Atmel SAM D09 SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel® | SMART™ SAM D09 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 14- to 24-pins with up to16KB Flash and 4KB of SRAM. The SAM D09 devices operate at a maximum frequency of 48MHz and reach 2.46 Coremark/MHz. They are designed for simple and intuitive migration with identical peripheral modules, hex compatible code, identical linear address map and pin compatible migration paths between all devices in the product series. All devices include intelligent and flexible peripherals, Atmel Event System for inter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces. The SAM D09 series is compatible to the other product series in the SAM D family, enabling easy migration to larger device with added features. The Atmel SAM D09 devices provide the following features: In-system programmable Flash, sixchannel direct memory access (DMA) controller, 6 channel Event System, programmable interrupt controller, up to 22 programmable I/O pins, 32-bit real-time clock and calendar, two 16bit Timer/Counters (TC), where each TC can be configured to perform frequency and waveform generation, accurate program execution timing or input capture with time and frequency measurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be cascaded to form a 32-bit TC, and one timer/counter has extended functions optimized for motor, lighting and other control applications. The series provide two Serial Communication Modules (SERCOM) that each can be configured to act as an USART, UART, SPI, I2C, SMBus, PMBus and LIN slave; up to 10-channel 350ksps 12-bit ADC with programmable gain and optional oversampling and decimation supporting up to 16-bit resolution, programmable Watchdog Timer, brown-out detector and power-on reset and two-pin Serial Wire Debug (SWD) program and debug interface. All devices have accurate and low-power external and internal oscillators. All oscillators can be used as a source for the system clock. Different clock domains can be independently configured to run at different frequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thus maintaining a high CPU frequency while reducing power consumption. The SAM D09 devices have two software-selectable sleep modes, idle and standby. In idle mode the CPU is stopped while all other functions can be kept running. In standby all clocks and functions are stopped expect those selected to continue running. The device supports SleepWalking. This feature allows the peripheral to wake up from sleep based on predefined conditions, and thus allows the CPU to wake up only when needed, e.g. when a threshold is crossed or a result is ready. The Event System supports synchronous and asynchronous events, allowing peripherals to receive, react to and send events even in standby mode. The Flash program memory can be reprogrammed in-system through the SWD interface. The same interface can be used for non-intrusive on-chip debug and trace of application code. A boot loader running in the device can use any communication interface to download and upgrade the application program in the Flash memory. The Atmel SAM D09 devices are supported with a full suite of program and system development tools, including C compilers, macro assemblers, program debugger/simulators, programmers and evaluation kits. Atmel-42414FS-SAM-D09-Summary_05/2016 SMART Features z Processor z ARM Cortex-M0+ CPU running at up to 48MHz z Single-cycle hardware multiplier z Micro Trace Buffer z Memories z 8/16KB in-system self-programmable Flash z 4KB SRAM Memory z System z Power-on reset (POR) and brown-out detection (BOD) z Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M) and 48MHz to 96MHz Fractional Digital Phase Locked Loop (FDPLL96M) z External Interrupt Controller (EIC) z 8 external interrupts z One non-maskable interrupt z Two-pin Serial Wire Debug (SWD) programming, test and debugging interface z Low Power z Idle and standby sleep modes z SleepWalking peripherals z Peripherals z 6-channel Direct Memory Access Controller (DMAC) z 6-channel Event System z Two 16-bit Timer/Counters (TC), configurable as either: z One 16-bit TC with compare/capture channels z One 8-bit TC with compare/capture channels z One 32-bit TC with compare/capture channels, by using two TCs z 32-bit Real Time Counter (RTC) with clock/calendar function z Watchdog Timer (WDT) z CRC-32 generator z Two Serial Communication Interfaces (SERCOM), each configurable to operate as either: z USART with full-duplex and single-wire half-duplex configuration z I2C Bus z SMBUS/PMBUS z SPI z LIN slave z 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 10 channels z Differential and single-ended input z 1/2x to 16x programmable gain stage z Automatic offset and gain error compensation z Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution z I/O z Up to 22 programmable I/O pins z Packages z 24-pin QFN z 14-pin SOIC z Operating Voltage z 2.4V – 3.63V Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 2 1. Configuration Summary Table 1-1. Configuration Summary SAM D09D – 24-pin QFN SAM D09C – 14-pin SOIC Pins 24 14 General Purpose I/O-pins (GPIOs) 22 12 Flash 16KB 8KB SRAM 4KB 4KB Timer Counter (TC) 2 2(1) Waveform output channels for TC 2 2 DMA channels 6 6 Serial Communication Interface (SERCOM) 2 2 Analog-to-Digital Converter (ADC) channels 10 5 Real-Time Counter (RTC) Yes Yes 1 1 1 32-bit value or 2 16-bit values 1 32-bit value or 2 16-bit values 8 8 48MHz 48MHz QFN SOIC RTC alarms RTC compare values External Interrupt lines Maximum CPU frequency Packages 32.768kHz crystal oscillator (XOSC32K) 0.4-32MHz crystal oscillator (XOSC) 32.768kHzinternal oscillator (OSC32K) 32kHz ultra-low-power internal oscillator (OSCULP32K) 8MHz high-accuracy internal oscillator (OSC8M) 48MHz Digital Frequency Locked Loop (DFLL48M) 96MHz Fractional Digital Phased Locked Loop (FDPLL96M) Oscillators Event System channels 6 6 SW Debug Interface Yes Yes Watchdog Timer (WDT) Yes Yes Note: 1. The signals for TC2 are not routed out on the 14-pin package. Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 3 2. Ordering Information SAMD 09 C 13 A - M U T Package Carrier Product Family SAMD = General Purpose Microcontroller No character = Tray (Default) T = Tape and Reel Product Series Package Grade 09 = Cortex M0+ DMA O Pin Count U = -40 - 85 C Matte Sn Plating C = 14 pins D = 24 pins Package Type Flash Memory Density M = QFN SS = SOIC 14 = 16KB 13 = 8KB Device Variant A = Default Variant 2.1 SAM D09C – 14-pin SOIC Ordering Code FLASH (bytes) SRAM (bytes) Package Carrier Type 8K 4K SOIC14 Tape & Reel FLASH (bytes) SRAM (bytes) Package Carrier Type 16K 4K QFN24 Tape & Reel ATSAMD09C13A-SSUT 2.2 SAM D09D – 24-pin QFN Ordering Code ATSAMD09D14A-MUT Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 4 Block Diagram CORTEX-M0+ PROCESSOR Fmax 48 MHz SERIAL WIRE DEVICE SERVICE UNIT 8/16 KB NVM 4 KB RAM NVM CONTROLLER Cache SRAM CONTROLLER M M M S M HIGH SPEED BUS MATRIX PERIPHERAL ACCESS CONTROLLER S S AHB-APB BRIDGE B AHB-APB BRIDGE A AHB-APB BRIDGE C PERIPHERAL ACCESS CONTROLLER SYSTEM CONTROLLER 2x 6 SERCOM x SERCOM XOSC DFLL48M FDPLL96M EVENT SYSTEM OSC32K XOSC32K OSC8M XIN XOUT DMA VREF OSCULP32K XOUT32 XIN32 DMA S PERIPHERAL ACCESS CONTROLLER BOD33 S PAD0 PAD1 PAD2 PAD3 DMA 2 x TIMER / COUNTER 8 x Timer Counter WO0 PORT SWCLK SWDIO MICRO TRACE BUFFER IOBUS PORT 3. WO1 AIN[9..0] DMA 10-CHANNEL 12-bit ADC 350KSPS VREFA VREFB POWER MANAGER CLOCK CONTROLLER RESETN RESET CONTROLLER GCLK_IO[5..0] SLEEP CONTROLLER GENERIC CLOCK CONTROLLER REAL TIME COUNTER WATCHDOG TIMER EXTINT[7..0] NMI 2. EXTERNAL INTERRUPT CONTROLLER Some products have different number of SERCOM instances and ADC signals. Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 5 4. Pinout 4.1 SAM D09C 14-pin SOIC PA05 1 14 PA04 PA08 2 13 PA02 PA09 3 12 VDDIO/IN/ANA PA14 4 11 GND PA15 5 10 PA25 6 9 PA24 7 8 PA31 PA28/RST PA30 DIGITAL PIN ANALOG PIN OSCILLATOR GROUND INPUT SUPPLY RESET/GPIO PIN Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 6 GND PA25 PA24 PA31 PA30 24 23 22 21 20 19 VDDIO/IN/ANA SAM D09D 24-pin QFN 1 2 3 4 5 6 18 17 16 15 14 13 PA28/RST PA27 PA23 PA22 PA17 PA16 7 8 9 10 11 12 PA02 PA03 PA04 PA05 PA06 PA07 DIGITAL PIN ANALOG PIN OSCILLATOR GROUND INPUT SUPPLY RESET/GPIO PIN PA08 PA09 PA10 PA11 PA14 PA15 4.2 Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 7 5. Product Mapping Figure 5-1. Atmel SAM D09 Product Mapping Global Memory Space 0x00000000 Code 0x00000000 Internal Flash Code 0x20000000 0x00004000 Reserved SRAM 0x1FFFFFFF 0x20001000 Undefined 0x40000000 AHB-APB Bridge C SRAM 0x20000000 Peripherals 0x42000000 PAC2 0x42000400 Internal SRAM EVSYS 0x42000800 SERCOM0 0x20001000 0x43000000 0x42000C00 Reserved 0x60000000 AHB-APB SERCOM1 0x42001000 Reserved 0x40000000 AHB-APB Bridge A Undefined 0x42001400 Reserved 0x42001800 0x60000200 TC1 0x41000000 AHB-APB Bridge B Reserved 0xFFFFFFFF 0x42001C00 TC2 0x42002000 0x42000000 AHB-APB Bridge C 0x42FFFFFF ADC 0x42002400 Reserved 0x42002800 Reserved AHB-APB Bridge A 0x42002C00 AHB-APB Bridge B 0x41000000 0x40000000 PAC1 PAC0 DSU PM 0x41004000 0x40000800 NVMCTRL SYSCTRL 0x41004400 0x40000C00 PORT GCLK 0x41004800 0x40001000 DMAC WDT 0x41005000 0x40001400 Reserved RTC 0x41006000 0x40001800 MTB EIC 0x41004700 0x40001C00 Reserved 0x40FFFFFF Reserved 0x40FFFFFF 0x41002000 0x40000400 Reserved 0x42003000 Reserved 0x41FFFFFF Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 8 6. Processor And Architecture 6.1 Cortex M0+ Processor The Atmel SAM D09 implements the ARM® Cortex™-M0+ processor, which is based on the ARMv6 Architecture and Thumb®-2 ISA. The Cortex M0+ is 100% instruction set compatible with its predecessor, the Cortex-M0 processor, and upward compatible to Cortex-M3 and M4 processors. For more information refer to www.arm.com. 6.1.1 Cortex M0+ Configuration Features Configuration option Atmel SAM D09 configuration Interrupts External interrupts 0-32 32 Data endianness Little-endian or big-endian Little-endian SysTick timer Present or absent Present Number of watchpoint comparators 0, 1, 2 2 Number of breakpoint comparators 0, 1, 2, 3, 4 4 Halting debug support Present or absent Present Multiplier Fast or small Fast (single cycle) Single-cycle I/O port Present or absent Present Wake-up interrupt controller Supported or not supported Not supported Vector Table Offset Register Present or absent Present Unprivileged/Privileged support Present or absent Absent(1) Memory Protection Unit Not present or 8-region Not present Reset all registers Present or absent Absent Instruction fetch width 16-bit only or mostly 32-bit 32-bit Note: 1. All software run in privileged mode only The ARM Cortex-M0+ core has two bus interfaces: z Single 32-bit AMBA®-3 AHB-Lite™ system interface that provides connections to peripherals and all system memory, including flash and RAM z Single 32-bit I/O port bus interfacing to the PORT with one-cycle loads and stores Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 9 7. Packaging Information 7.1 Thermal Considerations 7.1.1 Thermal Resistance Data Table 6-1 on page 13 summarizes the thermal resistance data depending on the package. Table 7-1. 7.1.2 Thermal Resistance Data Package Type θJA θJC Units 24-pin QFN 61.7 25.4 °C/W 14-pin SOIC 58.5 26.3 °C/W Junction Temperature The average chip-junction temperature, TJ, in °C can be obtained from the following: Equation 1 T J = T A + ( P D × θ JA ) Equation 2 T J = T A + ( P D × ( θ HEATSINK + θ JC ) ) where: z θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 6-1 on page 13. z θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 6-1 on page 13. z θHEATSINK = cooling device thermal resistance (°C/W), provided in the device datasheet. z PD = device power consumption (W). z TA = ambient temperature (°C). From the Equation 1, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in °C. Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 10 7.2 Package Drawings 7.2.1 24-pin QFN Table 7-2. Device and Package Maximum Weight 44 mg Table 7-3. Package Characteristics Moisture Sensitivity Level Table 7-4. MSL3 Package Reference JEDEC Drawing Reference MO-220 JESD97 Classification E3 Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 11 Table 7-5. 7.2.2 14-pin SOIC Table 7-6. Device and Package Maximum Weight 230 mg Table 7-7. Package Characteristics Moisture Sensitivity Level Table 7-8. MSL3 Package Reference Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 12 JEDEC Drawing Reference MS-012 JESD97 Classification E3 Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 13 7.3 Soldering Profile The following table gives the recommended soldering profile from J-STD-20. Profile Feature Green Package Average Ramp-up Rate (217°C to peak) 3°C/s max Preheat Temperature 175°C +/-25°C 150-200°C Time Maintained Above 217°C 60-150s Time within 5°C of Actual Peak Temperature 30s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max Time 25°C to Peak Temperature 8 minutes max A maximum of three reflow passes is allowed per component. ___REV___373875 Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 14 Table of Contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1. Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 SAM D09C – 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 SAM D09D – 24-pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.1 4.2 SAM D09C 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 SAM D09D 24-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Product Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6. Processor And Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6.1 Cortex M0+ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.1 7.2 7.3 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Atmel | SMART SAM D09 [DATASHEET SUMMARY] Atmel-42414FS-SAM-D09-Summary_05/2016 15 ARM Connected Logo XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2016 Atmel Corporation. / Rev.: Atmel-42414FS-SAM-D09-Summary_05/2016. 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