AT27C4096 - Complete

Features
• Fast read access time – 55ns
• Low-power CMOS operation
•
•
•
•
•
•
•
•
•
– 100µA max standby
– 40mA max active at 5MHz
JEDEC standard packages
– 40-lead PDIP
– 44-lead PLCC
Direct upgrade from 512Kbit, 1Mbit, and 2Mbit
Atmel® AT27C516, AT27C1024, and AT27C2048) EPROMs
5V ± 10% supply
High-reliability CMOS technology
– 2,000V ESD protection
– 200mA latchup immunity
Rapid programming algorithm – 50µs/word (typical)
CMOS- and TTL-compatible inputs and outputs
Integrated product identification code
Industrial temperature range
Green (Pb/halide-free) packaging option
1.
4Mb (256K x 16)
One-time
Programmable,
Read-only Memory
Atmel AT27C4096
Description
The Atmel AT27C4096 is a low-power, high-performance, 4,194,304-bit, one-time programmable, read-only memory (OTP EPROM) organized as 256K by 16 bits. It requires a
single 5V power supply in normal read mode operation. Any word can be accessed in less
than 55ns, eliminating the need for speed reducing WAIT states. The x16 organization
makes this part ideal for high-performance, 16- and 32-bit microprocessor systems.
In read mode, the AT27C4096 typically consumes 15mA. Standby mode supply current is
typically less than 10µA
The AT27C4096 is available in industry-standard, JEDEC-approved, one-time programmable (OTP) PDIP and PLCC packages. The device features two-line control (CE, OE) to
eliminate bus contention in high speed systems.
With high-density 256K word storage capability, the AT27C4096 allows firmware to be
stored reliably and to be accessed by the system without the delays of mass storage media.
The AT27C4096 has additional features that ensure high quality and efficient production
use. The rapid programming algorithm reduces the time required to program the part and
guarantees reliable programming. Programming time is typically only 50µs/word. The Integrated product identification code electronically identifies the device and manufacturer. This
feature is used by industry-standard programming equipment to select the proper programming algorithms and voltages.
0311J–EPROM–4/11
Pin configurations
A0 - A17
Addresses
O0 - O15
Outputs
CE
Chip enable
OE
Output enable
NC
No connect
Both GND pins must be
connected
O12
O11
O10
O9
O8
GND
NC
O7
O6
O5
O4
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
O3
O2
O1
O0
OE
NC
A0
A1
A2
A3
A4
Note:
40-lead PDIP
Top view
44-lead PLCC
Top view
O13
O14
O15
CE
VPP
NC
VCC
A17
A16
A15
A14
Function
6
5
4
3
2
1
44
43
42
41
40
Pin name
18
19
20
21
22
23
24
25
26
27
28
2.
3.
A13
A12
A11
A10
A9
GND
NC
A8
A7
A6
A5
VPP
CE
O15
O14
O13
O12
O11
O10
O9
O8
GND
O7
O6
O5
O4
O3
O2
O1
O0
OE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
VCC
A17
A16
A15
A14
A13
A12
A11
A10
A9
GND
A8
A7
A6
A5
A4
A3
A2
A1
A0
System considerations
Switching between active and standby conditions via the chip enable pin may produce transient voltage excursions. Unless
accommodated by the system design, these transients may exceed datasheet limits, resulting in device nonconformance.
At a minimum, a 0.1µF, high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This
capacitor should be connected between the VCC and ground terminals of the device, as close to the device as possible.
Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7µF bulk electrolytic
capacitor should be utilized, again connected between the VCC and ground terminals. This capacitor should be positioned as
close as possible to the point where the power supply is connected to the array.
Figure 3-1.
2
Block diagram
Atmel AT27C4096
0311J–EPROM–4/11
Atmel AT27C4096
4.
Absolute maximum ratings*
*NOTICE:
Temperature under bias . . . . . . . . . . . . . -55C to +125C
Storage temperature . . . . . . . . . . . . . . . . -65C to +150C
Voltage on any pin with
respect to ground . . . . . . . . . . . . . . . . . . . -2.0V to +7.0V(1)
Stresses beyond those listed under “Absolute
maximum ratings” may cause permanent damage to
the device. This is a stress rating only, and functional
operation of the device at these or any other
conditions beyond those indicated in the operational
sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended
periods may affect device reliability.
Voltage on A9 with
respect to ground . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1)
VPP supply voltage with
respect to ground . . . . . . . . . . . . . . . . . . -2.0V to +14.0V(1)
Note:
5.
1. Maximum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20ns. Maximum output pin voltage is
VCC + 0.75V DC, which may overshoot to +7.0V for pulses of less than 20ns.
DC and AC characterisitcs
Table 5-1.
Operating modes
Mode/Pin
CE
OE
Ai
VPP
(1)
Read
VIL
VIL
Ai
Output disable
X
VIH
X
Outputs
X
DOUT
X
High Z
(5)
Standby
VIH
X
X
X
High Z
Rapid program(2)
VIL
VIH
Ai
VPP
DIN
PGM verify
VIH
VIL
Ai
VPP
DOUT
PGM inhibit
VIH
VIH
X
VPP
High Z
VCC
Identification code
(3)
Product identification(4)
Notes:
VIL
VIL
A9 = VH
A0 = VIH or VIL
A1 - A17 = VIL
1. X can be VIL or VIH.
2. Refer to the Programming characteristics.
3. VH = 12.0  0.5V.
4. Two identifier words may be selected. All Ai inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the manufacturer’s identification word and high (VIH) to select the device code word.
5. Standby VCC current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB.
Table 5-2.
DC and AC operating conditions for read operation
Atmel AT27C4096
Industrial operating temperature (case)
VCC power supply
-55
-90
-40C - 85C
-40C - 85C
5V  10%
5V  10%
3
0311J–EPROM–4/11
Table 5-3.
DC and operating characteristics for read operation
Symbol
Parameter
Condition
ILI
Input load current
Output leakage current
ILO
IPP1
(2)
VPP
(1)
read/standby current
VCC(1) standby current
ISB
Min
Max
Units
VIN = 0V to VCC
1
µA
VOUT = 0V to VCC
5
µA
VPP = VCC
10
µA
ISB1 (CMOS)
CE = VCC± 0.3V
100
µA
ISB2 (TTL)
CE = 2.0 to VCC + 0.5V
1
mA
f = 5MHz, IOUT = 0mA, CE = VIL
40
mA
ICC
VCC active current
VIL
Input low voltage
-0.6
0.8
V
VIH
Input high voltage
2.0
VCC + 0.5
V
VOL
Output low voltage
IOL = 2.1mA
0.4
V
VOH
Output high voltage
IOH = -400µA
Notes:
2.4
V
1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and
IPP.
Table 5-4.
AC characteristics for read operation
Atmel AT27C4096
-55
Symbol
Parameter
Condition
tACC(1)
Address to output delay
CE = OE = VIL
tCE(1)
CE to output delay
tOE(1)
OE to output delay
tDF(1)
OE or CE high to output float,
whichever occurred first
tOH(1)
Output hold from address, CE or OE,
whichever occurred first
Note:
4
Min
-90
Max
Units
55
90
ns
OE = VIL
55
90
ns
CE = VIL
20
35
ns
20
20
ns
7
Max
Min
0
ns
1. See the AC waveforms for read operation diagram.
Atmel AT27C4096
0311J–EPROM–4/11
Atmel AT27C4096
Figure 5-1.
Notes:
AC waveforms for read operation(1)
1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC.
4. This parameter is only sampled, and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
Figure 5-2.
Input test waveforms and measurement levels
For -55 devices only:
tR, tF < 5ns (10% to 90%)
For -90 devices:
tR, tF < 20ns (10% to 90%)
Figure 5-3.
Output test load
1.3V
(1N914)
OUTPUT
PIN
3.3K
CL
Note:
CL = 100pF including jig capacitance.
5
0311J–EPROM–4/11
Table 5-5.
Pin capacitance
f = 1MHz, T = 25°C(1)
Symbol
Typ
Max
Units
Conditions
CIN
4
10
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled, and is not 100% tested.
Figure 5-4.
Notes:
Programming waveforms(1)
1. The input timing reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device, but must be accommodated by the programmer.
3. When programming the Atmel AT27C4096, a 0.1µF capacitor is required across VPP and ground to suppress spurious voltage transients.
6
Atmel AT27C4096
0311J–EPROM–4/11
Atmel AT27C4096
Table 5-6.
DC programming characteristics
TA = 25 5°C, VCC = 6.5 0.25V, VPP = 13.0 0.25V
Limits
Symbol
Parameter
Test conditions
ILI
Input load current
VIN = VIL, VIH
VIL
Input low level
VIH
Input high level
VOL
Output low voltage
IOL = 2.1mA
VOH
Output high voltage
IOH = -400µA
ICC2
VCC supply current (program and verify)
IPP2
VPP supply current
VID
A9 product identification voltage
Table 5-7.
Min
Max
Units
10
µA
-0.6
0.8
V
2.0
VCC + 0.7
V
0.4
V
2.4
V
CE = VIL
11.5
50
mA
30
mA
12.5
V
Max
Units
AC programming characteristics
TA = 25 5°C, VCC = 6.5 0.25V, VPP = 13.0 0.25V
Limits
Symbol
Parameter
Test conditions
tAS
Address setup time
tOES
OE setup time
tDS
Data setup time
tAH
Address hold time
tDH
Data hold time
tDFP
OE high to output float delay(2)
tVPS
VPP setup time
tVCS
VCC setup time
Min
2
µs
2
µs
2
µs
0
µs
Input pulse levels
0.45V to 2.4V
2
µs
Input timing reference level:
0.8V to 2.0V
2
µs
2
µs
Input rise and fall times :
(10% to 90%) 20ns
0
(3)
tPW
CE program pulse width
tOE
Data valid from OE
tPRT
VPP pulse rise time during
programming
Notes:
(1)
130
47.5
Output timing reference level
0.8V to 2.0V
ns
52.5
µs
150
ns
50
ns
1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after VPP.
2. This parameter is only sampled, and is not 100% tested. Output float is defined as the point where data is no longer driven.
See timing diagram.
3. Program pulse width tolerance is 50µs ± 5%.
Table 5-8.
The Atmel AT27C4096 intergrated product identification code
Pins
Codes
A0
O15-O8
O7
O6
O5
O4
O3
O2
O1
O0
Hex data
Manufacturer
0
0
0
0
0
1
1
1
1
0
001E
Device type
1
0
1
1
1
1
0
1
0
0
00F4
7
0311J–EPROM–4/11
6.
Rapid programming algorithm
A 50µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to
13.0V. Each address is first programmed with one 50µs CE pulse without verification. Then a verification/reprogramming
loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 50µs pulses are applied
with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed.
After the word verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and
VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails.
Figure 6-1.
8
Rapid programming algorithm
Atmel AT27C4096
0311J–EPROM–4/11
Atmel AT27C4096
7.
Ordering information
Green Package (Pb/halide-free)
ICC (mA)
tACC (ns)
Active
Standby
Atmel ordering code
Package
Lead finish
Operation range
55
40
0.1
AT27C4096-55JU
44J
Matte tin
Industrial
(-40C to 85C)
90
40
0.1
AT27C4096-90JU
AT27C4096-90PU
44J
40P6
Matte tin
Industrial
(-40C to 85C)
Package type
44J
44-lead, plastic, J-leaded chip carrier (PLCC)
40P6
40-lead, 0.600" wide, plastic, dual inline package (PDIP)
9
0311J–EPROM–4/11
8.
Packaging information
44J – PLCC
1.14(0.045) X 45°
PIN NO. 1
1.14(0.045) X 45°
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
E
D2/E2
B1
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45° MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, variation AC
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102mm) maximum
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
17.399
–
17.653
D1
16.510
–
16.662
E
17.399
–
17.653
E1
16.510
–
16.662
D2/E2
14.986
–
16.002
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
Package drawing contact:
[email protected]
10
TITLE
44J, 44-lead, plastic J-leaded chip carrier (PLCC)
DRAWING NO.
44J
REV.
B
Atmel AT27C4096
0311J–EPROM–4/11
Atmel AT27C4096
40P6 – PDIP
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
eB
Notes:
1. This package conforms to JEDEC reference MS-011, variation AC
2. Dimensions D and E1 do not include mold flash or protrusion.
mold flash or protrusion shall not exceed 0.25mm (0.010").
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
SYMBOL
MIN
NOM
MAX
A
–
–
4.826
A1
0.381
–
–
D
52.070
–
52.578
E
15.240
–
15.875
E1
13.462
–
13.970
B
0.356
–
0.559
B1
1.041
–
1.651
L
3.048
–
3.556
C
0.203
–
0.381
eB
15.494
–
17.526
e
NOTE
Note 2
Note 2
2.540 TYP
09/28/01
Package drawing contact:
[email protected]
TITLE
40P6, 40-lead (0.600"/15.24mm wide) Plastic dual
inline package (PDIP)
DRAWING NO.
40P6
REV.
B
11
0311J–EPROM–4/11
9.
12
Revision history
Doc. rev.
Date
0311J
04/2011
0311I
12/2007
Comments
Remove VSOP package
Add lead finish to ordering information
Atmel AT27C4096
0311J–EPROM–4/11
Atmel Corporation
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San Jose, CA 95131
USA
Tel: (+1) (408) 441-0311
Fax: (+1) (408) 487-2600
www.atmel.com
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GERMANY
Tel: (+49) 89-31970-0
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1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
JAPAN
Tel: (+81) (3) 3523-3551
Fax: (+81) (3) 3523-7581
© 2011 Atmel Corporation. All rights reserved. / Rev.: 0311J–EPROM–4/11
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