AT28C010-12DK - Complete

Features
• Fast Read Access Time – 120 ns
• Automatic Page Write Operation
•
•
•
•
•
•
•
•
•
•
– Internal Address and Data Latches for 128 Bytes
– Internal Control Timer
Fast Write Cycle Time
– Page Write Cycle Time – 10 ms Maximum
– 1 to 128-byte Page Write Operation
Low Power Dissipation
– 50 mA Active Current
– 10 mA CMOS Standby Current
Hardware and Software Data Protection
DATA Polling for End of Write Detection
High Reliability CMOS Technology
– Endurance: 5.104 Read/Modify Write Cycles @ Ground Level
– Data Retention: 10 Years
Operating Range: 4.5V to 5.5V, -55 to +125°C
CMOS and TTL Compatible Inputs and Outputs
No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2
Tested up to a Total Dose of (according to MIL STD 883 Method 1019):
– 10 kRads (Si) Read-only Mode when Biased
– 30 kRads (Si) Read-only Mode when Unbiased
JEDEC Approved byte-Wide Pinout
435 Mils Wide 32-Pin Flat Pack Package
AT2010-12DK Mil
Space 1-MBit
(128K x 8)
Paged Parallel
EEPROMs
AT28C010-12DK
Description
The AT28C010-12DK is a high-performance Electrically Erasable and Programmable
Read-Only Memory. Its one megabit of memory is organized as 131,072 words by 8
bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device
offers access times to 120 ns with power dissipation of just 275 mW. When the device
is deselected, the CMOS standby current is less than 10 mA.
The AT28C010-12DK is accessed like a Static RAM for the read or write cycle without
the need for external components. The device contains a 128-byte page register to
allow writing of up to 128 bytes simultaneously. During a write cycle, the address and
1 to 128 bytes of data are internally latched, freeing the address and data bus for
other operations. Following the initiation of a write cycle, the device will automatically
write the latched data using an internal control timer. The end of a write cycle can be
detected by DATA POLLING of I/O7. Once the end of a write cycle has been detected
a new access for a read or write can begin.
Atmel's 28C010 has additional features to ensure high quality in manufacturing. The
device utilizes internal error correction for extended endurance and improved data
retention characteristics. An optional software data protection mechanism is available
to guard against inadvertent writes. The device also includes an extra 128 bytes of
EEPROM for device identification or tracking.
Rev. 4259E–AERO–02/11
Pin Configuration
Pin Name
Function
A0 - A16
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
FLATPACK
Top View
A16
A15
A12
A7
A6
NC
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
NC
WE
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
Block Diagram
2
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Device
Operation
•
READ: The AT28C010-12DK is accessed like a Static RAM. When CE and OE are low and
WE is high, the data stored at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high impedance state when either CE or
OE is high. This dual-line control gives designers flexibility in preventing bus contention in
their system.
•
BYTE WRITE: A low pulse on the WE or CE input with CE or WE low (respectively) and OE
high initiates a write cycle. The address is latched on the falling edge of CE or WE,
whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte
write has been started it will automatically time itself to completion. Once a programming
operation has been initiated and for the duration of tWC, a read operation will effectively be a
polling operation.
•
PAGE WRITE: The page write operation of the AT28C010-12DK allows 1 to 128 bytes of
data to be written into the device during a single internal programming period. A page write
operation is initiated in the same manner as a byte write; the first byte written can then be
followed by 1 to 127 additional bytes. Each successive byte must be written within 150 μs
(tBLC) of the previous byte. If the tBLC limit is exceeded the AT28C010-12DK will cease
accepting data and commence the internal programming operation. All bytes during a page
write operation must reside on the same page as defined by the state of the A7 - A16 inputs.
For each WE high to low transition during the page write operation, A7 - A16 must be the
same.
•
The A0 to A6 inputs are used to specify which bytes within the page are to be written. The
bytes may be loaded in any order and may be altered within the same load period. Only
bytes which are specified for writing will be written; unnecessary cycling of other bytes within
the page does not occur.
•
DATA POLLING: The AT28C010-12DK features DATA Polling to indicate the end of a write
cycle. During a byte or page write cycle an attempted read of the last byte written will result
in the complement of the written data to be presented on I/O7. Once the write cycle has
been completed, true data is valid on all outputs, and the next write cycle may begin. DATA
Polling may begin at anytime during the write cycle.
•
TOGGLE BIT: In addition to DATA Polling the AT28C010-12DK provides another method for
determining the end of a write cycle. During the write operation, successive attempts to read
data from the device will result in I/O6 toggling between one and zero. Once the write has
completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may
begin at any time during the write cycle.
•
DATA PROTECTION: If precautions are not taken, inadvertent writes may occur during
transitions of the host system power supply. Atmel has incorporated both hardware and
software features that will protect the memory against inadvertent writes.
For more information see the application note:
http://www.atmel.com/dyn/resources/prod_documents/DOC0544.PDF
•
HARDWARE PROTECTION: Hardware features protect against inadvertent writes to the
AT28C010-12DK in the following ways: (a) VDD sense – if VDD is below 3.8V (typical) the
write function is inhibited; (b) VDD power-on delay – once VDD has reached 3.8V the device
will automatically time out 5 ms (typical) before allowing a write: (c) write inhibit - holding any
one of OE low, CE high or WE high inhibits write cycles; (d) noise filter - pulses of less than
15 ns (typical) on the WE or CE inputs will not initiate a write cycle.
SOFTWARE DATA PROTECTION: A software controlled data protection feature has been
implemented on the AT28C010-12DK. When enabled, the software data protection (SDP),
will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the
AT28C010-12DK is shipped from Atmel with SDP disabled.
•
SDP is enabled by the host system issuing a series of three write commands; three specific
bytes of data are written to three specific addresses (refer to Software Data Protection
3
4259E–AERO–02/11
Algorithm). After writing the 3-byte command sequence and after tWC the entire AT28C01012DK will be protected against inadvertent write operations. It should be noted, that once
protected the host may still perform a byte or page write to the AT28C010-12DK. This is
done by preceding the data to be written by the same 3-byte command sequence used to
enable SDP.
•
Once set, SDP will remain active unless the disable command sequence is issued. Power
transitions do not disable SDP and SDP will protect the AT28C010-12DK during power-up
and power-down conditions. All command sequences must conform to the page write timing
specifications. The data in the enable and disable command sequences is not written to the
device and the memory addresses used in the sequence may be written with data in either a
byte or page write operation.
•
After setting SDP, any attempt to write to the device without the 3-byte command sequence
will start the internal write timers. No data will be written to the device; however, for the
duration of tWC, read operations will effectively be polling operations.
•
DEVICE IDENTIFICATION: An extra 128 bytes of EEPROM memory are available to the
user for device identification. By raising A9 to 12V ± 0.5V and using address locations
1FF80H to 1FFFFH the bytes may be written to or read from in the same manner as the
regular memory array.
•
OPTIONAL CHIP ERASE MODE: The entire device can be erased using a 6-byte software
code. Please see Software Chip Erase application note for details.
DC and AC Operating Range
AT28C010-12DK-12
Operating Temperature (Case)
VDD Power Supply
4
-55°C to +125°C
5V ± 10%
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Operating Modes
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
Write(1)
VIL
VIH
VIL
DIN
Standby
VIH
X
X
High Z
Write Inhibit
X
X
VIH
Write Inhibit
VIH
X
X
High Z
Write Inhibit
X
VIL
X
DOUT or High Z
Write Inhibit
VIL
VIL
VIL
No operation
Software Chip Clear
VIL
VIH
VIL
DIN
Software Write Protect
VIL
VIH
VIL
DIN
High Voltage Chip Clear
VIL
VH
VIL
VIH
Output Disable
X
VIH
X
High Z
DOUT or High Z
VIH = High Logic, “1” state, VIL = Low Logic “0” state.
X = logic “don’t care” state, High Z = high impedance state.
VH = Chip clear voltage, DOUT = Data out, and DIN = Data in.
Notes:
1. Refer to AC Programming Waveforms
5
4259E–AERO–02/11
Electrical Characteristics
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
*NOTICE:
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VDD + 0.6V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Voltage on OE and A9
with Respect to Ground ...................................-0.6V to +13.5V
DC Characteristics
6
Symbol
Parameter
Condition
Min
Max
Units
IIL , IIH
Low Level Input Current
VIN = 0V to VDD +1V
-10
10
mA
IOZL , IOZH
Output Leakage Current
VI/O = 0V to VDD
-10
10
mA
ICC3
VDD Standby Current CMOS
CE = VDD - 0.3V to VDD + 1V
10
mA
ICC2
VDD Standby Current TTL
CE = 2.0V to VDD + 1V
10
mA
ICC1
VDD Active Current
f = 5 MHz; IOUT = 0 mA
50
mA
VIL
Input Low Voltage
0.8
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
VOH1
Output High Voltage
IOH = -400 mA
2.4
V
VOH2
Output High Voltage CMOS
IOH = -100 mA; VDD = 4.5V
4,2
V
2.0
V
0.45
V
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
AC Read Characteristics
AC Read Waveforms(1)(2)(3)(4)
ADDRESS
ADDRESS VALID
ADDRESS VALID
CE
TAVQV
TELQV
OE
TELQVPH
TELQV
TOLQV
TOLQV
TEHQZ
TAVQV
OUTPUT
Notes:
HIGH Z
TEHQZ
TAXQX
OUTPUT VALID
TAVQV
HIGH Z
TAXQX
OUTPUT VALID
1. CE may be delayed up to TAVQV - TELQV after the address transition without impact on TAVQV.
2. OE may be delayed up to TELQV - TOLQV after the falling edge of CE without impact on TELQV or
by TAVQV - TOLQV after an address change without impact in TAVQV.
3. TEHQZ is specified from OE or CE wichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
5. If CE is de-asserted, it must remain de-asserted for at least 50ns during read operations otherwise incorrect data may be read.
7
4259E–AERO–02/11
Input Test Waveforms and Measurement Level
Output Test Load
Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
Typ
Max
Units
Conditions
CIN
4
10
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. This parameter is 100% characterized and is not 100% tested.
AC Write Characteristics
8
Symbol
Parameter
Min
Max
Units
TAVEL, TAVWL, TOHWL, TOHEL,
Address, OE Set-up Time
0
ns
TELAX, TWLAX
Address Hold Time
50
ns
TWLEL, TELWL
Chip Select Set-up Time
0
ns
TEHWH, TWHEH
Chip Select Hold Time
0
ns
TELEH, TWLWHI
Write Pulse Width (WE or CE)
100
ns
TDVEH, TDVWH
Data Set-up Time
50
ns
TEHDX, TWHDX, TWHOL, TEHOL
Data, OE Hold Time
0
ns
TWPH
Write Pulse Width High
50
ns
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
AC Write
Waveforms
WE Controlled
TOHWL
TAVWL
TWHOL
TWLAX
TWHEH
TELWL
TWPH
TWLWH1
TDVWH
TWHDX
CE Controlled
TOHEL
TAVEL
EHOL
TELAX
EHWH
TWLEL
TWPH
TELEH
TDVEH
TEHDX
9
4259E–AERO–02/11
Page Mode Characteristics
Symbol
Parameter
TWHWL1
Write Cycle Time
TAVWL, TOHWL
Address Set-up Time, OE Set up time
0
ns
TWLAX
Address Hold Time
50
ns
TDVWH
Data Set-up Time
50
ns
Data Hold Time, OE Hold time
0
ns
100
ns
TWHDX, TWHOL
Min
TWLWH1
Write Pulse Width
TWHWL2
Byte Load Cycle Time
TWPH
Write Pulse Width High
Max
Units
10
ms
150
50
ms
ns
Page Mode Write Waveforms (1)(2)
TWPH
TWLWH1
TAVWL
TWLAX
TWHWL2
TWHDX
TDVWH
TWHWL1
Notes:
10
1. A7 through A16 must specify the page address during each high to low transition of WE (or
CE).
2. OE must be high only when WE and CE are both low.
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Chip Erase
Waveforms
tS = 5 msec (min.)
tW = tH = 10 msec (min.)
VH = 12.0V ± 0.5V
Software Data
Figure 1. Protection Enable Algorithm(1)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
WRITES ENABLED(2)
LOAD DATA XX
TO
ANY ADDRESS(3)
LOAD LAST BYTE
TO
LAST ADDRESS
Notes:
ENTER DATA
PROTECT STATE
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write even if no other data is loaded.
3. 1 to 128 bytes of data are loaded.
11
4259E–AERO–02/11
Figure 2. Protection Disable Algorithm(1)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 20
TO
ADDRESS 5555
EXIT DATA
PROTECT STATE(3)
LOAD DATA XX
TO
ANY ADDRESS(4)
LOAD LAST BYTE
TO
LAST ADDRESS
Notes:
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write even if no other data is loaded.
3. Write Protect state will be deactivated at end of write period even if no other data if loaded.
4. 1 to 128 bytes of data are loaded.
12
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Software Protected Program Cycle Waveform(1)(2)(3)
TWLWH1
TWPH
TWHWL2
TAVWL
TWLAX
TDVWH
TWHDX
TWHWL1
Notes:
1. A0 - A14 must conform to the addressing sequence for the first 3 bytes as shown above.
2. After the command sequence has been issued and a page write operation follows, the page
address inputs (A7 - A16) must be the same for each high to low transition of WE (or CE).
3. OE must be high only when WE and CE are both low.
13
4259E–AERO–02/11
Data Polling Characteristics(1)
Symbol
Parameter
TWHDX
Data Hold Time
TWHOL
OE Hold Time
Min
OE Access Time
tWR
Write Recovery Time
Max
Units
10
ns
10
ns
(2)
TOLQV
Notes:
Typ
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
Data Polling Waveforms
TWHOL
TWHDX
14
TOLQV
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Toggle Bit Characteristics(1)
Symbol
Parameter
Min
TWHDX
Data Hold Time
TWHOL
OE Hold Time
Max
OE Access Time
TOEHP
OE High Pulse
TWR
Write Recovery Time
Units
10
ns
10
ns
(2)
TOLQV
Notes:
Typ
ns
150
ns
0
ns
1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
TWHOL
TWHDX
Notes:
TOEHP
TOLQV
1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any addres location may be used but the address should not vary.
15
4259E–AERO–02/11
Ordering Information
tACC (ns)
ICC (mA)
Active
Ordering Code
Package
Standby
AT28C010-12DK-E
120
50
10
AT28C010-12DK-MQ
AT28C010-12DK-SV
16
Packing
Engineering Samples
FP32.4
Military Level B
Space Level B
AT28C010-12DK
4259E–AERO–02/11
AT28C010-12DK
Packaging Information
FP32.435
32F, 32-Lead, Non-Windowed, Ceramic Bottom
Brazed Flat Package (Flatpack)
Dimensions in Inches and Millimeters
MIL-STD-1835 F-18 CONFIG B
JEDEC OUTLINE MO-115
17
4259E–AERO–02/11
Document Revision History
Changes from
Rev. C to Rev. D
Page 7 : updated to be in compliance with military version of the datasheet which implements a
condition on the CE Pulse High Time to avoid bad output data when a very fast read enable is
used by application.
Changes from
Rev. D to Rev. E
Page 1 :
18
•
“Preliminary” status suppressed
•
Endurance : Read Cycles replaced by Read/Modify Write Cycles @ Ground Level
AT28C010-12DK
4259E–AERO–02/11
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054 Saint-Quentin-enYvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
Enter Product Line E-mail
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
4259E–AERO–02/11