AT24C01C and AT24C02C I2C-Compatible (2-wire) Serial EEPROM 1-Kbit (128 x 8), 2-Kbit (256 x 8) DATASHEET Features Low-voltage Operation ̶ VCC = 1.7V to 5.5V Internally Organized as 128 x 8 (1K) or 256 x 8 (2K) I2C Compatible (2-wire) Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 400kHz (1.7V) and 1MHz (2.5V, 2.7V, 5.0V) Compatibility Write Protect Pin for Hardware Data Protection 8-byte Page Write Mode ̶ Partial Page Writes Allowed Self-timed Write Cycle (5ms max) High-reliability ̶ Endurance: 1,000,000 Write Cycles Data Retention: 100 Years ̶ Green Package Options (Pb/Halide-free/RoHS-compliant) ̶ 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 5-lead SOT23, and 8-ball VFBGA Die Sale Options: Wafer Form and Tape and Reel Available Description The Atmel® AT24C01C/02C provides 1024/2048-bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 128/256 words of eight bits each. Both devices include a cascading feature that allows up to eight devices to share a common 2-wire bus. These devices are optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C01C/02C are available in space saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 5-lead SOT23, and 8-ball VFBGA packages. In addition, the entire family operates from 1.7V to 5.5V VCC. Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 1. Pin Configurations and Pinouts Table 1-1. Pin Descriptions Pin Number Pin Symbol 1, 2, 3 A0 – A2 4 Note: Asserted State Pin Type Address Inputs: The A2, A1, and A0 pins are device address inputs that are hard wired. As many as eight 1-Kbit or 2-Kbit devices may be addressed on a single bus system. — Input GND Ground: The ground reference for the power supply. GND should be connected to the system ground. — Power 5 SDA Serial Data: The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be wire-ORed with any number of other open drain or open collector devices. — Input/ Output 6 SCL Serial Clock Input: The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. — Input 7 WP Write Protect: Provides hardware data protection. The Write Protect pin allows normal read/write operations when connected to Ground (GND). When the Write Protect pin is connected to VCC, the write protection feature is enabled and operates as shown in Table 5-1. 8 VCC Device Power Supply: The VCC pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. 1. Pin Name and Functional Description Input — Power For use of 5-lead SOT23, the software A2, A1, and A0 bits in the device address word must be set to zero to properly communicate. 8-lead SOIC A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 8-pad UDFN 8-lead TSSOP SDA A0 1 2 3 4 A1 A2 GND VCC WP SCL SDA 8 7 6 5 A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA Top View Top View Top View 8-lead PDIP 5-lead SOT23 8-ball VFBGA A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA Top View SCL 1 GND 2 SDA 3 5 4 Top View WP VCC A0 1 8 VCC A1 2 7 WP A2 3 6 SCL GND 4 5 SDA Top View Note: Package drawings are not to scale. 2 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 2. Block Diagram Figure 2-1. Block Diagram VCC GND WP Start Stop Logic SDA Serial Control Logic LOAD Device Address Comparator A2 A1 A0 R/W EN H.V. Pump/Timing COMP LOAD Data Word Addr/counter Y DEC Data Recovery INC X DEC SCL EEPROM Serial MUX DOUT/ACK Logic DIN DOUT 3. Absolute Maximum Ratings Operating Temperature . . . . . . . . . . .-55C to +125C Storage Temperature . . . . . . . . . . . . .-65C to +150C Voltage on any pin with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 3 4. Memory Organization AT24C01C, 1K Serial EEPROM: Internally organized with 16 pages of eight bytes each, the 1K requires a 7-bit data word address for random word addressing. AT24C02C, 2K Serial EEPROM: Internally organized with 32 pages of eight bytes each, the 2K requires an 8-bit data word address for random word addressing. 4.1 Pin Capacitance Table 4-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 1.7V to 5.5V. Symbol Test Condition CI/O CIN Note: 4.2 1. Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Table 4-2. DC Characteristics Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.7 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 4.5 5.5 V ICC1 Supply Current VCC = 5.0V Read at 400kHz 0.4 1.0 mA ICC2 Supply Current VCC = 5.0V Write at 400kHz 2.0 3.0 mA ISB1 Standby Current VCC = 1.7V VIN = VCC or VSS 1.0 μA ISB2 Standby Current VCC = 2.5V VIN = VCC or VSS 2.0 μA ISB3 Standby Current VCC = 5.5V VIN = VCC or VSS 6.0 μA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA VIL Input Low Level(1) -0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V (1) Min Typ VIH Input High Level VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V Note: 4 Test Condition 1. VIL min and VIH max are reference only and are not tested. AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 4.3 AC Characteristics Table 4-3. AC Characteristics Applicable over recommended operating range from TAI = -40C to +85C, VCC = 1.7V to 5.5V, CL = 1TTL Gate and 100pF (unless otherwise noted). Test conditions are listed in Note 2. 1.7V Min 2.5V, 5.0V Symbol Parameter Max Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.2 0.4 μs tHIGH Clock Pulse Width High 0.6 0.4 μs tI Noise Suppression Time tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start. 1.2 0.5 μs tHD.STA Start Hold Time 0.6 0.25 μs tSU.STA Start Setup Time 0.6 0.25 μs tHD.DAT Data In Hold Time 0 0 μs tSU.DAT Data In Setup Time 100 100 ns tR Inputs Rise Time(1) 400 100 0.9 (1) 0.05 Max Units 1000 kHz 50 ns 0.55 μs 0.3 0.3 μs 300 100 ns tF Inputs Fall Time tSU.STO Stop Setup Time 0.6 .25 μs tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time (1) Endurance Note: 1. 2. 5 3.3V, +25C, Page Mode 5 1,000,000 ms Write Cycles This parameter is ensured by characterization only. AC measurement conditions: RL (connects to VCC): 1.3 k (2.5V, 5V), 10 k (1.7V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: 50ns Input and output timing reference voltages: 0.5 VCC AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 5 5. Write Protection The AT24C01C/02C utilizes a hardware data protection scheme that allows the user to write protect the entire memory contents when the WP pin is at VCC (or a valid VIH). No write protection will be set if the WP pin is at GND or left floating. Table 5-1. 6. Write Protect WP Pin Status Part of the Array Protected At VCC Full (2K) Array At GND Normal Read/Write Operations Device Operation Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. Figure 6-1. Data Validity SDA SCL Data Stable Data Stable Data Change Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any other command. Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop condition will place the EEPROM in a standby power mode. Figure 6-2. Start and Stop Definition SDA SCL Start 6 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 Stop Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. Figure 6-3. Output Acknowledge 1 SCL 8 9 Data In Data Out Start Acknowledge Standby Mode: The AT24C01C/02C features a low-power standby mode which is enabled: Upon power-up. After the receipt of the Stop condition and the completion of any internal operations. 2-wire Software Reset: After an interruption in protocol, power-loss, or system reset, any 2-wire part can be reset by following these steps: 1. Create a Start condition (if possible). 2. 3. Clock nine cycles. Create another Start condition followed by Stop condition as shown in Figure 6-4. The device will be ready for the next communication after above steps have been completed. The device should be ready for the next communication after above steps have been completed. In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device. Figure 6-4. Software Reset Dummy Clock Cycles SCL 1 Start Condition 2 3 8 9 Start Condition Stop Condition SDA AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 7 Figure 6-5. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT Figure 6-6. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th Bit ACK WORDN (1) tWR Stop Condition Note: 8 1. Start Condition The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal clear/write cycle. AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 7. Device Addressing The 1-Kbit and 2-Kbit EEPROM device requires an 8-bit device address word following a Start condition to enable the device for a Read or Write operation. The device address word consists of a mandatory ‘1010’ (0xA) sequence for the first four most significant bits as shown in Figure 7-1. This is common to all Serial EEPROM devices. The next three bits are the A2, A1, and A0 device address bits for the 1K and 2K EEPROM. These three bits must compare to their corresponding hard-wired input pins A2, A1, and A0 in order for the part to acknowledge. The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit is high and a Write operation is initiated if this bit is low. Upon a valid compare of the device address with hard-wired input pins A2, A1, and A0, the EEPROM will output a zero. If a compare is not successfully made, the chip will return to a standby state. Figure 7-1. 1K or 2K Device Address 1 0 1 0 A2 A1 A0 R/W MSB 8. LSB Write Operations Byte Write: A Byte Write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a Stop condition. At this time, the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete. Figure 8-1. Byte Write S T A R T Device Address W R I T E Word Address S T O P Data SDA LINE M S B R A / C W K A C K A C K Page Write: The 1-Kbit and 2-Kbit EEPROM are capable of an 8-byte Page Write. A Page Write is initiated the same as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to seven data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a Stop condition. The data word address lower three bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than eight data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 9 Figure 8-2. Page Write S T A R T Device Address W R I T E Word Address (n) Data (n) Data (n + 1) S T O P Data (n + x) SDA LINE M S B R A / C W K A C K A C K A C K A C K Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a Start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. Data Security: The AT24C01C/02C has a hardware data protection scheme that allows the user to write protect the entire memory when the WP pin is at VCC. 9. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: Current Address Read Random Address Read Sequential Read. Current Address Read: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address roll-over during read is from the last byte of the last memory page to the first byte of the first page. The address roll-over during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an zero but does generate a following Stop condition Figure 9-1. Current Address Read S T A R T Device Address R E A D S T O P Data SDA LINE M S B R A / C W K N O A C K 10 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 Random Read: A Random Read requires a dummy byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a Current Address Read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition. Figure 9-2. Random Read S T A R T Device Address W R I T E S T A R T Word Address (n) Device Address R E A D S T O P Data (n) SDA LINE R A / C W K M S B A C K A C K N O A C K Dummy Write Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll-over and the Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition. Figure 9-3. Sequential Read Device Address R E A D Data (n) A C K Data (n + 1) A C K Data (n + 2) A C K S T O P Data (n + x) SDA LINE M S B R A / C WK N O A C K AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 11 10. Ordering Code Detail AT24C01C-SSHM-B Atmel Designator Product Family 24C = Standard I2C-compatible Serial EEPROM Shipping Carrier Option B or Blank = Bulk (Tubes) T = Tape and Reel, Standard Quantity Option E = Tape and Reel, Expanded Quantity Option Operating Voltage M = 1.7V to 5.5V Device Density 01 = 1-Kbit 02 = 2-Kbit Package Device Grade or Wafer/Die Thickness U Device Revision = Green, matte Sn lead finish, Industrial temperature range (-40˚C to +85˚C) H = Green, NiPdAu lead finish, Industrial temperature range (-40˚C to +85˚C) 11 = 11mil wafer thickness Package Option SS = JEDEC SOIC X = TSSOP MA = UDFN P = PDIP ST = SOT23 C = VFBGA WWU = Wafer Unsawn 12 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 11. Part Markings AT24C01C and AT24C02C: Package Marking Information 8-lead PDIP 8-lead TSSOP 8-lead SOIC ATMLUYWW ###M @ AAAAAAAA ATHYWW ###M @ AAAAAAA ATMLHYWW ###M @ AAAAAAAA 5-lead SOT-23 8-lead UDFN 8-ball VFBGA 2.0 x 3.0 mm Body 2.35 x 3.73 mm Body ###MU ### [email protected] YXX YMXX Top Mark ###U @YMXX Bottom Mark Note: Top Line for 24C02C is 2CMBU Note 1: designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT24C01C Truncation Code ###: 01C AT24C02C Truncation Code ###: 02C Date Codes Y = Year 2: 2012 3: 2013 4: 2014 5: 2015 Voltages 6: 2016 7: 2017 8: 2018 9: 2019 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code M: 1.7V min Grade/Lead Finish Material U: H: Industrial/Matte Tin Industrial/NiPdAu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: ATM: ATML: Atmel Atmel Atmel 3/13/14 TITLE Package Mark Contact: [email protected] 24C01-02CSM, AT24C01C and AT24C02C Package Marking Information DRAWING NO. REV. 24C01-02CSM B AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 13 12. Ordering Information Delivery Information Atmel Ordering Code Lead Finish Package Form Quantity Bulk (Tubes) 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8P3 Bulk (Tubes) 50 per Tube 5TS1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel AT24C01C-SSHM-B 8S1 AT24C01C-SSHM-T AT24C01C-XHM-B AT24C01C-XHM-T NiPdAu (Lead-free/Halogen-free) AT24C01C-MAHM-T 8MA2 AT24C01C-MAHM-E AT24C01C-PUM AT24C01C-STUM-T AT24C01C-CUM-T 8X Matte Tin (Lead-free/Halogen-free) SnAgCu Ball (Lead-free/Halogen-free) AT24C01C-WWU11M(1) N/A Wafer Sale AT24C02C-SSHM-B 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8P3 Bulk (Tubes) 50 per Tube 5TS1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel AT24C02C-SSHM-T AT24C02C-XHM-B AT24C02C-XHM-T NiPdAu (Lead-free/Halogen-free) AT24C02C-MAHM-T 8MA2 AT24C02C-MAHM-E AT24C02C-PUM AT24C02C-STUM-T AT24C02C-CUM-T Matte Tin (Lead-free/Halogen-free) SnAgCu Ball (Lead-free/Halogen-free) AT24C02C-WWU11M(1) Note: 1. 8X N/A Wafer Sale Note 1 For Wafer sales, please contact Atmel Sales. Package Type 14 8P3 8-lead, 0.300" wide, Plastic Dual Inline (PDIP) 8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP) 8MA2 8-lead, 2.00mm x 3.00mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN) 5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23) 8U3-1 8-ball, die Ball Grid Array (VFBGA) AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 Industrial Temperature (-40C to 85C) Note 1 Bulk (Tubes) 8S1 Operation Range Industrial Temperature (-40C to 85C) 13. Packaging Information 13.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: [email protected] TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. REV. 8S1 G AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 15 13.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E NOTE 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] 16 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 GPC TNR DRAWING NO. 8X REV. E 13.3 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C TOP VIEW A2 SIDE VIEW A A1 E2 b (8x) 8 7 1 D2 6 3 5 4 e (6x) K L (8x) BOTTOM VIEW Notes: COMMON DIMENSIONS (Unit of Measure = mm) 2 Pin#1 ID 1. This drawing is for general information only. Refer to Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. 3. Dimensions b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. SYMBOL MIN NOM MAX A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 D 1.90 2.00 2.10 D2 1.40 1.50 1.60 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 b 0.18 0.25 0.30 C NOTE 3 1.52 REF L 0.30 e 0.35 0.40 0.50 BSC K 0.20 - - 11/26/14 Package Drawing Contact: [email protected] TITLE 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) GPC DRAWING NO. REV. YNZ 8MA2 G AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 17 13.4 8P3 — 8-lead PDIP E 1 E1 .381 Gage Plane N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = mm) D e D1 A2 A A1 b2 b3 b v 4 PLCS Side View L 0.254 m C MIN NOM MAX A - - 5.334 A1 0.381 A2 2.921 3.302 4.953 b 0.356 0.457 0.559 5 b2 1.143 1.524 1.778 6 b3 0.762 0.991 1.143 6 c 0.203 0.254 0.356 D 9.017 9.271 10.160 D1 0.127 0.000 0.000 3 E 7.620 7.874 8.255 4 E1 6.096 6.350 7.112 3 3.810 2 SYMBOL - e Notes: 2 - 3 2.540 BSC eA L NOTE 7.620 BSC 2.921 3.302 4 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 07/31/14 Package Drawing Contact: [email protected] 18 TITLE GPC DRAWING NO. 8P3, 8-lead, 0.300” Wide Body, Plastic Dual In-line Package (PDIP) PTC 8P3 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 REV. E 13.5 5TS1 — 5-lead SOT23 e1 C 4 5 E1 C L E L1 1 3 2 END VIEW TOP VIEW b A2 SEATING PLANE e A A1 D SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. SYMBOL MIN A A1 A2 c D E E1 L1 e e1 b 0.00 0.70 0.08 NOM 0.90 2.90 BSC 2.80 BSC 1.60 BSC 0.60 REF 0.95 BSC 1.90 BSC 0.30 - MAX 1.00 0.10 1.00 0.20 0.50 NOTE 3 1,2 1,2 1,2 3,4 5/31/12 Package Drawing Contact: [email protected] TITLE GPC 5TS1, 5-lead 1.60mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TSZ DRAWING NO. 5TS1 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 REV. D 19 13.6 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 1 2 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 Package Drawing Contact: [email protected] 20 TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 REV. F 14. Revision History Doc. Rev. Date Comments Add the UDFN extended quantity option. 8700G 8700F 01/2015 06/2012 Update part markings, package drawings, ordering information, template, and reorganize. Correct ordering codes: - AT24C01C-WWU11, Die Sale to AT24C01C-WWU11M, Wafer Sale. - AT24C02C-WWU11, Die Sale to AT24C02C-WWU11M, Wafer Sale. Remove WDT from ordering code detail. Update Atmel logos and disclaimer page. Update datasheet template. Add AT24C01C to document. 8700E 05/2012 Electrical performance improvements: - Reduce all ISB from legacy values - Increase 1MHz frequency range to include 2.5V operation. Update package drawings to latest versions (where applicable) and selected waveforms. 8700D 08/2010 Change AT24C02C-XHM Part Marking from [email protected] to 02CM @. Ordering Information: - Change Atmel AT24C02C-TSUM-T to Atmel AT24C02C-STUM-T. - Change Atmel AT24C02CY6-MAHM-T to Atmel AT24C02C-MAHM-T. - Change Atmel AT24C02CU3-CUM-T to Atmel AT24C02C-CUM-T. Catalog numbering scheme, change TS = SOT23 to ST = SOT23. 8700C 07/2010 Part marking SOT23: - Change 2CMWU to 2CMBU. - Change W = Write Protection Feature to B = Write Protection. Part marking PDIP and SOIC: Added @ = Country of Assembly. Part marking TSSOP: Replaced and removed bottom mark. Part marking UDFN: Added [email protected] Remove preliminary status. Change tI Max 40 to 50 in Table AC Characteristics. 8700B 02/2010 Correct catalog numbering scheme and ordering information. 8700A 12/2009 Initial document release. AT24C01C/02C [DATASHEET] Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015 21 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-8700G-SEEPROM-AT24C01C-02C-Datasheet_012015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.