ATAES132 SPI - Summary Mature

ATAES132
32Kb AES Serial EEPROM Specification
NOT RECOMMENDED
FOR NEW DESIGNS
Replaced by
ATAES132A
SPI SUMMARY DATASHEET
Features
 32Kb standard Serial EEPROM User Memory
Compatible with the Atmel® AT2530B
 16 user zones of 2Kb each

 High-security features







AES algorithm with 128-bit keys
AES-CCM for authentication
Message Authentication Code (MAC) for cryptographic operations
Secure storage for sixteen 128-bit keys
Encrypted User Memory Read and Write
FIPS Random Number Generator
16 high-endurance monotonic EEPROM counters
 Flexible, user-configurable security


User zone access rights independently configured
Authentication prior to zone access
 Read/Write, encrypted, or read-only user zone options
 10MHz serial interface
 2.5V to 5.5V supply, <250nA sleep
 Packages: SOIC or UDFN

Serial EEPROM compatible pinout
 -40C to +85C operating temperature
Benefits
Add security without retooling printed circuit board by just replacing an
existing Serial EEPROM.
 Authenticate consumables
 Authenticate components
 Authenticate network access
 Protect sensitive firmware
 Secure confidential data
 Prevent enablement of unpaid for features
 Manage contract manufacturers from overbuilds
 Manage warranty claims
This is a summary document.
The complete document is
available on the Atmel website
at www.atmel.com.
 Securely store complete identify including fingerprints and pictures
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
Description
The Atmel ATAES132 is a high-security, Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM)
providing both authentication, confidential, nonvolatile data storage capabilities. Access restrictions for the sixteen user
zones are independently configured, and any key can be used with any zone. Keys can also be used for standalone
authentication. This flexibility permits the ATAES132 to be used in a wide range of applications.
The AES-128 cryptographic engine operates in AES-CCM mode to provide authentication, stored data
encryption/decryption, and message authentication codes. Both internally stored data and/or small quantities of external
data can be protected by the ATAES132 device.
The ATAES132 pinout is compatible with standard Serial EEPROMs to allow placement on existing PC boards. The
Serial EEPROM portion of the ATAES132 instruction set is identical to the Atmel Serial EEPROM instruction set. The
ATAES132’s extended security functions are accessed by sending command packets to the ATAES132 using standard
Write instructions and reading responses using standard read instructions. The ATAES132 secure Serial EEPROM
architecture allows it to be inserted into existing applications.
The ATAES132 device incorporates multiple physical security mechanisms to prevent release of the internally stored
secrets. Secure personalization features are provided to facilitate third-party product manufacturing.
Table 1.
Package Pin List
Pad
Description
SOIC
UDFN
VCC
Supply Voltage
8
8
GND
Ground
4
4
SCK
Serial Clock Input
6
6
SI
Serial Data Input
5
5
CS
SPI Chip Select Input
1
1
SO
Serial Data Output
2
2
Figure 1.
Pin Configurations
SOIC
UDFN
CS
1
8
VCC
VCC 8
1
CS
SO
2
7
NC
NC 7
2
SO
NC
3
6
SCL
SCK 6
3
NC
GND
4
5
SDA
SI 5
4
GND
Top View
Note:
2
Bottom View
Drawings are not to scale.
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1.
Security
1.1
Advanced Encryption Standard (AES)
The ATAES132 cryptographic functions are implemented with a hardware cryptographic engine using the Advanced
Encryption Standard (AES) in the CCM (Counter mode Cipher block chaining Message authentication code) mode with
128-bit keys. AES-CCM mode provides both confidentiality and integrity checking with a single key. The integrity MAC
includes both the encrypted data and additional authenticate-only data bytes, as described in each command definition.
Each MAC is unique due to inclusion of a nonce and an incrementing MacCount register in the MAC calculation.
1.2
Hardware Security Features
The ATAES132 device contains physical security features to prevent an attacker from determining the internal secrets.
The ATAES132 includes tamper detectors for voltage, temperature, frequency, and light, as well as an active metal
shield over the circuitry, internal memory encryption, and various other features. The ATAES132 physical design and
cryptographic protocol are architected to prevent or significantly complicate most algorithmic, timing, and side-channel
attacks.
2.
Device Internal Regions
Seven distinct regions make up the internal organization of the ATAES132: User Memory, Information Region,
Configuration Memory, Counters, Key Memory, SmallZone, and I/O Support regions.
Figure 2-1. Device Internal Regions
User Memory (32Kb)
Information Region (36 bytes)
Configuration Memory (165 bytes)
Counters (2Kb)
Key Memory (2Kb)
Small Zone (32 bytes)
Free Space (96 bytes)
I/O Support SRAM
2.1
User Memory
The User Memory is comprised of 32Kb of nonvolatile memory, segmented into 16 zones. Access to the zones is
independently configurable to offer access restrictions, from open access, as in any standard Serial EEPROM, to full
restrictions that preclude Read/Write operations and will only permit internal, authenticated use for such data as security
keys.
2.2
Information Region
The information region holds read-only identification information, such as unique die serial numbers and other
information pertaining to the ATAES132.
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2.3
Configuration Memory
The Configuration Memory offers the ability to customize access rights to different resources of the device as a means to
tailor the various security features of the device to one’s specific application. This customizing, formally known as
personalization, grants the application owner the ability to define custom access rights to device resources, from
counters and key usage to memory. After personalization, the application owner issues lock commands to render the
configuration permanent and to forever seal security keys and information in user zones configured to be confidential.
The Configuration Memory supports multi-step workflows to support the use of third-party services like programming
without compromising the content or application security. In addition, Atmel offers optional, value-add programming
services through the use of hardware security modules, which allow application owners to virtually inject their secrets into
the ATAES132.
Table 2-1.
Name
Description
Write
Read
Bytes
Algorithm
Algorithm ID Code (0x0000).
Never
Always
2
ChipConfig
Device level cryptographic and power-up configuration options.
If Lockconfig =
Unlocked
Always
1
Counters
16 monotonic counters, each capable of counting to 2M.
If Lockconfig =
Unlocked
Always
128
CounterConfig
Configuration information for each counter.
If Lockconfig =
Unlocked
Always
32
DeviceNum
Atmel device number code.
Never
Always
1
EEPageSize
Length in bytes of physical EEPROM page (32, 0x20).
Never
Always
1
EncReadSize
Maximum data length in bytes for EncRead (32, 0x20).
Never
Always
1
EncWriteSize
Maximum data length in bytes for EncWrite (32, 0x20).
Never
Always
1
FreeSpace
Free memory for customer data storage.
If Lockconfig =
Unlocked
Always
96
JEDEC
Atmel JEDEC manufacturer code 0x001F.
Never
Always
2
KeyConfig
Configuration information for each key.
If Lockconfig =
Unlocked
Always
64
LockConfig(1)
Controls Configuration Memory Write access except SmallZone.
Default is the Unlocked state.
Via Lock
Command Only
Always
1
LockKeys(1)
Controls Key Memory Write Access. Default is the ‘unlocked’ state.
Via Lock
Command Only
Always
1
LockSmall(1)
Controls SmallZone Register Write access. Default is the ‘unlocked’
state.
Via Lock
Command Only
Always
1
LotHistory
Atmel proprietary manufacturing information
Never
Always
8
Note:
4
Summary of Configuration Table Parameters, Sorted by Name
1.
Changes to most of the configuration registers take effect immediately which allows the functionality to
be tested during the personalization process. Changes to the I2C Addr register take effect at the next
Reset, Power-Up, or Wake-Up from the Sleep state.
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Table 2-1.
Name
Description
Write
Read
Bytes
ManufacturingID
Two byte manufacturing ID code
Never
Always
2
PermConfig
Atmel factory device configuration options
Never
Always
1
SerialNum
Guaranteed unique die serial number. SerialNum is optionally
included in cryptographic calculations.
Never
Always
8
SmallZone
32 byte value. The first four bytes are optionally included in
cryptographic calculations.
If Locksmall =
Unlocked
Always
32
I2C Addr
Selects the serial interface mode and stores the I2C device
address.
If LockConfig =
Unlocked
Always
1
ZoneConfig
Access and usage permissions for each user zone.
If LockConfig =
Unlocked
Always
64
Note:
2.4
Summary of Configuration Table Parameters, Sorted by Name (Continued)
1.
Changes to most of the configuration registers take effect immediately which allows the functionality to
be tested during the personalization process. Changes to the I2C Addr register take effect at the next
Reset, Power-Up, or Wake-Up from the Sleep state.
Counters
The Counters region contains 16 nonreversible monotonic counters. Counter operation is customized during
personalization in the Configuration Memory to permit such features as free use, authenticated-only increments, and
control of key usage.
2.5
Key Memory
Key Memory holds sixteen 128-bit keys targeting various AES and AES-CCM operations. Key usage is customized
during personalization in the Configuration Memory to permit custom features like authentication-only, limited-use,
counter increment, user zone access, key permissions, and many other uses. The Key Memory is writeable only during
personalization, and is never readable under any circumstances. One may only use an authentication procedure to
validate the content of a key; however, ATAES132 offers a set of commands which, when so configured during
personalization, permits secure key creation, imports, and transfer of content from a confidential User Memory to key
space.
2.6
SmallZone
SmallZone is a 32-byte, general-purpose memory separate from the 32Kb user memory and with special features to aid
multi-step workflows. Configuration at personalization may make portions of this zone a mandatory input into
cryptographic calculations.
2.7
I/O Support
The I/O Support regions contains a FIFO and other registers, which together provide a means to send the ATAES132
commands and receive responses, including status information.
3.
Commands
The ATAES132 extends the command set of a standard Serial EEPROM to offer additional commands that solve various
security challenges. Unrestricted memory regions are accessible using standard Serial EEPROM SPI commands.
Restricted User Memory regions, as well as security features, are still accessible by using standard SPI commands to
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5
send extended command bytes to a FIFO address. Responses are read using standard SPI commands from same FIFO
address.
Table 3-1.
Opcode
6
ATAES132 Extended Command Set Summary
Name
Description
0x03
Auth
Performs one-way or mutual authentication using the specified key.
0x15
AuthCheck
Checks the output MAC generated by the Auth command or by reading a counter using the
Counter command on a second ATAES132 device.
0x14
AuthCompute
Computes the input MAC required to execute the Auth command or to increment a counter
using the Counter command on a second ATAES132 device.
0x10
BlockRead
Reads 1 to 32 bytes of data from User Memory or the Configuration Memory. Returns cleartext
data.
0x0A
Counter
Increments a monontonic counter and/or returns the counter value.
0x0B
Crunch
Processes a seed value through the internal crunch engine. This function is used to detect
clones.
0x07
Decrypt
Decrypts 16 or 32 bytes of data provided by the Host after verifying the integrity MAC.
0x04
EncRead
Encrypts 1 to 32 bytes of data from User Memory and returns the encrypted data and integrity
MAC.
0x06
Encrypt
Encrypts 16 or 32 bytes of plaintext data provided by the Host.
0x05
EncWrite
Writes 1 to 32 bytes of encrypted data into the User Memory or Key Memory after verifying the
integrity MAC.
0x0C
Info
Returns device information: the MacCount, authentication status, or the hardware revision
code.
0x08
KeyCreate
Generates a random number, stores it in Key Memory, and returns the encrypted key to the
Host.
0x19
KeyImport
Decrypts and writes a key that was output by the KeyCreate command.
0x09
KeyLoad
Writes an encrypted key to Key Memory after verifying the integrity MAC.
0x1A
KeyTransfer
Transfers a key from User Memory to the Key Memory or to the VolatileKey Register.
0x0F
Legacy
Performs a single AES-ECB mode operation on 16 bytes of data provided by the Host.
0x0D
Lock
Permanently locks the Configuration Memory or Key Memory. Locked memory can never be
unlocked.
0x01
Nonce
Generates a 128-bit nonce using the internal random number generator for use by the
cryptographic commands. This command can also be used to write a host nonce directly into
the Nonce Register.
0x13
NonceCompute
Generates a nonce in a manner that allows two ATAES132 devices to have identical nonce
values.
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Table 3-1.
Opcode
4.
ATAES132 Extended Command Set Summary (Continued)
Name
Description
0x02
Random
Returns a 128-bit random number from the internal random number generator.
0x00
Reset
Resets the device, clearing the cryptographic status.
0x11
Sleep
Places the device in the sleep state or standby state to reduce power consumption.
Power Management Features
The ATAES132 supports four power states that offer great flexibility in reducing its power consumption, especially in
low-power embedded systems. These are the Active, Standby, Sleep, and Off sates. Power consumption ranges from
less than 250nA in the Sleep state to10mA in the Active state. The ATAES132 can power-up into any of the powered
states, if so configured. It can also enter the standby or sleep states after receipt of a Sleep command from the Host.
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5.
Electrical Characteristics
5.1
Absolute Maximum Ratings*
Operating Temperature . . . . . . . . . . . .−40C to +85C
Storage Temperature . . . . . . . . . . . −65C to + 150C
Maximum Operating Voltage . . . . . . . . . . . . . . . . 6.0V
DC Output Current. . . . . . . . . . . . . . . . . . . . . . . 5.0mA
Voltage on Any Pin . . . . . . . . . . -0.7V to (VCC + 0.7V)
HBM ESD . . . . . . . . . . . . . . . . . . . . . . . 3kV minimum
5.2
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only,
and functional operation of the device at these or
any other condition beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Reliability
The ATAES132 is fabricated with Atmel high reliability CMOS EEPROM manufacturing technology. The reliability ratings
in Table 5-1 apply to each byte of the EEPROM memory.
Table 5-1.
EEPROM Reliability(1)
Parameter
Min
Write Endurance (Each byte)
Max
Units
100,000
Write Cycles
Data Retention (At 55C)
10
Years
Data Retention (At 35C)
30
Read Endurance
Note:
8
Typical
1.
50
Years
Unlimited
Read Cycles
These specifications apply to every byte of the User Memory, Configuration Memory, and Key Memory. The
Write Endurance specification also applies to the random number generator EEPROM Seed Register.
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5.3
DC Characteristics
5.3.1
Supply Voltage and Current Characteristics
Applicable over recommended operating range from TA = −40C to +85C, VCC = +2.5V to +5.5V (unless otherwise
noted).(1)
Symbol
VCC
(1)
Test Conditions
Min
Supply Voltage
Typ
2.5
Max
Units
5.5
V
ICC1
Supply Current
VCC = 3.3V at fmax(4),
SO = Open(3), Read, Write, or AES Operation.
6
mA
ICC2
Supply Current
VCC = 5.5V at fmax(4),
SO = Open(3), Read, Write, or AES Operation.
10
mA
ICC3
Idle Current
VCC = 3.3V or 5.5V at fmax(4),
SO = Open (3), Waiting for a Command.
600
800
μA
ISL1
Sleep Current
VCC = 3.3V, CS = VCC (3), Sleep State
0.10
0.25
μA
0.25
0.50
μA
(3)
ISL2
Sleep Current
VCC = 5.5V, CS = VCC
ISB1
Standby Current
VCC = 3.3V, CS = VCC (3), Standby State
15
30
μA
ISB2
Standby Current
VCC = 5.5V, CS = VCC (3), Standby State
20
40
μA
Notes: 1.
2.
5.3.2
Parameter
, Sleep State
Typical values are at 25C, and are for reference only. Typical values are not tested or guaranteed
On power-up, VCC must rise continuously from VSS to the operating voltage, with a rise time no faster than
1V/μs.
3.
All input pins must be held at either VSS or VCC during this measurement
4.
Measurement is performed at the maximum serial clock frequency
5.
The ATAES132 does not support hot swapping or hot plugging. Connecting or disconnecting this device to a
system while power is energized can cause permanent damage to ATAES132
DC Characteristics
Applicable over recommended operating range from TA = −40C to +85C, VCC = +2.5V to +5.5V (unless otherwise noted).
Symbol
Parameter
Test Conditions
Min
Max
Units
ILI
Input Current
VIN = 0V or VCC
−3.0
3.0
μA
ILO
Output Leakage
VOUT = 0V or VCC
−3.0
3.0
μA
VIL(1)
Input Low-voltage
−0.5
VCC x 0.3
V
VIH(1)
Input High-voltage
VCC x 0.7
VCC + 0.5
V
VOL1
Output low-voltage, except SI
IOL = 3.0mA
0
0.4
V
VOH1
Output high-voltage, except SI
IOH = −3.0mA
VCC −0.8
VCC
V
VOL2
Output low-voltage, SI
IOL = 3.0mA
0
0.4
V
Note:
1.
VIL min and VIH max are for reference only, and are not tested.
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5.4
AC Characteristics
Applicable over recommended operating range from TA = −40C to + 85C, VCC = +2.5V to +5.5V.
Symbol
Parameter
tWC1
tWC2
Note:
5.4.1
1.
Min
Max
Units
User Zone Write Cycle Time(1)
6
9
ms
Key Zone Write Cycle Time(1)
12
16
ms
The Write Cycle Time includes the EEPROM Erase, Write, and Automatic Data Write Verification
operations.
Power-up, Sleep, and Wake-up Timing Characteristics(1)
Applicable over recommended operating range from TA = −40C to + 85C, VCC = +2.5V to +5.5V
Symbol
Parameter
tPU.STATUS
Typ
Max
Units
Power-up Time, Status
500
600
μs
tPU.RDY
Power-up Ready Time
1200
1500
μs
tSB
Sleep Time, Entering the Standby State
65
100
μs
tSL
Sleep Time, Entering the Sleep State
55
90
μs
tWupSB.STATUS
Wake-up Status Time, Standby State
50
100
μs
tWupSB.RDY
Wake-up Ready Time, Standby State
200
240
μs
tWupSL.STATUS
Wake-up Status, Sleep State
500
600
μs
tWupSL.RDY
Wake-up Ready Time, Sleep State
1000
1200
μs
tCSS.Wup
CS Setup Time at Wake-up
(see Section 6., “Part Markings”)
Note:
10
1.
Min
100
All values are based on characterization, and are not tested. Typical values are at 25C and are for
reference only.
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ns
5.4.2
SPI Interface Timing
Applicable over recommended operating range from TA = −40C to + 85C, VCC = +2.5V to +5.5V,
CL = 1 TTL Gate and 30pF (unless otherwise noted).
Symbol
Parameter
Min
Max
Units
fSCK
SCK Clock Frequency
0
10
MHz
SCK Clock Duty Cycle
30
70
Percent
tWH
SCK High Time
40
ns
tWL
SCK Low Time
40
ns
tCS
CS High Time
50
ns
tCSS
CS Setup Time
50
ns
tCSH
CS Hold Time
50
ns
tSU
Data in Setup Time
10
ns
tH
Data in Hold Time
10
ns
tRI
Input Rise Time(1)
2
μs
tFI
Input Fall Time(1)
2
μs
tV
Output Valid
0
40
ns
tHO
Output Hold Time
0
tDIS
Output Disable Time
Note:
1.
ns
50
ns
Values are based on characterization, and are not tested.
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Figure 5-1. SPI Synchronous Data Timing
tCS
VIH
CS
VIL
tCSS
tCSH
VIH
tWH
SCK
tWL
VIL
tSU
tH
VIH
SI
Valid In
VIL
tHO
tV
tDIS
VOH
HI-Z
HI-Z
SO
VOL
Figure 5-2. SPI Interface Timing, CS Setup Time at Wake-up
tCS
VIH
CS
VIL
tCSS.Wup
tCSH
VIH
tWH
SCK
tWL
VIL
tSU
tH
VIH
SI
Valid In
VIL
tV
VOH
HI-Z
SO
VOL
12
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tHO
tDIS
HI-Z
6.
Part Markings
The part marking on the packages represents only variable manufacturing lot information and does not contain any
reference to the part number. Each reel or shipment may have different markings. Do not use the marking on the IC
package to determine product acceptance, instead, use the information on the shipment, reel, or box label.
7.
Ordering Information
The ATAES132 production ordering codes are listed below. The ATAES132 packages are marked only with a lot trace
code and not the ordering code.
7.1
Ordering Codes
ATAES132 Ordering Code
Package
Conditioning
ATAES132-SH-EQ
SOIC
Bulk
ATAES132-SH-EQ-T(1)
SOIC
Tape and Reel
ATAES132-MAH-EQ-T(1)
UDFN
Tape and Reel
Note:
1.
Interface Configuration
Temperature Range
SPI
-40C to 85C
T = Tape and Reel

SOIC = 4K per reel

UDFN = 5K per reel
Package Type
SOIC
8-pin SOIC, NiPdAu Lead Finish, Green(1)
UDFN
8-pin UDFN/USON 2.00mm x 3.00mm, NiPdAu Lead Finish, Green(1)
Note:
1.
Lead-free, halogen-free package. Exceeds RoHS requirements.
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7.2
Package Drawings
7.2.1
8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
SYMBOL MIN
A
1.35
NOM
MAX
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
6/22/11
Package Drawing Contact:
[email protected]
14
TITLE
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
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GPC
SWB
DRAWING NO.
REV.
8S1
G
7.2.2
8MA2 — 8-pad UDFN
E
1
8
Pin 1 ID
2
7
3
6
4
5
D
C
TOP VIEW
A2
SIDE VIEW
A
A1
E2
b (8x)
8
1
7
D2
6
3
5
4
e (6x)
K
L (8x)
BOTTOM VIEW
Notes:
COMMON DIMENSIONS
(Unit of Measure = mm)
2
Pin#1 ID
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
SYMBOL
MIN
NOM
MAX
A
0.50
0.55
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
D
1.90
2.00
2.10
D2
1.20
-
1.60
E
2.90
3.00
3.10
E2
1.20
-
1.60
b
0.18
0.25
0.30
C
L
3
1.52 REF
0.30
e
K
NOTE
0.35
0.40
0.50 BSC
0.20
-
-
6/6/14
Package Drawing Contact:
[email protected]
TITLE
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
GPC
DRAWING NO.
REV.
YNZ
8MA2
F
ATAES132 [SPI SUMMARY DATASHEET]
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
15
8.
Revision History
Doc. Rev.
Date
8763DS
07/2014
Comments
03/2015 Not recommended for new designs. Replaced by ATAES132A.
Update ESD from 2000V to 3kV and 8MA2 package drawing.
Remove DecRead and WriteCompute commands and TSSOP package option.
8763CS
10/2013
Update KeyExport to KeyCreate.
Add SOIC and UDFN package drawings.
Update footers and disclaimer page.
16
8763BS
02/2013
8763AS
05/2011
Ordering code table: add package column, notes, and update ordering codes.
Update Atmel logos and disclaimer/copy page.
Initial SPI summary document release.
ATAES132 [SPI SUMMARY DATASHEET]
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
XXXXXX
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