ATA6826C - Complete

ATA6826C
Triple Half-bridge DMOS Output Driver with Serial Input
Control
DATASHEET
Features
● Supply voltage up to 40V
● RDSon typically 0.8 at 25°C, Maximum 1.5 at 150°C
● Up to 1.0A output current
● Three half-bridge outputs formed by three high-side and three low-side drivers
● Capable of switching all kinds of loads such as DC motors, bulbs, resistors,
capacitors and inductors
● No shoot-through current
● Very low quiescent current IS < 2µA in Standby Mode versus total temperature
range
● Outputs short-circuit protected
● Overtemperature protection for each switch and overtemperature prewarning
● Undervoltage protection
● Various diagnostic functions such as shorted output, open-load, overtemperature
and power-supply fail detection
● Serial data interface, daisy chain capable, up to 2MHz clock frequency
● SO14 power package
9213F-AUTO-08/15
1.
Description
The Atmel® ATA6826C is a fully protected triple half-bridge designed in smart power SOI Technology, used to control up to
three different loads by a microcontroller in automotive and industrial applications.
Each of the three high-side and three low-side drivers is capable of driving currents up to 1.0A. The drivers are internally
connected to form three half-bridges and can be controlled separately from a standard serial data interface. Therefore, all
kinds of loads such as bulbs, resistors, capacitors and inductors can be combined. The IC design especially supports the
application of H-bridges to drive DC motors.
Protection is guaranteed regarding short-circuit conditions, overtemperature and undervoltage. Various diagnostic functions
and a very low quiescent current in standby mode opens a wide range of applications. Automotive qualification gives added
value and enhanced quality for exacting requirements of automotive applications.
Figure 1-1. Block Diagram
n.
u.
n.
u.
O
C
S
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
H
S
3
Input register
Output register
DI
5
P
S
F
O
P
L
S
C
D
n.
u.
n.
u.
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
3
Serial interface
n.
u.
n.
u.
n.
u.
n.
u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
VS
Charge
pump
T
P
CLK
6
CS
Fault
detect
INH
UV
protection
4
Fault
detect
Fault
detect
11
10
Control
logic
DO
9
VCC
Power-on
reset
1
7
Fault
detect
Fault
detect
2
OUT3
2
ATA6826C [DATASHEET]
9213F–AUTO–08/15
Fault
detect
12
OUT2
Thermal
protection
13
OUT1
8
14
GND
GND
GND
GND
2.
Pin Configuration
Figure 2-1. Pinning SO14
GND
OUT3
VS
CS
DI
CLK
GND
Table 2-1.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
GND
OUT1
OUT2
VCC
INH
DO
GND
Pin Description
Pin
Symbol
1
GND
Function
Ground; reference potential; internal connection to pin 7, 8 and 14; cooling tab
2
OUT3
Half-bridge output 3; formed by internally connected power MOS high-side switch 3 and lowside switch 3 with internal reverse diodes; short-circuit protection; overtemperature protection;
diagnosis for short and open load
3
VS
Power supply for output stages OUT1, OUT2 and OUT3, internal supply
4
CS
Chip select input; 5V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
5
DI
Serial data input; 5V CMOS logic level input with internal pull down; receives serial data from
the control device; DI expects a 16-bit control word with LSB being transferred first
6
CLK
Serial clock input; 5V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2MHz)
7
GND
Ground; see pin 1
8
GND
Ground; see pin 1
9
DO
Serial data output; 5V CMOS logic level tristate output for output (status) register data; sends
16-bit status information to the microcontroller (LSB is transferred first); output will remain
tri-stated unless device is selected by CS = low, therefore, several ICs can operate on only
one data output line.
10
INH
Inhibit input; 5V logic input with internal pull down; low = standby, high = normal operation
11
VCC
Logic supply voltage (5V)
12
OUT2
Half-bridge output 2; see pin 2
13
OUT1
Half-bridge output 1; see pin 2
14
GND
Ground; see pin 1
ATA6826C [DATASHEET]
9213F–AUTO–08/15
3
3.
Functional Description
3.1
Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized to CLK and is accepted on
the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the
rising edge of the CS signal. When CS is high, pin DO is in tri-state condition. This output is enabled on the falling edge of
CS. Output data will change their state with the rising edge of CLK and stay stable until the next rising edge of CLK appears.
LSB (bit 0, TP) is transferred first.
Figure 3-1. Data Transfer
CS
DI
SRR
0
LS1
1
HS1
2
LS2
3
HS2
LS3
HS3
n. u.
n. u.
n. u.
4
5
6
7
8
9
S2H
S3L
S3H
n. u.
n. u.
n. u.
n. u.
10
n. u.
11
n. u.
12
OCS
13
n. u.
14
n. u.
15
CLK
DO
Table 3-1.
4
TP
S1L
S1H
S2L
n. u.
n. u.
n. u.
SCD
OPL
PSF
Input Data Protocol
Bit
Input Register
0
SRR
Status register reset (high = reset; the bits PSF, OPL and SCD in the output data
register are set to low)
1
LS1
Controls output LS1 (high = switch output LS1 on)
2
HS1
Controls output HS1 (high = switch output HS1 on)
3
LS2
See LS1
4
HS2
See HS1
5
LS3
See LS1
6
HS3
See HS1
7
n. u.
Not used
8
n. u.
Not used
9
n. u.
Not used
10
n. u.
Not used
11
n. u.
Not used
12
n. u.
Not used
13
OCS
Overcurrent shutdown (high = overcurrent shutdown is active)
14
n. u.
Not used
15
n. u.
Not used
ATA6826C [DATASHEET]
9213F–AUTO–08/15
Function
Table 3-2.
Output Data Protocol
Bit
Output (Status)
Register
0
TP
Function
Temperature prewarning: high = warning
1
Status LS1
High = output is on, low = output is off; not affected by SRR
2
Status HS1
High = output is on, low = output is off; not affected by SRR
3
Status LS2
Description see LS1
4
Status HS2
Description see HS1
5
Status LS3
Description see LS1
6
Status HS3
Description see HS1
7
n. u.
Not used
8
n. u.
Not used
9
n. u.
Not used
10
n. u.
Not used
11
n. u.
Not used
12
n. u.
Not used
13
SCD
Short circuit detected: set high when at least one high-side or low-side switch is
switched off by a short-circuit condition. Bits 1 to 6 can be used to detect the
shorted switch.
14
OPL
Open load detected: set high, when at least one active high-side or low-side switch
sinks/sources a current below the open load threshold current.
15
PSF
Power-supply fail: undervoltage at pin VS detected
After power-on reset, the input register has the following status:
Bit 15 Bit 14
x
x
Bit 13
(OCS)
H
Bit 12 Bit 11
x
x
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
x
x
x
x
L
L
L
Bit 3 Bit 2 Bit 1
(LS2) (HS1) (LS1)
L
L
L
Bit 0
(SRR)
L
The following patterns are used to enable internal test modes of the IC. It is not recommended to use these patterns during normal
operation.
Bit 15 Bit 14
Bit 13
(OCS)
Bit 12 Bit 11 Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3 Bit 2 Bit 1
(LS2) (HS1) (LS1)
Bit 0
(SRR)
L
L
L
L
L
L
L
L
L
H
H
H
H
H
L
L
H
H
H
L
L
H
H
L
L
L
L
L
L
L
L
L
H
H
H
L
L
L
L
H
H
L
L
L
L
L
L
L
ATA6826C [DATASHEET]
9213F–AUTO–08/15
5
3.2
Power-supply Fail
In case of undervoltage at pin VS, the Power-Supply Fail bit (PSF) in the output register is set and all outputs are disabled.
To detect an undervoltage, its duration has to be longer than the undervoltage detection delay time tdUV. The outputs are
enabled immediately when supply voltage recovers to a normal operating value. The PSF bit stays high until it is reset by the
SRR (Status Register Reset) bit in the input register.
3.3
Open-load Detection
If the current through a high-side or low-side switch in the ON-state stays below the open-load detection threshold, the openload detection bit (OPL) in the output register is set.
The OPL bit stays high until it is reset by the SRR bit in the input register. To detect an open load, its duration has to be
longer than the open-load detection delay time tdOL.
3.4
Overtemperature Protection
If the junction temperature of one or more output stages exceeds the thermal prewarning threshold, TjPW set, the temperature
prewarning bit (TP) in the output register is set. When the temperature falls below the thermal prewarning threshold,
TjPW reset, the bit TP is reset. The TP bit can be read without transferring a complete 16-bit data word. The status of TP is
available at pin DO with the falling edge of CS. After the microcontroller has read this information, CS is set high and the
data transfer is interrupted without affecting the status of input and output registers.
If the junction temperature of one or more output stages exceeds the thermal shutdown threshold, Tj switch off, all outputs are
disabled and the corresponding bits in the output register are set to low. The outputs can be enabled again when the
temperature falls below the thermal shutdown threshold, Tjswitch on and the SRR bit in the input register is set to high.
Hysteresis of thermal pre-warning and shutdown threshold avoids oscillations.
3.5
Short-circuit Protection
The output currents are limited by a current regulator. Overcurrent detection is activated by writing a high to the OCS
(Overcurrent Shutdown) bit in the input register. When the current in an output stage exceeds the overcurrent limitation and
shutdown threshold, it is switched off after a delay time (tdSd). The short-circuit detection bit (SCD) is set and the
corresponding status bit in the output register is set to low. For OCS = low the overcurrent shutdown is inactive. The SCD bit
is also set if the current exceeds the overcurrent limitation and shutdown threshold, but the outputs are not affected. By
writing a high to the SRR bit in the input register the SCD bit is reset and the disabled outputs are enabled.
3.6
Inhibit
Applying 0V to pin 10 (INH) inhibits the Atmel® ATA6826C.
All output switches are then turned off and switched to tri-state. The data in the output register is deleted. The current
consumption is reduced to less than 2µA at pin VS and less than 25µA at pin VCC. The output switches can be activated
again by switching pin 10 (INH) to 5V which initiates an internal power-on reset.
6
ATA6826C [DATASHEET]
9213F–AUTO–08/15
4.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters
Pin
Symbol
Value
Unit
Supply voltage
3
VVS
–0.3 to +40
V
Supply voltage
t < 0.5s; IS > –2A
3
VVS
–1
V
Logic supply voltage
11
VVCC
–0.3 to +7
V
4 to 6, 10
VCS,VDI, VCLK, VINH
–0.3 to VVCC + 0.3
V
9
VDO
–0.3 to VVCC + 0.3
V
4 to 6, 10
ICS,IDI, ICLK, IINH
–10 to +10
mA
Output current
9
IDO
–10 to +10
mA
Output current
2, 12 and 13
IOut3, IOut2, IOut1
Internally limited, see output specification
Output voltage
2, 12 and 13
IOut3, IOut2, IOut1
–0.3 to +40
V
Reverse conducting current
(tpulse = 150µs)
2, 12 and 13
towards pin 3
IOut3, IOut2, IOut1
17
A
Junction temperature range
TJ
–40 to +150
°C
Storage temperature range
TSTG
–55 to +150
°C
Logic input voltage
Logic output voltage
Input current
5.
Thermal Resistance
Parameters
Test Conditions
Junction pin
Measured to GND
Pins 1, 7, 8 and 14
Junction ambient
6.
Symbol
Value
Unit
RthJP
30
K/W
RthJA
65
K/W
Operating Range
Parameters
Symbol
Value
Unit
Supply voltage
VVS
VUV(1) to 40
V
Logic supply voltage
VVCC
4.75 to 5.25
V
VCS,VDI, VCLK, VINH
–0.3 to VVCC
V
fCLK
2
MHz
Tj
–40 to +150
°C
Logic input voltage
Serial interface clock frequency
Junction temperature range
Note:
Threshold for undervoltage detection
ATA6826C [DATASHEET]
9213F–AUTO–08/15
7
7.
Noise and Surge Immunity
Parameters
Test Conditions
Conducted interferences
ISO 7637-1
Interference suppression
VDE 0879 Part 2
Value
Level 4(1)
Level 5
ESD (human body model); pins 2, 12, 13 vs. GND HBM: AEC-Q100-002-Ref-D
CEI/IEC 60749-26:2006
ESD (human body model), all other pins
ESDA/JEDEC JS-001-2010
8kV
CDM (charged device model)
ANSI/ESD S5.3.1-2009
1kV
MM (machine model)
AEC Q100-003-REV-E
ANSI/ESD S5.2-2009
250V
Note:
8.
5kV
Test pulse 5: Vsmax = 40V
Electrical Characteristics
7.5V < VVS < 40V; 4.75V < VVCC < 5.25V; INH = High; –40°C < Tj < 150C; unless otherwise specified, all values refer to GND pins.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
1
Current Consumption
1.1
Quiescent current VS
VVS < 20V, INH = low
3
IVS
1
2
µA
A
1.2
Quiescent current VCC
4.75V < VVCC < 5.25V,
INH = low
11
IVCC
15
25
µA
A
1.3
Supply current VS
VVS < 20V normal
operating, all outputs off
3
IVS
4
6
mA
A
1.4
Supply current VCC
4.75V < VVCC < 5.25V,
normal operating
11
IVCC
350
500
µA
A
1.5
Discharge current VS
VVS = 32.5V,
INH = low
3
IVS
0.5
5.5
mA
A
1.6
Discharge current VS
VVS = 40V,
INH = low
3
IVS
2.5
10
mA
A
11
VVCC
3.2
3.9
4.4
V
A
tdPor
30
95
190
µs
A
2
Undervoltage Detection, Power-on Reset
2.1
Power-on reset
threshold
2.2
Power-on reset
delay time
2.3a
Undervoltage-detection
VCC = 5V
threshold (down)
3
VUv
5.6
6.5
V
A
2.3b
Undervoltage-detection
VCC = 5V
threshold (up)
3
VUv
6.0
7.0
V
A
2.4
Undervoltage-detection
VCC = 5V
hysteresis
3
VUv
V
A
2.5
Undervoltage-detection
delay time
µs
A
After switching on VCC
tdUV
0.6
10
40
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1.
Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90%
of final level. Device not in standby for t > 1ms
8
ATA6826C [DATASHEET]
9213F–AUTO–08/15
8.
Electrical Characteristics (Continued)
7.5V < VVS < 40V; 4.75V < VVCC < 5.25V; INH = High; –40°C < Tj < 150C; unless otherwise specified, all values refer to GND pins.
No.
3
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Thermal Prewarning and Shutdown
3.1
Thermal prewarning set
TjPW set
120
145
170
°C
B
3.2
Thermal prewarning
reset
TjPW reset
105
130
155
°C
B
3.3
Thermal prewarning
hysteresis
TjPW
°C
B
3.4
Thermal shutdown off
Tj switch off
150
175
200
°C
B
3.5
Thermal shutdown on
Tj switch on
135
160
185
°C
B
3.6
Thermal shutdown
hysteresis
Tj switch off
K
B
3.7
Ratio thermal shutdown
off/thermal prewarning
set
Tj switch off/
TjPW set
1.05
1.2
B
3.8
Ratio thermal shutdown
on/thermal prewarning
reset
Tj switch on/
TjPW reset
1.05
1.2
B
4
15
15
Output Specification (OUT1-OUT3)
4.1
IOut 1-3 = –0.9A
2, 12,
13
RDSOn1-3
0.8
1.5

A
IOut 1-3 = +0.9A
2, 12,
13
RDSOn1-3
0.8
1.5

A
µA
A
200
µA
A
2
V
A
V
A
On resistance
4.2
4.3
High-side output
leakage current
VOut 1-3 = 0V,
output stages off
2, 12,
13
IOut1-3
4.4
Low-side output
leakage current
VOut 1-3 = VVS,
output stages off
2, 12,
13
IOut1-3
4.5
High-side switch
reverse diode forward
voltage
IOut 1-3 = 1.5A
2, 12,
VOut1-3 – VVS
13
4.6
Low-side switch
reverse diode forward
voltage
IOut 1-3 = –1.5A
2, 12,
13
VOut 1-3
–2
4.7
High-side overcurrent
7.5V < VS < 20V
limitation and shutdown
20V ≤ VS < 40V
threshold
2, 12,
13
IOut1-3
–1.7
–2.0
–1.3
–1.3
–1.0
–1.0
A
A
A
4.8
Low-side overcurrent
7.5V < VS < 20V
limitation and shutdown
20V ≤ VS < 40V
threshold
2, 12,
13
IOut1-3
1
1
1.3
1.3
1.7
2.0
A
A
A
4.9
Overcurrent shutdown
delay time
tdSd
10
40
µs
A
4.10
High-side open-load
detection threshold
2, 12,
13
IOut1-3
–50
–30
–10
mA
A
4.11
Low-side open-load
detection threshold
2, 12,
13
IOut1-3
10
30
50
mA
A
–15
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1.
Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90%
of final level. Device not in standby for t > 1ms
ATA6826C [DATASHEET]
9213F–AUTO–08/15
9
8.
Electrical Characteristics (Continued)
7.5V < VVS < 40V; 4.75V < VVCC < 5.25V; INH = High; –40°C < Tj < 150C; unless otherwise specified, all values refer to GND pins.
No.
Parameters
4.12
Symbol
Min.
Max.
Unit
Type*
Open-load detection
delay time
tdOL
200
600
µs
A
4.13
High-side output switch VVS = 13V
on delay(1)
RLoad = 30
tdon
20
µs
A
4.14
Low-side output switch VVS = 13V
on delay(1)
RLoad = 30
tdon
20
µs
A
4.15
High-side output switch VVS = 13V
off delay(1)
RLoad = 30
tdoff
20
µs
A
4.16
Low-side output switch VVS = 13V
off delay(1)
RLoad = 30
tdoff
3
µs
A
4.17
Dead time between
corresponding highand low-side switches
5
Test Conditions
Pin
VVS = 13V
RLoad = 30
Typ.
tdon – tdoff
1
µs
A
0.3 
VVCC
V
A
0.7
VVCC
V
A
Logic Inputs DI, CLK, CS, INH
5.1
Input voltage low-level
threshold
4-6, 10
VIL
5.2
Input voltage high-level
threshold
4-6, 10
VIH
5.3
Hysteresis of input
voltage
4-6, 10
VI
50
700
mV
B
5.4
Pull-down current pin
DI, CLK, INH
VDI, VCLK, VINH = VCC
5, 6,
10
IPD
10
65
µA
A
5.5
Pull-up current pin CS
VCS = 0V
4
IPU
–65
–10
µA
A
0.4
V
A
V
A
10
µA
A
100
µs
A
6
Serial Interface – Logic Output DO
6.1
Output-voltage low
level
IDOL = 2mA
9
VDOL
6.2
Output-voltage high
level
IDOL = –2mA
9
VDOH
VVCC –
0.7V
6.3
Leakage current
(tri-state)
VCS = VCC
0V < VDO < VVCC
9
IDO
–10
7
7.1
Inhibit Input - Timing
Delay time from
standby to normal
operation
tdINH
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1.
Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90%
of final level. Device not in standby for t > 1ms
10
ATA6826C [DATASHEET]
9213F–AUTO–08/15
9.
Serial Interface – Timing
Pin
Timing Chart No.(1)
Symbol
CDO = 100pF
9
1
DO disable after
CS rising edge
CDO = 100pF
9
8.3
DO fall time
CDO = 100pF
8.4
DO rise time
8.5
DO valid time
8.6
CS setup time
8.7
No.
Parameters
Test Conditions
8.1
DO enable after
CS falling edge
8.2
Min.
Typ.
Max.
Unit
Type*
tENDO
200
ns
D
2
tDISDO
200
ns
D
9
-
tDOf
100
ns
D
CDO = 100pF
9
-
tDOr
100
ns
D
CDO = 100pF
9
10
tDOVal
200
ns
D
4
4
tCSSethl
225
ns
D
CS setup time
4
8
tCSSetlh
225
ns
D
8.8
CS high time
4
9
tCSh
500
ns
D
8.9
CLK high time
6
5
tCLKh
225
ns
D
8.10
CLK low time
6
6
tCLKl
225
ns
D
8.11
CLK period time
6
-
tCLKp
500
ns
D
8.12
CLK setup time
6
7
tCLKSethl
225
ns
D
8.13
CLK setup time
6
3
tCLKSetlh
225
ns
D
8.14
DI setup time
5
11
tDIset
40
ns
D
8.15
DI hold time
5
12
tDIHold
40
ns
D
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1.
See Figure 9-1 on page 12 “Serial Interface Timing with Chart Numbers”
ATA6826C [DATASHEET]
9213F–AUTO–08/15
11
Figure 9-1. Serial Interface Timing with Chart Numbers
1
2
CS
DO
9
CS
4
7
CLK
5
3
6
8
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High level = 0.7 x VCC, low level = 0.3 x VCC
Output DO: High level = 0.8 x VCC, low level = 0.2 x VCC
12
ATA6826C [DATASHEET]
9213F–AUTO–08/15
10.
Application Circuit
Figure 10-1. Application Circuit
VCC
Enable
Trigger
Reset
Atmel
U5021M
Watchdog
VS
n.
u.
n.
u.
O
C
S
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
BYT41D
3
VS
VBatt
Microcontroller
CLK
CS
5
P
S
F
O
P
L
S
C
D
n.
u.
n.
u.
DO
n.
u.
n.
u.
n.
u.
n.
u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
13V
Charge
pump
L T
S P
1
6
Fault
detect
Fault
detect
VCC
UV
protection
4
Fault
detect
INH
Serial interface
11
10
Control
logic
VCC
VCC
5V
Power-on
reset
9
1 GND
+
DI
+
Input register
Output register
7 GND
Fault
detect
Fault
detect
Fault
detect
Thermal
protection
2
12
OUT3
8
14
GND
GND
13
OUT1
OUT2
VCC
M
11.
M
Application Notes
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as possible to the power supply and
GND pins.
Recommended value for capacitors at VS:
Electrolytic capacitor C > 22µF in parallel with a ceramic capacitor C = 100nF. The value for electrolytic capacitor depends
on external loads, conducted interferences and reverse conducting current IOut1,2,3 (see Section 4. “Absolute Maximum
Ratings” on page 7).
Recommended value for capacitors at VCC:
Electrolytic capacitor C > 10µF in parallel with a ceramic capacitor C = 100nF.
To reduce thermal resistance it is recommended to place cooling areas on the PCB as close as possible to the GND pins.
ATA6826C [DATASHEET]
9213F–AUTO–08/15
13
12.
Ordering Information
Extended Type Number
Package
ATA6826C-TUQW
13.
SO14
Remarks
Power package, taped and reeled, 4k, green
Package Information
1
7
14
technical drawings
according to DIN
specifications
8
Dimensions in mm
A
C
D
A2
A1
b
e
E1
L
E
COMMON DIMENSIONS
Note1): Dimensions “D” and “E1” do not include Moldflash or protrusion.
(MAX. 0.15mm per side)
Bemerkung:
ASE
(Unit of Measure = mm)
Symbol
MIN
NOM
MAX
A
1.35
1.55
1.75
A1
0.10
0.18
0.25
A2
1.25
1.38
1.50
b
0.33
0.42
0.51
C
0.19
0.22
0.25
D1)
8.55
8.65
8.75
E1)
3.80
3.90
4.00
E
5.80
6.00
6.20
e
L
1.27 BSC
0.40
0.84
1.27
04/13/12
TITLE
Package Drawing Contact:
[email protected]
14
ATA6826C [DATASHEET]
9213F–AUTO–08/15
Package: SO14
GPC
DRAWING NO.
REV.
6.541-5053.01-4
1
14.
Revision History
Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this
document.
Revision No.
History
9213F-AUTO-08/15
Section 12 “Ordering Information” on page 14 updated
9213E-AUTO-06/14
Put datasheet in the latest template
9213D-AUTO-09/12
Section 7 “Noise and Surge Immunity” on page 8 changed
9213C-AUTO-05/12
Section 13 “Package Information” on page 14 changed
9213B-BCD-01/11
Section 3.6 “Inhibit” on page 6 changed
ATA6826C [DATASHEET]
9213F–AUTO–08/15
15
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