AT32UC3C0512C/AT32UC3C1512C/AT32UC3C2512C - Summary

Features
• High Performance, Low Power 32-bit AVR® Microcontroller
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Compact Single-cycle RISC Instruction Set Including DSP Instruction Set
Built-in Floating-Point Processing Unit (FPU)
Read-Modify-Write Instructions and Atomic Bit Manipulation
Performing 1.49 DMIPS / MHz
• Up to 68 DMIPS Running at 50 MHz from Flash (1 Wait-State)
• Up to 37 DMIPS Running at 25 MHz from Flash (0 Wait-State)
– Memory Protection Unit
Multi-hierarchy Bus System
– High-Performance Data Transfers on Separate Buses for Increased Performance
– 16 Peripheral DMA Channels Improves Speed for Peripheral Communication
Internal High-Speed Flash
– 512 Kbytes, 256 Kbytes, 128 Kbytes Versions
– Single Cycle Access up to 25 MHz
– FlashVault™ Technology Allows Pre-programmed Secure Library Support for End
User Applications
– Prefetch Buffer Optimizing Instruction Execution at Maximum Speed
– 10,000 Write Cycles, 15-year Data Retention Capability
– Flash Security Locks and User Defined Configuration Area
Internal High-Speed SRAM, Single-Cycle Access at Full Speed
– 64 Kbytes (512 KB and 256 KB Flash), 32 Kbytes (128 KB Flash)
– 4 Kbytes on the Multi-Layer Bus System (HSB RAM)
External Memory Interface on AT32UC3C0 Derivatives
– SDRAM / SRAM Compatible Memory Bus (16-bit Data and 24-bit Address Buses)
Interrupt Controller
– Autovectored Low Latency Interrupt Service with Programmable Priority
System Functions
– Power and Clock Manager
– Internal 115KHz (RCSYS) and 8MHz/1MHz (RC8M) RC Oscillators
– One 32 KHz and Two Multipurpose Oscillators
– Clock Failure detection
– Two Phase-Lock-Loop (PLL) allowing Independent CPU Frequency from USB or
CAN Frequency
Windowed Watchdog Timer (WDT)
Asynchronous Timer (AST) with Real-Time Clock Capability
– Counter or Calendar Mode Supported
Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency
Ethernet MAC 10/100 Mbps interface
– 802.3 Ethernet Media Access Controller
– Supports Media Independent Interface (MII) and Reduced MII (RMII)
Universal Serial Bus (USB)
– Device 2.0 and Embedded Host Low Speed and Full Speed
– Flexible End-Point Configuration and Management with Dedicated DMA Channels
– On-chip Transceivers Including Pull-Ups
One 2-channel Controller Area Network (CAN)
– CAN2A and CAN2B protocol compliant, with high-level mailbox system
– Two independent channels, 16 Message Objects per Channel
32-bit AVR®
Microcontroller
AT32UC3C0512C
AT32UC3C1512C
AT32UC3C1256C
AT32UC3C2512C
AT32UC3C2256C
AT32UC3C2128C
Automotive
Summary
NOTE: This is a summary document.
The complete document is available on
the Atmel website at www.atmel.com.
9166DS–AVR–01/12
AT32UC3C
• One 4-Channel 20-bit Pulse Width Modulation Controller (PWM)
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– Complementary outputs, with Dead Time Insertion
– Output Override and Fault Protection
Two Quadrature Decoders
One 16-channel 12-bit Pipelined Analog-To-Digital Converter (ADC)
– Dual Sample and Hold Capability Allowing 2 Synchronous Conversions
– Single-Ended and Differential Channels, Window Function
Two 12-bit Digital-To-Analog Converters (DAC), with Dual Output Sample System
Four Analog Comparators
Six 16-bit Timer/Counter (TC) Channels
– External Clock Inputs, PWM, Capture and Various Counting Capabilities
One Peripheral Event Controller
– Trigger Actions in Peripherals Depending on Events Generated from Peripherals or from Input Pins
– Deterministic Trigger
– 34 Events and 22 Event Actions
Five Universal Synchronous/Asynchronous Receiver/Transmitters (USART)
– Independent Baudrate Generator, Support for SPI, LIN, IrDA and ISO7816 interfaces
– Support for Hardware Handshaking, RS485 Interfaces and Modem Line
Two Master/Slave Serial Peripheral Interfaces (SPI) with Chip Select Signals
One Inter-IC Sound (I2S) Controller
– Compliant with I2S Bus Specification
– Time Division Multiplexed mode
Three Master and Three Slave Two-Wire Interfaces (TWI), 400kbit/s I2C-compatible
QTouch® Library Support
– Capacitive Touch Buttons, Sliders, and Wheels
– QTouch® and QMatrix® Acquisition
On-Chip Non-intrusive Debug System
– Nexus Class 2+, Runtime Control, Non-Intrusive Data and Program Trace
– aWire™ single-pin programming trace and debug interface muxed with reset pin
– NanoTrace™ provides trace capabilities through JTAG or aWire interface
3 package options
– 64-pin QFN/TQFP (45 GPIO pins)
– 100-pin TQFP (81 GPIO pins)
– 144-pin LQFP (123 GPIO pins)
Two operating voltage ranges:
– Single 5V Power Supply
– Single 3.3V Power Supply
2
9166DS–AVR-01/12
AT32UC3C
1. Description
The AT32UC3C is a complete System-On-Chip microcontroller based on the AVR32UC RISC
processor running at frequencies up to 50 MHz. AVR32UC is a high-performance 32-bit RISC
microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density and high performance.
The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern operating systems and real-time operating systems. Using the
Secure Access Unit (SAU) together with the MPU provides the required security and integrity.
Higher computation capabilities are achievable either using a rich set of DSP instructions or
using the floating-point instructions.
The AT32UC3C incorporates on-chip Flash and SRAM memories for secure and fast access.
For applications requiring additional memory, an external memory interface is provided on
AT32UC3C0 derivatives.
The Memory Direct Memory Access controller (MDMA) enables transfers of block of data from
memories to memories without processor involvement.
The Peripheral Direct Memory Access (PDCA) controller enables data transfers between peripherals and memories without processor involvement. The PDCA drastically reduces processing
overhead when transferring continuous and large data streams.
The AT32UC3C incorporates on-chip Flash and SRAM memories for secure and fast access.
The FlashVault technology allows secure libraries to be programmed into the device. The secure
libraries can be executed while the CPU is in Secure State, but not read by non-secure software
in the device. The device can thus be shipped to end custumers, who are able to program their
own code into the device, accessing the secure libraries, without any risk of compromising the
proprietary secure code.
The Power Manager improves design flexibility and security. Power monitoring is supported by
on-chip Power-On Reset (POR), Brown-Out Detectors (BOD18, BOD33, BOD50). The CPU
runs from the on-chip RC oscillators, the PLLs, or the Multipurpose Oscillators. The Asynchronous Timer (AST) combined with the 32 KHz oscillator keeps track of the time. The AST can
operate in counter or calendar mode.
The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval
measurement, pulse generation, delay timing, and pulse width modulation.
The PWM module provides four channels with many configuration options including polarity,
edge alignment and waveform non overlap control. The PWM channels can operate independently, with duty cycles set independently from each other, or in interlinked mode, with multiple
channels updated at the same time. It also includes safety feature with fault inputs and the ability
to lock the PWM configuration registers and the PWM pin assignment.
The AT32UC3C also features many communication interfaces for communication intensive
applications. In addition to standard serial interfaces like UART, SPI or TWI, other interfaces like
flexible CAN, USB and Ethernet MAC are available. The USART supports different communication modes, like SPI mode and LIN mode.
The Inter-IC Sound Controller (I2SC) provides a 5-bit wide, bidirectional, synchronous, digital
audio link with off-chip audio devices. The controller is compliant with the I2S bus specification.
3
9166DS–AVR-01/12
AT32UC3C
The Full-Speed USB 2.0 Device interface supports several USB Classes at the same time
thanks to the rich End-Point configuration. The On-The-GO (OTG) Host interface allows device
like a USB Flash disk or a USB printer to be directly connected to the processor.
The media-independent interface (MII) and reduced MII (RMII) 10/100 Ethernet MAC module
provides on-chip solutions for network-connected devices.
The Peripheral Event Controller (PEVC) allows to redirect events from one peripheral or from
input pins to another peripheral. It can then trigger, in a deterministic time, an action inside a
peripheral without the need of CPU. For instance a PWM waveform can directly trigger an ADC
capture, hence avoiding delays due to software interrupt processing.
The AT32UC3C features analog functions like ADC, DAC, Analog comparators. The ADC interface is built around a 12-bit pipelined ADC core and is able to control two independent 8-channel
or one 16-channel. The ADC block is able to measure two different voltages sampled at the
same time. The analog comparators can be paired to detect when the sensing voltage is within
or outside the defined reference window.
Atmel offers the QTouch library for embedding capacitive touch buttons, sliders, and wheels
functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers
robust sensing and included fully debounced reporting of touch keys and includes Adjacent Key
Suppression® (AKS®) technology for unambiguous detection of key events. The easy-to-use
QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications.
AT32UC3C integrates a class 2+ Nexus 2.0 On-Chip Debug (OCD) System, with non-intrusive
real-time trace, full-speed read/write memory access in addition to basic runtime control. The
Nanotrace interface enables trace feature for aWire- or JTAG-based debuggers. The single-pin
aWire interface allows all features available through the JTAG interface to be accessed through
the RESET pin, allowing the JTAG pins to be used for GPIO or peripherals.
1.1
Disclaimer
Typical values contained in this data sheet are based on simulations and characterization of
other 32-bit AVR Microcontrollers manufactured on the same process technology. Min and Max
values will be available after the device is characterized.
1.2
Automotive Quality Grade
The AT32UC3C have been developed and manufactured according to the most stringent
requirements of the international standard ISO-TS 16949. This data sheet contains limit values
extracted from the results of extensive characterization (Temperature and Voltage). The quality
and reliability of the AT32UC3C have been verified during regular product qualification as per
AEC-Q100 grade 1.
As indicated in the ordering information paragraph, the product is available in only one temperature grade, Table 1-1.
Table 1-1.
Temperature Grade Identification for Automotive Products
Temperature(°C)
Temperature Identifier
Comments
-40;+125
Z
Full Automotive Temperature Range
4
9166DS–AVR-01/12
AT32UC3C
2. Overview
Block diagram
Block diagram
TDO
TCK
TDI
TMS
AVR32UC CPU
JTAG
INTERFACE
NEXUS
CLASS 2+
OCD
MCKO
MDO[5..0]
MSEO[1..0]
EVTI_N
EVTO_N
VBUS
D+
DID
VBOF
USB
INTERFACE
M
Flash
Controller
512/
256/
128/64
KB
Flash
M
S
S
M
W
M
R
M
S
M
M
PBB
HSB
PB
S
CONFIGURATION
PERIPHERAL
DMA
CONTROLLER
S
REGISTERS
HSB
Memory
DMA
COL,
CRS,
RXD[3..0],
RX_CLK,
RX_DV,
RX_ER,
TX_CLK
DMA
BUS
HSB
PB
HSB-PB
BRIDGE B
HSB-PB
BRIDGE A
DATA[15..0]
ADDR[23..0]
NCS[3..0]
NRD
NWAIT
NWE0
NWE1
RAS
CAS
SDA10
SDCK
SDCKE
SDWE
ETHERNET
MAC
PB
MDC,
TXD[3..0],
TX_EN,
TX_ER,
SPEED
DMA
ANALOG TO
DIGITAL
CONVERTER 0/1
DMA
SERIAL
PERIPHERAL
INTERFACE 1
SERIAL
PERIPHERAL
INTERFACE 0
DMA
I2S INTERFACE
TWO-WIRE
INTERFACE 0/1
DMA
USART0
USART2
USART3
DMA
USART4
DMA
RTS, CTS
CLK
TXD
RXD
PERIPHERAL EVENT
CONTROLLER
DMA
USART1
PBA
MDIO
DSR, DTR, DCD, RI
RTS, CTS
CLK
TXD
RXD
DMA
PAD_EVT
RXD
TXD
CLK
RTS, CTS
MISO, MOSI
BCLK
IWS
ISDI
ISDO
MCLK
supplied by VDDANA
ADCREF0/1
ADCIN[15..0]
ADCVREFP/N
SCK
MISO, MOSI
NPCS[3..0]
SCK
NPCS[3..0]
CLK[2..0]
B[2..0]
DMA
TWO-WIRE
INTERFACE 2
TWCK
TWD
PULSE WIDTH
MODULATION
CONTROLLER
DMA
TIMER/COUNTER 0
A[2..0]
External Interrupt
Controller
EXTINT[8:1]
NMI
CLOCK
CONTROLLER
RESET
CONTROLLER
GCLK[1..0]
TWD
PWMH[3..0]
PWML[3..0]
EXT_FAULTS[1:0]
PA
PB
PC
PD
supplied by VDDANA
DMA
POWER MANAGER
SLEEP
CONTROLLER
TWCK
TWALM
GENERAL PURPOSE IOs
GENERAL PURPOSE IOs
M
M
64/32/16
KB SRAM
S
HSB-PB
BRIDGE C
PA
PB
PC
PD
DATA
INTERFACE
HIGH SPEED
BUS MATRIX
CANIF
RXLINE[1]
TXCAN[1]
INSTR
INTERFACE
LOCAL BUS
S
4 KB
HSB
RAM
RXLINE[0]
TXLINE[0]
MEMORY PROTECTION UNIT
LOCAL BUS
INTERFACE
EXTERNAL BUS INTERFACE
(SDRAM & STATIC MEMORY
CONTROLLER)
aWire
RESET_N
MEMORY INTERFACE
Figure 2-1.
PBC
2.1
DIGITAL TO
ANALOG
CONVERTER 0/1
DAC0A/B
DAC1A/B
DACREF
ANALOG
COMPARATOR
0A/0B/1A/1B
AC0AP/N AC0BP/N
AC1AP/N AC1BP/N
AC0AOUT/AC0BOUT
AC1AOUT/AC1BOUT
TIMER/COUNTER 1
B[2..0]
RCSYS
A[2..0]
RC8M
CLK[2..0]
RC120M
XIN[1:0]
XOUT[1:0]
OSC0 / OSC1
SYSTEM CONTROL
INTERFACE
PLL0 / PLL1
XIN32
XOUT32
32 KHz OSC
QUADRATURE
DECODER
0/1
QEPA
QEPB
QEPI
ASYNCHRONOUS
TIMER
BODs (1.8V,
3.3V, 5V)
WATCHDOG
TIMER
FREQUENCY METER
5
9166DS–AVR-01/12
AT32UC3C
2.2
Configuration Summary
Table 2-1.
Configuration Summary
Feature
AT32UC3C0512C
AT32UC3C1512C
AT32UC3C2512C
Flash
512 KB
512 KB
512 KB
SRAM
64KB
64KB
64KB
HSB RAM
EBI
4 KB
1
0
0
123
81
45
External Interrupts
8
8
8
TWI
3
3
2
USART
5
5
4
Peripheral DMA Channels
16
16
16
Peripheral Event System
1
1
1
SPI
2
2
1
CAN channels
2
2
2
USB
1
1
1
1
RMII/MII
1
RMII/MII
1
RMII only
I2S
1
1
1
Asynchronous Timers
1
1
1
Timer/Counter Channels
6
6
3
GPIO
Ethernet MAC 10/100
PWM channels
QDEC
4x2
2
2
Frequency Meter
1
Watchdog Timer
1
Power Manager
1
1
PLL 80-240 MHz (PLL0/PLL1)
Crystal Oscillator 0.4-20 MHz (OSC0)
Crystal Oscillator 32 KHz (OSC32K)
RC Oscillator 115 kHz (RCSYS)
RC Oscillator 8 MHz (RC8M)
RC Oscillator 120 MHz (RC120M)
Oscillators
0.4-20 MHz (OSC1)
-
12-bit ADC
number of channels
1
16
1
16
1
11
12-bit DAC
number of channels
1
4
1
4
1
2
Analog Comparators
4
4
2
JTAG
1
6
9166DS–AVR-01/12
AT32UC3C
Table 2-1.
Configuration Summary
Feature
AT32UC3C0512C
aWire
AT32UC3C2512C
1
Max Frequency
Package
AT32UC3C1512C
50 MHz
LQFP144
TQFP100
TQFP64/QFN64
7
9166DS–AVR-01/12
AT32UC3C
3. Package and Pinout
3.1
Package
The device pins are multiplexed with peripheral functions as described in Table 3-1 on page 11.
QFN64/TQFP64 Pinout
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PD01
PD00
PC22
PC21
PC20
PC19
PC18
PC17
PC16
PC15
PC05
PC04
GNDIO2
VDDIO2
PC03
PC02
Figure 3-1.
PD02
PD03
VDDIO3
GNDIO3
PD11
PD12
PD13
PD14
PD21
PD27
PD28
PD29
PD30
PB00
PB01
RESET_N
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PB31
PB30
GNDCORE
VDDCORE
VDDIN_33
VDDIN_5
GNDPLL
DP
DM
VBUS
PA23
PA22
PA21
PA20
VDDANA
GNDANA
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PA19
ADCVREFN
ADCVREFP
PA16
PA09
PA08
PA07
PA06
PA05
PA04
GNDIO1
VDDIO1
PA03
PA02
PA01
PA00
Note:
on QFN packages, the exposed pad is unconnected.
8
9166DS–AVR-01/12
AT32UC3C
TQFP100 Pinout
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PD01
PD00
PC31
PC24
PC23
PC22
PC21
PC20
PC19
PC18
PC17
PC16
PC15
PC14
PC13
PC12
PC11
PC07
PC06
PC05
PC04
GNDIO2
VDDIO2
PC03
PC02
Figure 3-2.
PD02
PD03
PD07
PD08
PD09
PD10
VDDIO3
GNDIO3
PD11
PD12
PD13
PD14
PD21
PD22
PD23
PD24
PD27
PD28
PD29
PD30
PB00
PB01
RESET_N
PB02
PB03
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
PC01
PC00
PB31
PB30
PB23
PB22
PB21
PB20
PB19
GNDCORE
VDDCORE
VDDIN_33
VDDIN_5
GNDPLL
DP
DM
VBUS
PA25
PA24
PA23
PA22
PA21
PA20
VDDANA
GNDANA
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PA19
ADCVREFN
ADCVREFP
PA16
PA15
PA14
PA13
PA12
PA11
PA10
PA09
PA08
PA07
PA06
PA05
PA04
PB06
PB05
PB04
GNDIO1
VDDIO1
PA03
PA02
PA01
PA00
9
9166DS–AVR-01/12
AT32UC3C
LQFP144 Pinout
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
PD01
PD00
PC31
PC30
GNDIO3
VDDIO3
PC29
PC28
PC27
PC26
PC25
PC24
PC23
PC22
PC21
PC20
PC19
PC18
PC17
PC16
PC15
PC14
PC13
PC12
PC11
PC10
PC09
PC08
PC07
PC06
PC05
PC04
GNDIO2
VDDIO2
PC03
PC02
Figure 3-3.
PD02
PD03
PD04
PD05
PD06
PD07
PD08
PD09
PD10
VDDIO3
GNDIO3
PD11
PD12
PD13
PD14
PD15
PD16
PD17
PD18
PD19
PD20
PD21
PD22
PD23
PD24
PD25
PD26
PD27
PD28
PD29
PD30
PB00
PB01
RESET_N
PB02
PB03
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
PC01
PC00
PB31
PB30
PB29
PB28
PB27
PB26
PB25
PB24
PB23
PB22
PB21
PB20
PB19
PB18
GNDCORE
VDDCORE
VDDIN_33
VDDIN_5
GNDPLL
DP
DM
VBUS
PA29
PA28
PA27
PA26
PA25
PA24
PA23
PA22
PA21
PA20
VDDANA
GNDANA
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
PA19
ADCVREFN
ADCVREFP
PA16
PA15
PA14
PA13
PA12
PA11
PA10
PA09
PA08
PA07
PA06
PA05
PA04
PB17
PB16
PB15
PB14
PB13
PB12
PB11
PB10
PB09
PB08
PB07
PB06
PB05
PB04
GNDIO1
VDDIO1
PA03
PA02
PA01
PA00
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9166DS–AVR-01/12
AT32UC3C
3.2
Peripheral Multiplexing on I/O lines
3.2.1
Multiplexed Signals
Each GPIO line can be assigned to one of the peripheral functions. The following table
describes the peripheral signals multiplexed to the GPIO lines.
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
P
QFN
TQFP
LQFP
64
100
144
1
1
1
GPIO function
G
/
Pin
Type
PIN
I
O
Supply
(1)
PA00
0
VDDIO1
x1/x2
CANIF TXLINE[1]
x1/x2
CANIF RXLINE[1]
A
VDDIO1
2
2
2
PA01
1
VDDIO1
3
3
3
PA02
2
4
4
4
PA03
3
7
10
21
PA04
4
8
11
22
PA05
5
12
23
PA06
6
C
x1/x2
SCIF GCLK[1]
EIC EXTINT[1]
VDDANA
x1/x2
ADCIN0
USBC - ID
ACIFA0 ACAOUT
VDDANA
x1/x2
ADCIN1
USBC VBOF
ACIFA0 ACBOUT
AC1AP1
PEVC PAD_EVT
[2]
x1/x2
ADCIN2
10
13
24
PA07
7
VDDANA
x1/x2
ADCIN3
AC1AN1
PEVC PAD_EVT
[3]
11
14
25
PA08
8
VDDANA
x1/x2
ADCIN4
AC1BP1
EIC EXTINT[2]
12
15
26
PA09
9
VDDANA
x1/x2
ADCIN5
AC1BN1
ADCIN6
EIC EXTINT[4]
PEVC PAD_EVT
[13]
16
27
PA10
10
VDDANA
x1/x2
E
F
PEVC PAD_EVT
[1]
x1/x2
VDDANA
D
PEVC PAD_EVT
[0]
SCIF GCLK[0]
VDDIO1
9
B
17
28
PA11
11
VDDANA
x1/x2
ADCIN7
ADCREF1
PEVC PAD_EVT
[14]
18
29
PA12
12
VDDANA
x1/x2
AC1AP0
SPI0 NPCS[0]
AC1AP0 or
DAC1A
19
30
PA13
13
VDDANA
x1/x2
AC1AN0
SPI0 NPCS[1]
ADCIN15
20
31
PA14
14
VDDANA
x1/x2
AC1BP0
SPI1 NPCS[0]
21
32
PA15
15
VDDANA
x1/x2
AC1BN0
SPI1 NPCS[1]
13
22
33
PA16
16
VDDANA
x1/x2
ADCREF0
14
23
34
ADC
REFP
15
24
35
ADC
REFN
AC1BN0 or
DAC1B
DACREF
11
9166DS–AVR-01/12
AT32UC3C
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
P
QFN
TQFP
LQFP
64
100
144
16
25
19
20
21
22
62
63
GPIO function
G
/
Pin
Type
PIN
I
O
Supply
(1)
A
B
36
PA19
19
VDDANA
x1/x2
ADCIN8
EIC EXTINT[1]
28
39
PA20
20
VDDANA
x1/x2
ADCIN9
AC0AP0
AC0AP0 or
DAC0A
29
40
PA21
21
VDDANA
x1/x2
ADCIN10
AC0BN0
AC0BN0 or
DAC0B
AC0AN0
PEVC PAD_EVT
[4]
MACB SPEED
PEVC PAD_EVT
[5]
MACB WOL
30
41
PA22
22
VDDANA
x1/x2
ADCIN11
31
42
PA23
23
VDDANA
x1/x2
ADCIN12
AC0BP0
32
43
PA24
24
VDDANA
x1/x2
ADCIN13
SPI1 NPCS[2]
33
44
PA25
25
VDDANA
x1/x2
ADCIN14
SPI1 NPCS[3]
45
PA26
26
VDDANA
x1/x2
AC0AP1
EIC EXTINT[1]
46
PA27
27
VDDANA
x1/x2
AC0AN1
EIC EXTINT[2]
47
PA28
28
VDDANA
x1/x2
AC0BP1
EIC EXTINT[3]
48
PA29
29
VDDANA
x1/x2
AC0BN1
EIC EXTINT[0]
x1
USART0 CLK
CANIF RXLINE[1]
96
97
99
140
141
143
PB00
PB01
PB02
32
33
34
VDDIO1
VDDIO1
VDDIO1
C
E
EIC EXTINT[8]
PEVC PAD_EVT
[10]
PEVC PAD_EVT
[11]
x1
USBC - ID
PEVC PAD_EVT
[6]
USBC VBOF
PEVC PAD_EVT
[7]
TC1 - A1
100
144
PB03
35
VDDIO1
x1
7
7
PB04
36
VDDIO1
x1/x2
SPI1 MOSI
CANIF RXLINE[0]
QDEC1 QEPI
CANIF TXLINE[0]
PEVC PAD_EVT
[12]
USART3 CLK
MACB TXD[3]
QDEC1 QEPA
USART1 CLK
MACB TX_ER
MACB TXD[2]
8
8
PB05
37
VDDIO1
x1/x2
SPI1 MISO
9
9
PB06
38
VDDIO1
x2/x4
SPI1 SCK
10
PB07
39
VDDIO1
x1/x2
SPI1 NPCS[0]
EIC EXTINT[2]
QDEC1 QEPB
MACB RX_DV
PEVC PAD_EVT
[1]
PWM PWML[0]
MACB RXD[0]
PWM PWMH[0]
MACB RXD[1]
11
PB08
40
VDDIO1
x1/x2
SPI1 NPCS[1]
12
PB09
41
VDDIO1
x1/x2
SPI1 NPCS[2]
13
PB10
42
VDDIO1
x1/x2
USART1 DTR
SPI0 MOSI
F
EIC EXTINT[0]
CANIF TXLINE[1]
x1
D
PWM PWML[1]
12
9166DS–AVR-01/12
AT32UC3C
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
GPIO function
G
/
P
QFN
TQFP
LQFP
64
100
144
Pin
Type
PIN
I
O
Supply
(1)
14
PB11
43
VDDIO1
15
PB12
44
16
PB13
17
18
19
A
B
C
x1/x2
USART1 DSR
SPI0 MISO
PWM PWMH[1]
VDDIO1
x1/x2
USART1 DCD
SPI0 SCK
PWM PWML[2]
45
VDDIO1
x1/x2
USART1 RI
SPI0 NPCS[0]
PWM PWMH[2]
MACB RX_ER
PB14
46
VDDIO1
x1/x2
USART1 RTS
SPI0 NPCS[1]
PWM PWML[3]
MACB MDC
PB15
47
VDDIO1
x1/x2
USART1 CTS
USART1 CLK
PWM PWMH[3]
MACB MDIO
x1/x2
USART1 RXD
SPI0 NPCS[2]
PWM EXT_
FAULTS[0]
CANIF RXLINE[0]
SPI0 NPCS[3]
PWM EXT_
FAULTS[1]
CANIF TXLINE[0]
PB16
48
VDDIO1
D
E
20
PB17
49
VDDIO1
x1/x2
USART1 TXD
57
PB18
50
VDDIO2
x1/x2
TC0 CLK2
42
58
PB19
51
VDDIO2
x1/x2
TC0 - A0
SPI1 MOSI
IISC ISDO
43
59
PB20
52
VDDIO2
x1/x2
TC0 - B0
SPI1 MISO
IISC - ISDI
ACIFA1 ACAOUT
MACB COL
44
60
PB21
53
VDDIO2
x2/x4
TC0 CLK1
SPI1 SCK
IISC IMCK
ACIFA1 ACBOUT
MACB RXD[2]
45
61
PB22
54
VDDIO2
x1/x2
TC0 - A1
SPI1 NPCS[3]
IISC ISCK
SCIF GCLK[0]
MACB RXD[3]
46
62
PB23
55
VDDIO2
x1/x2
TC0 - B1
SPI1 NPCS[2]
IISC - IWS
SCIF GCLK[1]
MACB RX_CLK
63
PB24
56
VDDIO2
x1/x2
TC0 CLK0
SPI1 NPCS[1]
TC0 - A2
SPI1 NPCS[0]
PEVC PAD_EVT
[8]
x2/x4
TC0 - B2
SPI1 SCK
PEVC PAD_EVT
[9]
x1/x2
QDEC0 QEPA
SPI1 MISO
PEVC PAD_EVT
[10]
TC1 CLK0
MACB TXD[0]
x1/x2
QDEC0 QEPB
SPI1 MOSI
PEVC PAD_EVT
[11]
TC1 - B0
MACB TXD[1]
QDEC0 QEPI
SPI0 NPCS[0]
PEVC PAD_EVT
[12]
TC1 - A0
64
65
66
67
PB25
PB26
PB27
PB28
57
58
59
60
VDDIO2
VDDIO2
VDDIO2
VDDIO2
x1/x2
68
PB29
61
VDDIO2
x1/x2
F
EIC EXTINT[4]
MACB CRS
MACB TX_EN
31
47
69
PB30
62
VDDIO2
x1
32
48
70
PB31
63
VDDIO2
x1
49
71
PC00
64
VDDIO2
x1/x2
USBC - ID
SPI0 NPCS[1]
USART2 CTS
TC1 - B2
CANIF TXLINE[1]
50
72
PC01
65
VDDIO2
x1/x2
USBC VBOF
SPI0 NPCS[2]
USART2 RTS
TC1 - A2
CANIF RXLINE[1]
13
9166DS–AVR-01/12
AT32UC3C
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
P
QFN
TQFP
LQFP
64
100
144
33
51
34
37
38
GPIO function
G
/
Pin
Type
PIN
I
O
Supply
(1)
73
PC02
66
VDDIO2
52
74
PC03
67
55
77
PC04
68
56
57
58
78
79
80
81
82
PC05
PC06
PC07
PC08
PC09
69
70
71
72
73
A
B
C
D
E
x1
TWIMS0 TWD
SPI0 NPCS[3]
USART2 RXD
TC1 CLK1
MACB MDC
VDDIO2
x1
TWIMS0 TWCK
EIC EXTINT[1]
USART2 TXD
TC1 - B1
MACB MDIO
VDDIO2
x1
TWIMS1 TWD
EIC EXTINT[3]
USART2 TXD
TC0 - B1
x1
TWIMS1 TWCK
EIC EXTINT[4]
USART2 RXD
TC0 - A2
x1
PEVC PAD_EVT
[15]
USART2 CLK
USART2 CTS
TC0 CLK2
TWIMS2 TWD
TWIMS0 TWALM
x1
PEVC PAD_EVT
[2]
EBI NCS[3]
USART2 RTS
TC0 - B2
TWIMS2 TWCK
TWIMS1 TWALM
x1/x2
PEVC PAD_EVT
[13]
SPI1 NPCS[1]
EBI NCS[0]
USART4 TXD
x1/x2
PEVC PAD_EVT
[14]
SPI1 NPCS[2]
EBI ADDR[23]
USART4 RXD
SPI1 NPCS[3]
EBI ADDR[22]
VDDIO2
VDDIO2
VDDIO2
VDDIO2
VDDIO2
F
83
PC10
74
VDDIO2
x1/x2
PEVC PAD_EVT
[15]
59
84
PC11
75
VDDIO2
x1/x2
PWM PWMH[3]
CANIF RXLINE[1]
EBI ADDR[21]
TC0 CLK0
60
85
PC12
76
VDDIO2
x1/x2
PWM PWML[3]
CANIF TXLINE[1]
EBI ADDR[20]
USART2 CLK
61
86
PC13
77
VDDIO2
x1/x2
PWM PWMH[2]
EIC EXTINT[7]
62
87
PC14
78
VDDIO2
x1/x2
PWM PWML[2]
USART0 CLK
EBI SDCKE
USART0 CTS
39
63
88
PC15
79
VDDIO2
x1/x2
PWM PWMH[1]
SPI0 NPCS[0]
EBI SDWE
USART0 RXD
CANIF RXLINE[1]
40
64
89
PC16
80
VDDIO2
x1/x2
PWM PWML[1]
SPI0 NPCS[1]
EBI - CAS
USART0 TXD
CANIF TXLINE[1]
41
65
90
PC17
81
VDDIO2
x1/x2
PWM PWMH[0]
SPI0 NPCS[2]
EBI - RAS
IISC ISDO
USART3 TXD
42
66
91
PC18
82
VDDIO2
x1/x2
PWM PWML[0]
EIC EXTINT[5]
EBI SDA10
IISC ISDI
USART3 RXD
43
67
92
PC19
83
VDDIO3
x1/x2
PWM PWML[2]
SCIF GCLK[0]
EBI DATA[0]
IISC IMCK
USART3 CTS
44
68
93
PC20
84
VDDIO3
x1/x2
PWM PWMH[2]
SCIF GCLK[1]
EBI DATA[1]
IISC ISCK
USART3 RTS
x1/x2
PWM EXT_
FAULTS[0]
CANIF RXLINE[0]
EBI DATA[2]
IISC - IWS
x1/x2
PWM EXT_
FAULTS[1]
CANIF TXLINE[0]
EBI DATA[3]
x1/x2
QDEC1 QEPB
CANIF RXLINE[1]
EBI DATA[4]
45
46
69
70
71
94
95
96
PC21
PC22
PC23
85
86
87
VDDIO3
VDDIO3
VDDIO3
USART0 RTS
USART3 CLK
PEVC PAD_EVT
[3]
14
9166DS–AVR-01/12
AT32UC3C
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
GPIO function
G
/
P
QFN
TQFP
LQFP
64
100
144
72
PIN
I
O
Pin
Type
Supply
(1)
A
B
C
D
E
QDEC1 QEPA
CANIF TXLINE[1]
EBI DATA[5]
PEVC PAD_EVT
[4]
TC1 CLK2
EBI DATA[6]
SCIF GCLK[0]
USART4 TXD
TC1 - B2
EBI DATA[7]
SCIF GCLK[1]
USART4 RXD
TC1 - A2
EBI DATA[8]
EIC EXTINT[0]
USART4 CTS
97
PC24
88
VDDIO3
x1/x2
98
PC25
89
VDDIO3
x1/x2
99
PC26
90
VDDIO3
x1/x2
100
PC27
91
VDDIO3
x1/x2
101
PC28
92
VDDIO3
x1/x2
SPI1 NPCS[3]
TC1 CLK1
EBI DATA[9]
102
PC29
93
VDDIO3
x1/x2
SPI0 NPCS[1]
TC1 - B1
EBI DATA[10]
105
PC30
94
VDDIO3
x1/x2
SPI0 NPCS[2]
TC1 - A1
EBI DATA[11]
TC1 - B0
EBI DATA[12]
PEVC PAD_EVT
[5]
USART4 CLK
QDEC1 QEPI
USART4 RTS
73
106
PC31
95
VDDIO3
x1/x2
SPI0 NPCS[3]
47
74
107
PD00
96
VDDIO3
x1/x2
SPI0 MOSI
TC1 CLK0
EBI DATA[13]
QDEC0 QEPI
USART0 TXD
48
75
108
PD01
97
VDDIO3
x1/x2
SPI0 MISO
TC1 - A0
EBI DATA[14]
TC0 CLK1
USART0 RXD
49
76
109
PD02
98
VDDIO3
x2/x4
SPI0 SCK
TC0 CLK2
EBI DATA[15]
QDEC0 QEPA
50
77
110
PD03
99
VDDIO3
x1/x2
SPI0 NPCS[0]
TC0 - B2
EBI ADDR[0]
QDEC0 QEPB
111
PD04
100
VDDIO3
x1/x2
SPI0 MOSI
EBI ADDR[1]
112
PD05
101
VDDIO3
x1/x2
SPI0 MISO
EBI ADDR[2]
113
PD06
102
VDDIO3
x2/x4
SPI0 SCK
EBI ADDR[3]
78
114
PD07
103
VDDIO3
x1/x2
USART1 DTR
EIC EXTINT[5]
EBI ADDR[4]
QDEC0 QEPI
USART4 TXD
79
115
PD08
104
VDDIO3
x1/x2
USART1 DSR
EIC EXTINT[6]
EBI ADDR[5]
TC1 CLK2
USART4 RXD
80
116
PD09
105
VDDIO3
x1/x2
USART1 DCD
CANIF RXLINE[0]
EBI ADDR[6]
QDEC0 QEPA
USART4 CTS
81
117
PD10
106
VDDIO3
x1/x2
USART1 RI
CANIF TXLINE[0]
EBI ADDR[7]
QDEC0 QEPB
USART4 RTS
x1/x2
USART1 TXD
USBC - ID
EBI ADDR[8]
PEVC PAD_EVT
[6]
MACB TXD[0]
x1/x2
USART1 RXD
USBC VBOF
EBI ADDR[9]
PEVC PAD_EVT
[7]
MACB TXD[1]
x2/x4
USART1 CTS
USART1 CLK
EBI SDCK
PEVC PAD_EVT
[8]
MACB RXD[0]
x1/x2
USART1 RTS
EIC EXTINT[7]
EBI ADDR[10]
PEVC PAD_EVT
[9]
MACB RXD[1]
53
54
55
56
84
85
86
87
120
121
122
123
PD11
PD12
PD13
PD14
107
108
109
110
VDDIO3
VDDIO3
VDDIO3
VDDIO3
F
15
9166DS–AVR-01/12
AT32UC3C
Table 3-1.
GPIO Controller Function Multiplexing
TQFP
P
QFN
TQFP
LQFP
64
100
144
57
GPIO function
G
/
Pin
Type
PIN
I
O
Supply
(1)
A
B
C
124
PD15
111
VDDIO3
x1/x2
TC0 - A0
USART3 TXD
EBI ADDR[11]
125
PD16
112
VDDIO3
x1/x2
TC0 - B0
USART3 RXD
EBI ADDR[12]
126
PD17
113
VDDIO3
x1/x2
TC0 - A1
USART3 CTS
EBI ADDR[13]
127
PD18
114
VDDIO3
x1/x2
TC0 - B1
USART3 RTS
EBI ADDR[14]
128
PD19
115
VDDIO3
x1/x2
TC0 - A2
EBI ADDR[15]
129
PD20
116
VDDIO3
x1/x2
TC0 - B2
EBI ADDR[16]
88
130
PD21
117
VDDIO3
x1/x2
USART3 TXD
EIC EXTINT[0]
EBI ADDR[17]
QDEC1 QEPI
89
131
PD22
118
VDDIO1
x1/x2
USART3 RXD
TC0 - A2
EBI ADDR[18]
SCIF GCLK[0]
90
132
PD23
119
VDDIO1
x1/x2
USART3 CTS
USART3 CLK
EBI ADDR[19]
QDEC1 QEPA
91
133
PD24
120
VDDIO1
x1/x2
USART3 RTS
EIC EXTINT[8]
EBI NWE1
QDEC1 QEPB
134
PD25
121
VDDIO1
x1/x2
TC0 CLK0
USBC - ID
EBI NWE0
135
PD26
122
VDDIO1
x1/x2
TC0 CLK1
USBC VBOF
EBI - NRD
D
E
USART3 CLK
USART4 CLK
58
92
136
PD27
123
VDDIO1
x1/x2
USART0 TXD
CANIF RXLINE[0]
EBI NCS[1]
TC0 - A0
MACB RX_ER
59
93
137
PD28
124
VDDIO1
x1/x2
USART0 RXD
CANIF TXLINE[0]
EBI NCS[2]
TC0 - B0
MACB RX_DV
60
94
138
PD29
125
VDDIO1
x1/x2
USART0 CTS
EIC EXTINT[6]
USART0 CLK
TC0 CLK0
MACB TX_CLK
61
95
139
PD30
126
VDDIO1
x1/x2
USART0 RTS
EIC EXTINT[3]
EBI NWAIT
TC0 - A1
MACB TX_EN
Note:
F
1. Pin type x1 is pin with drive strength of x1. Pin type x1/x2 is pin with programmable drive strength of x1 or x2. Pin type x2/x4
is pin with programmable drive strength of x2 or x4. The drive strength is programmable through ODCR0, ODCR0S,
ODCR0C, ODCR0T registers of GPIO. Refer to ”Electrical Characteristics” on page 49 for a description of the electrical
properties of the pin types used.
See Section 3.3 for a description of the various peripheral signals.
16
9166DS–AVR-01/12
AT32UC3C
3.2.2
Peripheral Functions
Each GPIO line can be assigned to one of several peripheral functions. The following table
describes how the various peripheral functions are selected. The last listed function has priority
in case multiple functions are enabled on the same pin.
Table 3-2.
3.2.3
Peripheral Functions
Function
Description
GPIO Controller Function multiplexing
GPIO and GPIO peripheral selection A to F
Nexus OCD AUX port connections
OCD trace system
aWire DATAOUT
aWire output in two-pin mode
JTAG port connections
JTAG debug port
Oscillators
OSC0, OSC32
Oscillator Pinout
The oscillators are not mapped to the normal GPIO functions and their muxings are controlled
by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more
information about this.
Table 3-3.
Oscillator pinout
QFN64/
TQFP64 pin
TQFP100 pin
LQFP144 pin
Pad
Oscillator pin
31
47
69
PB30
xin0
99
143
PB02
xin1
62
96
140
PB00
xin32
32
48
70
PB31
xout0
100
144
PB03
xout1
97
141
PB01
xout32
63
3.2.4
JTAG port connections
If the JTAG is enabled, the JTAG will take control over a number of pins, irrespectively of the I/O
Controller configuration.
Table 3-4.
3.2.5
JTAG pinout
QFN64/
TQFP64 pin
TQFP100 pin
LQFP144 pin
Pin name
JTAG pin
2
2
2
PA01
TDI
3
3
3
PA02
TDO
4
4
4
PA03
TMS
1
1
1
PA00
TCK
Nexus OCD AUX port connections
If the OCD trace system is enabled, the trace system will take control over a number of pins, irrespectively of the GPIO configuration. Three different OCD trace pin mappings are possible,
17
9166DS–AVR-01/12
AT32UC3C
depending on the configuration of the OCD AXS register. For details, see the AVR32UC Technical Reference Manual.
Table 3-5.
3.2.6
Pin
AXS=0
AXS=1
AXS=2
EVTI_N
PA08
PB19
PA10
MDO[5]
PC05
PC31
PB06
MDO[4]
PC04
PC12
PB15
MDO[3]
PA23
PC11
PB14
MDO[2]
PA22
PB23
PA27
MDO[1]
PA19
PB22
PA26
MDO[0]
PA09
PB20
PA19
EVTO_N
PD29
PD29
PD29
MCKO
PD13
PB21
PB26
MSEO[1]
PD30
PD08
PB25
MSEO[0]
PD14
PD07
PB18
Other Functions
The functions listed in Table 3-6 are not mapped to the normal GPIO functions. The aWire DATA
pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be active
after the aWire is enabled and the 2_PIN_MODE command has been sent.
Table 3-6.
3.3
Nexus OCD AUX port connections
Other Functions
QFN64/
TQFP64 pin
TQFP100 pin
LQFP144 pin
Pad
Oscillator pin
64
98
142
RESET_N
aWire DATA
3
3
3
PA02
aWire DATAOUT
Signals Description
The following table give details on the signal name classified by peripherals.
Table 3-7.
Signal Name
Signal Description List
Function
Type
Active
Level
Comments
Power
VDDIO1
VDDIO2
VDDIO3
I/O Power Supply
Power
Input
4.5V to 5.5V
or
3.0V to 3.6 V
VDDANA
Analog Power Supply
Power
Input
4.5V to 5.5V
or
3.0V to 3.6 V
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Table 3-7.
Signal Description List
Signal Name
Active
Level
Function
Type
1.8V Voltage Regulator Input
Power
Input
Power Supply:
4.5V to 5.5V
or
3.0V to 3.6 V
VDDIN_33
USB I/O power supply
Power
Output/
Input
Capacitor Connection for the 3.3V
voltage regulator
or power supply:
3.0V to 3.6 V
VDDCORE
1.8V Voltage Regulator Output
Power
output
Capacitor Connection for the 1.8V
voltage regulator
GNDIO1
GNDIO2
GNDIO3
I/O Ground
Ground
GNDANA
Analog Ground
Ground
GNDCORE
Ground of the core
Ground
GNDPLL
Ground of the PLLs
Ground
VDDIN_5
Comments
Analog Comparator Interface - ACIFA0/1
AC0AN1/AC0AN0
Negative inputs for comparator AC0A
Analog
AC0AP1/AC0AP0
Positive inputs for comparator AC0A
Analog
AC0BN1/AC0BN0
Negative inputs for comparator AC0B
Analog
AC0BP1/AC0BP0
Positive inputs for comparator AC0B
Analog
AC1AN1/AC1AN0
Negative inputs for comparator AC1A
Analog
AC1AP1/AC1AP0
Positive inputs for comparator AC1A
Analog
AC1BN1/AC1BN0
Negative inputs for comparator AC1B
Analog
AC1BP1/AC1BP0
Positive inputs for comparator AC1B
Analog
ACAOUT/ACBOUT
analog comparator outputs
output
ADC Interface - ADCIFA
ADCIN[15:0]
ADC input pins
Analog
ADCREF0
Analog positive reference 0 voltage input
Analog
ADCREF1
Analog positive reference 1 voltage input
Analog
ADCVREFP
Analog positive reference connected to external
capacitor
Analog
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Table 3-7.
Signal Description List
Signal Name
Function
Type
ADCVREFN
Analog negative reference connected to
external capacitor
Active
Level
Comments
Analog
Auxiliary Port - AUX
MCKO
Trace Data Output Clock
Output
MDO[5:0]
Trace Data Output
Output
MSEO[1:0]
Trace Frame Control
Output
EVTI_N
Event In
Output
Low
EVTO_N
Event Out
Output
Low
aWire - AW
DATA
aWire data
I/O
DATAOUT
aWire data output for 2-pin mode
I/O
Controller Area Network Interface - CANIF
RXLINE[1:0]
CAN channel rxline
I/O
TXLINE[1:0]
CAN channel txline
I/O
DAC Interface - DACIFB0/1
DAC0A, DAC0B
DAC0 output pins of S/H A
Analog
DAC1A, DAC1B
DAC output pins of S/H B
Analog
DACREF
Analog reference voltage input
Analog
External Bus Interface - EBI
ADDR[23:0]
Address Bus
Output
CAS
Column Signal
Output
DATA[15:0]
Data Bus
NCS[3:0]
Chip Select
Output
Low
NRD
Read Signal
Output
Low
NWAIT
External Wait Signal
Input
Low
NWE0
Write Enable 0
Output
Low
NWE1
Write Enable 1
Output
Low
RAS
Row Signal
Output
Low
SDA10
SDRAM Address 10 Line
Output
Low
I/O
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Table 3-7.
Signal Description List
Signal Name
Function
Type
SDCK
SDRAM Clock
Output
SDCKE
SDRAM Clock Enable
Output
SDWE
SDRAM Write Enable
Output
Active
Level
Comments
Low
External Interrupt Controller - EIC
EXTINT[8:1]
External Interrupt Pins
Input
NMI_N = EXTINT[0]
Non-Maskable Interrupt Pin
Input
Low
General Purpose Input/Output - GPIOA, GPIOB, GPIOC, GPIOD
PA[29:19] - PA[16:0]
Parallel I/O Controller GPIOA
I/O
PB[31:0]
Parallel I/O Controller GPIOB
I/O
PC[31:0]
Parallel I/O Controller GPIOC
I/O
PD[30:0]
Parallel I/O Controller GPIOD
I/O
Inter-IC Sound (I2S) Controller - IISC
IMCK
I2S Master Clock
Output
ISCK
I2S Serial Clock
I/O
ISDI
I2S Serial Data In
ISDO
I2S Serial Data Out
IWS
I2S Word Select
Input
Output
I/O
JTAG
TCK
Test Clock
Input
TDI
Test Data In
Input
TDO
Test Data Out
TMS
Test Mode Select
Output
Input
Ethernet MAC - MACB
COL
Collision Detect
Input
CRS
Carrier Sense and Data Valid
Input
MDC
Management Data Clock
MDIO
Management Data Input/Output
RXD[3:0]
Receive Data
Output
I/O
Input
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Table 3-7.
Signal Description List
Signal Name
Function
Type
RX_CLK
Receive Clock
Input
RX_DV
Receive Data Valid
Input
RX_ER
Receive Coding Error
Input
SPEED
Speed
Output
TXD[3:0]
Transmit Data
Output
TX_CLK
Transmit Clock or Reference Clock
TX_EN
Transmit Enable
Output
TX_ER
Transmit Coding Error
Output
WOL
Wake-On-LAN
Output
Active
Level
Comments
Input
Peripheral Event Controller - PEVC
PAD_EVT[15:0]
Event Input Pins
Input
Power Manager - PM
RESET_N
Reset Pin
Input
Low
Pulse Width Modulator - PWM
PWMH[3:0]
PWML[3:0]
PWM Output Pins
EXT_FAULT[1:0]
PWM Fault Input Pins
Output
Input
Quadrature Decoder- QDEC0/QDEC1
QEPA
QEPA quadrature input
Input
QEPB
QEPB quadrature input
Input
QEPI
Index input
Input
System Controller Interface- SCIF
XIN0, XIN1, XIN32
Crystal 0, 1, 32K Inputs
Analog
XOUT0, XOUT1,
XOUT32
Crystal 0, 1, 32K Output
Analog
GCLK0 - GCLK1
Generic Clock Pins
Output
Serial Peripheral Interface - SPI0, SPI1
MISO
Master In Slave Out
I/O
MOSI
Master Out Slave In
I/O
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Table 3-7.
Signal Description List
Signal Name
Function
NPCS[3:0]
SPI Peripheral Chip Select
SCK
Clock
Type
Active
Level
I/O
Low
Comments
Output
Timer/Counter - TC0, TC1
A0
Channel 0 Line A
I/O
A1
Channel 1 Line A
I/O
A2
Channel 2 Line A
I/O
B0
Channel 0 Line B
I/O
B1
Channel 1 Line B
I/O
B2
Channel 2 Line B
I/O
CLK0
Channel 0 External Clock Input
Input
CLK1
Channel 1 External Clock Input
Input
CLK2
Channel 2 External Clock Input
Input
Two-wire Interface - TWIMS0, TWIMS1, TWIMS2
TWALM
SMBus SMBALERT
I/O
TWCK
Serial Clock
I/O
TWD
Serial Data
I/O
Low
Only on TWIMS0, TWIMS1
Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3, USART4
CLK
Clock
I/O
CTS
Clear To Send
Input
Low
DCD
Data Carrier Detect
Input
Low
Only USART1
DSR
Data Set Ready
Input
Low
Only USART1
DTR
Data Terminal Ready
Output
Low
Only USART1
RI
Ring Indicator
Input
Low
Only USART1
RTS
Request To Send
Output
Low
RXD
Receive Data
Input
TXD
Transmit Data
Output
Universal Serial Bus Device - USB
DM
USB Device Port Data -
Analog
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Table 3-7.
Signal Description List
Signal Name
Function
DP
USB Device Port Data +
Analog
VBUS
USB VBUS Monitor and OTG Negociation
Analog
Input
ID
ID Pin of the USB Bus
Input
VBOF
USB VBUS On/off: bus power control port
output
3.4
3.4.1
Type
Active
Level
Comments
I/O Line Considerations
JTAG pins
The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI
pins have pull-up resistors when JTAG is enabled. The TCK pin always have pull-up enabled
during reset. The TDO pin is an output, driven at VDDIO1, and has no pull-up resistor. The
JTAG pins can be used as GPIO pins and muxed with peripherals when the JTAG is disabled.
Please refer to Section 3.2.4 for the JTAG port connections.
3.4.2
RESET_N pin
The RESET_N pin integrates a pull-up resistor to VDDIO1. As the product integrates a power-on
reset cell, the RESET_N pin can be left unconnected in case no reset from the system needs to
be applied to the product.
The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debugging, it must not be driven by external circuitry.
3.4.3
TWI pins
When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and
inputs with inputs with spike-filtering. When used as GPIO-pins or used for other peripherals, the
pins have the same characteristics as GPIO pins.
3.4.4
GPIO pins
All I/O lines integrate programmable pull-up and pull-down resistors. Most I/O lines integrate
drive strength control, see Table 3-1. Programming of this pull-up and pull-down resistor or this
drive strength is performed independently for each I/O line through the GPIO Controllers.
After reset, I/O lines default as inputs with pull-up/pull-down resistors disabled. After reset, output drive strength is configured to the lowest value to reduce global EMI of the device.
When the I/O line is configured as analog function (ADC I/O, AC inputs, DAC I/O), the pull-up
and pull-down resistors are automatically disabled.
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4. Processor and Architecture
Rev: 2.1.2.0
This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the
AVR32 architecture. A summary of the programming model, instruction set, and MPU is presented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical
Reference Manual.
4.1
Features
• 32-bit load/store AVR32A RISC architecture
–
–
–
–
–
•
•
•
•
4.2
15 general-purpose 32-bit registers
32-bit Stack Pointer, Program Counter and Link Register reside in register file
Fully orthogonal instruction set
Privileged and unprivileged modes enabling efficient and secure operating systems
Innovative instruction set together with variable instruction length ensuring industry leading
code density
– DSP extension with saturating arithmetic, and a wide variety of multiply instructions
3-stage pipeline allowing one instruction per clock cycle for most instructions
– Byte, halfword, word, and double word memory access
– Multiple interrupt priority levels
MPU allows for operating systems with memory protection
FPU enables hardware accelerated floating point calculations
Secure State for supporting FlashVault technology
AVR32 Architecture
AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for costsensitive embedded applications, with particular emphasis on low power consumption and high
code density. In addition, the instruction set architecture has been tuned to allow a variety of
microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance
processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications.
Through a quantitative approach, a large set of industry recognized benchmarks has been compiled and analyzed to achieve the best code density in its class. In addition to lowering the
memory requirements, a compact code size also contributes to the core’s low power characteristics. The processor supports byte and halfword data types without penalty in code size and
performance.
Memory load and store operations are provided for byte, halfword, word, and double word data
with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely
linked to the architecture and is able to exploit code optimization features, both for size and
speed.
In order to reduce code size to a minimum, some instructions have multiple addressing modes.
As an example, instructions with immediates often have a compact format with a smaller immediate, and an extended format with a larger immediate. In this way, the compiler is able to use
the format giving the smallest code size.
Another feature of the instruction set is that frequently used instructions, like add, have a compact format with two operands as well as an extended format with three operands. The larger
format increases performance, allowing an addition and a data move in the same instruction in a
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single cycle. Load and store instructions have several different formats in order to reduce code
size and speed up execution.
The register file is organized as sixteen 32-bit registers and includes the Program Counter, the
Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values
from function calls and is used implicitly by some instructions.
4.3
The AVR32UC CPU
The AVR32UC CPU targets low- and medium-performance applications, and provides an
advanced On-Chip Debug (OCD) system, no caches, and a Memory Protection Unit (MPU). A
hardware Floating Point Unit (FPU) is also provided through the coprocessor instruction space.
Java acceleration hardware is not implemented.
AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch,
one High Speed Bus master for data access, and one High Speed Bus slave interface allowing
other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the
CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing.
Also, power consumption is reduced by not needing a full High Speed Bus access for memory
accesses. A dedicated data RAM interface is provided for communicating with the internal data
RAMs.
A local bus interface is provided for connecting the CPU to device-specific high-speed systems,
such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a
one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data
between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated
memory range allocated to it, and data transfers are performed using regular load and store
instructions. Details on which devices that are mapped into the local bus space is given in the
CPU Local Bus section in the Memories chapter.
Figure 4-1 on page 27 displays the contents of AVR32UC.
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OCD interface
Reset interface
Overview of the AVR32UC CPU
Interrupt controller interface
Figure 4-1.
OCD
system
Power/
Reset
control
AVR32UC CPU pipeline
MPU
4.3.1
High
Speed
Bus slave
CPU Local
Bus
master
CPU Local Bus
High Speed
Bus master
High Speed Bus
High Speed Bus
High Speed Bus master
High Speed Bus
Data memory controller
Instruction memory controller
CPU RAM
Pipeline Overview
AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruction Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic
(ALU) section, one multiply (MUL) section, and one load/store (LS) section.
Instructions are issued and complete in order. Certain operations require several clock cycles to
complete, and in this case, the instruction resides in the ID and EX stages for the required number of clock cycles. Since there is only three pipeline stages, no internal data forwarding is
required, and no data dependencies can arise in the pipeline.
Figure 4-2 on page 28 shows an overview of the AVR32UC pipeline stages.
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Figure 4-2.
The AVR32UC Pipeline
MUL
IF
ID
Prefetch unit
Decode unit
Regfile
Read
ALU
LS
4.3.2
4.3.2.1
Multiply unit
Regfile
write
ALU unit
Load-store
unit
AVR32A Microarchitecture Compliance
AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is targeted at cost-sensitive, lower-end applications like smaller microcontrollers. This
microarchitecture does not provide dedicated hardware registers for shadowing of register file
registers in interrupt contexts. Additionally, it does not provide hardware registers for the return
address registers and return status registers. Instead, all this information is stored on the system
stack. This saves chip area at the expense of slower interrupt handling.
Interrupt Handling
Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These
registers are pushed regardless of the priority level of the pending interrupt. The return address
and status register are also automatically pushed to stack. The interrupt handler can therefore
use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are
restored, and execution continues at the return address stored popped from stack.
The stack is also used to store the status register and return address for exceptions and scall.
Executing the rete or rets instruction at the completion of an exception or system call will pop
this status register and continue execution at the popped return address.
4.3.2.2
Java Support
AVR32UC does not provide Java hardware acceleration.
4.3.2.3
Floating Point Support
A fused multiply-accumulate Floating Point Unit (FPU), performaing a multiply and accumulate
as a single operation with no intermediate rounding, therby increasing precision is provided. The
floating point hardware conforms to the requirements of the C standard, which is based on the
IEEE 754 floating point standard.
4.3.2.4
Memory Protection
The MPU allows the user to check all memory accesses for privilege violations. If an access is
attempted to an illegal memory address, the access is aborted and an exception is taken. The
MPU in AVR32UC is specified in the AVR32UC Technical Reference manual.
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4.3.2.5
Unaligned Reference Handling
AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is
able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an
address exception. Doubleword-sized accesses with word-aligned pointers will automatically be
performed as two word-sized accesses.
The following table shows the instructions with support for unaligned addresses. All other
instructions require aligned addresses.
Table 4-1.
4.3.2.6
Instructions with Unaligned Reference Support
Instruction
Supported Alignment
ld.d
Word
st.d
Word
Unimplemented Instructions
The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented
Instruction Exception if executed:
• All SIMD instructions
• All coprocessor instructions if no coprocessors are present
• retj, incjosp, popjc, pushjc
• tlbr, tlbs, tlbw
• cache
4.3.2.7
CPU and Architecture Revision
Three major revisions of the AVR32UC CPU currently exist. The device described in this
datasheet uses CPU revision 3.
The Architecture Revision field in the CONFIG0 system register identifies which architecture
revision is implemented in a specific device.
AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled
for revision 1 or 2 is binary-compatible with revision 3 CPUs.
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4.4
4.4.1
Programming Model
Register File Configuration
The AVR32UC register file is shown below.
Figure 4-3.
The AVR32UC Register File
Application
Supervisor
INT0
Bit 31
Bit 31
Bit 31
Bit 0
Bit 0
INT1
Bit 0
INT2
Bit 31
Bit 0
INT3
Bit 31
Bit 0
Bit 31
Bit 0
Exception
NMI
Bit 31
Bit 31
Bit 0
Secure
Bit 0
Bit 31
Bit 0
PC
LR
SP_APP
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SYS
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
PC
LR
SP_SEC
R12
R11
R10
R9
R8
INT0PC
R7
INT1PC
R6
FINTPC
R5
SMPC
R4
R3
R2
R1
R0
SR
SR
SR
SR
SR
SR
SR
SR
SR
SS_STATUS
SS_ADRF
SS_ADRR
SS_ADR0
SS_ADR1
SS_SP_SYS
SS_SP_APP
SS_RAR
SS_RSR
4.4.2
Status Register Configuration
The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 4-4
and Figure 4-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T,
and L bits, while the upper halfword contains information about the mode and state the processor executes in. Refer to the AVR32 Architecture Manual for details.
Figure 4-4.
The Status Register High Halfword
B it 31
Bit 16
SS
LC
1
-
-
DM
D
-
M2
M1
M0
EM
I3M
I2M
FE
I1M
I0M
GM
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
Bit nam e
Initial value
G lobal Interrupt M ask
Interrupt Level 0 M ask
Interrupt Level 1 M ask
Interrupt Level 2 M ask
Interrupt Level 3 M ask
Exception M ask
M ode Bit 0
M ode Bit 1
M ode Bit 2
R eserved
D ebug State
D ebug State M ask
R eserved
Secure State
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Figure 4-5.
The Status Register Low Halfword
Bit 15
Bit 0
-
T
-
-
-
-
-
-
-
-
L
Q
V
N
Z
C
Bit name
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Initial value
Carry
Zero
Sign
Overflow
Saturation
Lock
Reserved
Scratch
Reserved
4.4.3
4.4.3.1
Processor States
Normal RISC State
The AVR32 processor supports several different execution contexts as shown in Table 4-2.
Table 4-2.
Overview of Execution Modes, their Priorities and Privilege Levels.
Priority
Mode
Security
Description
1
Non Maskable Interrupt
Privileged
Non Maskable high priority interrupt mode
2
Exception
Privileged
Execute exceptions
3
Interrupt 3
Privileged
General purpose interrupt mode
4
Interrupt 2
Privileged
General purpose interrupt mode
5
Interrupt 1
Privileged
General purpose interrupt mode
6
Interrupt 0
Privileged
General purpose interrupt mode
N/A
Supervisor
Privileged
Runs supervisor calls
N/A
Application
Unprivileged
Normal program execution mode
Mode changes can be made under software control, or can be caused by external interrupts or
exception processing. A mode can be interrupted by a higher priority mode, but never by one
with lower priority. Nested exceptions can be supported with a minimal software overhead.
When running an operating system on the AVR32, user processes will typically execute in the
application mode. The programs executed in this mode are restricted from executing certain
instructions. Furthermore, most system registers together with the upper halfword of the status
register cannot be accessed. Protected memory areas are also not available. All other operating
modes are privileged and are collectively called System Modes. They have full access to all privileged and unprivileged resources. After a reset, the processor will be in supervisor mode.
4.4.3.2
Debug State
The AVR32 can be set in a debug state, which allows implementation of software monitor routines that can read out and alter system information for use during application development. This
implies that all system and application registers, including the status registers and program
counters, are accessible in debug state. The privileged instructions are also available.
All interrupt levels are by default disabled when debug state is entered, but they can individually
be switched on by the monitor routine by clearing the respective mask bit in the status register.
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Debug state can be entered as described in the AVR32UC Technical Reference Manual.
Debug state is exited by the retd instruction.
4.4.3.3
4.4.4
Secure State
The AVR32 can be set in a secure state, that allows a part of the code to execute in a state with
higher security levels. The rest of the code can not access resources reserved for this secure
code. Secure State is used to implement FlashVault technology. Refer to the AVR32UC Technical Reference Manual for details.
System Registers
The system registers are placed outside of the virtual memory space, and are only accessible
using the privileged mfsr and mtsr instructions. The table below lists the system registers specified in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is
responsible for maintaining correct sequencing of any instructions following a mtsr instruction.
For detail on the system registers, refer to the AVR32UC Technical Reference Manual.
Table 4-3.
System Registers
Reg #
Address
Name
Function
0
0
SR
Status Register
1
4
EVBA
Exception Vector Base Address
2
8
ACBA
Application Call Base Address
3
12
CPUCR
CPU Control Register
4
16
ECR
Exception Cause Register
5
20
RSR_SUP
Unused in AVR32UC
6
24
RSR_INT0
Unused in AVR32UC
7
28
RSR_INT1
Unused in AVR32UC
8
32
RSR_INT2
Unused in AVR32UC
9
36
RSR_INT3
Unused in AVR32UC
10
40
RSR_EX
Unused in AVR32UC
11
44
RSR_NMI
Unused in AVR32UC
12
48
RSR_DBG
Return Status Register for Debug mode
13
52
RAR_SUP
Unused in AVR32UC
14
56
RAR_INT0
Unused in AVR32UC
15
60
RAR_INT1
Unused in AVR32UC
16
64
RAR_INT2
Unused in AVR32UC
17
68
RAR_INT3
Unused in AVR32UC
18
72
RAR_EX
Unused in AVR32UC
19
76
RAR_NMI
Unused in AVR32UC
20
80
RAR_DBG
Return Address Register for Debug mode
21
84
JECR
Unused in AVR32UC
22
88
JOSP
Unused in AVR32UC
23
92
JAVA_LV0
Unused in AVR32UC
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Table 4-3.
System Registers (Continued)
Reg #
Address
Name
Function
24
96
JAVA_LV1
Unused in AVR32UC
25
100
JAVA_LV2
Unused in AVR32UC
26
104
JAVA_LV3
Unused in AVR32UC
27
108
JAVA_LV4
Unused in AVR32UC
28
112
JAVA_LV5
Unused in AVR32UC
29
116
JAVA_LV6
Unused in AVR32UC
30
120
JAVA_LV7
Unused in AVR32UC
31
124
JTBA
Unused in AVR32UC
32
128
JBCR
Unused in AVR32UC
33-63
132-252
Reserved
Reserved for future use
64
256
CONFIG0
Configuration register 0
65
260
CONFIG1
Configuration register 1
66
264
COUNT
Cycle Counter register
67
268
COMPARE
Compare register
68
272
TLBEHI
Unused in AVR32UC
69
276
TLBELO
Unused in AVR32UC
70
280
PTBR
Unused in AVR32UC
71
284
TLBEAR
Unused in AVR32UC
72
288
MMUCR
Unused in AVR32UC
73
292
TLBARLO
Unused in AVR32UC
74
296
TLBARHI
Unused in AVR32UC
75
300
PCCNT
Unused in AVR32UC
76
304
PCNT0
Unused in AVR32UC
77
308
PCNT1
Unused in AVR32UC
78
312
PCCR
Unused in AVR32UC
79
316
BEAR
Bus Error Address Register
80
320
MPUAR0
MPU Address Register region 0
81
324
MPUAR1
MPU Address Register region 1
82
328
MPUAR2
MPU Address Register region 2
83
332
MPUAR3
MPU Address Register region 3
84
336
MPUAR4
MPU Address Register region 4
85
340
MPUAR5
MPU Address Register region 5
86
344
MPUAR6
MPU Address Register region 6
87
348
MPUAR7
MPU Address Register region 7
88
352
MPUPSR0
MPU Privilege Select Register region 0
89
356
MPUPSR1
MPU Privilege Select Register region 1
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Table 4-3.
4.5
System Registers (Continued)
Reg #
Address
Name
Function
90
360
MPUPSR2
MPU Privilege Select Register region 2
91
364
MPUPSR3
MPU Privilege Select Register region 3
92
368
MPUPSR4
MPU Privilege Select Register region 4
93
372
MPUPSR5
MPU Privilege Select Register region 5
94
376
MPUPSR6
MPU Privilege Select Register region 6
95
380
MPUPSR7
MPU Privilege Select Register region 7
96
384
MPUCRA
Unused in this version of AVR32UC
97
388
MPUCRB
Unused in this version of AVR32UC
98
392
MPUBRA
Unused in this version of AVR32UC
99
396
MPUBRB
Unused in this version of AVR32UC
100
400
MPUAPRA
MPU Access Permission Register A
101
404
MPUAPRB
MPU Access Permission Register B
102
408
MPUCR
MPU Control Register
103
412
SS_STATUS
Secure State Status Register
104
416
SS_ADRF
Secure State Address Flash Register
105
420
SS_ADRR
Secure State Address RAM Register
106
424
SS_ADR0
Secure State Address 0 Register
107
428
SS_ADR1
Secure State Address 1 Register
108
432
SS_SP_SYS
Secure State Stack Pointer System Register
109
436
SS_SP_APP
Secure State Stack Pointer Application Register
110
440
SS_RAR
Secure State Return Address Register
111
444
SS_RSR
Secure State Return Status Register
112-191
448-764
Reserved
Reserved for future use
192-255
768-1020
IMPL
IMPLEMENTATION DEFINED
Exceptions and Interrupts
In the AVR32 architecture, events are used as a common term for exceptions and interrupts.
AVR32UC incorporates a powerful event handling scheme. The different event sources, like Illegal Op-code and interrupt requests, have different priority levels, ensuring a well-defined
behavior when multiple events are received simultaneously. Additionally, pending events of a
higher priority class may preempt handling of ongoing events of a lower priority class.
When an event occurs, the execution of the instruction stream is halted, and execution is passed
to an event handler at an address specified in Table 4-4 on page 38. Most of the handlers are
placed sequentially in the code space starting at the address specified by EVBA, with four bytes
between each handler. This gives ample space for a jump instruction to be placed there, jumping to the event routine itself. A few critical handlers have larger spacing between them, allowing
the entire event routine to be placed directly at the address specified by the EVBA-relative offset
generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR)
addresses. This allows the interrupt controller to directly specify the ISR address as an address
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AT32UC3C
relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384
bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset),
not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up
appropriately. The same mechanisms are used to service all different types of events, including
interrupt requests, yielding a uniform event handling scheme.
An interrupt controller does the priority handling of the interrupts and provides the autovector offset to the CPU.
4.5.1
System Stack Issues
Event handling in AVR32UC uses the system stack pointed to by the system stack pointer,
SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event
code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section,
since the timing of accesses to this memory section is both fast and deterministic.
The user must also make sure that the system stack is large enough so that any event is able to
push the required registers to stack. If the system stack is full, and an event occurs, the system
will enter an UNDEFINED state.
4.5.2
Exceptions and Interrupt Requests
When an event other than scall or debug request is received by the core, the following actions
are performed atomically:
1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and
GM bits in the Status Register are used to mask different events. Not all events can be
masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and
Bus Error) can not be masked. When an event is accepted, hardware automatically
sets the mask bits corresponding to all sources with equal or lower priority. This inhibits
acceptance of other events of the same or lower priority, except for the critical events
listed above. Software may choose to clear some or all of these bits after saving the
necessary state if other priority schemes are desired. It is the event source’s responsability to ensure that their events are left pending until accepted by the CPU.
2. When a request is accepted, the Status Register and Program Counter of the current
context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also automatically stored to stack. Storing the Status
Register ensures that the core is returned to the previous execution mode when the
current event handling is completed. When exceptions occur, both the EM and GM bits
are set, and the application may manually enable nested exceptions if desired by clearing the appropriate bit. Each exception handler has a dedicated handler address, and
this address uniquely identifies the exception source.
3. The Mode bits are set to reflect the priority of the accepted event, and the correct register file bank is selected. The address of the event handler, as shown in Table 4-4 on
page 38, is loaded into the Program Counter.
The execution of the event handler routine then continues from the effective address calculated.
The rete instruction signals the end of the event. When encountered, the Return Status Register
and Return Address Register are popped from the system stack and restored to the Status Register and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3,
registers R8-R12 and LR are also popped from the system stack. The restored Status Register
contains information allowing the core to resume operation in the previous execution mode. This
concludes the event handling.
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4.5.3
Supervisor Calls
The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is
designed so that privileged routines can be called from any context. This facilitates sharing of
code between different execution modes. The scall mechanism is designed so that a minimal
execution cycle overhead is experienced when performing supervisor routine calls from timecritical event handlers.
The scall instruction behaves differently depending on which mode it is called from. The behaviour is detailed in the instruction set reference. In order to allow the scall routine to return to the
correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC
CPU, scall and rets uses the system stack to store the return address and the status register.
4.5.4
Debug Requests
The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by
the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the
status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the
Debug Exception handler. By default, Debug mode executes in the exception context, but with
dedicated Return Address Register and Return Status Register. These dedicated registers
remove the need for storing this data to the system stack, thereby improving debuggability. The
Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers
in all contexts, while retaining full privileges.
Debug mode is exited by executing the retd instruction. This returns to the previous context.
4.5.5
Entry Points for Events
Several different event handler entry points exist. In AVR32UC, the reset address is
0x80000000. This places the reset address in the boot flash memory area.
TLB miss exceptions and scall have a dedicated space relative to EVBA where their event handler can be placed. This speeds up execution by removing the need for a jump instruction placed
at the program address jumped to by the event hardware. All other exceptions have a dedicated
event routine entry point located relative to EVBA. The handler routine address identifies the
exception source directly.
AVR32UC uses the ITLB and DTLB protection exceptions to signal a MPU protection violation.
ITLB and DTLB miss exceptions are used to signal that an access address did not map to any of
the entries in the MPU. TLB multiple hit exception indicates that an access address did map to
multiple TLB entries, signalling an error.
All interrupt requests have entry points located at an offset relative to EVBA. This autovector offset is specified by an interrupt controller. The programmer must make sure that none of the
autovector offsets interfere with the placement of other code. The autovector offset has 14
address bits, giving an offset of maximum 16384 bytes.
Special considerations should be made when loading EVBA with a pointer. Due to security considerations, the event handlers should be located in non-writeable flash memory, or optionally in
a privileged memory protection region if an MPU is present.
If several events occur on the same instruction, they are handled in a prioritized way. The priority
ordering is presented in Table 4-4 on page 38. If events occur on several instructions at different
locations in the pipeline, the events on the oldest instruction are always handled before any
events on any younger instruction, even if the younger instruction has events of higher priority
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than the oldest instruction. An instruction B is younger than an instruction A if it was sent down
the pipeline later than A.
The addresses and priority of simultaneous events are shown in Table 4-4 on page 38. Some of
the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floatingpoint unit.
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Table 4-4.
Priority and Handler Addresses for Events
Priority
Handler Address
Name
Event source
Stored Return Address
1
0x80000000
Reset
External input
Undefined
2
Provided by OCD system
OCD Stop CPU
OCD system
First non-completed instruction
3
EVBA+0x00
Unrecoverable exception
Internal
PC of offending instruction
4
EVBA+0x04
TLB multiple hit
MPU
PC of offending instruction
5
EVBA+0x08
Bus error data fetch
Data bus
First non-completed instruction
6
EVBA+0x0C
Bus error instruction fetch
Data bus
First non-completed instruction
7
EVBA+0x10
NMI
External input
First non-completed instruction
8
Autovectored
Interrupt 3 request
External input
First non-completed instruction
9
Autovectored
Interrupt 2 request
External input
First non-completed instruction
10
Autovectored
Interrupt 1 request
External input
First non-completed instruction
11
Autovectored
Interrupt 0 request
External input
First non-completed instruction
12
EVBA+0x14
Instruction Address
CPU
PC of offending instruction
13
EVBA+0x50
ITLB Miss
MPU
PC of offending instruction
14
EVBA+0x18
ITLB Protection
MPU
PC of offending instruction
15
EVBA+0x1C
Breakpoint
OCD system
First non-completed instruction
16
EVBA+0x20
Illegal Opcode
Instruction
PC of offending instruction
17
EVBA+0x24
Unimplemented instruction
Instruction
PC of offending instruction
18
EVBA+0x28
Privilege violation
Instruction
PC of offending instruction
19
EVBA+0x2C
Floating-point
UNUSED
20
EVBA+0x30
Coprocessor absent
Instruction
PC of offending instruction
21
EVBA+0x100
Supervisor call
Instruction
PC(Supervisor Call) +2
22
EVBA+0x34
Data Address (Read)
CPU
PC of offending instruction
23
EVBA+0x38
Data Address (Write)
CPU
PC of offending instruction
24
EVBA+0x60
DTLB Miss (Read)
MPU
PC of offending instruction
25
EVBA+0x70
DTLB Miss (Write)
MPU
PC of offending instruction
26
EVBA+0x3C
DTLB Protection (Read)
MPU
PC of offending instruction
27
EVBA+0x40
DTLB Protection (Write)
MPU
PC of offending instruction
28
EVBA+0x44
DTLB Modified
UNUSED
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5. Memories
5.1
Embedded Memories
• Internal High-Speed Flash (See Table 5-1 on page 40)
– 512 Kbytes
– 256 Kbytes
– 128 Kbytes
• 0 Wait State Access at up to 25 MHz in Worst Case Conditions
• 1 Wait State Access at up to 50 MHz in Worst Case Conditions
• Pipelined Flash Architecture, allowing burst reads from sequential Flash locations, hiding
penalty of 1 wait state access
• Pipelined Flash Architecture typically reduces the cycle penalty of 1 wait state operation
to only 15% compared to 0 wait state operation
• 10 000 Write Cycles, 15-year Data Retention Capability
• Sector Lock Capabilities, Bootloader Protection, Security Bit
• 32 Fuses, Erased During Chip Erase
• User Page For Data To Be Preserved During Chip Erase
• Internal High-Speed SRAM, Single-cycle access at full speed (See Table 5-1 on page 40)
– 64 Kbytes
– 32 Kbytes
• Supplementary Internal High-Speed System SRAM (HSB RAM), Single-cycle access at full speed
– Memory space available on System Bus for peripherals data.
– 4 Kbytes
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5.2
Physical Memory Map
The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they
are never remapped in any way, not even in boot. Note that AVR32UC CPU uses unsegmented
translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space
is mapped as follows:
Table 5-1.
AT32UC3C Physical Memory Map
AT32UC3 Derivatives
Device
Start Address
C0512C
C1512C
C2512C
C1256C
C2256C
C2128C
Embedded SRAM
0x0000_0000
64 KB
64 KB
64 KB
32 KB
Embedded Flash
0x8000_0000
512 KB
512 KB
256 KB
128 KB
SAU
0x9000_0000
1 KB
1 KB
1 KB
1 KB
HSB SRAM
0xA000_0000
4 KB
4 KB
4 KB
4 KB
EBI SRAM CS0
0xC000_0000
16 MB
-
-
-
EBI SRAM CS2
0xC800_0000
16 MB
-
-
-
EBI SRAM CS3
0xCC00_0000
16 MB
-
-
-
EBI SRAM CS1
/SDRAM CS0
0xD000_0000
128 MB
-
-
-
HSB-PB Bridge C
0xFFFD_0000
64 KB
64 KB
64 KB
64 KB
HSB-PB Bridge B
0xFFFE_0000
64 KB
64 KB
64 KB
64 KB
HSB-PB Bridge A
0xFFFF_0000
64 KB
64 KB
64 KB
64 KB
Table 5-2.
5.3
Flash Memory Parameters
Part Number
Flash Size
(FLASH_PW)
Number of
pages
(FLASH_P)
Page size
(FLASH_W)
AT32UC3C0512C
AT32UC3C1512C
AT32UC3C2512C
512 Kbytes
1024
128 words
AT32UC3C1256C
AT32UC3C2256C
256 Kbytes
512
128 words
AT32UC3C2128C
128 Kbytes
256
128 words
Peripheral Address Map
Table 5-3.
Peripheral Address Mapping
Address
Peripheral Name
0xFFFD0000
PDCA
Peripheral DMA Controller - PDCA
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9166DS–AVR-01/12
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Table 5-3.
Peripheral Address Mapping
0xFFFD1000
MDMA
0xFFFD1400
USART1
Memory DMA - MDMA
Universal Synchronous/Asynchronous
Receiver/Transmitter - USART1
0xFFFD1800
SPI0
Serial Peripheral Interface - SPI0
0xFFFD1C00
CANIF
Control Area Network interface - CANIF
0xFFFD2000
TC0
0xFFFD2400
Timer/Counter - TC0
ADCIFA
ADC controller interface with Touch Screen functionality
- ADCIFA
USART4
Universal Synchronous/Asynchronous
Receiver/Transmitter - USART4
0xFFFD2800
0xFFFD2C00
TWIM2
Two-wire Master Interface - TWIM2
TWIS2
Two-wire Slave Interface - TWIS2
0xFFFD3000
0xFFFE0000
HFLASHC
Flash Controller - HFLASHC
0xFFFE1000
USBC
USB 2.0 OTG Interface - USBC
0xFFFE2000
HMATRIX
HSB Matrix - HMATRIX
0xFFFE2400
SAU
Secure Access Unit - SAU
SMC
Static Memory Controller - SMC
0xFFFE2800
0xFFFE2C00
SDRAMC
SDRAM Controller - SDRAMC
0xFFFE3000
MACB
Ethernet MAC - MACB
INTC
Interrupt controller - INTC
0xFFFF0000
0xFFFF0400
PM
Power Manager - PM
0xFFFF0800
SCIF
System Control Interface - SCIF
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AT32UC3C
Table 5-3.
Peripheral Address Mapping
0xFFFF0C00
AST
Asynchronous Timer - AST
WDT
Watchdog Timer - WDT
EIC
External Interrupt Controller - EIC
0xFFFF1000
0xFFFF1400
0xFFFF1800
FREQM
Frequency Meter - FREQM
0xFFFF2000
GPIO
0xFFFF2800
General Purpose Input/Output Controller - GPIO
USART0
Universal Synchronous/Asynchronous
Receiver/Transmitter - USART0
USART2
Universal Synchronous/Asynchronous
Receiver/Transmitter - USART2
USART3
Universal Synchronous/Asynchronous
Receiver/Transmitter - USART3
0xFFFF2C00
0xFFFF3000
0xFFFF3400
SPI1
Serial Peripheral Interface - SPI1
0xFFFF3800
TWIM0
Two-wire Master Interface - TWIM0
TWIM1
Two-wire Master Interface - TWIM1
TWIS0
Two-wire Slave Interface - TWIS0
TWIS1
Two-wire Slave Interface - TWIS1
0xFFFF3C00
0xFFFF4000
0xFFFF4400
0xFFFF4800
IISC
Inter-IC Sound (I2S) Controller - IISC
PWM
Pulse Width Modulation Controller - PWM
0xFFFF4C00
0xFFFF5000
QDEC0
Quadrature Decoder - QDEC0
QDEC1
Quadrature Decoder - QDEC1
0xFFFF5400
0xFFFF5800
TC1
Timer/Counter - TC1
0xFFFF5C00
PEVC
Peripheral Event Controller - PEVC
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AT32UC3C
Table 5-3.
Peripheral Address Mapping
0xFFFF6000
ACIFA0
Analog Comparators Interface - ACIFA0
ACIFA1
Analog Comparators Interface - ACIFA1
0xFFFF6400
0xFFFF6800
DACIFB0
DAC interface - DACIFB0
DACIFB1
DAC interface - DACIFB1
0xFFFF6C00
0xFFFF7000
AW
5.4
aWire - AW
CPU Local Bus Mapping
Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to
being mapped on the Peripheral Bus. These registers can therefore be reached both by
accesses on the Peripheral Bus, and by accesses on the local bus.
Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since
the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at
CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers.
The following GPIO registers are mapped on the local bus:
Table 5-4.
Local bus mapped GPIO registers
Port
Register
Mode
Local Bus
Address
Access
A
Output Driver Enable Register (ODER)
WRITE
0x40000040
Write-only
SET
0x40000044
Write-only
CLEAR
0x40000048
Write-only
TOGGLE
0x4000004C
Write-only
WRITE
0x40000050
Write-only
SET
0x40000054
Write-only
CLEAR
0x40000058
Write-only
TOGGLE
0x4000005C
Write-only
-
0x40000060
Read-only
Output Value Register (OVR)
Pin Value Register (PVR)
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AT32UC3C
Table 5-4.
Local bus mapped GPIO registers
Port
Register
Mode
Local Bus
Address
Access
B
Output Driver Enable Register (ODER)
WRITE
0x40000140
Write-only
SET
0x40000144
Write-only
CLEAR
0x40000148
Write-only
TOGGLE
0x4000014C
Write-only
WRITE
0x40000150
Write-only
SET
0x40000154
Write-only
CLEAR
0x40000158
Write-only
TOGGLE
0x4000015C
Write-only
Pin Value Register (PVR)
-
0x40000160
Read-only
Output Driver Enable Register (ODER)
WRITE
0x40000240
Write-only
SET
0x40000244
Write-only
CLEAR
0x40000248
Write-only
TOGGLE
0x4000024C
Write-only
WRITE
0x40000250
Write-only
SET
0x40000254
Write-only
CLEAR
0x40000258
Write-only
TOGGLE
0x4000025C
Write-only
Pin Value Register (PVR)
-
0x40000260
Read-only
Output Driver Enable Register (ODER)
WRITE
0x40000340
Write-only
SET
0x40000344
Write-only
CLEAR
0x40000348
Write-only
TOGGLE
0x4000034C
Write-only
WRITE
0x40000350
Write-only
SET
0x40000354
Write-only
CLEAR
0x40000358
Write-only
TOGGLE
0x4000035C
Write-only
-
0x40000360
Read-only
Output Value Register (OVR)
C
Output Value Register (OVR)
D
Output Value Register (OVR)
Pin Value Register (PVR)
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AT32UC3C
6. Supply and Startup Considerations
6.1
6.1.1
Supply Considerations
Power Supplies
The AT32UC3C has several types of power supply pins:
• VDDIO pins (VDDIO1, VDDIO2, VDDIO3): Power I/O lines. Two voltage ranges are available: 5V or
3.3V nominal. The VDDIO pins should be connected together.
• VDDANA: Powers the Analog part of the device (Analog I/Os, ADC, ACs, DACs). 2 voltage ranges
•
•
•
•
•
•
•
available: 5V or 3.3V nominal.
VDDIN_5: Input voltage for the 1.8V and 3.3V regulators. Two Voltage ranges are available: 5V or
3.3V nominal.
VDDIN_33:
– USB I/O power supply
– if the device is 3.3V powered: Input voltage, voltage is 3.3V nominal.
– if the device is 5V powered: stabilization for the 3.3V voltage regulator, requires external
capacitors
VDDCORE: Stabilization for the 1.8V voltage regulator, requires external capacitors.
GNDCORE: Ground pins for the voltage regulators and the core.
GNDANA: Ground pin for Analog part of the design
GNDPLL: Ground pin for the PLLs
GNDIO pins (GNDIO1, GNDIO2, GNDIO3): Ground pins for the I/O lines. The GNDIO pins should be
connected together.
See ”Electrical Characteristics” on page 49 for power consumption on the various supply pins.
For decoupling recommendations for the different power supplies, please refer to the schematic
checklist.
6.1.2
Voltage Regulators
The AT32UC3C embeds two voltage regulators:
• One 1.8V internal regulator that converts from VDDIN_5 to 1.8V. The regulator supplies the
output voltage on VDDCORE.
• One 3.3V internal regulator that converts from VDDIN_5 to 3.3V. The regulator supplies the
USB pads on VDDIN_33. If the USB is not used or if VDDIN_5 is within the 3V range, the
3.3V regulator can be disabled through the VREG33CTL field of the VREGCTRL SCIF
register.
6.1.3
Regulators Connection
The AT32UC3C supports two power supply configurations.
• 5V single supply mode
• 3.3V single supply mode
6.1.3.1
5V Single Supply Mode
In 5V single supply mode, the 1.8V internal regulator is connected to the 5V source (VDDIN_5
pin) and its output feeds VDDCORE.
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The 3.3V regulator is connected to the 5V source (VDDIN_5 pin) and its output feeds the USB
pads. If the USB is not used, the 3.3V regulator can be disabled through the VREG33CTL field
of the VREGCTRL SCIF register.
Figure 6-1 on page 46 shows the power schematics to be used for 5V single supply mode. All
I/O lines and analog blocks will be powered by the same power (VDDIN_5 = VDDIO1 = VDDIO2
= VDDIO3 = VDDANA).
Figure 6-1.
5V Single Power Supply mode
+
4.55.5V
-
CIN2
VDDIO1
VDDIO2
VDDIO3
VDDIN_5
VDDANA
GNDANA
CIN1
BOD33
Analog: ADC, AC, DAC, ...
BOD50
VDDIN_33
COUT2
3.3V
Reg
COUT1
VDDCORE
COUT2
CPU
Peripherals
Memories
GNDIO1
GNDIO2
GNDIO3
1.8V
Reg
COUT1
SCIF, BOD,
RCSYS
GNDPLL
PLL
BOD18
GNDCORE
POR
6.1.3.2
3.3V Single Supply Mode
In 3.3V single supply mode, the VDDIN_5 and VDDIN_33 pins should be connected together
externally. The 1.8V internal regulator is connected to the 3.3 V source (VDDIN_5 pin) and its
output feeds VDDCORE.
The 3.3V regulator should be disabled once the circuit is running through the VREG33CTL field
of the VREGCTRL SCIF register.
Figure 6-2 on page 47 shows the power schematics to be used for 3.3V single supply mode. All
I/O lines and analog blocks will be powered by the same power (VDDIN_5 = VDDIN_33 =
VDDIO1 = VDDIO2 = VDDIO3 = VDDANA).
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Figure 6-2.
3 Single Power Supply Mode
+
3.03.6V
CIN2
VDDIO1
VDDIO2
VDDIO3
VDDIN_5
VDDANA
GNDANA
CIN1
BOD33
Analog: ADC, AC, DAC, ...
BOD50
3.3V
Reg
VDDIN_33
VDDCORE
COUT2
1.8V
Reg
COUT1
CPU
Peripherals
Memories
GNDIO1
GNDIO2
GNDIO3
SCIF, BOD,
RCSYS
GNDPLL
PLL
BOD18
GNDCORE
POR
6.1.4
6.1.4.1
Power-up Sequence
Maximum Rise Rate
To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values
described in Table 7-2 on page 50.
Recommended order for power supplies is also described in this table.
6.1.4.2
Minimum Rise Rate
The integrated Power-Reset circuitry monitoring the powering supply requires a minimum rise
rate for the VDDIN_5 power supply.
See Table 7-2 on page 50 for the minimum rise rate value.
If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, the following configuration can be used:
• A logic “0” value is applied during power-up on pin RESET_N until:
– VDDIN_5 rises above 4.5V in 5V single supply mode.
– VDDIN_33 rises above 3V in 3.3V single supply mode.
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6.2
Startup Considerations
This chapter summarizes the boot sequence of the AT32UC3C. The behavior after power-up is
controlled by the Power Manager. For specific details, refer to the Power Manager chapter.
6.2.1
Starting of clocks
At power-up, the BOD33 and the BOD18 are enabled. The device will be held in a reset state by
the power-up circuitry, until the VDDIN_33 (resp. VDDCORE) has reached the reset threshold of
the BOD33 (resp BOD18). Refer to the Electrical Characteristics for the BOD thresholds. Once
the power has stabilized, the device will use the System RC Oscillator (RCSYS, 115KHz typical
frequency) as clock source. The BOD18 and BOD33 are kept enabled or are disabled according
to the fuse settings (See the Fuse Setting section in the Flash Controller chapter).
On system start-up, the PLLs are disabled. All clocks to all modules are running. No clocks have
a divided frequency, all parts of the system receive a clock with the same frequency as the internal RC Oscillator.
6.2.2
Fetching of initial instructions
After reset has been released, the AVR32UC CPU starts fetching instructions from the reset
address, which is 0x8000_0000. This address points to the first address in the internal Flash.
The internal Flash uses VDDIO voltage during read and write operations. It is recommended to
use the BOD33 to monitor this voltage and make sure the VDDIO is above the minimum level
(3.0V).
The code read from the internal Flash is free to configure the system to use for example the
PLLs, to divide the frequency of the clock routed to some of the peripherals, and to gate the
clocks to unused peripherals.
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7. Electrical Characteristics
7.1
Absolute Maximum Ratings*
Operating temperature................................... -40°C to +125°C
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage temperature...................................... -60°C to +150°C
Voltage on any pin except DM/DP/VBUS
with respect to ground ............................ -0.3V to VVDD(1)+0.3V
Voltage on DM/DP with respect to ground.........-0.3V to +3.6V
Voltage on VBUS with respect to ground...........-0.3V to +5.5V
Maximum operating voltage (VDDIN_5) ........................... 5.5V
Maximum operating voltage (VDDIO1, VDDIO2, VDDIO3,
VDDANA).......................................................................... 5.5V
Maximum operating voltage (VDDIN_33) ......................... 3.6V
Total DC output current on all I/O pins- VDDIO1 ........... 40 mA
Total DC output current on all I/O pins- VDDIO2 ........... 40 mA
Total DC output current on all I/O pins- VDDIO3 ........... 40 mA
Total DC output current on all I/O pins- VDDANA.......... 40 mA
Notes:
1. VVDD corresponds to either VVDDIO1, VVDDIO2, VVDDIO3, or VVDDANA, depending on the supply for the pin. Refer to Section 3-1
on page 11 for details.
7.2
Supply Characteristics
The following characteristics are applicable to the operating temperature range: TA = -40°C to 125°C, unless otherwise
specified and are valid for a junction temperature up to TJ = 145°C. Please refer to Section 6. ”Supply and Startup Considerations” on page 45.
Table 7-1.
Supply Characteristics
Voltage
Symbol
Parameter
VVDDIN_5
DC supply internal regulators
VVDDIN_33
VVDDANA
VVDDIO1
VVDDIO2
VVDDIO2
Condition
Min
Max
3V range
3.0
3.6
5V range
4.5
5.5
DC supply USB I/O
only in 3V range
3.0
3.6
DC supply peripheral I/O and
analog part
3V range
3.0
3.6
5V range
4.5
5.5
3V range
3.0
3.6
5V range
4.5
5.5
Unit
V
V
V
DC supply peripheral I/O
V
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Table 7-2.
Supply Rise Rates and Order
Rise Rate
Symbol
Parameter
Min
Max
VVDDIN_5
DC supply internal 3.3V regulator
0.01 V/ms
1.25 V/us
VVDDIN_33
DC supply internal 1.8V regulator
0.01 V/ms
1.25 V/us
VVDDIO1
VVDDIO2
VVDDIO3
DC supply peripheral I/O
0.01 V/ms
1.25 V/us
Rise after or at the same time as
VDDIN_5, VDDIN_33
VVDDANA
DC supply peripheral I/O and
analog part
0.01 V/ms
1.25 V/us
Rise after or at the same time as
VDDIN_5, VDDIN_33
7.3
Comment
Maximum Clock Frequencies
These parameters are given in the following conditions:
• VVDDCORE > 1.85V
• Temperature = -40°C to 125°C
Table 7-3.
Clock Frequencies
Symbol
Parameter
fCPU
Conditions
Min
Max
Units
CPU clock frequency
50
MHz
fPBA
PBA clock frequency
50
MHz
fPBB
PBB clock frequency
50
MHz
fPBC
PBC clock frequency
50
MHz
(1)
fGCLK0
GCLK0 clock frequency
Generic clock for USBC
50
MHz
fGCLK1
GCLK1 clock frequency
Generic clock for CANIF
66(1)
MHz
fGCLK2
GCLK2 clock frequency
Generic clock for AST
80(1)
MHz
GCLK4 clock frequency
fGCLK4
GCLK11 clock frequency
fGCLK11
Generic clock for PWM
Generic clock for IISC
(1)
120
(1)
50
MHz
MHz
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
7.4
Power Consumption
The values in Table 7-4 are measured values of power consumption under the following conditions, except where noted:
• Operating conditions core supply (Figure 7-1)
– VVDDIN_5 = VVDDIN_33 = 3.3V
– VVDDCORE = 1.85V, supplied by the internal regulator
– VVDDIO1 = VVDDIO2 = VVDDIO3 = 3.3V
– VVDDANA = 3.3V
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– Internal 3.3V regulator is off
• TA = 25°C
• I/Os are configured as inputs, with internal pull-up enabled.
• Oscillators
– OSC0/1 (crystal oscillator) stopped
– OSC32K (32KHz crystal oscillator) stopped
– PLL0 running
– PLL1 stopped
• Clocks
– External clock on XIN0 as main clock source (10MHz)
– CPU, HSB, and PBB clocks undivided
– PBA, PBC clock divided by 4
– All peripheral clocks running
Table 7-4.
Mode
Power Consumption for Different Operating Modes
Conditions
(1)
Active
Measured on
CPU running a recursive Fibonacci algorithm
Consumption Typ
Unit
512
Idle(1)
258
µA/MHz
(1)
106
Frozen
Standby(1)
48
Amp
Stop
73
DeepStop
43
µA
OSC32K and AST running
32
AST and OSC32K stopped
31
Static
Note:
1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies.
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Figure 7-1.
Measurement Schematic
VDDANA
VDDIO
Amp
VDDIN_5
VDDIN_33
VDDCORE
GNDCORE
GNDPLL
7.4.1
Peripheral Power Consumption
The values in Table 7-5 are measured values of power consumption under the following
conditions.
• Operating conditions core supply (Figure 7-1)
– VVDDIN_5 = VDDIN_33 = 3.3V
– VVDDCORE = 1.85V , supplied by the internal regulator
– VVDDIO1 = VVDDIO2 = VVDDIO3 = 3.3V
– VVDDANA = 3.3V
– Internal 3.3V regulator is off.
• TA = 25°C
• I/Os are configured as inputs, with internal pull-up enabled.
• Oscillators
– OSC0/1 (crystal oscillator) stopped
– OSC32K (32KHz crystal oscillator) stopped
– PLL0 running
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– PLL1 stopped
• Clocks
– External clock on XIN0 as main clock source.
– CPU, HSB, and PB clocks undivided
Consumption active is the added current consumption when the module clock is turned on and
when the module is doing a typical set of operations.
Table 7-5.
Peripheral
Typical Current Consumption by Peripheral(2)
Typ Consumption Active
(1)
ACIFA
(1)
3
ADCIFA
7
AST
3
CANIF
25
DACIFB(1)
3
EBI
23
EIC
0.5
FREQM
0.5
GPIO
37
INTC
3
MDMA
4
PDCA
24
PEVC
15
PWM
40
QDEC
3
SAU
3
SDRAMC
2
SMC
9
SPI
5
TC
8
TWIM
2
TWIS
2
USART
10
USBC
5
WDT
2
Notes:
Unit
µA/MHz
1. Includes the current consumption on VDDANA.
2. These numbers are valid for the measured condition only and must not be extrapolated to
other frequencies.
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7.5
I/O Pin Characteristics
Normal I/O Pin Characteristics(1)
Table 7-6.
Symbol
Parameter
RPULLUP
Pull-up resistance
RPULLDOWN
Pull-down resistance
VIL
Input low-level
voltage
VIH
Input high-level
voltage
Condition
Min
VVDD = 3V
VVDD = 5V
Typ
Max
Units
5
26
kOhm
5
16
kOhm
2
16
kOhm
VVDD = 3V
0.3*VVDDIO
VVDD = 4.5V
0.3*VVDDIO
VVDD = 3.6V
0.7*VVDDIO
VVDD = 5.5V
0.7*VVDDIO
V
V
IOL = -3.5mA, pin drive x1(2)
VOL
Output low-level
voltage
IOL = -7mA, pin drive x2(2)
0.5
V
IOL = -14mA, pin drive x4(2)
IOH = 3.5mA, pin drive x1(2)
VOH
Output high-level
voltage
IOH = 7mA, pin drive x2(2)
VVDD - 0.8
V
(2)
IOH = 14mA, pin drive x4
VVDD = 3.0V
fMAX
load = 10pF, pin drive x1(2)
30
load = 10pF, pin drive x2(2)
50
load = 10pF, pin drive x4
(2)
60
load = 30pF, pin drive x1
(2)
15
load = 30pF, pin drive x2(2)
25
(2)
40
(2)
45
load = 10pF, pin drive x2(2)
65
load = 10pF, pin drive x4(2)
85
load = 30pF, pin drive x1(2)
20
load = 30pF, pin drive x4
Output frequency(3)
load = 10pF, pin drive x1
VVDD =4.5V
MHz
load = 30pF, pin drive x2
(2)
40
load = 30pF, pin drive x4
(2)
60
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Normal I/O Pin Characteristics(1)
Table 7-6.
Symbol
Parameter
Condition
VVDD = 3.0V
tRISE
Rise time(3)
VVDD = 4.5V
VVDD = 3.0V
tFALL
Fall time(3)
VVDD = 4.5V
ILEAK
CIN
Min
Max
load = 10pF, pin drive x1
8.4
load = 10pF, pin drive x2
(2)
3.8
load = 10pF, pin drive x4
(2)
2.1
load = 30pF, pin drive x1(2)
17.5
load = 30pF, pin drive x2(2)
8.2
load = 30pF, pin drive x4
(2)
4.2
load = 10pF, pin drive x1
(2)
5.9
load = 10pF, pin drive x2(2)
2.6
load = 10pF, pin drive x4
(2)
1.5
load = 30pF, pin drive x1
(2)
12.2
load = 30pF, pin drive x2
(2)
5.7
load = 30pF, pin drive x4(2)
3.0
load = 10pF, pin drive x1
(2)
8.5
load = 10pF, pin drive x2
(2)
3.9
load = 10pF, pin drive x4
(2)
2.1
17.6
load = 30pF, pin drive x2(2)
8.1
load = 30pF, pin drive x4
(2)
4.3
load = 10pF, pin drive x1
(2)
5.9
load = 10pF, pin drive x2(2)
2.7
load = 10pF, pin drive x4
(2)
1.5
load = 30pF, pin drive x1
(2)
12.2
load = 30pF, pin drive x2
(2)
5.7
load = 30pF, pin drive x4(2)
3.0
Input leakage current
Pull-up resistors disabled
Input capacitance
PA00-PA29, PB00-PB31, PC00-PC01,
PC08-PC31, PD00-PD30
Units
ns
load = 30pF, pin drive x1(2)
PC02, PC03, PC04, PC05, PC06, PC07
Note:
Typ
(2)
ns
2.0
µA
7.5
pF
2
1. VVDD corresponds to either VVDDIO1, VVDDIO2, VVDDIO3, or VVDDANA, depending on the supply for the pin. Refer to Section 3-1
on page 11 for details.
2. drive x1 capability pins are: PB00, PB01, PB02, PB03, PB30, PB31, PC02, PC03, PC04, PC05, PC06, PC07 - drive x2 /x4
capability pins are: PB06, PB21, PB26, PD02, PD06, PD13 - drive x1/x2 capability pins are the remaining PA, PB, PC, PD
pins. The drive strength is programmable through ODCR0, ODCR0S, ODCR0C, ODCR0T registers of GPIO.
3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
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7.6
Oscillator Characteristics
7.6.1
7.6.1.1
Oscillator (OSC0 and OSC1) Characteristics
Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied
on XIN0 or XIN1.
Table 7-7.
Digital Clock Characteristics
Symbol
Parameter
fCPXIN
XIN clock frequency
tCPXIN
XIN clock period
tCHXIN
XIN clock high half-priod
0.4 x tCPXIN
0.6 x tCPXIN
ns
tCLXIN
XIN clock low half-priod
0.4 x tCPXIN
0.6 x tCPXIN
ns
CIN
XIN input capacitance
7.6.1.2
Conditions
Min
Typ
Max
Units
50
MHz
20
ns
2
pF
Crystal Oscillator Characteristics
The following table describes the characteristics for the oscillator when a crystal is connected
between XIN and XOUT as shown in Figure 7-2. The user must choose a crystal oscillator
where the crystal load capacitance CL is within the range given in the table. The exact value of CL
can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can
then be computed as follows:
C LEXT = 2 ( C L – C i ) – C PCB
where CPCB is the capacitance of the PCB and Ci is the internal equivalent load capacitance.
Figure 7-2.
Oscillator Connection
UC3C
CLEXT
XOUT
Ci
CL
XIN
CLEXT
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Table 7-8.
Crystal Oscillator Characteristics
Symbol
Parameter
fOUT
Crystal oscillator frequency
Ci
Internal equivalent load capacitance
tSTARTUP
Notes:
Conditions
Min
Typ
0.4
Max
Unit
20
MHz
1.7
pF
fOUT = 8MHz
SCIF.OSCCTRL.GAIN = 1(1)
975
us
fOUT = 16MHz
SCIF.OSCCTRL.GAIN = 2(1)
1100
us
Startup time
1. Please refer to the SCIF chapter for details.
7.6.2
32KHz Crystal Oscillator (OSC32K) Characteristics
7.6.2.1
Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied
on XIN32.
Table 7-9.
Digital 32KHz Clock Characteristics
Symbol
Parameter
fCPXIN
XIN32 clock frequency
tCPXIN
XIN32 clock period
tCHXIN
XIN32 clock high half-priod
0.4 x tCPXIN
0.6 x tCPXIN
ns
tCLXIN
XIN32 clock low half-priod
0.4 x tCPXIN
0.6 x tCPXIN
ns
CIN
XIN32 input capacitance
7.6.2.2
Conditions
Min
Typ
Max
Units
32.768
5000
KHz
200
ns
2
pF
Crystal Oscillator Characteristics
Figure 7-2 and the equation above also applies to the 32 KHz oscillator connection. The user
must choose a crystal oscillator where the crystal load capacitance CL is within the range given
in the table. The exact value of CL can then be found in the crystal datasheet..
Table 7-10.
32 KHz Crystal Oscillator Characteristics
Symbol
Parameter
fOUT
Crystal oscillator frequency
tSTARTUP
Startup time
CL
Crystal load capacitance
Ci
Internal equivalent load
capacitance
Conditions
Min
RS = 50 kOhm, CL = 12.5pF
Typ
Max
Unit
32 768
Hz
2
s
6
15
1.4
pF
pF
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7.6.3
Phase Lock Loop (PLL0 and PLL1) Characteristics
Table 7-11.
PLL Characteristics
Symbol
Parameter
fVCO
Output frequency
fIN
Input frequency
IPLL
Current consumption
tSTARTUP
Startup time, from enabling
the PLL until the PLL is
locked
7.6.4
Typ
Max
Unit
80
240
MHz
4
16
MHz
Active mode, fVCO = 80MHz
250
Active mode, fVCO = 240MHz
600
Wide Bandwidth mode disabled
15
Wide Bandwidth mode enabled
45
µA
µs
Internal 120MHz RC Oscillator Characteristics
Symbol
Parameter
fOUT
Output frequency(1)
IRC120M
Current consumption
tSTARTUP
Startup time
Conditions
Min
Typ
Max
Unit
88
120
152
MHz
1.85
mA
3
µs
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
7.6.5
System RC Oscillator (RCSYS) Characteristics
Table 7-13.
Symbol
System RC Oscillator Characteristics
Parameter
Output frequency
fOUT
7.6.6
Conditions
Min
Typ
Max
Calibrated at TA = 125°C
110
115.2
120
TA = 25°C
105
109
115
TA = -40°C
100
104
108
Unit
kHz
8MHz/1MHz RC Oscillator (RC8M) Characteristics
Table 7-14.
Symbol
8MHz/1MHz RC Oscillator Characteristics
Parameter
fOUT
Output frequency
tSTARTUP
Startup time
Notes:
Min
120MHz RC Oscillator (RC120M) Characteristics
Table 7-12.
Note:
Conditions
Conditions
Min
Typ
Max
SCIF.RCCR8.FREQMODE = 0
(1)
7.5
8
8.5
SCIF.RCCR8.FREQMODE = 1
(1)
0.925
1
1.075
Unit
MHz
20
µs
1. Please refer to the SCIF chapter for details.
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7.7
Flash Characteristics
Table 7-15 gives the device maximum operating frequency depending on the number of flash
wait states. The FSW bit in the FLASHC FSR register controls the number of wait states used
when accessing the flash memory.
Table 7-15.
Maximum Operating Frequency
Flash Wait States
Read Mode
Maximum Operating Frequency
0
1 cycle
25MHz
1
2 cycles
50MHz
Table 7-16.
Flash Characteristics
Symbol
Parameter
tFPP
Page programming time
tFPE
Page erase time
tFFP
Fuse programming time
tFEA
Full chip erase time (EA)
tFCE
JTAG chip erase time (CHIP_ERASE)
Table 7-17.
Conditions
Min
Typ
Max
Unit
17
17
fCLK_HSB = 50MHz
1.3
ms
18.3
fCLK_HSB = 115kHz
640
Flash Endurance and Data Retention
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
NFARRAY
Array endurance (write/page)
10k
cycles
NFFUSE
General Purpose fuses endurance (write/bit)
500
cycles
tRET
Data retention
15
years
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7.8
Analog Characteristics
7.8.1
1.8V Voltage Regulator Characteristics
Table 7-18.
1.8V Voltage Regulator Electrical Characteristics
Symbol
Parameter
VVDDIN_5
Input voltage range
VVDDCORE
Output voltage, calibrated value
IOUT
DC output current
Table 7-19.
Condition
Min
Typ
Max
5V range
4.5
5.5
3V range
3.0
3.6
Units
V
1.85
V
80
mA
Decoupling Requirements
Symbol
Parameter
CIN1
Typ
Techno.
Units
Input regulator capacitor 1
1
NPO
nF
CIN2
Input regulator capacitor 2
4.7
X7R
uF
COUT1
Output regulator capacitor 1
470
NPO
pf
COUT2
Output regulator capacitor 2
2.2
X7R
uF
7.8.2
Condition
3.3V Voltage Regulator Characteristics
Table 7-20.
3.3V Voltage Regulator Electrical Characteristics
Symbol
Parameter
VVDDIN_5
Input voltage range
VVDDIN_33
Output voltage, calibrated value
IOUT
DC output current
IVREG
Static current of regulator
7.8.3
Condition
Min
Typ
4.5
Max
Units
5.5
V
3.4
V
35
Low power mode
mA
10
µA
1.8V Brown Out Detector (BOD18) Characteristics
The values in Table 7-21 describe the values of the BOD.LEVEL in the SCIF module.
Table 7-21.
BODLEVEL Values
BODLEVEL Value
Parameter
Min
Max
0
1.34
1.52
20
1.39
1.60
1.46
1.67
28
1.48
1.70
32
1.52
1.74
36
1.56
1.79
40
1.61
1.85
26
threshold at power-up sequence
Units
V
60
9166DS–AVR-01/12
AT32UC3C
7.8.4
3.3V Brown Out Detector (BOD33) Characteristics
The values in Table 7-23 describe the values of the BOD33.LEVEL field in the SCIF module.
Table 7-23.
BOD33.LEVEL Values
BOD33.LEVEL Value
Parameter
Min
Max
17
2.27
2.52
22
2.36
2.61
27
2.45
2.71
2.52
2.79
33
2.56
2.83
39
2.67
2.95
44
2.76
3.05
49
2.85
3.15
53
2.91
3.23
60
3.05
3.37
31
threshold at power-up sequence
Units
V
7.8.5
5V Brown Out Detector (BOD50) Characteristics
The values in Table 7-25 describe the values of the BOD50.LEVEL field in the SCIF module.
Table 7-25.
BOD50.LEVEL Values
BOD50.LEVEL Value
Parameter
Min
Max
16
3.28
3.61
25
3.52
3.87
35
3.78
4.17
44
4.02
4.43
53
4.25
4.69
61
4.47
4.92
Units
V
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7.8.6
Analog to Digital Converter (ADC) and sample and hold (S/H) Characteristics
Table 7-27.
Symbol
fADC
ADC and S/H characteristics
Parameter
ADC clock
frequency
Conditions
Min
Typ
12-bit resolution mode, VVDDANA = 3V
1.2
10-bit resolution mode, VVDDANA = 3V
1.6
8-bit resolution mode, VVDDANA = 3V
2.2
12-bit resolution mode, VVDDANA = 4.5V
1.5
10-bit resolution mode, VVDDANA = 4.5V
2
8-bit resolution mode, VVDDANA = 4.5V
2.4
ADC cold start-up
tSTARTUP
Startup time
tCONV
Conversion time
(latency)
Throughput rate
ADC hot start-up
ms
24
8
(ADCIFA.SEQCFGn.SRES)/2 + 3,
ADCIFA.CFG.SHD = 0
7
9
12-bit resolution,
ADC clock = 1.2 MHz, VVDDANA = 3V
1.2
10-bit resolution,
ADC clock = 1.6 MHz, VVDDANA = 3V
1.6
12-bit resolution,
ADC clock = 1.5 MHz, VVDDANA = 4.5V
1.5
ADC clock
cycles
MSPS
2
ADC Reference Voltage
Parameter
VADCREF0
ADCREF0 input voltage range
VADCREF1
ADCREF1 input voltage range
VADCREFN
MHz
ADC clock
cycles
6
Symbol
VADCREFP
Units
1
(ADCIFA.SEQCFGn.SRES)/2 + 2,
ADCIFA.CFG.SHD = 1
10-bit resolution,
ADC clock = 2 MHz, VVDDANA = 4.5V
Table 7-28.
Max
ADCREFP input voltage
ADCREFN input voltage
Internal 1V reference
Internal 0.6*VDDANA reference
Conditions
Min
Typ
Max
5V Range
1
3.5
3V Range
1
VVDDANA-0.7
5V Range
1
3.5
3V Range
1
VVDDANA-0.7
5V Range - Voltage reference
applied on ADCREFP
1
3.5
3V Range - Voltage reference
applied on ADCREFP
1
VVDDANA-0.7
Voltage reference applied on
ADCREFN
Unit
s
V
V
V
GNDANA
V
1.0
V
0.6*VVDDANA
V
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AT32UC3C
Table 7-29.
ADC Decoupling requirements
Symbol
Parameter
Conditions
CADCREFPN
ADCREFP/ADCREFN capacitance
No voltage reference appplied on
ADCREFP/ADCREFN
Table 7-30.
Min
Typ
Max
100
Units
nF
ADC Inputs
Symbol
Parameter
VADCINn
ADC input voltage range
Conditions
CONCHIP
Internal Capacitance
RONCHIP
Switch resistance
Figure 7-3.
Min
Typ
0
Max
Units
VVDDANA
V
ADC used without S/H
5
ADC used with S/H
4
ADC used without S/H
5.1
ADC used with S/H
4.6
pF
kΩ
ADC input
UC3C
RSOURCE
VIN
Table 7-31.
ADCIN
RONCHIP
CSOURCE
CONCHIP
ADC Transfer Characteristics 12-bit Resolution Mode(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 0
(Fadc = 1.2MHz)
Offset error
Gain error
Min
Typ
Max
Units
12
Bit
6
LSB
5
LSB
-10
10
mV
-30
30
mV
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AT32UC3C
Table 7-31.
Symbol
ADC Transfer Characteristics (Continued)12-bit Resolution Mode(1)
Parameter
Conditions
Differential mode,
VVDDANA = 5V,
VADCREF0 = 3V,
ADCFIA.SEQCFGn.SRES = 0
(Fadc = 1.5MHz)
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Note:
Max
Units
12
Bit
5
LSB
4
LSB
-20
20
mV
-30
30
mV
Max
Units
10
Bit
1.25
LSB
ADC Transfer Characteristics 10-bit Resolution Mode(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 1
(Fadc = 1.5MHz)
DNL
Differential Non-Linearity
Offset error
Gain error
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Differential mode,
VVDDANA = 5V,
VADCREF0= 3V,
ADCFIA.SEQCFGn.SRES = 1
(Fadc = 1.5MHz)
Min
Typ
1.25
LSB
-10
10
mV
-20
20
mV
10
Bit
1.25
LSB
1.25
LSB
-20
20
mV
-25
25
mV
Max
Units
8
Bit
0.3
LSB
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
Table 7-33.
ADC Transfer Characteristics 8-bit Resolution Mode(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 2
(Fadc =1.5MHz)
DNL
Differential Non-Linearity
Offset error
Gain error
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Note:
Typ
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
Table 7-32.
Note:
Min
Differential mode,
VVDDANA = 5V,
VADCREF0 = 3V,
ADCFIA.SEQCFGn.SRES = 2
(Fadc = 1.5MHz)
Min
Typ
0.3
LSB
-10
10
mV
-20
20
mV
8
Bit
0.3
LSB
0.25
LSB
-25
25
mV
-25
25
mV
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
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Table 7-34.
ADC and S/H Transfer Characteristics 12-bit Resolution Mode and S/H gain = 1(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 0,
S/H gain = 1
(Fadc = 1.2MHz)
DNL
Differential Non-Linearity
Offset error
Gain error
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Note:
Differential mode,
VVDDANA = 5V,
VADCREF0 = 3V,
ADCFIA.SEQCFGn.SRES = 0,
S/H gain = 1
(Fadc = 1.5MHz)
Typ
Max
Units
12
Bit
6
LSB
5
LSB
-10
10
mV
-30
30
mV
12
Bit
6
LSB
4
LSB
-15
15
mV
-30
30
mV
Max
Units
12
Bit
30
LSB
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
Table 7-35.
ADC and S/H Transfer Characteristics 12-bit Resolution Mode and S/H gain from 1 to 8(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 0,
S/H gain from 1 to 8
(Fadc = 1.2MHz)
DNL
Differential Non-Linearity
Offset error
Gain error
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Note:
Min
Differential mode,
VVDDANA = 5V,
VADCREF0 = 3V,
ADCFIA.SEQCFGn.SRES = 0,
S/H gain from 1 to 8
(Fadc = 1.5MHz)
Min
Typ
30
LSB
-10
10
mV
-25
25
mV
12
Bit
10
LSB
15
LSB
-20
20
mV
-30
30
mV
Max
Units
10
Bit
4
LSB
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain
Table 7-36.
ADC and S/H Transfer Characteristics 10-bit Resolution Mode and S/H gain from 1 to 16(1)
Symbol
Parameter
Conditions
RES
Resolution
INL
Integral Non-Linearity
Differential mode,
VVDDANA = 3V,
VADCREF0 = 1V,
ADCFIA.SEQCFGn.SRES = 1,
S/H gain from 1 to 16
(Fadc = 1.5MHz)
DNL
Differential Non-Linearity
Offset error
Gain error
Min
Typ
4
LSB
-15
15
mV
-25
25
mV
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AT32UC3C
Table 7-36.
ADC and S/H Transfer Characteristics (Continued)10-bit Resolution Mode and S/H gain from 1 to 16(1)
Symbol
Parameter
Conditions
Differential mode,
VVDDANA = 5V,
VADCREF0 = 3V,
ADCFIA.SEQCFGn.SRES = 1,
S/H gain from 1 to 16
(Fadc = 1.5MHz)
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
Offset error
Gain error
Note:
Min
Typ
Max
Units
10
Bit
2
LSB
2
LSB
-30
30
mV
-30
30
mV
Max
Units
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
7.8.7
Digital to Analog Converter (DAC) Characteristics
Table 7-37.
Channel Conversion Time and DAC Clock
Symbol
Parameter
Conditions
Min
Typ
fDAC
DAC clock frequency
1
MHz
tSTARTUP
Startup time
3
µs
1
µs
1.5
µs
No S/H enabled, internal DAC
tCONV
Conversion time (latency)
One S/H
Two S/H
Throughput rate
Table 7-38.
Parameter
VDACREF
DACREF input voltage range
Symbol
µs
MSPS
External Voltage Reference Input
Symbol
Table 7-39.
2
1/tCONV
Conditions
Min
Typ
1.2
Max
Units
VVDDANA-0.7
V
DAC Outputs
Parameter
Output range
Conditions
Min
with external DAC reference
0.2
VDACREF
with internal DAC reference
0.2
VVDDANA-0.7
100
CLOAD
Output capacitance
0
RLOAD
Output resitance
2
Typ
Max
Units
V
pF
kΩ
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AT32UC3C
Figure 7-4.
DAC output
UC3C
DAC0A
S/H
CLOAD
DAC
RLOAD
Transfer Characteristics(1)
Table 7-40.
Symbol
Parameter
RES
Resolution
INL
Integral Non-Linearity
DNL
Differential Non-linearity
Offset error
Conditions
Min
VVDDANA = 3V,
VDACREF = 2V,
One S/H
Typ
Max
Units
12
Bit
20
LSB
20
LSB
80
mV
Gain error
100
mV
RES
Resolution
12
Bit
INL
Integral Non-Linearity
20
LSB
DNL
Differential Non-linearity
Offset error
VVDDANA = 5V,
VDACREF = 3V,
One S/H
Gain error
Note:
20
LSB
120
mV
100
mV
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
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7.8.8
Analog Comparator Characteristics
Analog Comparator Characteristics(1)
Table 7-41.
Symbol
Parameter
VOFFSET
Conditions
Max
Units
0
VVDDANA
V
Negative input voltage range
0
VVDDANA
V
Hysteresis
tDELAY
Propagation delay
tSTARTUP
Start-up time
Note:
Typ
Positive input voltage range
Offset
VHYST
Min
No hysteresis, Low Power mode
-36
36
mV
No hysteresis, High Speed mode
-21
21
mV
Low hysteresis, Low Power mode
7
49
Low hysteresis, High Speed mode
5
39
High hysteresis, Low Power mode
16
113
High hysteresis, High Speed mode
12
76
Low Power mode
3.3
High Speed mode
0.102
mV
mV
us
20
µs
1. The measures are done without any I/O activity on VDDANA/GNDANA power domain.
Table 7-42.
VDDANA scaled reference
Symbol
Parameter
Min
SCF
ACIFA.SCFi.SCF range
VVDDANA scaled
Typ
Max
0
32
(64 - SCF) * VVDDANA / 65
VVDDANA voltage accuracy
7.8.9
Units
V
4.1
%
USB Transceiver Characteristics
7.8.9.1
Electrical Characteristics
Table 7-43.
Electrical Parameters
Symbol
Parameter
Conditions
REXT
Recommended external USB series
resistor
In series with each USB pin with
±5%
Min.
Typ.
39
Max.
Unit
Ω
The USB on-chip buffers comply with the Universal Serial Bus (USB) v2.0 standard. All AC
parameters related to these buffers can be found within the USB 2.0 electrical specifications.
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7.9
Timing Characteristics
7.9.1
Startup, Reset, and Wake-up Timing
The startup, reset, and wake-up timings are calculated using the following formula:
t = t CONST + N CPU × t CPU
Where t CONST and N CPU are found in Table 7-44. t CONST is the delay relative to RCSYS,
t CPU is the period of the CPU clock. If another clock source than RCSYS is selected as CPU
clock the startup time of the oscillator, t OSCSTART , must be added to the wake-up time in the
stop, deepstop, and static sleep modes. Please refer to the source for the CPU clock in the
”Oscillator Characteristics” on page 56 for more details about oscillator startup times.
Table 7-44.
Maximum Reset and Wake-up Timing
Max t CONST (in µs)
Max N CPU
Parameter
Measuring
Startup time from power-up, using
regulator
VDDIN_5 rising (10 mV/ms)
Time from VVDDIN_5=0 to the first instruction entering
the decode stage of CPU. VDDCORE is supplied by
the internal regulator.
2600
0
Startup time from reset release
Time from releasing a reset source (except POR,
BOD18, and BOD33) to the first instruction entering
the decode stage of CPU.
1240
0
0
19
268
209
268
209
268+ t OSCSTART
212
Deepstop
268+ t OSCSTART
212
Static
268+ t OSCSTART
212
Idle
Frozen
Standby
Wake-up
Stop
From wake-up event to the first instruction entering
the decode stage of the CPU.
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AT32UC3C
Figure 7-5.
Startup and Reset Time
Voltage
VDDIN_5, VDDIN_33
BOD33 threshold at power-up
VDDCORE
BOD18 threshold at power-up
Time
Internal
Reset
7.9.2
Reset Time
Startup Time
from reset
Release
Decoding Stage
RESET_N characteristics
Table 7-45.
RESET_N Clock Waveform Parameters
Symbol
Parameter
tRESET
RESET_N minimum pulse length
Condition
Min.
2 * TRCSYS
Typ.
Max.
Units
clock cycles
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7.9.3
USART in SPI Mode Timing
7.9.3.1
Master mode
Figure 7-6.
USART in SPI Master Mode With (CPOL= CPHA= 0) or (CPOL= CPHA= 1)
SPCK
MISO
USPI0
USPI1
MOSI
USPI2
Figure 7-7.
USART in SPI Master Mode With (CPOL= 0 and CPHA= 1) or (CPOL= 1 and
CPHA= 0)
SPCK
MISO
USPI3
USPI4
MOSI
USPI5
Table 7-46.
Symbol
USART in SPI Mode Timing, Master Mode(1)
Parameter
USPI0
MISO setup time before SPCK rises
USPI1
MISO hold time after SPCK rises
USPI2
SPCK rising to MOSI delay
USPI3
MISO setup time before SPCK falls
USPI4
MISO hold time after SPCK falls
USPI5
SPCK falling to MOSI delay
Note:
Conditions
Min
27.5+
Max
tSAMPLE(2)
ns
0
external
capacitor =
40pF
Units
ns
12
ns
27.5+ tSAMPLE(2)
ns
0
ns
12.5
ns
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
t SPCK
1⎞
--- × t CLKUSART
2. Where: t SAMPLE = t SPCK – ⎛ -----------------------------------⎝ 2×t
2⎠
CLKUSART
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Maximum SPI Frequency, Master Output
The maximum SPI master output frequency is given by the following formula:
1 f CLKSPI × 2
f SPCKMAX = MIN (f PINMAX,------------, -----------------------------)
SPIn
9
Where SPIn is the MOSI delay, USPI2 or USPI5 depending on CPOL and NCPHA. f PINMAX is
the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for
the maximum frequency of the pins. f CLKSPI is the maximum frequency of the CLK_SPI. Refer
to the SPI chapter for a description of this clock.
Maximum SPI Frequency, Master Input
The maximum SPI master input frequency is given by the following formula:
f CLKSPI × 2
1
f SPCKMAX = MIN (------------------------------------,----------------------------)
SPIn + t VALID
9
Where SPIn is the MISO setup and hold time, USPI0 + USPI1 or USPI3 + USPI4 depending
on CPOL and NCPHA. T VALID is the SPI slave response time. Please refer to the SPI slave
datasheet for T VALID . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI
chapter for a description of this clock.
7.9.3.2
Slave mode
Figure 7-8.
USART in SPI Slave Mode With (CPOL= 0 and CPHA= 1) or (CPOL= 1 and
CPHA= 0)
SPCK
MISO
USPI6
MOSI
USPI7
USPI8
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Figure 7-9.
USART in SPI Slave Mode With (CPOL= CPHA= 0) or (CPOL= CPHA= 1)
SPCK
MISO
USPI9
MOSI
USPI10
USPI11
Figure 7-10. USART in SPI Slave Mode NPCS Timing
USPI12
USPI13
USPI14
USPI15
SPCK, CPOL=0
SPCK, CPOL=1
NSS
Table 7-47.
USART in SPI mode Timing, Slave Mode(1)
Symbol
Parameter
USPI6
SPCK falling to MISO delay
USPI7
MOSI setup time before SPCK rises
USPI8
MOSI hold time after SPCK rises
USPI9
SPCK rising to MISO delay
USPI10
MOSI setup time before SPCK falls
USPI11
MOSI hold time after SPCK falls
USPI12
Conditions
Min
tSAMPLE(2)
Max
Units
28.5
ns
+ tCLK_USART
ns
0
ns
30
external
capacitor =
40pF
ns
tSAMPLE(2) + tCLK_USART
ns
0
ns
NSS setup time before SPCK rises
35
ns
USPI13
NSS hold time after SPCK falls
0
ns
USPI14
NSS setup time before SPCK falls
35
ns
USPI15
NSS hold time after SPCK rises
0
ns
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
t SPCK
+1
---⎞ × t CLKUSART
2. Where: t SAMPLE = t SPCK – ⎛ -----------------------------------⎝ 2×t
2⎠
CLKUSART
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Maximum SPI Frequency, Slave Input Mode
The maximum SPI slave input frequency is given by the following formula:
f CLKSPI × 2 1
f SPCKMAX = MIN (----------------------------,------------)
9
SPIn
Where SPIn is the MOSI setup and hold time, USPI7 + USPI8 or USPI10 + USPI11 depending
on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI
chapter for a description of this clock.
Maximum SPI Frequency, Slave Output Mode
The maximum SPI slave output frequency is given by the following formula:
f CLKSPI × 2
1
f SPCKMAX = MIN (-----------------------------, f PINMAX,------------------------------------)
9
SPIn + t SETUP
Where SPIn is the MISO delay, USPI6 or USPI9 depending on CPOL and NCPHA. T SETUP is
the SPI master setup time. Please refer to the SPI masterdatasheet for T SETUP . f CLKSPI is the
maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this
clock. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins.
7.9.4
7.9.4.1
SPI Timing
Master mode
Figure 7-11. SPI Master Mode With (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1)
SPCK
MISO
SPI0
SPI1
MOSI
SPI2
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AT32UC3C
Figure 7-12. SPI Master Mode With (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0)
SPCK
MISO
SPI3
SPI4
MOSI
SPI5
Table 7-48.
SPI Timing, Master Mode(1)
Symbol
Parameter
SPI0
MISO setup time before SPCK rises
SPI1
MISO hold time after SPCK rises
SPI2
SPCK rising to MOSI delay
SPI3
MISO setup time before SPCK falls
SPI4
MISO hold time after SPCK falls
SPI5
SPCK falling to MOSI delay
Note:
Conditions
external
capacitor =
40pF
Min
Max
Units
30.5+ (tCLK_SPI)/2
ns
0
ns
11.5
ns
30.5 + (tCLK_SPI)/2
ns
0
ns
11.5
ns
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
Maximum SPI Frequency, Master Output
The maximum SPI master output frequency is given by the following formula:
1 -)
f SPCKMAX = MIN (f PINMAX,----------SPIn
Where SPIn is the MOSI delay, SPI2 or SPI5 depending on CPOL and NCPHA. f PINMAX is the
maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the
maximum frequency of the pins.
Maximum SPI Frequency, Master Input
The maximum SPI master input frequency is given by the following formula:
1
f SPCKMAX = ----------------------------------SPIn + t VALID
Where SPIn is the MISO setup and hold time, SPI0 + SPI1 or SPI3 + SPI4 depending on
CPOL and NCPHA. t VALID is the SPI slave response time. Please refer to the SPI slave
datasheet for t VALID .
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7.9.4.2
Slave mode
Figure 7-13. SPI Slave Mode With (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0)
SPCK
MISO
SPI6
MOSI
SPI7
SPI8
Figure 7-14. SPI Slave Mode With (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1)
SPCK
MISO
SPI9
MOSI
SPI10
Figure 7-15.
SPI11
SPI Slave Mode NPCS Timing
SPI12
SPI13
SPI14
SPI15
SPCK, CPOL=0
SPCK, CPOL=1
NPCS
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Table 7-49.
SPI Timing, Slave Mode(1)
Symbol
Parameter
Conditions
Min
Max
Units
SPI6
SPCK falling to MISO delay
31
ns
SPI7
MOSI setup time before SPCK rises
0
ns
SPI8
MOSI hold time after SPCK rises
7
ns
SPI9
SPCK rising to MISO delay
SPI10
MOSI setup time before SPCK falls
SPI11
MOSI hold time after SPCK falls
SPI12
NPCS setup time before SPCK rises
SPI13
32
external
capacitor =
40pF
ns
1.5
ns
5
ns
4
ns
NPCS hold time after SPCK falls
2.5
ns
SPI14
NPCS setup time before SPCK falls
3.5
ns
SPI15
NPCS hold time after SPCK rises
2.5
ns
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
Maximum SPI Frequency, Slave Input Mode
The maximum SPI slave input frequency is given by the following formula:
1
f SPCKMAX = MIN (f CLKSPI,------------)
SPIn
Where SPIn is the MOSI setup and hold time, SPI7 + SPI8 or SPI10 + SPI11 depending on
CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock.
Maximum SPI Frequency, Slave Output Mode
The maximum SPI slave output frequency is given by the following formula:
1
f SPCKMAX = MIN (f PINMAX,-----------------------------------)
SPIn + t SETUP
Where SPIn is the MISO delay, SPI6 or SPI9 depending on CPOL and NCPHA. t SETUP is the
SPI master setup time. Please refer to the SPI masterdatasheet for t SETUP . f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the
maximum frequency of the pins.
7.9.5
TWIM/TWIS Timing
Figure 7-50 shows the TWI-bus timing requirements and the compliance of the device with
them. Some of these requirements (tr and tf) are met by the device without requiring user intervention. Compliance with the other requirements (tHD-STA, tSU-STA, tSU-STO, tHD-DAT, tSU-DAT-I2C, tLOWI2C, tHIGH, and fTWCK) requires user intervention through appropriate programming of the relevant
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TWIM and TWIS user interface registers. Please refer to the TWIM and TWIS sections for more
information.
Table 7-50.
TWI-Bus Timing Requirements
Minimum
Symbol
Parameter
Mode
Requirement
Standard(1)
tr
TWCK and TWD rise time
tf
TWCK and TWD fall time
tHD-STA
(Repeated) START hold time
tSU-STA
(Repeated) START set-up time
tSU-STO
STOP set-up time
tHD-DAT
Data hold time
tLOW-I2C
Standard(1)
4.0
Fast(1)
0.6
Standard(1)
4.7
Fast(1)
0.6
Standard(1)
4.0
Fast(1)
0.6
Fast(1)
250
Fast(1)
100
-
tLOW
4.7
(1)
1.3
TWCK HIGH period
fTWCK
TWCK frequency
20 + 0.1 Cb
300
-
300
20 + 0.1 Cb
300
Standard
4.0
Fast(1)
0.6
Notes:
Fast
-
μs
tclkpb
-
μs
4tclkpb
-
μs
3.45
Standard(1)
(1)
Unit
tclkpb
2tclkpb
(1)
tHIGH
1000
-
Standard(1)
Fast
Device
-
0.3(2)
Standard(1)
TWCK LOW period
Requirement
ns
Fast(1)
Standard(1)
tSU-DAT
Device
ns
Fast(1)
Standard(1)
tSU-DAT-I2C Data set-up time
Maximum
??
μs
0.9
2tclkpb
-
ns
tclkpb
-
-
4tclkpb
-
μs
tclkpb
-
-
8tclkpb
-
μs
100
400
1
-----------------------12t clkpb
kHz
1. Standard mode: f TWCK ≤ 100 kHz ; fast mode: f TWCK > 100 kHz .
2. A device must internally provide a hold time of at least 300 ns for TWD with reference to the falling edge of TWCK.
Notations:
Cb = total capacitance of one bus line in pF
tclkpb = period of TWI peripheral bus clock
tprescaled = period of TWI internal prescaled clock (see chapters on TWIM and TWIS)
The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW-I2C) of TWCK.
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7.9.6
JTAG Timing
Figure 7-16. JTAG Interface Signals
JTAG2
TCK
JTAG0
JTAG1
TMS/TDI
JTAG3
JTAG4
JTAG7
JTAG8
TDO
JTAG5
JTAG6
Boundary
Scan Inputs
Boundary
Scan Outputs
JTAG9
JTAG10
Table 7-51.
JTAG Timings(1)
Symbol
Parameter
JTAG0
TCK Low Half-period
23
ns
JTAG1
TCK High Half-period
9
ns
JTAG2
TCK Period
31
ns
JTAG3
TDI, TMS Setup before TCK High
7
ns
JTAG4
TDI, TMS Hold after TCK High
0
ns
JTAG5
TDO Hold Time
13.5
ns
JTAG6
TCK Low to TDO Valid
JTAG7
Boundary Scan Inputs Setup Time
0
ns
JTAG8
Boundary Scan Inputs Hold Time
4.5
ns
JTAG9
Boundary Scan Outputs Hold Time
12
ns
JTAG10
TCK to Boundary Scan Outputs Valid
Note:
Conditions
external
capacitor =
40pF
Min
Max
23
19
Units
ns
ns
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
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7.9.7
EBI Timings
See EBI I/O lines description for more details.
Table 7-52.
SMC Clock Signal.
Symbol
Parameter
1/(tCPSMC)
SMC Controller clock frequency
Note:
Max(1)
Units
fcpu
MHz
1. The maximum frequency of the SMC interface is the same as the max frequency for the HSB.
SMC Read Signals with Hold Settings(1)
Table 7-53.
Symbol
Parameter
Conditions
Min
Units
NRD Controlled (READ_MODE = 1)
SMC1
Data setup before NRD high
SMC2
Data hold after NRD high
SMC3
NRD high to NBS0/A0 change(2)
SMC4
NRD high to NBS1 change
34.4
0
(2)
(2)
SMC5
NRD high to NBS2/A1 change
SMC7
NRD high to A2 - A25 change(2)
SMC8
NRD high to NCS inactive(2)
SMC9
NRD pulse width
VVDD = 3.0V,
drive strength of the
pads set to the lowest,
external capacitor =
40pF
nrd hold length * tCPSMC - 1.5
nrd hold length * tCPSMC - 0
nrd hold length * tCPSMC - 0
ns
nrd hold length * tCPSMC - 5.9
(nrd hold length - ncs rd hold length) *
tCPSMC - 1.3
nrd pulse length * tCPSMC - 0.9
NRD Controlled (READ_MODE = 0)
SMC10
Data setup before NCS high
SMC11
Data hold after NCS high
SMC12
NCS high to NBS0/A0 change(2)
SMC13
NCS high to NBS0/A0 change(2)
SMC14
(2)
NCS high to NBS2/A1 change
SMC16
NCS high to A2 - A25 change(2)
SMC17
NCS high to NRD inactive(2)
SMC18
NCS pulse width
Note:
36.1
0
VVDD = 3.0V,
drive strength of the
pads set to the lowest,
external capacitor =
40pF
ncs rd hold length * tCPSMC - 3.2
ncs rd hold length * tCPSMC - 2.2
ncs rd hold length * tCPSMC - 1.2
ns
ncs rd hold length * tCPSMC - 7.6
(ncs rd hold length - nrd hold length) *
tCPSMC - 2.4
ncs rd pulse length * tCPSMC - 3.3
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
2. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs rd hold length” or “nrd hold length”.
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SMC Read Signals with no Hold Settings(1)
Table 7-54.
Symbol
Parameter
Conditions
Min
Units
NRD Controlled (READ_MODE = 1)
SMC19
Data setup before NRD high
SMC20
Data hold after NRD high
VVDD = 3.0V,
drive strength of the pads set to the lowest,
external capacitor = 40pF
34.4
ns
0
NRD Controlled (READ_MODE = 0)
SMC21
Data setup before NCS high
SMC22
Data hold after NCS high
Note:
VVDD = 3.0V,
drive strength of the pads set to the lowest,
external capacitor = 40pF
30.2
ns
0
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
SMC Write Signals with Hold Settings(1)
Table 7-55.
Symbol
Parameter
Conditions
Min
Units
NRD Controlled (READ_MODE = 1)
SMC23
Data Out valid before NWE high
(nwe pulse length - 1) * tCPSMC - 1.7
SMC24
Data Out valid after NWE high(2)
nwe pulse length * tCPSMC - 5.1
SMC25
NWE high to NBS0/A0 change(2)
SMC29
(2)
NWE high to NBS2/A1 change
(2)
SMC31
NWE high to A2 - A25 change
SMC32
NWE high to NCS inactive(2)
SMC33
NWE pulse width
nwe pulse length * tCPSMC - 2.8
VVDD = 3.0V,
drive strength of the pads set
to the lowest,
external capacitor = 40pF
nwe pulse length * tCPSMC - 0.8
ns
nwe pulse length * tCPSMC - 7.2
(nwe hold pulse - ncs wr hold length) *
tCPSMC - 2.6
nwe pulse length * tCPSMC - 0.4
NRD Controlled (READ_MODE = 0)
SMC34
Data Out valid before NCS high
SMC35
(2)
SMC36
Note:
Data Out valid after NCS high
NCS high to NWE inactive
(2)
VVDD = 3.0V,
drive strength of the pads set
to the lowest,
external capacitor = 40pF
(ncs wr pulse length - 1) * tCPSMC - 2.5
ncs wr hold length * tCPSMC - 5.5
ns
(ncs wr hold length - nwe hold length) *
tCPSMC - 2.2
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
2. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs wr hold length” or “nwe hold
length”
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SMC Write Signals with No Hold Settings (NWE Controlled only)(1)
Table 7-56.
Symbol
Parameter
SMC37
NWE rising to A2-A25 valid
9.1
SMC38
NWE rising to NBS0/A0 valid
7.9
SMC40
NWE rising to A1/NBS2 change
SMC42
NWE rising to NCS rising
SMC43
Data Out valid before NWE rising
SMC44
Data Out valid after NWE rising
SMC45
NWE pulse width
Note:
Conditions
Min
VVDD = 3.0V,
drive strength of the pads
set to the lowest,
external capacitor = 40pF
Units
9.1
8.7
ns
(nwe pulse length - 1) * tCPSMC - 1.5
8.7
nwe pulse length * tCPSMC - 0.1
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
Figure 7-17. SMC Signals for NCS Controlled Accesses
SMC16
SMC16
SMC16
SMC12
SMC13
SMC14
SMC15
SMC12
SMC13
SMC14
SMC15
A2-A25
SMC12
SMC13
SMC14
SMC15
A0/A1/NBS[3:0]
NRD
SMC17
SMC17
NCS
SMC18
SMC21
SMC18
SMC18
SMC22
SMC10
SMC11
SMC34
SMC35
D0 - D15
SMC36
NWE
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Figure 7-18. SMC Signals for NRD and NRW Controlled Accesses(1)
SMC37
SMC7
SMC7
SMC31
A2-A25
SMC25
SMC26
SMC29
SMC30
SMC3
SMC4
SMC5
SMC6
SMC38
SMC39
SMC40
SMC41
SMC3
SMC4
SMC5
SMC6
A0/A1/NBS[3:0]
SMC42
SMC32
SMC8
NCS
SMC8
SMC9
SMC9
NRD
SMC19
SMC20
SMC43
SMC44
SMC1
SMC23
SMC2
SMC24
D0 - D15
SMC45
SMC33
NWE
Note:
7.9.8
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
SDRAM Signals
Table 7-57.
SDRAM Clock Signal
Symbol
Parameter
1/(tCPSDCK)
SDRAM Controller clock frequency
Note:
Max(1)
Units
fcpu
MHz
1. The maximum frequency of the SDRAMC interface is the same as the max frequency for the
HSB.
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Table 7-58.
SDRAM Signal(1)
Symbol
Parameter
Conditions
Min
SDRAMC1
SDCKE high before SDCK rising edge
7.7
SDRAMC2
SDCKE low after SDCK rising edge
10
SDRAMC3
SDCKE low before SDCK rising edge
8.8
SDRAMC4
SDCKE high after SDCK rising edge
10.9
SDRAMC5
SDCS low before SDCK rising edge
8.1
SDRAMC6
SDCS high after SDCK rising edge
11
SDRAMC7
RAS low before SDCK rising edge
9.1
SDRAMC8
RAS high after SDCK rising edge
10.3
SDRAMC9
SDA10 change before SDCK rising edge
8.6
SDRAMC10
SDA10 change after SDCK rising edge
9.8
VVDD = 3.0V,
drive strength of the pads set to
the highest,
external capacitor = 40pF on
SDRAM pins
except 8 pF on SDCK pins
SDRAMC11
Address change before SDCK rising edge
SDRAMC12
Address change after SDCK rising edge
SDRAMC13
Bank change before SDCK rising edge
SDRAMC14
Bank change after SDCK rising edge
SDRAMC15
CAS low before SDCK rising edge
8.7
SDRAMC16
CAS high after SDCK rising edge
10.4
SDRAMC17
DQM change before SDCK rising edge
8.1
SDRAMC18
DQM change after SDCK rising edge
9.3
SDRAMC19
D0-D15 in setup before SDCK rising edge
7.0
SDRAMC20
D0-D15 in hold after SDCK rising edge
SDRAMC23
SDWE low before SDCK rising edge
9.1
SDRAMC24
SDWE high after SDCK rising edge
10
SDRAMC25
D0-D15 Out valid before SDCK rising edge
7.3
SDRAMC26
D0-D15 Out valid after SDCK rising edge
5.7
Note:
Units
6.7
6.8
ns
8.4
9.5
0
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
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Figure 7-19. SDRAMC Signals relative to SDCK.
SDCK
SDRAMC1
SDRAMC2
SDRAMC3
SDRAMC4
SDCKE
SDRAMC5
SDRAMC6
SDRAMC7
SDRAMC8
SDRAMC5
SDRAMC6
SDRAMC5
SDRAMC6
SDCS
RAS
SDRAMC15 SDRAMC16
SDRAMC15 SDRAMC16
CAS
SDRAMC23 SDRAMC24
SDWE
SDRAMC9 SDRAMC10
SDRAMC9 SDRAMC10
SDRAMC9 SDRAMC10
SDRAMC11 SDRAMC12
SDRAMC11 SDRAMC12
SDRAMC11 SDRAMC12
SDRAMC13 SDRAMC14
SDRAMC13 SDRAMC14
SDRAMC13 SDRAMC14
SDRAMC17 SDRAMC18
SDRAMC17 SDRAMC18
SDA10
A0 - A9,
A11 - A13
BA0/BA1
DQM0 DQM3
SDRAMC19 SDRAMC20
D0 - D15
Read
SDRAMC25 SDRAMC26
D0 - D15
to Write
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7.9.9
MACB Characteristics
Table 7-59.
Symbol
Ethernet MAC Signals(1)
Parameter
MAC1
Setup for MDIO from MDC rising
MAC2
Hold for MDIO from MDC rising
MAC3
MDIO toggling from MDC falling
Note:
Conditions
Min.
Max.
Unit
VVDD = 3.0V,
drive strength of the pads set to the
highest,
external capacitor = 10pF on MACB
pins
0
2.6
ns
0
0.7
ns
0
1.1
ns
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
Table 7-60.
Symbol
Ethernet MAC MII Specific Signals(1)
Parameter
Conditions
Min.
Max.
Unit
MAC4
Setup for COL from TX_CLK rising
0
ns
MAC5
Hold for COL from TX_CLK rising
0
ns
MAC6
Setup for CRS from TX_CLK rising
0.5
ns
MAC7
Hold for CRS from TX_CLK rising
0.6
ns
MAC8
TX_ER toggling from TX_CLK rising
MAC9
TX_EN toggling from TX_CLK rising
MAC10
TXD toggling from TX_CLK rising
MAC11
Setup for RXD from RX_CLK
MAC12
Hold for RXD from RX_CLK
MAC13
VVDD = 3.0V,
drive strength of the pads set to the
highest,
external capacitor = 10pF on MACB
pins
17.3
19.6
ns
15.5
16.2
ns
14.9
19.2
ns
1.3
ns
2
ns
Setup for RX_ER from RX_CLK
3.6
ns
MAC14
Hold for RX_ER from RX_CLK
0
ns
MAC15
Setup for RX_DV from RX_CLK
0.7
ns
MAC16
Hold for RX_DV from RX_CLK
1.4
ns
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
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Figure 7-20. Ethernet MAC MII Mode
MDC
MAC1
MAC2
MAC3
MDIO
MAC4
MAC5
COL
MAC6
MAC7
CRS
TX_CLK
MAC8
TX_ER
MAC9
TX_EN
MAC10
TXD[3:0]
RX_CLK
MAC11
MAC12
MAC13
MAC14
MAC15
MAC16
RXD[3:0]
RX_ER
RX_DV
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Table 7-61.
Symbol
Ethernet MAC RMII Specific Signals(1)
Parameter
Conditions
Min.
Max.
Unit
MAC21
TX_EN toggling from TX_CLK rising
12.5
13.4
ns
MAC22
TXD toggling from TX_CLK rising
12.5
13.4
ns
MAC23
Setup for RXD from TX_CLK
MAC24
Hold for RXD from TX_CLK
MAC25
Setup for RX_ER from TX_CLK
MAC26
Hold for RX_ER from TX_CLK
MAC27
MAC28
Note:
4.7
ns
0
ns
3.6
ns
0
ns
Setup for RX_DV from TX_CLK
4.6
ns
Hold for RX_DV from TX_CLK
0
ns
VVDD = 3.0V,
drive strength of the pads set to the
highest,
external capacitor = 10pF on MACB
pins
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production.
Figure 7-21. Ethernet MAC RMII Mode
TX_CLK
MAC21
TX_EN
MAC22
TXD[1:0]
MAC23
MAC24
MAC25
MAC26
MAC27
MAC28
RXD[3:0]
RX_ER
RX_DV
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8. Mechanical Characteristics
8.1
8.1.1
Thermal Considerations
Thermal Data
Table 8-1 summarizes the thermal resistance data depending on the package.
Table 8-1.
8.1.2
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
θJA
Junction-to-ambient thermal resistance
No air flow
QFN64
20.0
θJC
Junction-to-case thermal resistance
QFN64
0.8
θJA
Junction-to-ambient thermal resistance
TQFP64
40.5
θJC
Junction-to-case thermal resistance
TQFP64
8.7
θJA
Junction-to-ambient thermal resistance
TQFP100
39.3
θJC
Junction-to-case thermal resistance
TQFP100
8.5
θJA
Junction-to-ambient thermal resistance
LQFP144
38.1
θJC
Junction-to-case thermal resistance
LQFP144
8.4
Unit
°C/W
No air flow
°C/W
No air flow
°C/W
No air flow
°C/W
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
1.
T J = T A + ( P D × θ JA )
2.
T J = T A + ( P D × ( θ HEATSINK + θ JC ) )
where:
• θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1 on page
89.
• θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
Table 8-1 on page 89.
• θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
• PD = device power consumption (W) estimated from data provided in the section ”Power
Consumption” on page 50.
• TA = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature TJ in °C.
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8.2
Package Drawings
Figure 8-1.
Note:
QFN-64 package drawing
The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 8-2.
Device and Package Maximum Weight
200
Table 8-3.
mg
Package Characteristics
Moisture Sensitivity Level
Table 8-4.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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Figure 8-2.
TQFP-64 package drawing
Table 8-5.
Device and Package Maximum Weight
300
Table 8-6.
mg
Package Characteristics
Moisture Sensitivity Level
Table 8-7.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
91
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Figure 8-3.
TQFP-100 package drawing
Table 8-8.
Device and Package Maximum Weight
500
Table 8-9.
mg
Package Characteristics
Moisture Sensitivity Level
Table 8-10.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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Figure 8-4.
LQFP-144 package drawing
Table 8-11.
Device and Package Maximum Weight
1300
Table 8-12.
mg
Package Characteristics
Moisture Sensitivity Level
Table 8-13.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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8.3
Soldering Profile
Table 8-14 gives the recommended soldering profile from J-STD-20.
Table 8-14.
Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3°C/sec
Preheat Temperature 175°C ±25°C
Min. 150 °C, Max. 200 °C
Temperature Maintained Above 217°C
60-150 sec
Time within 5⋅C of Actual Peak Temperature
30 sec
Peak Temperature Range
260 °C
Ramp-down Rate
6 °C/sec
Time 25⋅C to Peak Temperature
Max. 8 minutes
Note:
It is recommended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
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9. Ordering Information
Table 9-1.
Device
AT32UC3C0512C
AT32UC3C1512C
AT32UC3C1256C
AT32UC3C2512C
AT32UC3C2512C
AT32UC3C2256C
AT32UC3C2256C
AT32UC3C2128C
AT32UC3C2128C
Ordering Information
Ordering Code
Carrier Type
AT32UC3C0512C-ALZT
Tray
AT32UC3C0512C-ALZR
Tape & Reel
AT32UC3C1512C-AZT
Tray
AT32UC3C1512C-AZR
Tape & Reel
AT32UC3C1256C-AZT
Tray
AT32UC3C1256C-AZR
Tape & Reel
AT32UC3C2512C-A2ZT
Tray
AT32UC3C2512C-A2ZR
Tape & Reel
AT32UC3C2512C-Z2ZT
Tray
AT32UC3C2512C-Z2ZR
Tape & Reel
AT32UC3C2256C-A2ZT
Tray
AT32UC3C2256C-A2ZR
Tape & Reel
AT32UC3C2256C-Z2ZT
Tray
AT32UC3C2256C-Z2ZR
Tape & Reel
AT32UC3C2128C-A2ZT
Tray
AT32UC3C2128C-A2ZR
Tape & Reel
AT32UC3C2128C-Z2ZT
Tray
AT32UC3C2128C-Z2ZR
Tape & Reel
Package
Temperature Operating Range
LQFP 144
TQFP 100
TQFP 100
TQFP 64
QFN 64
Automotive (-40°C to 125°C)
TQFP 64
QFN 64
TQFP 64
QFN 64
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10. Errata
10.1
10.1.1
10.1.2
10.1.3
rev E
ADCIFA
1
ADCREFP/ADCREFN can not be selected as an external ADC reference by setting the
ADCIFA.CFG.EXREF bit to one
Fix/Workaround
A voltage reference can be applied on ADCREFP/ADCREFN pins if the
ADCIFA.CFG.EXREF bit is set to zero, the ADCIFA.CFG.RS bit is set to zero and the voltage reference applied on ADCREFP/ADCREFN pins is higher than the internal 1V
reference.
1
AST wake signal is released one AST clock cycle after the BUSY bit is cleared
After writing to the Status Clear Register (SCR) the wake signal is released one AST clock
cycle after the BUSY bit in the Status Register (SR.BUSY) is cleared. If entering sleep mode
directly after the BUSY bit is cleared the part will wake up immediately.
Fix/Workaround
Read the Wake Enable Register (WER) and write this value back to the same register. Wait
for BUSY to clear before entering sleep mode.
1
aWire MEMORY_SPEED_REQUEST command does not return correct CV
The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to
the formula in the aWire Debug Interface chapter.
Fix/Workaround
Issue a dummy read to address 0x100000000 before issuing the
MEMORY_SPEED_REQUEST command and use this formula instead:
AST
aWire
7f aw
f sab = ---------------CV – 3
10.1.4
Power Manager
1
TWIS may not wake the device from sleep mode
If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed.
Fix/Workaround
When using the TWI address match to wake the device from sleep, do not switch to sleep
modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the
TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus
events.
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10.1.5
10.1.6
SCIF
1
PLLCOUNT value larger than zero can cause PLLEN glitch
Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up.
Fix/Workaround
The lock-masking mechanism for the PLL should not be used.
The PLLCOUNT field of the PLL Control Register should always be written to zero.
2
PLL lock might not clear after disable
Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator
may not go back to zero after the PLL oscillator has been disabled. This can cause the propagation of clock signals with the wrong frequency to parts of the system that use the PLL
clock.
Fix/Workaround
PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL
has been turned off, a delay of 30us must be observed after the PLL has been enabled
again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is
locked.
3
BOD33 reset locks the device
If BOD33 is enabled as a reset source (SCIF.BOD33.CTRL=0x1) and when VDDIN_33
power supply voltage falls below the BOD33 voltage (SCIF.BOD33.LEVEL), the device is
locked permanently under reset even if the power supply goes back above BOD33 reset
level. In order to unlock the device, an external reset event should be applied on RESET_N.
Fix/Workaround
Use an external BOD on VDDIN_33 or an external reset source.
1
SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0
When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI
module will not start a data transfer.
Fix/Workaround
Disable mode fault detection by writing a one to MR.MODFDIS.
2
Disabling SPI has no effect on the SR.TDRE bit
Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered
when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is
disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer
is empty, and this data will be lost.
Fix/Workaround
Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the
SPI and PDCA.
3
SPI disable does not work in SLAVE mode
SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a software reset by writing a one to the Software
Reset bit in the Control Register (CR.SWRST).
SPI
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10.1.7
10.1.8
4
SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and
NCPHA=0
When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one
(CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0,
then an additional pulse will be generated on SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1
if CSRn.CPOL=1 and CSRn.NCPHA=0.
1
Channel chaining skips first pulse for upper channel
When chaining two channels using the Block Mode Register, the first pulse of the clock
between the channels is skipped.
Fix/Workaround
Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle
for the upper channel. After the dummy cycle has been generated, indicated by the
SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real
values.
1
SMBALERT bit may be set after reset
For TWIM0 and TWIM1 modules, the SMBus Alert (SMBALERT) bit in the Status Register
(SR) might be erroneously set after system reset.
Fix/Workaround
After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer.
TC
TWIM
For TWIM2 module, the SMBus Alert (SMBALERT) is not implemented but the bit in the Status Register (SR) is erroneously set once TWIM2 is enabled.
Fix/Workaround
None.
10.1.9
10.1.10
TWIS
1
Clearing the NAK bit before the BTF bit is set locks up the TWI bus
When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to
attempt to continue transmitting data, thus locking up the bus.
Fix/Workaround
Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been
set.
1
UPINRQx.INRQ field is limited to 8-bits
In Host mode, when using the UPINRQx.INRQ feature together with the multi-packet mode
to launch a finite number of packet among multi-packet, the multi-packet size (located in the
descriptor table) is limited to the UPINRQx.INRQ value multiply by the pipe size.
Fix/Workaround
UPINRQx.INRQ value shall be less than the number of configured multi-packet.
2
In USB host mode, downstream resume feature does not work (UHCON.RESUME=1).
USBC
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Fix/Workaround
None.
10.1.11
3
In host mode, the disconnection during OUT transition is not supported
In USB host mode, a pipe can not work if the previous USB device disconnection has
occurred during a USB transfer.
Fix/Workaround
Reset the USBC (USBCON.USB=0 and =1) after a device disconnection (UHINT.DDISCI).
4
In USB host mode, entering suspend mode can fail
In USB host mode, entering suspend mode can fail when UHCON.SOFE=0 is done just
after a SOF reception (UHINT.HSOFI).
Fix/Workaround
Check that UHNUM.FLENHIGH is below 185 in Full speed and below 21 in Low speed
before clearing UHCON.SOFE.
5
In USB host mode, entering suspend mode for low speed device can fail when the
USB freeze (USBCON.FRZCLK=1) is done just after UHCON.SOFE=0.
Fix/Workaround
When entering suspend mode (UHCON.SOFE is cleared), check that USBFSM.DRDSTATE
is not equal to three before freezing the clock (USBCON.FRZCLK=1).
1
WDT Control Register does not have synchronization feedback
When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN),
Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization
takes a finite amount of time, but only the status of the synchronization of the EN bit is
reflected back to the user. Writing to the synchronized fields during synchronization can lead
to undefined behavior.
Fix/Workaround
-When writing to the affected fields, the user must ensure a wait corresponding to 2 clock
cycles of both the WDT peripheral bus clock and the selected WDT clock source.
-When doing writes that changes the EN bit, the EN bit can be read back until it reflects the
written value.
WDT
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10.2
10.2.1
10.2.2
10.2.3
rev D
ADCIFA
1
ADCREFP/ADCREFN can not be selected as an external ADC reference by setting the
ADCIFA.CFG.EXREF bit to one
Fix/Workaround
A voltage reference can be applied on ADCREFP/ADCREFN pins if the
ADCIFA.CFG.EXREF bit is set to zero, the ADCIFA.CFG.RS bit is set to zero and the voltage reference applied on ADCREFP/ADCREFN pins is higher than the internal 1V
reference.
1
AST wake signal is released one AST clock cycle after the BUSY bit is cleared
After writing to the Status Clear Register (SCR) the wake signal is released one AST clock
cycle after the BUSY bit in the Status Register (SR.BUSY) is cleared. If entering sleep mode
directly after the BUSY bit is cleared the part will wake up immediately.
Fix/Workaround
Read the Wake Enable Register (WER) and write this value back to the same register. Wait
for BUSY to clear before entering sleep mode.
1
aWire MEMORY_SPEED_REQUEST command does not return correct CV
The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to
the formula in the aWire Debug Interface chapter.
Fix/Workaround
Issue a dummy read to address 0x100000000 before issuing the
MEMORY_SPEED_REQUEST command and use this formula instead:
AST
aWire
7f aw
f sab = ---------------CV – 3
10.2.4
GPIO
1
10.2.5
Clearing Interrupt flags can mask other interrupts
When clearing interrupt flags in a GPIO port, interrupts on other pins of that port, happening
in the same clock cycle will not be registered.
Fix/Workaround
Read the PVR register of the port before and after clearing the interrupt to see if any pin
change has happened while clearing the interrupt. If any change occurred in the PVR
between the reads, they must be treated as an interrupt.
Power Manager
1
Clock Failure Detector (CFD) can be issued while turning off the CFD
While turning off the CFD, the CFD bit in the Status Register (SR) can be set. This will
change the main clock source to RCSYS.
Fix/Workaround
Solution 1: Enable CFD interrupt. If CFD interrupt is issues after turning off the CFD, switch
back to original main clock source.
Solution 2: Only turn off the CFD while running the main clock on RCSYS.
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10.2.6
10.2.7
2
Requesting clocks in idle sleep modes will mask all other PB clocks than the
requested
In idle or frozen sleep mode, all the PB clocks will be frozen if the TWIS or the AST need to
wake the cpu up.
Fix/Workaround
Disable the TWIS or the AST before entering idle or frozen sleep mode.
3
TWIS may not wake the device from sleep mode
If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed.
Fix/Workaround
When using the TWI address match to wake the device from sleep, do not switch to sleep
modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the
TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus
events.
1
PLLCOUNT value larger than zero can cause PLLEN glitch
Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up.
Fix/Workaround
The lock-masking mechanism for the PLL should not be used.
The PLLCOUNT field of the PLL Control Register should always be written to zero.
2
PLL lock might not clear after disable
Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator
may not go back to zero after the PLL oscillator has been disabled. This can cause the propagation of clock signals with the wrong frequency to parts of the system that use the PLL
clock.
Fix/Workaround
PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL
has been turned off, a delay of 30us must be observed after the PLL has been enabled
again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is
locked.
3
BOD33 reset locks the device
If BOD33 is enabled as a reset source (SCIF.BOD33.CTRL=0x1) and when VDDIN_33
power supply voltage falls below the BOD33 voltage (SCIF.BOD33.LEVEL), the device is
locked permanently under reset even if the power supply goes back above BOD33 reset
level. In order to unlock the device, an external reset event should be applied on RESET_N.
Fix/Workaround
Use an external BOD on VDDIN_33 or an external reset source.
1
SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0
When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI
module will not start a data transfer.
Fix/Workaround
Disable mode fault detection by writing a one to MR.MODFDIS.
SCIF
SPI
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10.2.8
10.2.9
2
Disabling SPI has no effect on the SR.TDRE bit
Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered
when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is
disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer
is empty, and this data will be lost.
Fix/Workaround
Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the
SPI and PDCA.
3
SPI disable does not work in SLAVE mode
SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a software reset by writing a one to the Software
Reset bit in the Control Register (CR.SWRST).
4
SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and
NCPHA=0
When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one
(CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0,
then an additional pulse will be generated on SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1
if CSRn.CPOL=1 and CSRn.NCPHA=0.
1
Channel chaining skips first pulse for upper channel
When chaining two channels using the Block Mode Register, the first pulse of the clock
between the channels is skipped.
Fix/Workaround
Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle
for the upper channel. After the dummy cycle has been generated, indicated by the
SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real
values.
1
SMBALERT bit may be set after reset
For TWIM0 and TWIM1 modules, the SMBus Alert (SMBALERT) bit in the Status Register
(SR) might be erroneously set after system reset.
Fix/Workaround
After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer.
TC
TWIM
For TWIM2 module, the SMBus Alert (SMBALERT) is not implemented but the bit in the Status Register (SR) is erroneously set once TWIM2 is enabled.
Fix/Workaround
None.
2
TWIM TWALM polarity is wrong
The TWALM signal in the TWIM is active high instead of active low.
Fix/Workaround
Use an external inverter to invert the signal going into the TWIM. When using both TWIM
and TWIS on the same pins, the TWALM cannot be used.
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10.2.10
10.2.11
TWIS
1
Clearing the NAK bit before the BTF bit is set locks up the TWI bus
When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to
attempt to continue transmitting data, thus locking up the bus.
Fix/Workaround
Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been
set.
2
TWIS stretch on Address match error
When the TWIS stretches TWCK due to a slave address match, it also holds TWD low for
the same duration if it is to be receiving data. When TWIS releases TWCK, it releases TWD
at the same time. This can cause a TWI timing violation.
Fix/Workaround
None.
3
TWALM forced to GND
The TWALM pin is forced to GND when the alternate function is selected and the TWIS
module is enabled.
Fix/Workaround
None.
1
UPINRQx.INRQ field is limited to 8-bits
In Host mode, when using the UPINRQx.INRQ feature together with the multi-packet mode
to launch a finite number of packet among multi-packet, the multi-packet size (located in the
descriptor table) is limited to the UPINRQx.INRQ value multiply by the pipe size.
Fix/Workaround
UPINRQx.INRQ value shall be less than the number of configured multi-packet.
2
In USB host mode, downstream resume feature does not work (UHCON.RESUME=1).
Fix/Workaround
None.
3
In host mode, the disconnection during OUT transition is not supported
In USB host mode, a pipe can not work if the previous USB device disconnection has
occurred during a USB transfer.
Fix/Workaround
Reset the USBC (USBCON.USB=0 and =1) after a device disconnection (UHINT.DDISCI).
4
In USB host mode, entering suspend mode can fail
In USB host mode, entering suspend mode can fail when UHCON.SOFE=0 is done just
after a SOF reception (UHINT.HSOFI).
Fix/Workaround
Check that UHNUM.FLENHIGH is below 185 in Full speed and below 21 in Low speed
before clearing UHCON.SOFE.
5
In USB host mode, entering suspend mode for low speed device can fail when the
USB freeze (USBCON.FRZCLK=1) is done just after UHCON.SOFE=0.
Fix/Workaround
When entering suspend mode (UHCON.SOFE is cleared), check that USBFSM.DRDSTATE
is not equal to three before freezing the clock (USBCON.FRZCLK=1).
USBC
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10.2.12
WDT
1
Clearing the Watchdog Timer (WDT) counter in second half of timeout period will
issue a Watchdog reset
If the WDT counter is cleared in the second half of the timeout period, the WDT will immediately issue a Watchdog reset.
Fix/Workaround
Use twice as long timeout period as needed and clear the WDT counter within the first half
of the timeout period. If the WDT counter is cleared after the first half of the timeout period,
you will get a Watchdog reset immediately. If the WDT counter is not cleared at all, the time
before the reset will be twice as long as needed.
2
WDT Control Register does not have synchronization feedback
When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN),
Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization
takes a finite amount of time, but only the status of the synchronization of the EN bit is
reflected back to the user. Writing to the synchronized fields during synchronization can lead
to undefined behavior.
Fix/Workaround
-When writing to the affected fields, the user must ensure a wait corresponding to 2 clock
cycles of both the WDT peripheral bus clock and the selected WDT clock source.
-When doing writes that changes the EN bit, the EN bit can be read back until it reflects the
written value.
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11. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
11.1
11.2
11.3
Rev. D – 01/12
1
Errata: Updated
2
PM: Clock Mask Table Updated
3
Fixed PLLOPT field description in SCIF chapter
4
MDMA: Swapped bit descriptions for IER and IDR
5
MACB: USRIO register description and bit descriptions for IMR/IDR/IER Updated
6
USBC: UPCON.PFREEZE and UPINRQn description Updated
7
ACIFA: Updated
8
ADCIFA: CFG.MUXSET, SSMQ description and conversion results section Updated
9
DACIFB: Calibration section Updated
10
Electrical Characteristics: ADCREFP/ADCREFN added
11
Add devices: C1256C, C2256C, C2128C
1
Electrical Characteristics Updated:
- I/O Pins characteristics
- 8MHz/1MHz RC Oscillator (RC8M) characteristics
- 1.8V Voltage Regulator characteristics
- 3.3V Voltage Regulator characteristics
- 1.8VBrown Out Detector (BOD18) characteristics
- 3.3VBrown Out Detector (BOD33) characteristics
- 5VBrown Out Detector (BOD50) characteristics
- Analog to Digital Converter (ADC) and sample and hold (S/DH) Characteristics
- Analog Comparator characteristics
2
Errata: Updated
3
TWIS: Updated
1
Package and pinout: Added supply column. Updated peripheral functions
2
Supply and Startup Considerations: Updated I/O lines power
3
PM: Added AWEN description
Rev. C – 08/11
Rev. B – 02/11
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11.4
4
SCIF: Added VREGCR register
5
AST: Updated digital tuner formula
6
SDRAMC: cleaned-up SDCS/NCS names. Added VERSION register
7
SAU: Updated SR.IDLE
8
USART: Updated
9
CANIF: Updated address map figure
10
USBC: Updated
11
DACIFB: Updated
12
Programming and Debugging: Added JTAG Data Registers section
13
Electrical Characteristics: Updated
14
Ordering Information: Updated
15
Errata: Updated
1
Initial revision
Rev. A – 10/10
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Table of Contents
1
2
3
4
5
6
7
Description ............................................................................................... 3
1.1
Disclaimer ..........................................................................................................4
1.2
Automotive Quality Grade .................................................................................4
Overview ................................................................................................... 5
2.1
Block diagram ....................................................................................................5
2.2
Configuration Summary .....................................................................................6
Package and Pinout ................................................................................. 8
3.1
Package .............................................................................................................8
3.2
Peripheral Multiplexing on I/O lines .................................................................11
3.3
Signals Description ..........................................................................................18
3.4
I/O Line Considerations ...................................................................................24
Processor and Architecture .................................................................. 25
4.1
Features ..........................................................................................................25
4.2
AVR32 Architecture .........................................................................................25
4.3
The AVR32UC CPU ........................................................................................26
4.4
Programming Model ........................................................................................30
4.5
Exceptions and Interrupts ................................................................................34
Memories ................................................................................................ 39
5.1
Embedded Memories ......................................................................................39
5.2
Physical Memory Map .....................................................................................40
5.3
Peripheral Address Map ..................................................................................40
5.4
CPU Local Bus Mapping .................................................................................43
Supply and Startup Considerations ..................................................... 45
6.1
Supply Considerations .....................................................................................45
6.2
Startup Considerations ....................................................................................48
Electrical Characteristics ...................................................................... 49
7.1
Absolute Maximum Ratings* ...........................................................................49
7.2
Supply Characteristics .....................................................................................49
7.3
Maximum Clock Frequencies ..........................................................................50
7.4
Power Consumption ........................................................................................50
7.5
I/O Pin Characteristics .....................................................................................54
7.6
Oscillator Characteristics .................................................................................56
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8
9
7.7
Flash Characteristics .......................................................................................59
7.8
Analog Characteristics .....................................................................................60
7.9
Timing Characteristics .....................................................................................69
Mechanical Characteristics ................................................................... 89
8.1
Thermal Considerations ..................................................................................89
8.2
Package Drawings ...........................................................................................90
8.3
Soldering Profile ..............................................................................................94
Ordering Information ............................................................................. 95
10 Errata ....................................................................................................... 96
10.1
rev E ................................................................................................................96
10.2
rev D ..............................................................................................................100
11 Datasheet Revision History ................................................................ 105
11.1
Rev. D – 01/12 ...............................................................................................105
11.2
Rev. C – 08/11 ...............................................................................................105
11.3
Rev. B – 02/11 ...............................................................................................105
11.4
Rev. A – 10/10 ...............................................................................................106
108
9166DS–AVR-01/12
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