ATA8520 Single-Chip SIGFOX RF Transmitter DATASHEET Features ● Fully integrated, single-chip RF transmitter (SIGFOX™ compliant) ● System-on-chip solution including SIGFOX related protocol handling for modem operation ● AVR® microcontroller core with embedded firmware, SIGFOX, protocol stack and ID/PAC ● Supports uplink operation, i.e. transmit data telegram to SIGFOX base stations ● Operating frequency range: 868.0MHz to 868.6MHz ● Low current consumption: 32.7mA during telegram transmit with +14.5dBm TX output power ● Typical OFF mode current: 5nA (maximum 600nA at VS = +3.6V and T = +85°C) ● Data rate: 100bit/s with DBPSK modulation ● SPI interface for TX data access and transmitter configuration ● Event signal indicates the status of the IC to an external microcontroller ● Power-up (typical 10ms OFF mode -> IDLE mode) ● Supply voltage ranges 1.9V to 3.6V and 2.4V to 5.5V (SIGFOX compliant supply range 3V±5% and 3.3V to 5.5V) ● Temperature range –40°C to +85°C ● ESD protection at all pins (±4kV HBM, ±200V MM, ±750V FCDM) ● Small 55mm QFN32 package/pitch 0.5mm Applications SIGFOX compatible modem for long-range, low-power and low-cost applications using the SIGFOX network ● Home and building automation ● Alarm and security systems ● Smart environment and industrial ● Smart parking ● Tracking ● Metering 9372H-INDCO-11/15 1. General Description 1.1 Introduction The Atmel® ATA8520 is a highly integrated, low-power RF transmitter with an integrated AVR® microcontroller for applications using the wide area SIGFOX™ network The Atmel ATA8520 is partitioned into three sections: an RF front end, a digital baseband and the low-power 8-bit AVR microcontroller. The product is designed for the ISM frequency band in the range of 868.0MHz to 868.6MHz. The external part count is kept to a minimum due to the very high level of integration in this device. By combining outstanding RF performance with highly sophisticated baseband signal processing, robust wireless communication can be easily achieved. The transmit path uses a closed loop fractional-N modulator. The SPI interface enables external control and device configuration. 1.2 System Overview Figure 1-1. Circuit Overview AVCC VS DVCC Supply and Reset PLL SIGFOX Protocol Stack RF_OUT Firmware DSP Peripherals TX ID and PAC CPU RF Frontend DATA BUS XTO Port B Port C PB[7..0] (SPI) PC[5..0] XTAL Figure 1-1 shows an overview of the main functional blocks of the Atmel ATA8520. External control of the Atmel ATA8520 is performed through the SPI pins SCK, MOSI, MISO, and NSS. The functionality of the device is defined by the internal firmware and processed by the AVR. SPI commands are used to control the device and to start the data telegram transmission. The end of the telegram transmission is signaled to an external microcontroller on pin 28 (PB6/EVENT). It is important to note that all PWRON and NPWRON pins (PC1..5, PB4, PB7) are active in OFF mode. This means that even if the Atmel ATA8520 is in OFF mode and the DVCC voltage is switched off, the power management circuitry within the Atmel ATA8520 biases these pins with VS. The AVR microcontroller ports can be used as button inputs, LED drivers, EVENT pin, general purpose digital inputs, or wake-up inputs, etc. Functionality of these ports is already implemented in the firmware. 2 ATA8520 [DATASHEET] 9372H–INDCO–11/15 Pinning NC NC NC AGND PB7 PB6 PB5 PB4 PB3 Figure 1-2. Pin Diagram 32 31 30 29 28 27 26 25 1 NC 2 NC 3 exposed die pad Atmel ATA8520 24 PB2 23 PB1 22 PB0 21 DGND 6 19 PC5 RF_OUT 7 18 PC4 VS_PA 8 17 PC3 9 10 11 12 13 14 15 16 PC2 NC PC1 DVCC PC0 20 VS 5 AVCC NC XTAL2 4 XTAL1 NC NC 1.3 Note: The exposed die pad is connected to the internal die. Table 1-1. Pin Description Pin No. Pin Name Type 1 NC Connected to GND 2 NC Connected to GND 3 NC Connected to GND 4 NC Connected to GND 5 NC Leave open Description 6 NC 7 RF_OUT Analog Connected to GND Power amplifier output 8 VS_PA Analog Power amplifier supply. 3V supply: connect to VS. 5V supply: leave open. Use SPI command “Write System Configuration” (0x11) to enable 5V supply mode 9 NC – 10 XTAL1 Analog Crystal oscillator pin 1 (input) 11 XTAL2 Analog Crystal oscillator pin 2 (output) 12 AVCC Analog RF front-end supply regulator output 13 VS Analog Main supply voltage input 14 PC0 Digital Main : NRESET 15 PC1 Digital Main Alternate : AVR Port C1 : NPWRON1 16 PC2 Digital Main Alternate : AVR Port C2 : NPWRON2 17 PC3 Digital Main Alternate : AVR Port C3 : NPWRON3 Connected to GND ATA8520 [DATASHEET] 9372H–INDCO–11/15 3 Table 1-1. Pin Description (Continued) Pin No. Pin Name Type Description 18 PC4 Digital Main Alternate : AVR Port C4 : NPWRON4 19 PC5 Digital Main Alternate : AVR Port C5 : NPWRON5 20 DVCC – Digital supply voltage regulator output 21 DGND – Digital ground 22 PB0 Digital Main :-- 23 PB1 Digital Main : SCK 24 PB2 Digital Main : MOSI (SPI master out Slave in) 25 PB3 Digital Main : MISO (SPI master in Slave out) 26 PB4 Digital Main : PWRON 27 PB5 Digital Main : NSS 28 PB6 Digital Main : EVENT 29 PB7 Digital Main Alternate : TX active : NPWRON6 30 AGND – Analog ground 31 NC – Connected to GND NC – Connected to GND GND – Ground/backplane on exposed die pad 32 4 ATA8520 [DATASHEET] 9372H–INDCO–11/15 1.4 Applications This section provides application examples for the two supply modes for the Atmel® ATA8520 device. In addition the recommended PCB design and layout is described to achieve the SIGFOX™ certification. 3V Application Example Figure 1-3. 3V Application with External Microcontroller IRQ NSS MISO NC 25 PB3 26 PB4 27 PB5 PB7 1 28 PB6 29 AGND NC 30 NC 31 32 24 23 22 NC PB0 Atmel ATA8520 4 NC 21 DGND 20 5 NC PC5 RF_OUT PC4 18 VS_PA PC3 17 C2 9 10 11 12 13 14 15 C5 PC2 PC1 PC0 VS AVCC XTAL2 7 8 C1 NC 19 XTAL1 L1 Microcontroller DVCC 6 RF Filter SCK PB1 NC 3 C6 MOSI PB2 2 NC 1.4.1 16 Wake/Monitor Q1 C3 C4 VS = 3V VDD Supply Figure 1-3 shows a typical application circuit with an external host microcontroller operating from a 3V lithium cell. The Atmel ATA8520 stays in OFFMode until NPWRON1 (PC1) is used to wake it up. In OFFMode the Atmel ATA8520 draws typically less than 5nA at 25°C. In OFFMode all Atmel ATA8520 AVR® ports PB0..PB7 and PC0..PC5 are switched to input. PC0..PC5 and PB7 have internal pull-up resistors ensuring that the voltage at these ports is VS. PB0..PB6 are tri-state inputs and require additional consideration. PB1, PB2, and PB5 have defined voltages since they are connected to the output of the external microcontroller. PB4 is connected to ground to avoid unwanted power-ups. PB0, PB3 and PB6 do not require external circuitry since the internal circuit avoids transverse currents in OFFMode. The external microcontroller has to tolerate the floating inputs. Otherwise additional pull-down resistors are required on these floating lines. Typically, the Atmel ATA8520 wake-up is done by pulling NPWRON1 (pin 15) to ground. RF_OUT is matched with C1/L1 for 50 antenna connection. The RF filter is required to suppress unwanted side and spurious emissions. The design of this filter depends on the final PCB and system layout and is subject to SIGFOX and ETSI certification procedures. Together with the fractional-N PLL within the Atmel ATA8520, an external crystal is used to fix the Tx frequency. Accurate load capacitors for this crystal are integrated to reduce the system part count and cost. Only four supply blocking capacitors are needed to decouple the different supply voltages AVCC, DVCC, VS, and VS_PA of the Atmel ATA8520. The exposed die pad is the RF and analog ground of the Atmel ATA8520. It is connected directly to AGND via a fused lead. The Atmel ATA8520 is controlled using specific SPI commands via the SPI interface. ATA8520 [DATASHEET] 9372H–INDCO–11/15 5 1.4.2 5V Application Example In addition to the 3V supply mode the device can be used with a 3.3V to 5.5V supply voltage as shown in Figure 1-4. This requires to remove the connection between VS and VS_PA (pin 8) and to enable the internal LDO regulator. The 5V mode can be enabled using the SPI command “Write System Configuration” (0x11) followed by a system reset to enable these settings (the 5V mode can only be used with firmware revision ≥V1.0. Firmware revisions <V1.0 allow only the 3V supply mode). Figure 1-4. 5V Application with External Microcontroller IRQ NSS MISO NC 25 PB3 26 PB4 27 PB5 PB7 1 28 PB6 29 AGND NC 30 NC 31 32 24 23 2 22 NC PB0 Atmel ATA8520 4 NC 21 DGND 20 5 6 PC5 RF_OUT PC4 18 VS_PA PC3 17 9 10 11 12 13 14 15 C5 PC2 PC1 PC0 VS AVCC NC C2 XTAL2 7 8 C1 NC 19 XTAL1 L1 Microcontroller DVCC NC RF Filter SCK PB1 NC 3 C6 MOSI PB2 16 Wake/Monitor Q1 C3 C4 VS = 5V VDD Supply Figure 1-4 shows a typical application circuit with an external host microcontroller operating from a 5V supply. This application differs from the 3V supply mode that VS is not connected to VS_PA. Instead an internal LDO must be activated using the SPI command “Write System Configuration” (0x11) after powering the device and before transmitting a data telegram. 6 ATA8520 [DATASHEET] 9372H–INDCO–11/15 2. System Functional Description 2.1 SPI Command Interface The SPI command interface requires a timing setup as described in the following section and provides a set of commands to control the operation of the Atmel® ATA8520 device. The SPI transmission occurs with MSB first. 2.1.1 SPI Timing The SPI communication requires a special timing to prevent data corruption. The SPI peripheral uses a SCK frequency of 125kHz for the bit transmission and requires timing delays between the CS signals and the start and stop of the SPI communication as shown in Figure 2-1. Figure 2-1. SPI Timing Parameters NSS MISO/MOSI CLK T0 T1 T2 T3 T0 ≥ 65µs, T1 ≥ 40µs, T2 ≥ 100µs, T3 ≥ 50µs, SPI CLK ≤ 125kHz (SPI Mode 0: CPOL = CPHA = 0) 2.1.2 SPI Command Set The following SPI commands are available to control the ATA8520 operation from a host microcontroller. 184.108.40.206 System Reset This command uses the system internal WDT to do a complete hardware reset of the ATA8520D. Resetting the device takes ~10ms. Afterwards the system restarts and generates an event on the EVENT signal after ~10ms. This event will be cleared with the “Get Status” SPI command (0x0A). Master System Reset (0x01) ATA8520 Dummy 220.127.116.11 I/O Init The I/O lines of port C can be used as additional I/O lines for an application. The port C I/O Init command defines the internal data direction register of output port PORTC (DDRC). Pin PC0 is used as NRESET signal and will always be an input pin, i.e. bit 0 will be written as 0 to be an input pin. Master I/O Init (0x02) DDRC content ATA8520 Dummy Dummy 18.104.22.168 I/O Write The I/O write command writes directly to the output port register PORTC to set the I/O pins. Pin PC0 is used as NRESET signal and will always be an input pin with enabled pull-up, i.e. bit 0 will be written as 1 to enable the internal pull-up resistor. Master I/O Init (0x03) PORTC content ATA8520 Dummy Dummy ATA8520 [DATASHEET] 9372H–INDCO–11/15 7 22.214.171.124 I/O Read The I/O read command reads the status of the I/O pins directly from the input port register PINC. Pin PC0 is used as NRESET signal and will always be read as 1. Master I/O Read (0x04) Dummy Dummy ATA8520 Dummy Dummy PINC content 126.96.36.199 OFF Mode The OFF mode command puts the ATA8520 into off mode. To wake up the ATA8520 device, one of the power on lines has to be activated, i.e. set PWRON line to high or NPWRONx line to low. To switch the device into OFF mode the power on lines have to be de-activated before otherwise the device will remain in the on state. Master OFF Mode (0x05) ATA8520 Dummy 188.8.131.52 Atmel Version The Atmel version command reads the version information including a major and a minor version number. Master Atmel Version (0x06) Dummy Dummy Dummy ATA8520 Dummy Dummy MajorVers MinorVers 184.108.40.206 Write TX Buffer The write TX buffer command fills the TX buffer to be sent with the next SIGFOX™ data frame with payload data of up to 12 bytes. The buffer can hold any number of bytes ranging from 0 to 12 bytes and are not buffered, i.e. a new SPI command will override the previous data. Master Write TX Buffer (0x07) RF TX Num bytes RF TX Bytes 0 ATA8520 Dummy Dummy Dummy .............. RF TX Num bytes-1 Dummy 220.127.116.11 Test Mode (for Atmel Version <V1.0) The test mode command triggers the SIGFOX defined test procedure to generate a test signal with frame (high, low byte): Number of frames to be send. Each frame is send 3 times [0...32768, –1 for infinite]. Chain (high, low Byte): Channel number used for transmission [0...480, –1 for hopping]. Master Test Mode (0x08) FrameLowByte FramHighByte ChanLowByte ChanHighByte ATA8520 Dummy Dummy Dummy Dummy Dummy Note: This command will change in next generation devices. 18.104.22.168 SIGFOX Version The SIGFOX version reads the SIGFOX library version information as a text string with N = 11 characters. 8 Master SIGFOX Version (0x09) Dummy Dummy ATA8520 Dummy Dummy SFX Verinfo ATA8520 [DATASHEET] 9372H–INDCO–11/15 .............. Dummy SFX Verinfo[N] 22.214.171.124 Get Status The get status command reads the internal status of the device. Issuing this command clears the systems event line (PB6) and the status bytes. The event line is set to low when: a. System is ready after power-up or reset b. finishes the transmit operation c. finishes a temperature and supply measurement d. finishes the EEPROM write operation. The following status information is read after the event line is activated, i.e. polling using the Get Status command is not necessary: Hardware SSM status Atmel® status: ● Bit6: System ready to operate (system ready event) ● ● ● Bit5: Frame sent (frame ready event) Bit4 to Bit1: Error code ● 0000: no error ● 0001: command error / not supported ● 0010: generic error ● 0011: frequency error ● 0100: usage error ● 0101: opening error ● 0110: closing error ● 0111: send error Bit0: PA on/off indication SIGFOX™ status: ● 0x00: No error ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 0x01: Manufacturer error 0x02: ID or key error 0x03: State machine error 0x04: Frame size error 0x05: Manufacturer send error 0x06: Get voltage/temperature error 0x07: Close issues encountered 0x08: API error indication 0x09: Error getting PN9 0x0A: Error getting frequency 0x0B: Error building frame 0x0C: Error in delay routine 0x0D: callback causes error 0x0E: timing error 0x0F: frequency error Master Get Status (0x0A) Dummy Dummy Dummy Dummy ATA8520 Dummy Dummy SSM status Atmel status SIGFOX status ATA8520 [DATASHEET] 9372H–INDCO–11/15 9 126.96.36.199 Send Data Bit This command sends a data bit (0/1) within a SIGFOX™ RF frame as specified by SIGFOX. An event on the EVENT signal is generated when finished. Master Send Bit (0x0B) Bit ATA8520 Dummy Dummy 188.8.131.52 Send Frame The send frame command triggers the start of a frame transmit process. The payload data has to be written into the TX buffer before using the write TX buffer command. The transmit operation will take ~7 seconds and will generate an event on the EVENT signal when finished. For Atmel® version ≥1.0 pin PB7 is switched to logic “1” during transmit operation which can be used to control an external power amplifier. Master Send Frame (0x0D) ATA8520 Dummy 184.108.40.206 Get PAC The get PAC command will read the 16 byte PAC information which is used for the device registration process at the SIGFOX backend. Only the 8 lower bytes (0) .. (7) are used, the remaining 8 upper bytes (8) .. (15) are read as 0. Master Get PAC (0x0F) Dummy Dummy ATA8520 Dummy Dummy PAC ID ...... Dummy PAC ID 220.127.116.11 Write System Configuration The Write System Configuration command writes the configuration data for the port C and the system configuration into the internal EEPROM. This changes will be applied by performing a system reset. An event on the EVENT signal is generated when finished.DDRC register defines the data direction for the port C pins (0: input, 1: output). PORTC register defines the output level for an output pin and enables a pull-up resistor for input pins when set. SysConf has to be set to 0xFF for 3V supply mode and 0xF7 for 5V supply mode. 5V supply mode can only be used when this command was send before, otherwise the device may be damaged. Master Write Sys Conf (0x11) DDRC PORTC 0x02 SysConf ATA8520D Dummy Dummy Dummy Dummy Dummy 18.104.22.168 Get ID The get ID command will read the 4 byte ID information which is used for the device registration process at the SIGFOX backend. 10 Master Get ID (0x12) Dummy Dummy ATA8520 Dummy Dummy UID ATA8520 [DATASHEET] 9372H–INDCO–11/15 ...... Dummy UID 22.214.171.124 Read Supply Voltage and Temperature This command triggers the read out of the measured supply voltage in idle and active mode and the device temperature. To trigger a measurement the SPI command (0x14) has to be used. The return voltage level is in mV and the temperature value has to be calculated as T = (TM – 500)/10 in °C. All values are of type 16 bit unsigned integer (with high and low byte). Master Read Sup/Temp (0x13) Dummy Dummy Dummy Dummy Dummy ATA8520 Dummy Dummy VHidle VLidle VHactive VLactive TemperatureH TemperatureL Dummy Dummy 126.96.36.199 Start Supply and Temperature Measurement This command will start the measurement of the temperature and the supply voltage. An event on the EVENT signal is generated when finished. Master Start Measurement (0x14) ATA8520 Dummy 188.8.131.52 Start TX Test Mode The test mode command triggers the SIGFOX™ defined test procedure to generate a test signal with frame (high, low byte): Number of frames to be send. Each frame is send 3 times [0...32768, –1 for infinite]. Chain (high, low Byte): Channel number used for transmission [0...480, –1 to deactivate hopping]. An event on the EVENT signal is generated when finished. Master TX Test Mode (0x15) FrameLowByte FramHighByte ChanLowByte ChanHighByte ATA8520 Dummy Dummy Dummy Dummy Dummy 184.108.40.206 Send CW The test mode command enables or disables the transmission of a continuous carrier (CW) as defined by SIGFOX. Master Send CW (0x17) On(0x11)/Off(0x00) ATA8520 Dummy Dummy 220.127.116.11 Set TX Frequency Set TX center frequency temporarily for testing purposes. This settings are lost after reset or when switching the device off. The frequency value is an unsigned 32-bit integer within the range [868.000.000Hz to 868.600.000Hz]. Default is 868.130.000Hz. Master Set TX Frequency (0x1B) TX[31:24] TX[23:16] TX[15:8] TX[7:0] ATA8520 Dummy Dummy Dummy Dummy Dummy ATA8520 [DATASHEET] 9372H–INDCO–11/15 11 2.1.3 Command Table Overview Table 2-1. Command Table Overview CMD Index Write Data Read Data System reset 0x01 None None I/O Init 0x02 DDRC register setting None I/O Write 0x03 PORTC register setting None I/O Read 0x04 None PINC register setting OFF mode 0x05 None None Atmel version 0x06 None Major / minor Write TX buffer 0x07 Data written to TX buffer None Frame/channel None - - Test mode (<V1.0) Reserved (≥V1.0) ™ SIGFOX version 0x09 None Version L-H Get status 0x0A None SSM / Atmel® FW / SIGFOX library 0x0B(1) Send bit Bit (0/1) None Reserved 0x0C - - Send frame 0x0D None None Reserved 0x0E - - Get PAC 0x0F None PAC, PAC …. PAC Reserved 0x10 - - DDRC, PORTC, SysConf None Write Sys Conf Get ID 0x11 (1) 0x12 None ID … ID Read sup/temp (1) 0x13 None Supply idle / supply active / temperature Start measurement 0x14(1) None None Frame/channel None - - (1) TX test mode 0x15 Reserved 0x16 (1) Send CW On/Off None Reserved 0x17 0x18 - - Reserved 0x19 - - Reserved 0x1A - - TX frequency None Set TX frequency Reserved Note: 1. 12 0x08 0x1B (1) 0x1C These commands are available in device with Atmel Version V ≥ 1.0 ATA8520 [DATASHEET] 9372H–INDCO–11/15 2.2 Operating Modes Overview This section gives an overview of the operating modes supported by the Atmel ATA8520. After connecting the supply voltage to the VS pin, the Atmel ATA8520 always starts in OFF mode. All internal circuits are disconnected from the power supply. Therefore, no SPI communication is supported. The Atmel ATA8520 can be woken up by activating the PWRON pin or one of the NPWRONx pins. This triggers the power-on sequence which will set the event line PB6 to low. After the system initialization the Atmel ATA8520 reaches the IDLE Mode. The IDLE Mode is the basic system mode supporting SPI communication and transitions to the other operating modes. The transmit mode (TX Mode) starts the data transmission using the payload data which has to be previously written into the TX buffer with the SPI command “Write TX Buffer”. The data transmission is started with the SPI command “Send Frame”. After transmitting the data frame, the end of the transmission is indicated when the event pin PB6 switches to low and the device enters the IDLE Mode again. Reading the device status with the “Get Status” SPI command clears the PB6 event line, setting it to high level again. 2.2.1 System Configuration This section specifies the system configuration settings used in the SPI command (0x11). This system configuration has to be set after the system issues a system ready event and before using any other SPI RF transmit command. The settings are stored in the internal EEPROM and will be applied after a system reset. This settings are typically applied at the EOL testing in the factory. Table 2-2 summarizes the configuration settings. Table 2-2. Function Bit No. None 7 to 4 Supply voltage 3 None 2 to 0 Caution: 2.2.2 System Configuration Settings :1111 (default) :0, 5V supply :1, 3V supply (default) :111 (default) The device is delivered with default configuration, i.e. with 3V supply mode enabled. When using the device with 5V supply it has to be ensured that before using the RF transmit operation the 5V supply mode is configured! Power-up Sequence This section describes the power-up sequence for the device as described in Figure 2-2. The device is usually in OFF mode were the signals NPWRONx, PWRON and NRESET are inactive but VS is supplied with power. Switching the NRESET signal active or sending the SPI command System Reset (0x01) will have no effect in OFF mode. Switching one of the power-on pins active will wake-up the device and an internal power-on reset is performed. In addition the external NRESET line can be used to keep the device in reset state when waking-up the device. The minimum activation time for the NPWRONx, PWRON and NRESET signals is 10µs. Figure 2-2. Power-up Sequence NPWRONx PWRON NRESET EVENT 1 2 3 4 5 6 ATA8520 [DATASHEET] 9372H–INDCO–11/15 13 After applying the reset signal NRESET one of the power-up signals NPWRON1...6 or PWRON is applied at timing point T1. At timing point T2 (~10µs after T1) the external reset signal is removed and the device starts its internal power-up sequence. This internal sequence is finished at timing point T3 (~10ms after T2) and is signaled with the event line. Reading the device status with the SPI command (0x0A) „Get status” will clear the event line at timing point T4. The device is now in idle mode and operational even if the NPWRONx and PWRON signals are deactivated. To shutdown the device into OFF mode the power-up signals NPWRON1...6 or PWRON have to be deactivated at first (shown in timing point T5). The shutdown into OFF mode is then performed by sending the SPI command (0x05) „OFF mode” to the device. 2.2.3 Application Example The software to control the device and to transmit a data frame has to perform the following steps: 1. Initialize device as shown in Figure 2-2 for the power-up sequence 2. Check for the startup event and read the device status with SPI command (0x0A) „Get status” to clear this event 3. Load the transmit buffer with up to 12 bytes using the SPI command (0x07) „Write TX Buffer“ 4. Start the data transmit with SPI command (0x0D) „Send Frame“ 5. Wait until the event signal appears (this takes about 7-8 seconds) 6. Read the device status with SPI command (0x0A) „Get status” to clear this event 7. Switch off the power-on signals as shown in Figure 2-2 8. Send the SPI command (0x05) „OFF mode” to the shutdown the device For the SPI communication it is important to keep the timing as shown in Figure 2-1 on page 7. With the SPI commands (0x0F) „Get PAC” and (0x12) „Get ID” the SIGFOX™ registration information can be read to register the device in the SIGFOX cloud. 14 ATA8520 [DATASHEET] 9372H–INDCO–11/15 3. Electrical Characteristics 3.1 ESD Protection Circuits GND is the exposed die pad of the Atmel® which is internally connected to AGND (pin 30). All Zener diodes shown in Figure 3-1 (marked as power clamps) are realized with dynamic clamping circuits and not physical Zener diodes. Therefore, DC currents are not clamped to the shown voltages. Figure 3-1. Atmel ESD Protection Circuit XTAL1 (Pin 10) XTAL2 (Pin 11) AVCC (Pin 12) VS (Pin 13) Power Clamp 1.8V AGND (Pin 30) GND GND VS_PA (Pin 8) VS (Pin 13) RF_OUT (Pin 7) Power Clamp 3.3V GND VS (Pin 13) DVCC (Pin 20) Power Clamp 1.8V PC0 to PC5 (Pin 14 to Pin 19) DGND (Pin 21) PB0 to PB7 (Pin 22 to Pin 29) Power Clamp 5.5V GND ATA8520 [DATASHEET] 9372H–INDCO–11/15 15 3.2 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Symbol Min. Max. Unit +150 °C Junction temperature Tj Storage temperature Tstg –55 +125 °C Ambient temperature Tamb –40 +85 °C VVS –0.3 +6.0 V VVS_PA –0.3 +4.0 V ESD (human body model) all pins HBM –4 +4 kV ESD (machine model) all pins MM –200 +200 V FCDM –750 +750 V Supply voltage Supply voltage PA (1.9 to 3.6V application) ESD (field induced charged device model) all pins 3.3 Thermal Resistance Parameters Thermal resistance, junction ambient, soldered in compliance with JEDEC 3.4 Symbol Value Unit Rth_JA 35 K/W Supply Voltages and Current Consumption All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 3V application 13 VVS 1.9 3.0 3.6 V A 5V application 13 VVS 2.4 5.0 5.5 V A 3V application Supply voltage for 1.01 SIGFOX™ compliance 5V application 13 VVS 2.9 3.0 3.1 V 13 VVS 3.3 5.0 5.5 V 13 VVS_rise 1 V/µs D 3V application 8 VVS_PA 3.6 V A 5V application 8 VVS_PA 3 V A SIGFOX compliant 8 VVS_PA 3 V 8, 13 IOFFMode_3V 5 150 600 nA nA B B 13 IIdleMode 50 90 µA B Supply voltage 1.00 range VS Supply voltage rise 1.05 time Supply voltage range 1.10 VS_PA OFF mode 1.20 Current consumption Tamb = 25°C Tamb = 85°C Idle Mode current 1.30 consumption Temperature range –40°C to +65°C 1.9 3 *) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter Pin numbers in brackets mean they are measured matched to 50 on the application board. 16 ATA8520 [DATASHEET] 9372H–INDCO–11/15 3.4 Supply Voltages and Current Consumption (Continued) All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* TX mode current 2.00 consumption Pout = +14dBm fRF = 868.3MHz (7), 8, 13 ITXMode 32.7 45 mA B SIGFOX™ TX mode 2.05 current consumption Tamb = 25°C, 3V application (7), 8, 13 ISIGFOXMode 31.8 40.1 mA B SIGFOX TX mode 2.06 current consumption Tamb = 85°C, 3V application (7), 8, 13 ISIGFOXMode 32.7 41.1 mA B *) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter Pin numbers in brackets mean they are measured matched to 50 on the application board. 3.5 RF Transmit Characteristics All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Parameters 10.00 Output power range Test Conditions Pin Symbol Min. Tamb = 25°C (7) PRange (7) PSIGFOX 13.5 (7) PSIGFOX 13.1 Defined by SIGFOX protocol (7) fVCO 868.0 (7) Pout_14dBm –1.5dB (7) HM214dBm (7) HM314dBm Typ. Max. Unit Type* +14.5 dBm B 13.8 14.0 dBm B 13.8 14.7 dBm B 868.6 MHz +1.5dB dBm B –24 dBc C –50 dBc C +2 dB C C –60 –60 –60 dBc B C C Tamb = 25°C, VVS = 2.9V Output power for 10.01 SIGFOX compliance to 3.1V, 3V application (for 5V applications see no. 11.50) Tamb = –45°C to +85°C, 10.02 Output power for SIGFOX compliance 10.05 Frequency range VVS = 3.0V, 3V application (for 5V applications see no. 11.50) 11.00 Output power at 14dBm Tamb = 25°C 11.10 Output 2nd harmonic at 14dBm Tamb = 25°C 11.20 Output 3rd harmonic at 14dBm Tamb = 25°C using 14dBm matching using 14dBm matching using 14dBm matching Output power change 11.50 full temperature and supply voltage range For 13.8dBm VVS_PA = 3.0V ±0.3V P = Pout + P (7) PTambVs2 11.60 Spurious emission at ±fXTO at ±fAVR (fXTO / 4) at ±fCLK_OUT (fXTO / 6) (7) SPTX 14 –3.5 –72 –85 –78 *) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter Pin numbers in brackets mean they are measured matched to 50 on the application board. ATA8520 [DATASHEET] 9372H–INDCO–11/15 17 3.6 RF Transmit Characteristics All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances, quartz parameters Cm = 4fF and C0 = 1pF unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. Pin Symbol Unit Type* 13.30 XTO frequency range No. Parameters Test Conditions 10, 11 fxto Min. 24.305 Typ. Max. MHz C KDS: 1C324305AB0B NDK: NX3225SA XTO frequency for 13.35 EXS00A-CS08559 ™ SIGFOX compliance NX2016SA EXS00A-CS08560 10, 11 fSIGFOX_XTO 24.305 MHz XTO pulling due to 13.40 internal capacitance and XTO tolerance Cm = 4fF, Tamb = 25°C 10, 11 FXTO1 –10 +10 ppm B XTO pulling due to 13.50 temperature and supply voltage Cm = 4fF Tamb = –40°C to +85°C 10, 11 FXTO2 –4 +4 ppm B 13.60 Maximum C0 of XTAL XTAL parameter 10, 11 C0_max 1 2 pF D XTAL parameter 10, 11 Cm 4 10 fF D 13.70 XTAL, Cm motional capacitance 13.80 XTAL, real part of XTO Cm = 4fF, C0 = 1pF impedance at start-up 10, 11 Rm_start1 950 B 13.90 XTAL, real part of XTO Cm = 4fF, C0 = 1pF, impedance at start-up Tamb < 85°C 10, 11 Re_start2 1100 B 14.00 XTAL, maximum Rm after start-up 10, 11 Rm_max 110 D CL1, CL2 13.3 pF B XTAL parameter Including ESD and package capacitance. XTAL has to be specified 14.10 Internal load capacitors 10, 11 for 7.5pF load capacitance (incl. 1pF PCB capacitance per pin) 14 14.7 *) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter Pin numbers in brackets mean they are measured matched to 50 on the application board. 18 ATA8520 [DATASHEET] 9372H–INDCO–11/15 3.7 I/O Characteristics for Ports PB0 to PB7 and PC0 to PC5 All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Pin Symbol Min. 15.00 Input low voltage PC0 to PC5 PB0 to PB7 14-19 22-29 Max. Unit Type* VIL –0.3 0.2 VVS V A Input low leakage current I/O pin PC0 to PC5 PB0 to PB7 14-19 22-29 IIL –1 µA A 15.10 Input high voltage PC0 to PC5 PB0 to PB7 14-19 22-29 VIH VVS + 0.3 V A Input high leakage current I/O pin PC0 to PC5 PB0 to PB7 14-19 22-29 IIH 1 µA A 15.20 Output low voltage IOL = 0.2mA 14-19 22-29 VOL_3V 0.1 VVS V A 15.30 Output high voltage IOH = –0.2mA 14-19 22-29 VOH_3V 0.9 VVS V A 15.40 I/O pin pull-up resistor OFF mode: see port B and port C 14-19 22-29 RPU 30 50 70 k A CLoad = 10pF 14-19 22-29 Tdel_rise_3V 13.6 17.5 22.4 ns D I/O pin rise time 16.20 (0.1 VVS to 0.9 VVS) CLoad = 10pF 14-19 22-29 Trise_3V 20.7 23.9 28.4 ns D 16.30 I/O pin slew rate (rising edge) CLoad = 10pF 14-19 22-29 Tsr_rise_3V 0.115 0.100 0.084 V/ns D 16.40 I/O pin output delay time (falling edge) CLoad = 10pF 14-19 22-29 Tdel_fall_3V 13.7 17.4 22.7 ns D CLoad = 10pF 14-19 22-29 Tfall_3V 16.2 19.2 22.5 ns D CLoad = 10pF 14-19 22-29 Tsr_fall_3V 0.148 0.125 0.106 V/ns D 15.05 15.15 16.10 Parameters I/O pin output delay time (rising edge) I/O pin fall time 16.50 (0.9 VVS to 0.1 VVS) 16.60 I/O pin slew rate (falling edge) Test Conditions Typ. 0.8 VVS *) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples, D = design parameter 3.8 Hardware Timings All parameters refer to GND (backplane) and are valid for Tamb = –40°C to + 85°C, VVS =1.9V to 3.6V over all process tolerances. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Parameters 17.50 Startup time Test Conditions PWRON = ‘1’ or NPWRON = ‘0’ to EVENT generation Pin Symbol 13, 20 TSTARTUP Min. Typ. 10 Max. Unit Type* ms C *) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples, D = design parameter ATA8520 [DATASHEET] 9372H–INDCO–11/15 19 3.9 Hardware SPI Timing Characteristics Timing shown for CPHA=0 and CPOL=0 in Figure 3-2, timing is valid for all CPHA and CPOL configurations. See also Section 2.1 “SPI Command Interface” on page 7 for functional SPI description and for firmware limitations on SPI data transfer. All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V (3V Application) and 4.5V to 5.5V (5V Application) over all process tolerances. Typical values are given at VVS = 5V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz. No. Parameters Test Conditions Pin Symbol Min. 49.10 SCK cycle time 23 TSCK_periode 8 49.20 SCK high or low time 23 TSCK_high_low 330 49.30 SCK rise or fall time 23 TSCK_rise_fall Typ. Max. 100 Unit Type* µs D ns D ns D 49.40 MOSI setup time to active edge of SCK 23, 24 TSetup 80 ns D 49.50 MOSI hold time to active edge of SCK 23, 24 THold 245 ns D 23, 25 TSCK_out ns D 23, 27 TSCK_NSS_high µs D 25, 27 TNSS_high_tristate ns D 23, 27 TNSS_low_SCK µs D Time periode active 49.60 edge of SCK to data out at MISO 49.70 Time periode SCK inactive to NSS high 49.80 Time periode NSS high to MISO tristate 49.90 Time periode NSS low to active edge SCK CLOAD_MISO = 10pF CLOAD_MISO = 10pF 250 100 250 65 *) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples, D = design parameter Figure 3-2. SPI Interface Timing Requirements TNSS_high_tristate NSS TNSS_low_SCK TSCK_out TSCK_periode TSCK_NSS_high SCK (CPOL = 0) THold TSCK_high_low TSetup MOSI (Data Input) MISO (Data Output) 20 ATA8520 [DATASHEET] 9372H–INDCO–11/15 MSB MSB TSCK_rise_fall LSB LSB Ordering Information Extended Type Number Package ATA8520-GHQW 5mm 5mm, Pb-free, 6k, taped and reeled QFN32 Package Information Top View D 32 1 E technical drawings according to DIN specifications PIN 1 ID Dimensions in mm 8 A1 Two Step Singulation process A Side View Partially Plated Surface Bottom View D2 9 16 17 8 COMMON DIMENSIONS E2 (Unit of Measure = mm) 1 SYMBOL MIN NOM MAX A 0.8 0.85 0.9 A1 A3 0 0.16 0.035 0.21 0.05 0.26 24 32 Z 25 e Z 10:1 L 5. Remarks A3 4. D 4.9 5 5.1 D2 3.5 3.6 3.7 E 4.9 5 5.1 E2 3.5 3.6 3.7 L 0.35 0.4 0.45 b 0.2 0.25 0.3 e NOTE 0.5 b 10/18/13 TITLE Package Drawing Contact: firstname.lastname@example.org Package: VQFN_5x5_32L Exposed pad 3.6x3.6 GPC DRAWING NO. REV. 6.543-5124.03-4 1 ATA8520 [DATASHEET] 9372H–INDCO–11/15 21 6. Disclaimer Atmel® components and materials in the Product comply with Atmel data sheet and the Product has achieved SIGFOXcompliant certification. Apart from these warranties, the customer acknowledges that no express or implied warranties are given in relation to the Product and, in particular, no warranties are given in relation to the quality or suitability of any third party software or materials incorporated into the Product. Atmel does not warrant that the Product will be error-free and the Customer acknowledges that it has not been developed to meet the Customer's individual requirements. Accordingly, Atmel accepts no liability or responsibility with regard to any third party software or materials incorporated into the Product and in no event shall Atmel be liable for any direct, indirect or consequential loss (of whatever nature) caused by the use or possession of any third party software or material. Without prejudice to the remainder of this Agreement, in no circumstances will Atmel's liability to the Customer for any direct loss or damage arising out of use or possession of the Product (if any) exceed the price payable for the relevant Order relating to the defective Product. In no circumstances will Atmel be liable for any indirect or consequential loss or for any loss of profits or revenue caused by the Product being defective. 7. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 9372H-INDCO-11/15 Section 2.2.1 “System Configuration” on page 13 updated Table 1-1 “Pin Description” on page 3 updated 9372G-INDCO-10/15 9372F-INDCO-09/15 9372E-INDCO-08/15 Section 1.4 “Applications” on pages 5 to 6 updated Section 1.4.3 “Recommended PCB Design and Layout” removed Section 3.5 “RF Transmit Characteristics” on page 17 updated Section 1.4.3 “Recommended PCB Design and Layout” on page 7 updated Section 2.1 “SPI Command Interface” on pages 8 to 12 updated Section 2.2 “Operating Modes Overview” on page 14 updated Section 3.9 “Hardware SPI Timing Characteristics” on page 21 added Section 2.1 “SPI Command Interface” on pages 9 to 13 updated Figure 3-1 “Atmel ESD Protection Circuit” on page 15 updated 9372D-INDCO-06/15 Section 3.2 “Absolute Maximum Ratings” on page 16 updated Section 3.4 “Supply Voltages and Current Consumption” on pages 16 to 17 updated Section 6 “Disclaimer” on page 21 added Features on page 1 updated Section 1.3 “Pinning” on page 3 updated Section 1.4 “Applications and Recommendations” on pages 5 to 7 updated 9372C-INDCO-06/15 Section 2 “System Functional Description” on pages 8 to 12 updated Section 3.2 “Absolute Maximum Ratings” on page 15 updated Section 3.4 “Supply Voltages and Current Consumption” on pages 15 to 16 updated Section 3.5 “RF Transmit Characteristics” on page 16 updated Section 3.8 “Hardware Timings” on page 18 updated Power-up timing in section “Features” on page 1 updated Section 18.104.22.168 “Atmel Version” on page 7 updated 9372B-INDCO-01/15 Table 2-1 “Command Table Overview” on page 9 updated Section 2.2.1 “Power-up Sequence” on page 10 updated Figure 2-2 “Power-up Sequence” on page 10 updated Section 2.2.2 “Application Example” on page 10 updated 22 ATA8520 [DATASHEET] 9372H–INDCO–11/15 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: 9372H–INDCO–11/15 Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. 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