ATF1504AS and ATF1504ASL High-performance Complex Programmable Logic Device DATASHEET Features High-density, High-performance, Electrically-erasable Complex Programmable Logic Device ̶ 64 Macrocells 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell 44, 84, 100 Pins 7.5ns Maximum Pin-to-pin Delay Registered Operation up to 125MHz Enhanced Routing Resources ̶ ̶ ̶ ̶ ̶ In-System Programmability (ISP) via JTAG Flexible Logic Macrocell ̶ D/T/Latch Configurable Flip-flops Global and Individual Register Control Signals Global and Individual Output Enable Programmable Output Slew Rate Programmable Output Open Collector Option Maximum Logic Utilization by Burying a Register with a COM Output ̶ ̶ ̶ ̶ ̶ Advanced Power Management Features ̶ ̶ Automatic μA Standby for “L” Version Pin-controlled 1mA Standby Mode Programmable Pin-keeper Circuits on Inputs and I/Os Reduced-power Feature per Macrocell ̶ ̶ Available in Commercial and Industrial Temperature Ranges Available in 44-lead and 84-lead PLCC; 44-lead and 100-lead TQFP Advanced EE Technology ̶ ̶ ̶ ̶ ̶ ̶ 100% Tested Completely Reprogrammable 10,000 Program/Erase Cycles 20 Year Data Retention 2000V ESD Protection 200mA Latch-up Immunity JTAG Boundary-scan Testing to IEEE Std. 1149.1-1990 and 1149.1a-1993 Supported PCI-compliant 3.3V or 5.0V I/O Pins Security Fuse Feature Green (Pb/Halide-free/RoHS Compliant) Package Options Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 Enhanced Features Improved Connectivity (Additional Feedback Routing, Alternate Input Routing) Output Enable Product Terms Transparent — Latch Mode Combinatorial Output with Registered Feedback within Any Macrocell Three Global Clock Pins ITD (Input Transition Detection) Circuits on Global Clocks, Inputs, and I/O Fast Registered Input from Product Term Programmable “Pin-keeper” Option VCC Power-up Reset Option Pull-up Option on JTAG Pins TMS and TDI Advanced Power Management Features ̶ ̶ ̶ Edge-controlled Power-down “L” Individual Macrocell Power Option Disable ITD on Global Clocks, Inputs, and I/O Description The Atmel ®ATF1504AS(L) is a high-performance, high-density Complex Programmable Logic Device (CPLD) which utilizes the Atmel proven electrically-erasable memory technology. With 64 logic macrocells and up to 68 inputs, it easily integrates logic from several TTL, SSI, MSI, LSI, and classic PLDs. The ATF1504AS(L) enhanced routing switch matrices increases usable gate count and the odds of successful pin-locked design modifications. The ATF1504AS(L) has up to 68 bi-directional I/O pins and four dedicated input pins, depending on the type of device package selected. Each dedicated pin can also serve as a global control signal, register clock, register reset, or output enable. Each of these control signals can be selected for use individually within each macrocell. Each of the 64 macrocells generates a buried feedback which goes to the global bus. Each input and I/O pin also feeds into the global bus. The switch matrix in each logic block then selects 40 individual signals from the global bus. Each macrocell also generates a foldback logic term which goes to a regional bus. Cascade logic between macrocells in the ATF1504AS(L) allows fast, efficient generation of complex logic functions. The ATF1504AS(L) contains four such logic chains; each capable of creating sum term logic with a fan-in of up to 40 product terms. The ATF1504AS(L) macrocell, shown in Figure 1, is flexible enough to support highly-complex logic functions operating at high speed. The macrocell consists of five sections: 2 Product Terms and Product Term Select Multiplexer OR/XOR/CASCADE Logic Flip-flop Output Select and Enable Logic Array Inputs ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 Figure 1. ATF1504AS(L) Macrocell ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 3 Pin Configurations and Pinouts Pinouts 44-lead TQFP 44-lead PLCC (Top View) (Top View) 33 32 31 30 29 28 27 26 25 24 23 1 2 3 4 5 6 7 8 9 10 11 TDI/I/O I/O I/O GND PD1/I/O I/O I/O/TMS I/O VCC I/O I/O I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O 39 38 37 36 35 34 33 32 31 30 29 I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 100-lead TQFP (Top View) (Top View) NC NC VCCIO I/O/TDI NC I/O NC I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O NC I/O NC I/O 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 GND NC NC I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O NC NC 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 I/O I/O GND I/O/TDO I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 I/O I/O I/O I/O GND I/O I/O I/O VCCINT GCLK2/OE2/I I/GCLR I/OE1 GCLK1/I GND GCLK3/I/O I/O I/O VCCIO 1/O I/O I/O 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O I/O I/O I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O NC NC I/O 84-lead PLCC I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O VCCIO I/O VCCIO I/O/TDI I/O I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O GND 7 8 9 10 11 12 13 14 15 16 17 I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 12 13 14 15 16 17 18 19 20 21 22 I/O/TDI I/O I/O GND PD1/I/O I/O TMS/I/O I/O VCC I/O I/O 6 5 4 3 2 1 44 43 42 41 40 44 43 42 41 40 39 38 37 36 35 34 I/O I/O I/O VCC GCLK2/OE2/I GCLR/I OE1/I GCLK1/I GND GCLK3/I/O I/O I/O I/O I/O VCC GCLK2/OE2/I GCLR/I I/OE1 GCLK1/I GND GCLK3/I/O I/O Figure 1-1. 18 19 20 21 22 23 24 25 26 27 28 1. Note: 4 Drawings are not to scale. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 I/O GND I/O/TDO NC I/O NC I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O NC I/O NC I/O VCCIO Block Diagram Figure 2-1. Block Diagram Regional Foldbacks Logic Block A Switch Matrix Global Clock Mux Logic Block C I/O Pins GCK[0:2] GCLEAR GCK[0:2] I/O (MC64)/GCLK3 Output Enable Switch Matrix I/O Pins GCLEAR Logic Block B I/O Pins Logic Block D GLOBAL BUS (INPUTS and FEEDBACKS BUS) I/O Pins GOE[0:5] Macrocells 1 to 16 GOE[0:5] 2. GCK[0:2] OE1/INPUT INPUT/GCLK1 INPUT/OE2/GCLK2 Global Clock Mux GCLEAR INPUT/GCLR Unused product terms are automatically disabled by the compiler to decrease power consumption. A security fuse, when programmed, protects the contents of the ATF1504AS(L). Two bytes (16 bits) of User Signature are accessible to the user for purposes such as storing project name, part number, revision, or date. The User Signature is accessible regardless of the state of the security fuse. The ATF1504AS(L) device is an In-System Programmable (ISP) device. It uses the industry-standard 4-pin JTAG interface (IEEE Std. 1149.1), and is fully-compliant with JTAG’s Boundary-scan Description Language (BSDL). ISP allows the device to be programmed without removing it from the printed circuit board. In addition to simplifying the manufacturing flow, ISP also allows design modifications to be made in the field via software. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 5 3. Macrocell Sections Table 3-1. Macrocell Sections Section Product Terms and Select Mux Description Each ATF1504AS(L) macrocell has five product terms. Each product term receives as its possible inputs all signals from both the global bus and regional bus. The Product Term Select Multiplexer (PTMUX) allocates the five product terms as needed to the macrocell logic gates and control signals. The PTMUX programming is determined by the design compiler, which selects the optimum macrocell configuration. The ATF1504AS(L) logic structure is designed to efficiently support all types of logic. Within a single macrocell, all the product terms can be routed to the OR gate, creating a 5-input AND/OR sum term. With the addition of the CASIN from neighboring macrocells, this can be expanded to as many as 40 product terms with a little small additional delay. OR/XOR/CASCADE Logic The macrocell’s XOR gate allows efficient implementation of compare and arithmetic functions. One input to the XOR comes from the OR sum term. The other XOR input can be a product term or a fixed high-level or low-level. For combinatorial outputs, the fixed level input allows polarity selection. For registered functions, the fixed levels allow DeMorgan minimization of product terms. The XOR gate is also used to emulate T-type and JK-type flip-flops. The ATF1504AS(L) flip-flop has very flexible data and control functions. The data input can come from either the XOR gate, from a separate product term, or directly from the I/O pin. Selecting the separate product term allows creation of a buried registered feedback within a combinatorial output macrocell. (This feature is automatically implemented by the fitter software). In addition to D, T, JK, and SR operation, the flip-flop can also be configured as a flow-through latch. In this mode, data passes through when the clock is high and is latched when the clock is low. Flip-flop The clock itself can either be one of the Global CLK Signals (GCK[0:2]) or an individual product term. The flip-flop changes state on the clock’s rising edge. When the GCK signal is used as the clock, one of the macrocell product terms can be selected as a clock enable. When the clock enable function is active and the enable signal (product term) is low, all clock edges are ignored. The flip-flop’s Asynchronous Reset signal (AR) can either be the Global Clear (GCLEAR), a product term, or always off. AR can also be a logic OR of GCLEAR with a product term. The Asynchronous Preset (AP) can be a product term or always off. The ATF1504AS(L) macrocell output can be selected as registered or combinatorial. The buried feedback signal can be either combinatorial or registered signal regardless of whether the output is combinatorial or registered. Output Select and Enable 6 The output enable multiplexer (MOE) controls the output enable signals. Any buffer can be permanently enabled for simple output operation. Buffers can also be permanently disabled to allow use of the pin as an input. In this configuration all the macrocell resources are still available, including the buried feedback, expander, and CASCADE logic. The output enable for each macrocell can be selected as either of the two dedicated OE input pins as an I/O pin configured as an input, or as an individual product term. Global Bus/Switch Matrix The global bus contains all input and I/O pin signals, as well as, the buried feedback signal from all 64 macrocells. The switch matrix in each logic block receives as its possible inputs all signals from the global bus. Under software control, up to 40 of these signals can be selected as inputs to the logic block. Foldback Bus Each macrocell also generates a foldback product term. This signal goes to the regional bus and is available to four macrocells. The foldback is an inverse polarity of one of the macrocell’s product terms. The sixteen foldback terms in each region allow generation of high fan-in sum terms (up to sixteen product terms) with a nominal additional delay. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 4. Programmable Pin-keeper Option for Inputs and I/Os The ATF1504AS(L) offers the option of programming all input and I/O pins so the pin-keeper circuits can be utilized. When any pin is driven high or low and then subsequently left floating, it will stay at that previous high-level or low-level. This circuitry prevents unused input and I/O lines from floating to intermediate voltage levels, which causes unnecessary power consumption and system noise. The keeper circuits eliminate the need for external pull-up resistors and eliminate their DC power consumption. Figure 4-1. Input Diagram VCC Input 100K ESD Protection Circuit Figure 4-2. Programmable Option I/O Diagram VCC OE Data I/O VCC 100K Programmable Option ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 7 5. Speed/Power Management The ATF1504AS(L) has several built-in speed and power management features. The ATF1504AS(L) contains circuitry which automatically puts the device into a low-power standby mode when no logic transitions are occurring. This not only reduces power consumption during inactive periods, but also provides proportional power savings for most applications running at system speeds below 5MHz. This feature may be selected as a device option. To further reduce power, each ATF1504AS(L) macrocell has a Reduced Power bit feature. This feature allows individual macrocells to be configured for maximum power savings. This feature may be selected as a design option. All ATF1504AS(L) have an optional power-down mode. In this mode, current drops to below 10mA. When the power-down option is selected, either PD1 or PD2 pins (or both) can be used to power-down the part. The powerdown option is selected in the design source file. When enabled, the device goes into power-down when either PD1 or PD2 is high. In the power-down mode, all internal logic signals are latched and held, as are any enabled outputs. All pin transitions are ignored until the PD pin is brought low. When the power-down feature is enabled, the PD1 or PD2 pin cannot be used as a logic input or output; however, the pin’s macrocell may still be used to generate buried foldback and cascade logic signals. All power-down AC characteristic parameters are computed from external input or I/O pins, with Reduced Power bit turned on. For macrocells in reduced-power mode (Reduced Power bit turned on), the reduced-power adder, tRPA, must be added to the AC parameters, which include the data paths tLAD, tLAC, tIC, tACL, tACH, and tSEXP. The ATF1504AS(L) macrocell also has an option whereby the power can be reduced on a per macrocell basis. By enabling this power-down option, macrocells that are not used in an application can be turned-down, thereby reducing the overall power consumption of the device. Each output also has individual slew rate control. This may be used to reduce system noise by slowing down outputs that do not need to operate at maximum speed. Outputs default to slow switching, and may be specified as fast switching in the design file. 6. Design Software Support ATF1504AS(L) designs are supported by several industry-standard third-party tools. Automated fitters allow logic synthesis using a variety of high level description languages and formats. 7. Power-up Reset The ATF1504AS(L) is designed with a power-up reset, a feature critical for state machine initialization. At a point delayed slightly from VCC crossing VRST, all registers will be initialized, and the state of each output will depend on the polarity of its buffer. However, due to the asynchronous nature of reset and uncertainty of how VCC actually rises in the system, the following conditions are required: The VCC rise must be monotonic, After reset occurs, all input and feedback setup times must be met before driving the clock pin high, and, The clock must remain stable during TD. The ATF1504AS(L) has two options for the hysteresis about the reset level, VRST, Small and Large. During the fitting process users may configure the device with the Power-up Reset hysteresis set to Large or Small. Atmel POF2JED users may select the Large option by including the flag “-power_reset” on the command line after “filename.POF”. To allow the registers to be properly reinitialized with the Large hysteresis option selected, the following condition is added: If VCC falls below 2.0V, it must shut off completely before the device is turned on again. When the Large hysteresis option is active, ICC is reduced by several hundred micro amps as well. 8 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 8. Security Fuse Usage A single fuse is provided to prevent unauthorized copying of the ATF1504AS(L) fuse patterns. Once programmed, fuse verify is inhibited; however, the 16-bit User Signature remains accessible. 9. Programming ATF1504AS(L) devices are In-System Programmable (ISP) devices utilizing the 4-pin JTAG protocol. This capability eliminates package handling normally required for programming and facilitates rapid design iterations and field changes. Atmel provides ISP hardware and software to allow programming of the ATF1504AS(L) via the PC. ISP is performed by using either a download cable or a comparable board tester or a simple microprocessor interface. To facilitate ISP programming by the Automated Test Equipment (ATE) vendors. Serial Vector Format (SVF) files can be created by Atmel provided software utilities. ATF1504AS(L) devices can also be programmed using standard third-party programmers. With third-party programmer, the JTAG ISP port can be disabled thereby allowing four additional I/O pins to be used for logic. Contact your local Atmel representatives or Atmel PLD applications for details. 10. ISP Programming Protection The ATF1504AS(L) has a special feature which locks the device and prevents the inputs and I/O from driving if the programming process is interrupted for any reason. The inputs and I/O default to high-Z state during such a condition. In addition, the pin-keeper option preserves the former state during device programming if this circuit were previously programmed on the device. This prevents disturbing the operation of other circuits in the system while the ATF1504AS(L) is being programmed via ISP. All ATF1504AS(L) devices are initially shipped in the erased state thereby making them ready to use for ISP. Note: For more information refer to the “Designing for In-System Programmability with Atmel CPLDs” application note. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 9 11. Electrical Characteristics 11.1 Absolute Maximum Ratings* Temperature Under Bias . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on Any Pin with Respect to Ground . . . . . . . . . . . . . . . . . . . .-2.0V to +7.0V(1) Voltage on Input Pins with Respect to Ground During Programming . . . . . . . . .-2.0V to +14.0V(1) *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Programming Voltage with Respect to Ground . . . . . . . . . . . . . . . . . . .-2.0V to +14.0V(1) Note: 11.2 1. Pin Capacitance Table 11-1. Pin Capacitance(1) Typ Max Units Conditions CIN 8 10 pF VIN = 0V; f = 1MHz CI/O 8 10 pF VOUT = 0V; f = 1MHz Note: 11.3 Minimum voltage is -0.60VDC, which may undershoot to -2.0V for pulses of less than 20ns. Maximum output pin voltage is VCC + 0.75VDC, which may overshoot to 7.0V for pulses of less than 20ns. 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. The OGI pin (high-voltage pin during programming) has a maximum capacitance of 12pF. DC and AC Operating Conditions Table 11-2. DC and AC Operating Conditions Operating Temperature (Ambient) VCCINT or VCCIO (5.0V) Power Supply VCCIO (3.3V) Power Supply 10 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 Commercial Industrial 0C to 70C -40C to 85C 5.0V± 5% 5.0V± 10% 3.0V to 3.6V 3.0V to 3.6V 11.4 DC Characteristics Table 11-3. DC Characteristics Symbol Parameter Condition IIL Input or I/O Low Leakage Current VIN = VCC IIH Input or I/O High Leakage Current IOZ Tri-state Output Off-state Current Min VO = VCC or GND Std Mode Power Supply Current, Standby ICC1 VCC = Max VIN = 0, VCC “L” Mode ICC2 Power Supply Current, Power-down Mode VCC = Max VIN = 0, VCC “PD” Mode ICC3(2) Current in Reduced-power Mode VCC = Max VIN = 0, VCC Std Power VCCIO Supply Voltage 5.0V Device Output VCCIO Supply Voltage 3.3V Device Output VIL VIH Notes: 1. 2. Max Units -2 -10 μA 2 10 -40 40 μA Com. 105 mA Ind. 130 mA Com. 10 μA Ind. 10 μA 1 Com 85 Ind 105 10 mA ma Com. 4.75 5.25 V Ind. 4.50 5.50 V 3.00 3.60 V Input Low Voltage -0.30 0.80 V Input High Voltage 2.00 VCCIO + 0.3 V 0.45 V Output Low Voltage (TTL) VIN = VIH or VIL VCCIO = Min, IOL = 12mA Com. Output Low Voltage (CMOS) VIN = VIH or VIL VCC = Min, IOL = 0.1mA Com. 0.20 V Ind. 0.20 V Output High Voltage (TTL) VIN = VIH or VIL VCCIO = Min, IOH = -4.0mA VOL VOH Typ Ind. 2.4 V Not more than one output at a time should be shorted. Duration of short circuit test should not exceed 30s. When macrocell reduced-power feature is enabled. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 11 11.5 AC Characteristics AC Characteristics(1)(2) Table 11-4. -7 -25 Symbol Parameter tPD1 Input or Feedback to Non-registered Output tPD2 I/O Input or Feedback to Non-registered Feedback tSU Global Clock Setup Time 6 7 20 ns tH Global Clock Hold Time 0 0 0 ns tFSU Global Clock Setup Time of Fast Input 3 3 5 ns tFH Global Clock Hold Time of Fast Input 0.5 0.5 2 ns tCOP Global Clock to Output Delay tCH Global Clock High Time 3 4 7 ns tCL Global Clock Low Time 3 4 7 ns tASU Array Clock Setup Time 3 3 5 ns tAH Array Clock Hold Time 2 3 6 ns tACOP Array Clock Output Delay tACH Array Clock High Time 3 4 10 ns tACL Array Clock Low Time 3 4 10 ns tCNT Minimum Clock Global Period fCNT Maximum Internal Global Clock Frequency tACNT Minimum Array Clock Period fACNT Maximum Internal Array Clock Frequency fMAX Maximum Clock Frequency tIN Input Pad and Buffer Delay 0.5 0.5 2 ns tIO I/O Input Pad and Buffer Delay 0.5 0.5 2 ns tFIN Fast Input Delay 1 1 2 ns tSEXP Foldback Term Delay 4 5 12 ns tPEXP Cascade Logic Delay 0.8 0.8 1.2 ns tLAD Logic Array Delay 3 5 8 ns Notes: 12 -10 1. 2. Min Max Min Max Min Max Units 7.5 10 25 ns 7 9 25 ns 4.5 5 7.5 10 8 125 13 25 10 100 8 22 50 10 ns ns ns MHz 22 ns 125 100 50 MHz 166.7 125 60 MHz See ordering information for valid part numbers. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reduced-power mode. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 AC Characteristics(1)(2) (Continued) Table 11-4. -7 -10 Symbol Parameter tLAC Logic Control Delay 3 tIOE Internal Output Enable Delay tOD1 Max Units 5 8 ns 2 2 4 ns Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 5.0V; CL = 35pF) 2 1.5 6 ns tOD2 Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35pF) 2.5 2.0 7 ns tOD3 Output Buffer and Pad Delay (Slow slew rate = ON; VCCIO = 5.0V or 3.3V; CL = 35pF) 5 5.5 10 ns tZX1 Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 5.0V; CL = 35pF) 4.0 5.0 10 ns tZX2 Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35pF) 4.5 5.5 10 ns tZX3 Output Buffer Enable Delay (Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35pF) 9 9 12 ns tXZ Output Buffer Disable Delay (CL = 5pF) 4 5 8 ns tSU Register Setup Time 3 3 6 ns tH Register Hold Time 2 3 6 ns tFSU Register Setup Time of Fast Input 3 3 3 ns tFH Register Hold Time of Fast Input 0.5 0.5 2.5 ns tRD Register Delay 1 2 2 ns tCOMB Combinatorial Delay 1 2 2 ns tIC Array Clock Delay 3 5 8 ns tEN Register Enable Time 3 5 8 ns tGLOB Global Control Delay 1 1 1 ns tPRE Register Preset Time 2 3 6 ns tCLR Register Clear Time 2 3 6 ns tUIM Switch Matrix Delay 1 1 2 ns tRPA Reduced-power Adder(2) 10 11 15 ns Notes: 1. 2. Min Max Min -25 Max Min See ordering information for valid part numbers. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reduced-power mode. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 13 12. Timing Model Figure 12-1. Timing Model Internal Output Enable Delay tIOE Global Control Delay tGLOB Input Delay tIN Logic Array Delay tLAD Switch Matrix tUIM Register Control Delay tLAC tIC tEN Foldback Term Delay tSEXP 12.1 Input Test Waveforms and Measurement Levels 3.0V AC Driving Levels 1.5V 0.0V Note: tR, tF = 1.5ns typical Output AC Test Loads Figure 12-3. Output AC Test Loads 5.0V R1 = 464Ω Output Pin R2 = 250Ω 14 Fast Input Delay tFIN Input Test Waveforms and Measurement Levels Figure 12-2. 12.2 Cascade Logic Delay tPEXP CL = 35pF ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 AC Measurement Level Register Delay tSU tH tPRE tCLR tRD tCOMB tFSU tFH Output Delay tOD1 tOD2 tOD3 tXZ tZX1 tZX2 tZX3 I/O Delay tIO 12.3 Power-down Mode The ATF1504AS(L) includes an optional pin-controlled power-down feature. When this mode is enabled, the PD pin acts as the power-down pin. When the PD pin is high, the device supply current is reduced to less than 10mA. During power-down, all output data and internal logic states are latched internally and held; therefore, all registered and combinatorial output data remain valid. Any outputs that were in a high-Z state at the onset will remain at high-Z. During power-down, all input signals except the power-down pin are blocked. Input and I/O hold latches remain active to ensure pins do not float to indeterminate levels, further reducing system power. The power-down mode feature is enabled in the logic design file or as a fitted or translated s/w option. Designs using the power-down pin may not use the PD pin as a logic array input; however, all other PD pin macrocell resources may still be used, including the buried feedback and foldback product term array inputs. 12.3.1 Power-down AC Characteristics Table 12-1. Power-down AC Characteristics(1)(2) -7 Symbol Parameter tIVDH Valid I, I/O before PD High (2) Min Max Min -15 Max Min -20 Max Min -25 Max Min Max Units 7 10 15 20 25 ns 7 10 15 20 25 ns 7 10 15 20 25 ns tGVDH Valid OE tCVDH Valid Clock(2) before PD High tDHIX I, I/O Don’t Care after PD High 12 15 25 30 35 ns tDHGX OE(2) Don’t Care after PD High 12 15 25 30 35 ns 12 15 25 30 35 ns (2) before PD High -10 tDHCX Clock tDLIV PD Low to Valid I, I/O 1 1 1 1 1 μs tDLGV PD Low to Valid OE (Pin or Term) 1 1 1 1 1 μs tDLCV PD Low to Valid Clock (Pin or Term) 1 1 1 1 1 μs tDLOV PD Low to Valid Output 1 1 1 1 1 μs Notes: 1. 2. 3. Don’t Care after PD High For slow slew outputs, add tSSO. Pin or product term. Includes tRPA due to reduced power bit enabled. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 15 13. JTAG-BST/ISP Overview The JTAG boundary-scan testing is controlled by the Test Access Port (TAP) controller in the ATF1504AS(L). The boundary-scan technique involves the inclusion of a shift-register stage (contained in a boundary-scan cell) adjacent to each component so signals at component boundaries can be controlled and observed using scan testing principles. Each input pin and I/O pin has its own Boundary-Scan Cell (BSC) in order to support boundary scan testing. The ATF1504AS(L) does not currently include a Test Reset (TRST) input pin because the TAP controller is automatically reset at power-up. The five JTAG modes supported include: SAMPLE/PRELOAD EXTEST BYPASS IDCODE HIGHZ The ATF1504AS(L) ISP can fully be described using JTAG’s BSDL as described in IEEE Standard 1149.1b. This allows ATF1504AS(L) programming to be described and implemented using any one of the third-party development tools supporting this standard. The ATF1504AS(L) has the option of using four JTAG-standard I/O pins for boundary-scan testing (BST) and in-System Programming (ISP) purposes. The ATF1504AS(L) is programmable through the four JTAG pins using the IEEE standard JTAG programming protocol established by IEEE Standard 1149.1 using 5V TTL-level programming signals from the ISP interface for in-system programming. The JTAG feature is a programmable option. If JTAG (BST or ISP) is not needed, then the four JTAG control pins are available as I/O pins. 14. JTAG Boundary-Scan Cell (BSC) Testing The ATF1504AS(L) contains up to 68 I/O pins and four input pins depending on the device type and package type selected. Each input pin and I/O pin has its own BSC in order to support boundary-scan testing as described in detail by IEEE Standard 1149.1. A typical BSC consists of three capture registers or scan registers and up to two update registers. There are two types of BSCs, one for input or I/O pin and one for the macrocells. The BSCs in the device are chained together through the capture registers. Input to the capture register chain is fed in from the TDI pin while the output is directed to the TDO pin. Capture registers are used to capture active device data signals, to shift data in, and out of the device, and to load data into the update registers. Control signals are generated internally by the JTAG TAP controller. The BSC configuration for the input and I/O pins and macrocells are shown below. Figure 14-1. BSC Configuration for Input and I/O Pins (Except JTAG TAP Pins) Dedicated Input To Internal Logic 0 D 1 Q TDO Capture Registers Clock Shift TDI (From Next Register) Note: 16 The ATF1504AS(L) has pull-up option on TMS and TDI pins. This feature is selected as a design option. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 Figure 14-2. BSC Configuration for Macrocell Pin BSC TDO 0 Pin D Q 1 Capture DR Clock TDI Shift TDO OEJ 0 0 1 D Q D Q 1 OUTJ 0 0 Pin 1 D Q D Q Capture DR Update DR 1 TDI Mode Shift Clock Macrocell BSC ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 17 15. PCI Compliance The ATF1504AS(L) supports the growing need in the industry to support the new Peripheral Component Interconnect (PCI) interface standard in PCI-based designs and specifications. The PCI interface calls for high current drivers, which are much larger than the traditional TTL drivers. In general, PLDs and FPGAs parallel outputs to support the high current load required by the PCI interface. The ATF1504AS(L) allows this without contributing to system noise while delivering low output-to-output skew. Having a programmable high drive option is also possible without increasing output delay or pin capacitance. Figure 15-1. PCI Voltage-to-current Curves for +5.0V Signaling in Pull-up Mode Figure 15-2. PCI Voltage-to-current Curves for +5.0V Signaling in Pull-down Mode Pull Down Pull Up VCC VCC 2.4 2.2 DC drive point DC drive point 1.4 0.55 AC drive point -2 Table 15-1. Test Point -44 Current (mA) -178 3,6 95 Current (mA) 380 PCI DC Characteristics Symbol Parameter Min Max Units VCC Supply Voltage 4.75 5.25 V VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.5 0.8 V IIH Input High Leakage Current VIN = 2.7V 70 μA IIL Input Low Leakage Current VIN = 0.5V -70 μA VOH Output High Voltage IOUT = -2mA VOL Output Low Voltage IOUT = 3mA, 6mA Conditions CIN 2.4 V 0.55 V Input Pin Capacitance 10 pF CCLK CLK Pin Capacitance 12 pF CIDSEL IDSEL Pin Capacitance 8 pF LPIN Pin Inductance 20 nH Note: 18 AC drive point Voltage Voltage Test Point 1. Leakage current is with pin-keeper off. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 Table 15-2. Symbol PCI AC Characteristics Parameter Switching Current High (Test High) IOH(AC) Conditions Min 0 < VOUT 1.4 -44 mA -44+(VOUT - 1.4)/0.024 mA 1.4 < VOUT < 2.4 Max 3.1 < VOUT < VCC VOUT = 3.1V VOUT >2.2V Switching Current Low (Test Point) IOL(AC) 2.2 > VOUT > 0 Units Equation A mA -142 μA 95 mA VOUT/0.023 mA 0.1 > VOUT > 0 VOUT = 0.71 Equation B mA 206 mA ICL Low Clamp Current -5 < VIN -1 SLEWR Output Rise Slew Rate 0.4V to 2.4V load 0.5 3 V/ns SLEWF Output Fall Slew Rate 2.4V to 0.4V load 0.5 3 V/ns Notes: 1. 2. -25+(VIN + 1)/0.015 mA Equation A: IOH = 11.9 (VOUT - 5.25) * (VOUT + 2.45) for VCC > VOUT > 3.1V. Equation B: IOL = 78.5 * VOUT * (4.4 - VOUT) for 0V < VOUT < 0.71V. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 19 16. Pinouts 16.1 ATF1504AS(L) Dedicated Pinouts 44-lead TQFP 44-lead J-lead 84-lead J-lead 100-lead TQFP INPUT/OE2/GCLK2 40 2 2 90 INPUT/GCLR 39 1 1 89 INPUT/OE1 38 44 84 88 INPUT/GCLK1 37 43 83 87 I/O /GCLK3 35 41 81 85 I/O/PD (1,2) 5, 19 11, 25 20, 46 12, 42 I/O/TDI (JTAG) 1 7 14 4 I/O/TMS (JTAG) 7 13 23 15 I/O/TCK (JTAG) 26 32 62 62 I/O/TDO (JTAG) 32 38 71 73 GND 4, 16, 24, 36 10, 22, 30, 42 7, 19, 32, 42, 47, 59, 72, 82 11, 26, 38, 43, 59, 74, 86, 95 VCCINT 9, 17, 29, 41 3, 15, 23, 35 3, 43 39, 91 VCCIO — — 13, 26, 38, 53, 66, 78 3, 18, 34, 51, 66, 82 N/C — — — 1, 2, 5, 7, 22, 24, 27, 28, 49, 50, 53, 55, 70, 72, 77, 78 # of Signal Pins 36 36 68 68 # User I/O Pins 32 32 64 64 Dedicated Pin Note: 20 OE (1, 2) . . . . . . . . . . . . . GCLR . . . . . . . . . . . . . . . GCLK (1, 2, 3) . . . . . . . . . PD (1, 2) . . . . . . . . . . . . . TDI, TMS, TCK, TDO . . . GND . . . . . . . . . . . . . . . . VCCINT . . . . . . . . . . . . . . . VCCIO . . . . . . . . . . . . . . . . Global OE Pins Global Clear Pin Global Clock Pins Power-down pins JTAG pins used for boundary-scan testing or in-system programming Ground Pins VCC pins for the device (+5V - Internal) VCC pins for output drivers (for I/O pins) (+5V or 3.3V - I/Os) ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 16.2 ATF1504AS(L) I/O Pinouts MC PLC 44-lead PLCC 44-lead TQFP 84-lead PLCC 100-lead TQFP MC PLC 44-lead PLCC 44-lead TQFP 84-lead PLCC 100-lead TQFP 1 A 12 6 22 14 33 C 24 18 44 40 2 A — — 21 13 34 C — — 45 41 3 A/PD1 11 5 20 12 35 C/PD2 25 19 46 42 4 A 9 3 18 10 36 C 26 20 48 44 5 A 8 2 17 9 37 C 27 21 49 45 6 A — — 16 8 38 C — — 50 46 7 A — — 15 6 39 C — — 51 47 8/TDI A 7 1 14 4 40 C 28 22 52 48 9 A — — 12 100 41 C 29 23 54 52 10 A — — 11 99 42 C — — 55 54 11 A 6 44 10 98 43 C — — 56 56 12 A — — 9 97 44 C — — 57 57 13 A — — 8 96 45 C — — 58 58 14 A 5 43 6 94 46 C 31 25 60 60 15 A — — 5 93 47 C — — 61 61 16 A 4 42 4 92 48/TCK C 32 26 62 62 17 B 21 15 41 37 49 D 33 27 63 63 18 B — — 40 36 50 D — — 64 64 19 B 20 14 39 35 51 D 34 28 65 65 20 B 19 13 37 33 52 D 36 30 67 67 21 B 18 12 36 32 53 D 37 31 68 68 22 B — — 35 31 54 D — — 69 69 23 B — — 34 30 55 D — — 70 71 24 B 17 11 33 29 56/TDO D 38 32 71 73 25 B 16 10 31 25 57 D 39 33 73 75 26 B — — 30 23 58 D — — 74 76 27 B — — 29 21 59 D — — 75 79 28 B — — 28 20 60 D — — 76 80 29 B — — 27 19 61 D — — 77 81 30 B 14 8 25 17 62 D 40 34 79 83 31 B — — 24 16 63 D — — 80 84 32/TMS B 13 7 23 15 64 D/GCLK3 41 35 81 85 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 21 22 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 23 24 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 17. Ordering Information 17.1 Green Package Options (Pb/Halide-free/RoHS Compliant) tPD (ns) 7.5 10 25 tCO1 (ns) 4.5 5 15 fMAX (MHz) 166.7 125 70 Ordering Code Package ATF1504AS-7AX44 44A ATF1504AS-7JX44 44J Commercial (0C to 70C) ATF1504AS-7AX100 100A ATF1504AS-10AU44 44A ATF1504AS-10JU44 44J ATF1504AS-10AU100 Industrial (-40C to +85C) 100A ATF1504AS-10JU84 84J ATF1504ASL-25AU44 44A ATF1504ASL-25JU44 44J ATF1504ASL-25AU100 Operation Range Industrial (-40C to +85C) 100A Package Type 44A 44-lead, Thin Plastic Gull Wing Quad Flatpack Package (TQFP) 44J 44-lead, Plastic J-leaded Chip Carrier (PLCC) 84J 84-lead, Plastic J-leaded Chip Carrier (PLCC) 100A 100-lead, 14 x 14mm body, Thin Profile Plastic Quad Flat Package (TQFP) ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 25 18. Packaging Information 18.1 44A — 44-lead TQFP D1 D e E E1 b BOTTOM VIEW TOP VIEW C 0°~7° A1 L A2 A SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. SYMBOL MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 11.75 12.00 12.25 D1 9.90 10.00 10.10 E 11.75 12.00 12.25 E1 9.90 10.00 10.10 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e NOTE Note 2 Note 2 0.80 TYP 1/10/13 Package Drawing Contact: [email protected] 26 ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 TITLE 44A, 44-lead 10.0 x 10.0x1.0 mm Body, 0.80 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) GPC DRAWING NO. REV. AIX 44A D 18.2 44J — 44-lead PLCC 1.14(0.045) X 45° PIN NO. 1 1.14(0.045) X 45° 0.318(0.0125) 0.191(0.0075) IDENTIFIER E1 E D2/E2 B1 B e A2 D1 A1 D A 0.51(0.020)MAX 45° MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 4.191 – 4.572 A1 2.286 – 3.048 A2 0.508 – – D 17.399 – 17.653 D1 16.510 – 16.662 E 17.399 – 17.653 E1 16.510 – 16.662 D2/E2 14.986 – 16.002 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 DRAWING NO. REV. TITLE Package Drawing Contact: [email protected] 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) 44J ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 B 27 18.3 84J — 84-lead PLCC 1.14(0.045) X 45° PIN NO. 1 1.14(0.045) X 45° 0.318(0.0125) 0.191(0.0075) IDENTIFIER E1 E D2/E2 B1 B e A2 D1 A1 D A 0.51(0.020)MAX 45° MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-018, Variation AF. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 4.191 – 4.572 A1 2.286 – 3.048 A2 0.508 – – D 30.099 – 30.353 D1 29.210 – 29.413 E 30.099 – 30.353 E1 29.210 – 29.413 D2/E2 27.686 – 28.702 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 TITLE Package Drawing Contact: [email protected] 28 84J, 84-lead, Plastic J-leaded Chip Carrier (PLCC) ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 DRAWING NO. REV. 84J B 18.4 100A — 100-lead TQFP D D1 e E E1 b Bottom View Top View A2 C 0°~7° COMMON DIMENSIONS (Unit of Measure = mm) L A1 A Side View SYMBOL MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 16.00 BSC D1 14.00 BSC E 16.00 BSC E1 Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. Note 2 14.00 BSC b 0.17 C L e NOTE Note 2 0.22 0.27 0.09 – 0.20 0.45 0.60 0.75 0.50 TYP 09/26/11 Package Drawing Contact: [email protected]tmel.com TITLE 100A, 100-lead 14.0 x 14.0 x 1.0 mm Body, 0.50 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) GPC DRAWING NO. REV. AAD 100A D ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 29 19. Revision History Doc. Rev. Date Comments Add ATF1504AS-7AX100 ordering code. 0950P 03/2014 Remove 68-pin PLCC and 100-pin PQFP packages and -15 and -20ns speed grades. Update template, logo, and disclaimer page. 0950O 30 07/2006 Add Green package options. ATF1504AS(L) [DATASHEET] Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2014 Atmel Corporation. / Rev.: Atmel-0950P-CPLD-ATF1504AS(L)-Datasheet_032014. Atmel®, Atmel logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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