AT24C01A/02/04/08A/16A - Mature

Features
• Low-voltage and Standard-voltage Operation
•
•
•
•
•
•
•
•
•
•
•
•
•
– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),
1024 x 8 (8K) or 2048 x 8 (16K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
Automotive Devices Available
8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead
SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
Two-wire
Serial EEPROM
1K (128 x 8)
2K (256 x 8)
4K (512 x 8)
8K (1024 x 8)
Description
The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial
electrically erasable and programmable read-only memory (EEPROM) organized as
128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage operation
are essential. The AT24C01A/02/04/08A/16A is available in space-saving 8-lead
PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3) , 5-lead SOT23
(AT24C01A/AT24C02/AT24C04), 8-lead TSSOP, and 8-ball dBGA2 packages and is
accessed via a Two-wire serial interface. In addition, the entire family is available in
2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.
8-lead TSSOP
Table 1. Pin Configuration
Pin Name
Function
A0 - A2
Address Inputs
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
NC
No Connect
GND
Ground
VCC
Power Supply
A0
A1
A2
GND
8
7
6
5
1
2
3
4
VCC
WP
SCL
SDA
8-ball dBGA2
VCC
WP
SCL
SDA
8
1
7
2
6
3
5
4
A0
A1
A2
GND
Bottom View
8-lead SOIC
A0
A1
A2
GND
1
2
3
4
8
7
6
5
8
7
6
5
VCC
WP
SCL
SDA
8-lead Ultra Thin Mini-MAP
(MLP 2x3)
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
A0
A1
A2
GND
Bottom View
5-lead SOT23
8-lead PDIP
A0
A1
A2
GND
1
2
3
4
VCC
WP
SCL
SDA
SCL
1
GND
2
SDA
3
5
WP
4
VCC
16K (2048 x 8)
AT24C01A(1)
AT24C02(2)
AT24C04
AT24C08A
AT24C16A(3)
Notes:
1. Not Recommended for
new design; Please
refer to AT24C01B
datasheet.
2. Not Recommended for
new design; Please
refer to AT24C02B
datasheet.
3. Not Recommended for
new design; Please
refer to AT24C16B
datasheet
0180Z1–SEEPR–5/07
1
Absolute Maximum Ratings
Operating Temperature..................................–55°C to +125°C
Storage Temperature .....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground .................................... –1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Figure 1. Block Diagram
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AT24C01A/02/04/08A/16A
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or opencollector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device
address inputs that are hard wired for the AT24C01A and the AT24C02. As many as
eight 1K/2K devices may be addressed on a single bus system (device addressing is
discussed in detail under the Device Addressing section).
The AT24C04 uses the A2 and A1 inputs for hard wire addressing and a total of four 4K
devices may be addressed on a single bus system. The A0 pin is a no connect and can
be connected to ground.
The AT24C08A only uses the A2 input for hardwire addressing and a total of two 8K
devices may be addressed on a single bus system. The A0 and A1 pins are no connects
and can be connected to ground.
The AT24C16A does not use the device address pins, which limits the number of
devices on a single bus to one. The A0, A1 and A2 pins are no connects and can be
connected to ground.
WRITE PROTECT (WP): The AT24C01A/02/04/08A/16A has a Write Protect pin that
provides hardware data protection. The Write Protect pin allows normal Read/Write
operations when connected to ground (GND). When the Write Protect pin is connected
to VCC, the write protection feature is enabled and operates as shown in Table 2.
Table 2. Write Protect
WP Pin
Status
Memory Organization
Part of the Array Protected
24C01A
24C02
At VCC
Full (1K)
Array
Full (2K)
Array
At GND
Normal Read/Write Operations
24C04
Full (4K)
Array
24C08A
Full (8K)
Array
24C16A
Full (16K)
Array
AT24C01A, 1K SERIAL EEPROM: Internally organized with 16 pages of 8 bytes each,
the 1K requires a 7-bit data word address for random word addressing.
AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each,
the 2K requires an 8-bit data word address for random word addressing.
AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each,
the 4K requires a 9-bit data word address for random word addressing.
AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes
each, the 8K requires a 10-bit data word address for random word addressing.
AT24C16A, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes
each, the 16K requires an 11-bit data word address for random word addressing.
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0180Z1–SEEPR–5/07
Table 3. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V
Symbol
Test Condition
CI/O
CIN
Note:
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (A0, A1, A2, SCL)
6
pF
VIN = 0V
1. This parameter is characterized and is not 100% tested.
Table 4. DC Characteristics
Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +1.8V to +5.5V
(unless otherwise noted)
Symbol
Parameter
VCC1
Supply Voltage
VCC2
Max
Units
1.8
5.5
V
Supply Voltage
2.7
5.5
V
VCC3
Supply Voltage
4.5
5.5
V
ICC
Supply Current VCC = 5.0V
READ at 100 kHz
0.4
1.0
mA
ICC
Supply Current VCC = 5.0V
WRITE at 100 kHz
2.0
3.0
mA
ISB1
Standby Current VCC = 1.8V
VIN = VCC or VSS
0.6
3.0
µA
ISB2
Standby Current VCC = 2.5V
VIN = VCC or VSS
1.4
4.0
µA
ISB3
Standby Current VCC = 2.7V
VIN = VCC or VSS
1.6
4.0
µA
ISB4
Standby Current VCC = 5.0V
VIN = VCC or VSS
8.0
18.0
µA
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
µA
ILO
Output Leakage Current
VOUT = VCC or VSS
0.05
3.0
µA
VIL
Input Low Level(1)
–0.6
VCC x 0.3
V
VIH
Input High Level(1)
VCC x 0.7
VCC + 0.5
V
VOL2
Output Low Level VCC = 3.0V
IOL = 2.1 mA
0.4
V
VOL1
Output Low Level VCC = 1.8V
IOL = 0.15 mA
0.2
V
Note:
4
Test Condition
Min
Typ
1. VIL min and VIH max are reference only and are not tested.
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
Table 5. AC Characteristics
Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V,
CL = 1 TTL Gate and 100 pF (unless otherwise noted)
1.8-volt
Symbol
Parameter
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
tHIGH
Clock Pulse Width High
Min
2.7, 5.0-volt
Max
Min
100
Max
Units
400
kHz
4.7
1.2
µs
4.0
0.6
µs
(1)
tI
Noise Suppression Time
tAA
Clock Low to Data Out Valid
0.1
tBUF
Time the bus must be free before
a new transmission can start(1)
4.7
1.2
µs
tHD.STA
Start Hold Time
4.0
0.6
µs
tSU.STA
Start Setup Time
4.7
0.6
µs
tHD.DAT
Data In Hold Time
0
0
µs
tSU.DAT
Data In Setup Time
200
100
ns
tR
Inputs Rise Time(1)
1.0
0.3
µs
tF
Inputs Fall Time(1)
300
300
ns
tSU.STO
Stop Setup Time
4.7
0.6
µs
tDH
Data Out Hold Time
100
50
ns
tWR
Write Cycle Time
Endurance(1)
5.0V, 25°C, Byte Mode
Note:
100
4.5
0.1
5
1M
50
ns
0.9
µs
5
1M
ms
Write
Cycles
1. This parameter is characterized.
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0180Z1–SEEPR–5/07
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see
Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop
condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (see Figure 5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.
After a read sequence, the stop command will place the EEPROM in a standby power
mode (see Figure 5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from
the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has
received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode
which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the
completion of any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2wire part can be reset by following these steps:
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition.
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AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
Bus Timing
Figure 2. SCL: Serial Clock, SDA: Serial Data I/O®
Write Cycle Timing
Figure 3. SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
8th BIT
ACK
WORDn
(1)
twr
STOP
CONDITION
Note:
START
CONDITION
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
Figure 4. Data Validity
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0180Z1–SEEPR–5/07
Figure 5. Start and Stop Definition
Figure 6. Output Acknowledge
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AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
Device Addressing
The 1K, 2K, 4K, 8K and 16K EEPROM devices all require an 8-bit device address word
following a start condition to enable the chip for a read or write operation (refer to Figure
7).
The device address word consists of a mandatory one, zero sequence for the first four
most significant bits as shown. This is common to all the EEPROM devices.
The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM.
These 3 bits must compare to their corresponding hard-wired input pins.
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a
memory page address bit. The two device address bits must compare to their corresponding hard-wired input pins. The A0 pin is no connect.
The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for
memory page addressing. The A2 bit must compare to its corresponding hard-wired
input pin. The A1 and A0 pins are no connect.
The 16K does not use any device address bits but instead the 3 bits are used for memory page addressing. These page addressing bits on the 4K, 8K and 16K devices
should be considered the most significant bits of the data word address which follows.
The A0, A1 and A2 pins are no connect.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is
not made, the chip will return to a standby state.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the
device address word and acknowledgment. Upon receipt of this address, the EEPROM
will again respond with a zero and then clock in the first 8-bit data word. Following
receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally timed write cycle, t WR , to the
nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will
not respond until the write is complete (see Figure 8 on page 11).
PAGE WRITE: The 1K/2K EEPROM is capable of an 8-byte page write, and the 4K, 8K
and 16K devices are capable of 16-byte page writes.
A page write is initiated the same as a byte write, but the microcontroller does not send
a stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to seven
(1K/2K) or fifteen (4K, 8K, 16K) more data words. The EEPROM will respond with a zero
after each data word received. The microcontroller must terminate the page write
sequence with a stop condition (see Figure 9 on page 11).
The data word address lower three (1K/2K) or four (4K, 8K, 16K) bits are internally
incremented following the receipt of each data word. The higher data word address bits
are not incremented, retaining the memory page row location. When the word address,
internally generated, reaches the page boundary, the following byte is placed at the
beginning of the same page. If more than eight (1K/2K) or sixteen (4K, 8K, 16K) data
words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten.
9
0180Z1–SEEPR–5/07
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond
with a zero allowing the read or write sequence to continue.
Read
Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll
over” during read is from the last byte of the last memory page to the first byte of the first page.
The address “roll over” during write is from the last byte of the current page to the first byte of
the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The
microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 10 on page 12).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition.
The microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 11 on page 12).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory
address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond
with a zero but does generate a following stop condition (see Figure 12 on page 12).
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AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
Figure 7. Device Address
MSB
8K
16K
Figure 8. Byte Write
Figure 9. Page Write
(* = DON’T CARE bit for 1K)
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0180Z1–SEEPR–5/07
Figure 10. Current Address Read
Figure 11. Random Read
(* = DON’T CARE bit for 1K)
Figure 12. Sequential Read
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AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
AT24C01A Ordering Information(1)
Ordering Code
Package
AT24C01A-10PU-2.7(2)
AT24C01A-10PU-1.8(2)
AT24C01A-10SU-2.7(2)
AT24C01A-10SU-1.8(2)
AT24C01A-10TU-2.7(2)
AT24C01A-10TU-1.8(2)
AT24C01A-10TSU-1.8(2)
AT24C01AU3-10UU-1.8(2)
AT24C01AY1-10YU-1.8(2) (Not recommended for new
design)
AT24C01AY6-10YH-1.8(3)
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
8U31
8Y1
8Y6
AT24C01A-W1.8-11(4)
Die Sale
Notes:
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
1. This device is not recommended for new design. Please refer to AT24C01B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1
8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7
Low-voltage (2.7V to 5.5V)
–1.8
Low-voltage (1.8V to 5.5V)
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0180Z1–SEEPR–5/07
AT24C02 Ordering Information(1)
Ordering Code
Package
(2)
AT24C02-10PU-2.7
AT24C02-10PU-1.8(2)
AT24C02N-10SU-2.7(2)
AT24C02N-10SU-1.8(2)
AT24C02-10TU-2.7(2)
AT24C02-10TU-1.8(2)
AT24C02Y1-10YU-1.8(2)
AT24C02-10TSU-1.8(2)
AT24C02U3-10UU-1.8(2)
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
5TS1
8U3-1
AT24C02-W2.7-11(3)
Die Sale
Notes:
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
1. This device is not recommended for new design. Please refer to AT24C02B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5TS1
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1
8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7
Low-voltage (2.7V to 5.5V)
–1.8
Low-voltage (1.8V to 5.5V)
14
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0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
AT24C04 Ordering Information(1)
Ordering Code
Package
(2)
AT24C04-10PU-2.7
AT24C04-10PU-1.8(2)
AT24C04N-10SU-2.7(2)
AT24C04N-10SU-1.8(2)
AT24C04-10TU-2.7(2)
AT24C04-10TU-1.8(2)
AT24C04Y1-10YU-1.8(2) (Not recommended for new design)
AT24C04Y6-10YH-1.8(3)
AT24C04-10TSU-1.8(2)
AT24C04U3-10UU-1.8(2)
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
5TS1
8U3-1
AT24C04-W1.8-11(4)
Die Sale
Notes:
1.
2.
3.
4.
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
“U” designates Green Package + RoHS compliant.
“H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1
8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7
Low-voltage (2.7V to 5.5V)
–1.8
Low-voltage (1.8V to 5.5V)
15
0180Z1–SEEPR–5/07
AT24C08A Ordering Information(1)
Ordering Code
Package
(2)
8P3
AT24C08A-10PU-1.8(2)
8P3
AT24C08A-10PU-2.7
AT24C08AN-10SU-2.7
(2)
8S1
AT24C08AN-10SU-1.8
(2)
8S1
AT24C08A-10TU-2.7
(2)
8A2
AT24C08A-10TU-1.8(2)
8A2
(2)
AT24C08AY1-10YU-1.8
(Not recommended for new design)
(3)
(2
1.
2.
3.
4.
8Y1
8U2-1
AT24C08A-W1.8-11(4)
Notes:
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
8Y6
AT24C08AY6-10YH-1.8
AT24C08AU2-10UU-1.8
Operation Range
Die Sale
Industrial Temperature
(–40°C to 85°C)
For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
“U” designates Green Package + RoHS compliant.
“H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
Package Type
8P3
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U2-1
8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7
Low Voltage (2.7V to 5.5V)
−1.8
Low Voltage (1.8V to 5.5V)
16
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
AT24C16A Ordering Information(1)
Ordering Code
(2)
AT24C16A-10PU-2.7
AT24C16A-10PU-1.8(2)
AT24C16AN-10SU-2.7(2)
AT24C16AN-10SU-1.8(2)
AT24C16A-10TU-2.7(2)
AT24C16A-10TU-1.8(2)
AT24C16AY1-10YU-1.8(2) (Not recommended for new
design)
AT24C16AY6-10YH-1.8(3)
AT24C16AU2-10UU-1.8(2)
AT24C16A-W1.8-11(3)
Notes:
Package
Operation Range
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
8U2-1
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
Die Sale
Industrial Temperature
(−40°C to 85°C)
1. This device is not recommended for new design. Please refer to AT24C16B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
Package Type
8P3
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y1
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8U2-1
8-ball, die Ball Grid Array Package (dBGA2)
Options
−2.7
Low Voltage (2.7V to 5.5V)
−1.8
Low Voltage (1.8V to 5.5V)
17
0180Z1–SEEPR–5/07
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
D1
A2 A
b2
L
b3
b
4 PLCS
Side View
SYMBOL
NOM
MAX
NOTE
2
A
–
–
0.210
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
3
D1
0.005
–
–
3
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
e
0.100 BSC
eA
0.300 BSC
L
Notes:
MIN
0.115
0.130
4
0.150
2
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
R
18
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
REV.
8P3
B
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
Side View
MIN
NOM
MAX
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.00
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
∅
0˚
–
8˚
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
8S1
REV.
B
19
0180Z1–SEEPR–5/07
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
A
b
MIN
NOM
MAX
NOTE
2.90
3.00
3.10
2, 5
3, 5
E
e
A2
D
6.40 BSC
E1
4.30
4.40
4.50
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
Side View
L
4
0.65 BSC
0.45
L1
0.60
0.75
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
R
20
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
REV.
B
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
8Y1 – MAP
PIN 1 INDEX AREA
A
1
3
2
4
PIN 1 INDEX AREA
E1
D1
D
L
8
Bottom View
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
NOM
MAX
A
–
–
0.90
A1
0.00
–
0.05
D
4.70
4.90
5.10
E
2.80
3.00
3.20
D1
0.85
1.00
1.15
E1
0.85
1.00
1.15
b
0.25
0.30
0.35
SYMBOL
Side View
5
e
End View
Top View
6
b
A1
E
7
e
L
NOTE
0.65 TYP
0.50
0.60
0.70
2/28/03
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package
(MAP) Y1
DRAWING NO.
REV.
8Y1
C
21
0180Z1–SEEPR–5/07
8Y6 − Mini-MAP (MLP 2x3 mm)
D2
A
b
(8X)
E
E2
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
A2
e (6X)
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
2.00 BSC
E
3.00 BSC
MAX
D2
1.40
1.50
1.60
E2
-
-
1.40
A
-
-
0.60
A1
0.0
0.02
0.05
A2
-
-
0.55
A3
L
b
NOTE
0.20 REF
0.20
e
Notes:
NOM
D
0.30
0.40
0.50 BSC
0.20
0.25
0.30
2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
8/26/05
R
22
2325 Orchard Parkway
San Jose, CA 95131
DRAWING NO.
TITLE
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
8Y6
Dual No Lead Package (DFN) ,(MLP 2x3)
REV.
C
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
5TS1 – SOT23
e1
C
4
5
E1
C
L
E
L1
1
3
2
End View
Top View
b
A2
Seating
Plane
e
A
A1
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
SYMBOL
MIN
NOM
MAX
A
–
–
1.10
A1
0.00
–
0.10
A2
0.70
0.90
1.00
c
0.08
–
0.20
NOTE
4
D
2.90 BSC
2, 3
E
2.80 BSC
2, 3
E1
1.60 BSC
2, 3
L1
0.60 REF
e
0.95 BSC
e1
1.90 BSC
b
0.30
–
0.50
4, 5
6/25/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
DRAWING NO.
PO5TS1
REV.
A
23
0180Z1–SEEPR–5/07
8U2 – dBGA2
E
Pin 1 Mark
this corner
D
Top View
- Z -
7
2
COMMON DIMENSIONS
(Unit of Measure = mm)
Øb
0
.
1
5
M
Z
0
.
0
8
M
Z
X
Y
#
1
#
8
SYMBOL
MIN
NOM
D
3
#
6
d
D1
e
E1
D1
1.43 TYP
E
4
A2
A
A1
Bottom View
Side View
3.25
E1
1.25 TYP
e
0.75 TYP
d
0.75 TYP
A
A1
0.90 REF
0.49
0.52
0.55
A2
0.35
0.38
0.41
Øb
0.47
0.50
0.53
Notes: 1. These drawings are for general information only. No JEDEC Drawing to refer to for additional information.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z.
TITLE
R
24
NOTE
5.10
#
5
MAX
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
02/04/02
DRAWING NO.
8U2, 8-ball 0.75 pitch, Die Ball Grid Array
Package (dBGA) AT24C512 (AT19870)
8U2
REV.
A
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
AT24C01A/02/04/08A/16A
8U3-1 – dBGA2
E
D
1.
b
A1
PIN 1 BALL PAD CORNER
A2
Top View
A
Side View
PIN 1 BALL PAD CORNER
1
2
3
4
8
7
6
5
(d1)
d
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
Bottom View
8 SOLDER BALLS
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
SYMBOL
MIN
NOM
MAX
A
0.71
0.81
0.91
A1
0.10
0.15
0.20
A2
0.40
0.45
0.50
b
0.20
0.25
0.30
D
NOTE
1.50 BSC
E
2.00 BSC
e
0.50 BSC
e1
0.25 REF
d
1.00 BSC
d1
0.25 REF
6/24/03
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
DRAWING NO.
REV.
PO8U3-1
A
25
0180Z1–SEEPR–5/07
Revision History
26
Doc. No.
Date
Comments
0180Z1
5/2007
Implemented revision history.
Changed formatting on page 16
AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
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0180Z1–SEEPR–5/07
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