5962-09A03 (for AT7910E) - Standard Microcircuit Drawing

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
REV STATUS
REV
OF SHEETS
SHEET
PMIC N/A
PREPARED BY
1
2
3
4
5
6
7
8
9
10
11
12
13
Phu H. Nguyen
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
Phu H. Nguyen
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Thomas M. Hess
DRAWING APPROVAL DATE
MICROCIRCUIT, DIGITAL, ASIC, CMOS GATE
ARRAY, SPACEWIRE ROUTER, MONOLITHIC
SILICON
09-10-01
AMSC N/A
REVISION LEVEL
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-09A03
13
5962-E390-09
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
09A03
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
X
X
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
AT7910E
SpaceWire Router
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
Package style
196
Multilayer Quad Flat Pack grounded lid
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
2
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range (VCC).................................................................................
Power dissipation (Pd) ........................................................................................
Storage temperature range.................................................................................
Maximum junction temperature (TJ) ....................................................................
Thermal resistance junction to case (Rjc) ..........................................................
Operating free-air temperature range (TA) ..........................................................
-0.5V to 4.0 V dc
4W
-65°C to 150°C
175°C
5°C/W
-55°C to +125°C
1.4 Recommended operating conditions.
Supply voltage range (VCC)................................................................................. 3.0 V to 3.6 V dc
Ambient operating temperature (TA) .................................................................. -55°C to 125°C
Storage temperature .......................................................................................... 30°C, 20 to 65% RH, dust free,
original packing
1.5 Radiation features.
Maximum total dose available (dose rate = 0.1 rads(Si)/s) ................................. 100 krads(Si)
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
________
1/
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
All voltage referenced to ground unless otherwise specified
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block or logic diagram(s). The block or logic diagram(s) shall be as specified on figure 3.
3.2.4 Timing waveforms. The timing waveforms shall be as specified on figure 4.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 123 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
4
TABLE IA. Electrical performance characteristics.
Test
Symbol
Low level input voltage
High level input voltage
Low level input current
Low level input current Pull-down
High level input current
High level input current Pull-down
Output leakage low and high current
Low level output voltage
high level output voltage
Output short circuit current
VIL
VIH
IIL
IILPD
IIH
IIHPD
IOZ
VOL
VOH
IOS
Supply current
ICCSB
Operating supply current
ICCOP
Input capacitance 2/
Input/Output capacitance 1/
Propagation delay CLK Low to
DOUT0 high
3/
Propagation delay CLK Low to
DOUT1 high
3/
Propagation delay CLK Low to
DOUT2 high
3/
Propagation delay CLK Low to
DOUT3 high
3/
Propagation delay CLK Low to
DOUT4 high
3/
Propagation delay CLK Low to
DOUT5 high
3/
Propagation delay CLK Low to
DOUT6 high
3/
Propagation delay CLK Low to
DOUT7 high
3/
Propagation delay CLK Low to
DOUT0 low
3/
Propagation delay CLK Low to
DOUT1 low 3/
Propagation delay CLK Low to
DOUT2 low 3/
Propagation delay CLK Low to
DOUT3 low 3/
Conditions 1/
-55°C ≤ TA ≤ +125°C
3.0 V ≤ VCC ≤ 3.6 V
unless otherwise specified
Group A
subgroups
VIN = GND, VCC = 3.6V
VIN = GND, VCC = 3.6V
VIN = VCC = 3.6V
VIN = VCC = 3.6V
Outputs disabled, VOUT = GND
VCC = 3.0V, IOL = 3,6,12 mA
VCC = 3.0V, IOH = -3,-6,-12 mA
VOUT = VCC
VOUT = GND
All interfaces active including
external ports
Clk at 3.12 MHz and all SpW
links at 3.12 Mbps,
no data transfert
VCC = 0 V
VCC = 0 V
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
Limits
Min
Unit
Max
0.8
2.0
-1
-5
-1
70
-1
V
V
µA
µA
µA
µA
µA
V
V
mA
1
5
1
540
1
0.4
2.4
1,2,3
23
13
550
1,2,3
790
mA
4
4
9,10,11
2.4
6.6
16
pF
pF
ns
tp1
9,10,11
16
ns
tp2
9,10,11
16
ns
tp3
9,10,11
16
ns
tp4
9,10,11
16
ns
tp5
9,10,11
16
ns
tp6
9,10,11
16
ns
tp7
9,10,11
16
ns
tp8
9,10,11
16
ns
tp9
9,10,11
16
ns
tp10
9,10,11
16
ns
tp11
9,10,11
16
ns
CIN
CIO
tp0
mA
See footnote at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
5
TABLE IA. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
3.0 V ≤ VCC ≤ 3.6 V
unless otherwise specified
Group A
subgroups
Limits
Min
Unit
Max
Propagation delay CLK Low to DOUT4 low 3/
tp12
9,10,11
16
ns
Propagation delay CLK Low to DOUT5 low
3/
tp13
9,10,11
16
ns
Propagation delay CLK Low to DOUT6 low
3/
tp14
9,10,11
16
ns
Propagation delay CLK Low to DOUT7 low
3/
tp15
9,10,11
16
ns
Propagation delay CLK Low to SOUT0 high
3/
tp16
9,10,11
16
ns
Propagation delay CLK Low to SOUT1 high
3/
tp17
9,10,11
16
ns
Propagation delay CLK Low to SOUT2 high
3/
tp18
9,10,11
16
ns
Propagation delay CLK Low to SOUT3 high
3/
tp19
9,10,11
16
ns
Propagation delay CLK Low to SOUT4 high
3/
tp20
9,10,11
16
ns
Propagation delay CLK Low to SOUT5 high 3/
tp21
9,10,11
16
ns
Propagation delay CLK Low to SOUT6 high
2/
tp22
9,10,11
16
ns
Propagation delay CLK Low to SOUT7 high
3/
tp23
9,10,11
16
ns
Propagation delay CLK Low to SOUT0 low
3/
tp24
9,10,11
16
ns
Propagation delay CLK Low to SOUT1 low
3/
tp25
9,10,11
16
ns
Propagation delay CLK Low to SOUT2 low
3/
tp26
9,10,11
16
ns
Propagation delay CLK Low to SOUT3 low
3/
tp27
9,10,11
16
ns
Propagation delay CLK Low to SOUT4 low
3/
tp28
9,10,11
16
ns
Propagation delay CLK Low to SOUT5 low
3/
tp29
9,10,11
16
ns
Propagation delay CLK Low to SOUT6 low
3/
tp30
9,10,11
16
ns
Propagation delay CLK Low to SOUT7 low
3/
tp31
9,10,11
16
ns
1/
2/
3/
RHA device supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. Device
type 01 is tested in accordance with MIL-STD-883, method 1019, condition A for RHA level "R”. Pre and post irradiation
values are identical unless otherwise specified in table IA. When performing post irradiation electrical measurements for
o
any RHA level, TA=+25 C.
This parameter is tested initially and after major process changes, otherwise guaranteed.
This parameter is measured under production configuration (PLL bypassed and test mode enabled). During normal
operation (PLL active and test mode disabled) the propagation delay is directly linked to the PLL. Then, the timing figures
are not applicable under application conditions.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
6
NOTE: Lid is connected to ground.
FIGURE 1. Case outline.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
7
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
8
FIGURE 3. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
9
CLK
DOUTi
SOUTi
Tp0 to Tp7
Tp16 to Tp23
CLK
DOUTi
SOUTi
Tp8 to Tp15
Tp24 to Tp31
FIGURE 4. Timing waveforms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
10
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
11
TABLE IIA. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
1/
2/
3/
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
1,7,9
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
1,7,9
Device
class V
1,7,9
1, 2, 3, 4, 7, 8, 9, 10,
11 1/
1, 2, 3, 4, 7, 8,
9, 10, 11 1/
1, 2, 3, 4, 7, 8, 9,
10, 11, 2/ 3/
1, 2, 3, 4, 7, 8, 9, 10,
11
1, 2, 3, 4, 7, 8,
9, 10, 11
1, 2, 3, 4, 7, 8, 9,
10, 11
1,7,9
1,7,9
1,7,9, 3/
1,7,9
1,7,9
1,7,9
1,7,9
1,7,9
1,7,9
PDA applies to subgroup 1.
PDA applies to subgroups 1 and 7.
Delta limits, as specified in table IIB, shall be required where specified, and the delta values shall be
completed with reference to the zero hour electrical parameters.
TABLE IIB. Burn-in delta parameters (25°C).
Parameter
IIL/IIH
IOZL/IOZH
ICCSB
Limit
+/- 10% of specified value in table IA
+/- 10% of specified value in table IA
+/- 10% of specified value in table IA
Unit
µA
µA
mA
NOTE: The parameters shall be recorded before and after the required burn-in
and life test to determine the delta limits.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, D or E. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
12
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table IIA herein.
c.
When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883,
method 1019, condition A, and as specified herein.
4.4.4.1.1 Accelerated annealing testing. Accelerated annealing testing shall be performed on all devices requiring a RHA
level greater than 5k rads (Si). The post-anneal end-point electrical parameter limits shall be as specified in table IA herein and
shall be the pre-irradiation end-point electrical parameter limits at 25°C ±5°C. Testing shall be performed at initial qualification
and after any design or process changes which may affect the RHA response of the device.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09A03
A
REVISION LEVEL
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 09-10-01
Approved sources of supply for SMD 5962-09A03 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded
by the next dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
5962-09A0301QXC
5962-09A0301VXC
5962R09A0301VXC
Vendor
CAGE
number
F7400
F7400
F7400
Vendor
similar
PIN 2/
AT7910KB-MQ
AT7910KB-SV
AT7910KB-SR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
F7400
Vendor name
and address
ATMEL Nantes SA
BP 70602
44306 Nantes Cedex 3, France
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.