation • • • • • • • • • • • – 5.0 (VCC = 4.5V to 5.5V) – 2.7 (VCC = 2.7V to 5.5V) Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 100 kHz (2.7V) and 400 kHz (5V) Compatibility Write Protect Pin for Hardware Data Protection 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes Partial Page Writes are Allowed Self-timed Write Cycle (5 ms max) High-reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years 8-lead PDIP and 8-lead JEDEC SOIC Packages Two-wire Automotive Serial EEPROM 1K (128 x 8) 2K (256 x 8) Description 4K (512 x 8) The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many automotive applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP and 8-lead JEDEC SOIC packages and is accessed via a two-wire serial interface. In addition, the entire family is available in 5.0V (4.5V to 5.5V) and 2.7V (2.7V to 5.5V) versions. Table 1. Pin Configuration Pin Name Function A0 - A2 Address Inputs SDA Serial Data SCL Serial Clock Input WP Write Protect NC No Connect 8-lead PDIP A0 A1 A2 GND 1 2 3 4 8 7 6 5 VCC WP SCL SDA 1 2 3 4 8 7 6 5 16K (2048 x 8) AT24C01A AT24C02 AT24C04 AT24C08(1) AT24C16(2) Note: 1. This device is not recommended for new designs. Please refer to AT24C08A. 2. This device is not recommended for new designs. Please refer to AT24C16A. 8-lead SOIC A0 A1 A2 GND 8K (1024 x 8) VCC WP SCL SDA 3256F–SEEPR–10/04 1 Absolute Maximum Ratings Operating Temperature......................................−55°C to +125°C Storage Temperature .........................................−65°C to +150°C Voltage on Any Pin with Respect to Ground ........................................ −1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Output Current........................................................ 5.0 mA Figure 1. Block Diagram Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or opencollector devices. DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired for the AT24C01A and the AT24C02. As many as eight 1K/2K devices may be addressed on a single bus system (device addressing is discussed in detail under the Device Addressing section). The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K devices may be addressed on a single bus system. The A0 pin is a no connect. 2 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 The AT24C08 only uses the A2 input for hardwire addressing and a total of two 8K devices may be addressed on a single bus system. The A0 and A1 pins are no connects. The AT24C16 does not use the device address pins, which limits the number of devices on a single bus to one. The A0, A1 and A2 pins are no connects. WRITE PROTECT (WP): The AT24C01A/02/04/16 has a Write Protect pin that provides hardware data protection. The Write Protect pin allows normal read/write operations when connected to ground (GND). When the Write Protect pin is connected to VCC, the write protection feature is enabled and operates as shown see Table 2. Table 2. Write Protect WP Pin Status 24C01A 24C02 At VCC Full (1K) Array At GND Normal Read/Write Operations Notes: Memory Organization Part of the Array Protected Full (2K) Array 24C04 Full (4K) Array 24C08(1) Normal Read/ Write Operation 24C16(2) Upper Half (8K) Array 1. This device is not recommended for new designs. Please refer to AT24C08A. 2. This device is not recommended for new designs. Please refer to AT24C16A. AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each, the 1K requires a 7-bit data word address for random word addressing. AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit data word address for random word addressing. AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data word address for random word addressing. AT24C08, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word address for random word addressing. AT24C16, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires an 11-bit data word address for random word addressing. 3 3256F–SEEPR–10/04 Table 3. Pin Capacitance(1) Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +2.7V. Symbol Test Condition CI/O CIN Note: Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested. Table 4. DC Characteristics Applicable over recommended operating range from: TA = −40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise noted). Symbol Parameter Test Condition VCC1 Supply Voltage VCC2 Supply Voltage ICC Supply Current VCC = 5.0V READ at 100 kHz ICC Supply Current VCC = 5.0V ISB1 Max Units 2.7 5.5 V 4.5 5.5 V 0.4 1.0 mA WRITE at 100 kHz 2.0 3.0 mA Standby Current VCC = 2.7V VIN = VCC or VSS 1.6 4.0 µA ISB2 Standby Current VCC = 5.0V VIN = VCC or VSS 8.0 18.0 µA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 µA −0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V (1) Min Typ VIL Input Low Level VIH Input High Level(1) VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V VOL1 Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V Notes: 4 1. VIL min and VIH max are reference only and are not tested. AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 Table 5. AC Characteristics Applicable over recommended operating range from TA = −40°C to +125°C, VCC = +2.7V to +5.5V, CL = 1 TTL Gate and 100 pF (unless otherwise noted). AT24C01A/02/04/08, 2.7V Symbol Parameter Min Max AT24C16, 2.7V Min (1) Max AT24C01A/02/04/08/16, 5.0V Min Max Units 400 kHz fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.2 1.2 1.2 µs tHIGH Clock Pulse Width High 0.6 0.6 0.6 µs tI Noise Suppression Time(2) tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start(3) 1.2 1.2 1.2 µs tHD.STA Start Hold Time 0.6 0.6 0.6 µs tSU.STA Start Set-up Time 0.6 0.6 0.6 µs tHD.DAT Data In Hold Time 0 0 0 µs tSU.DAT Data In Set-up Time 100 100 100 ns 400 400 50 (3) 0.9 50 0.1 0.9 0.1 50 ns 0.9 µs tR Inputs Rise Time tF Inputs Fall Time(3) tSU.STO Stop Set-up Time 0.6 0.6 0.6 µs tDH Data Out Hold Time 50 50 50 ns tWR Write Cycle Time Endurance 5.0V, 25°C Notes: 300 300 300 ns 300 300 300 ns 5 1M 5 1M 5 1M ms Write Cycles 1. The AT24C01A/02/04/08 bearing the process letter “D” on the package (the mark is located in the lower right corner on the topside of the package), guarantees 400 kHz (2.5V, 2.7V). 2. This parameter is characterized and is not 100% tested (TA = 25°C). 3. This parameter is characterized and is not 100% tested. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 5 on page 7). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 5 on page 7). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. 5 3256F–SEEPR–10/04 STANDBY MODE: The AT24C01A/02/04/08/16 features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the Stop bit and the completion of any internal operations. MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2wire part can be reset by following these steps: 1. Clock up to 9 cycles. 2. Look for SDA high in each cycle while SCL is high. 3. Create a start condition. Bus Timing Figure 2. SCL: Serial Clock, SDA: Serial Data I/O Write Cycle Timing Figure 3. SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn twr STOP CONDITION Note: 6 (1) START CONDITION 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 Figure 4. Data Validity Figure 5. Start and Stop Definition Figure 6. Output Acknowledge 7 3256F–SEEPR–10/04 Device Addressing The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word following a start condition to enable the chip for a read or write operation (see Figure 7 on page 9). The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. This is common to all the EEPROM devices. The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM. These 3 bits must compare to their corresponding hard-wired input pins. The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a memory page address bit. The two device address bits must compare to their corresponding hard-wired input pins. The A0 pin is no connect. The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for memory page addressing. The A2 bit must compare to its corresponding hard-wired input pin. The A1 and A0 pins are no connect. The 16K does not use any device address bits but instead the 3 bits are used for memory page addressing. These page addressing bits on the 4K, 8K and 16K devices should be considered the most significant bits of the data word address which follows. The A0, A1 and A2 pins are no connect. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally timed write cycle, t WR , to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 8 on page 10). PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K and 16K devices are capable of 16-byte page writes. A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to seven (1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 9 on page 10). The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send- 8 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 ing a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 10 on page 10). RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 11 on page 11). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 12 on page 11). Figure 7. Device Address 9 3256F–SEEPR–10/04 Figure 8. Byte Write Figure 9. Page Write (* = DON’T CARE bit for 1K) Figure 10. Current Address Read 10 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 Figure 11. Random Read (* = DON’T CARE bit for 1K) Figure 12. Sequential Read 11 3256F–SEEPR–10/04 AT24C01A Ordering Information Ordering Code Package Operation Range AT24C01A-10PA-5.0C AT24C01A-10SA-5.0C 8P3 8S1 Automotive (−40°C to 125°C) AT24C01A-10PA-2.7C AT24C01A-10SA-2.7C 8P3 8S1 Automotive (−40°C to 125°C) Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) Options −5.0 Standard Operation (4.5V to 5.5V) −2.7 Low-voltage (2.7V to 5.5V) 12 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 AT24C02 Ordering Information Ordering Code Package Operation Range AT24C02-10PA-5.0C AT24C02N-10SA-5.0C 8P3 8S1 Automotive (−40°C to 125°C) AT24C02-10PA-2.7C AT24C02N-10SA-2.7C 8P3 8S1 Automotive (−40°C to 125°C) Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) Options −5.0 Standard Operation (4.5V to 5.5V) −2.7 Low-voltage (2.7V to 5.5V) 13 3256F–SEEPR–10/04 AT24C04 Ordering Information Ordering Code Package Operation Range AT24C04-10PA-5.0C AT24C04N-10SA-5.0C 8P3 8S1 Automotive (−40°C to 125°C) AT24C04-10PA-2.7C AT24C04N-10SA-2.7C 8P3 8S1 Automotive (−40°C to 125°C) Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) Options −5.0 Standard Operation (4.5V to 5.5V) −2.7 Low-voltage (2.7V to 5.5V) 14 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 AT24C08(1) Ordering Information Ordering Code Package Operation Range AT24C08-10PA-5.0C AT24C08N-10SA-5.0C 8P3 8S1 Automotive (−40°C to 125°C) AT24C08-10PA-2.7C AT24C08N-10SA-2.7C 8P3 8S1 Automotive (−40°C to 125°C) Note: 1. This device is not recommended for new designs. Please refer to AT24C08A. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) Options −5.0 Standard Operation (4.5V to 5.5V) −2.7 Low-voltage (2.7V to 5.5V) 15 3256F–SEEPR–10/04 AT24C16(1) Ordering Information Ordering Code Package Operation Range AT24C16-10PA-5.0C AT24C16N-10SA-5.0C 8P3 8S1 Automotive (−40°C to 125°C) AT24C16-10PA-2.7C AT24C16N-10SA-2.7C 8P3 8S1 Automotive (−40°C to 125°C) Note: 1. This device is not recommended for new designs. Please refer to AT24C16A. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) Options −5.0 Standard Operation (4.5V to 5.5V) −2.7 Low-voltage (2.7V to 5.5V) 16 AT24C01A/02/04/08/16 3256F–SEEPR–10/04 AT24C01A/02/04/08/16 Packaging Information 8P3 – PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A b2 b3 b 4 PLCS Side View L MIN NOM MAX NOTE A – – 0.210 2 A2 0.115 0.130 0.195 SYMBOL b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 3 D1 0.005 – – 3 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 e eA L Notes: 0.100 BSC 0.300 BSC 0.115 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B 17 3256F–SEEPR–10/04 8S1 – JEDEC SOIC C 1 E E1 L N Top View ∅ End View e b COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D Side View NOM MAX NOTE A 1.70 2.16 A1 0.05 0.25 b 0.35 0.48 5 C 0.15 0.35 5 D 5.13 5.35 E1 5.18 5.40 E 7.70 8.26 L 0.51 0.85 ∅ 0° 8° e Notes: 1. 2. 3. 4. 5. MIN 1.27 BSC 2, 3 4 This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. Mismatch of the upper and lower dies and resin burrs are not included. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded. Determines the true geometric position. Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/−0.005 mm. 10/7/03 R 18 2325 Orchard Parkway San Jose, CA 95131 TITLE 8S2, 8-lead, 0.209" Body, Plastic Small Outline Package (EIAJ) DRAWING NO. 8S2 REV. C AT24C01A/02/04/08/16 3256F–SEEPR–10/04 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. 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