802.15.4 ATSAMR21G18-MR210UA DATASHEET PRELIMINARY Description The ATSAMR21G18-MR210UA is a 20mm x 19mm wireless module with a solder mount footprint. It integrates an ATSAMR21G18 IC together with a serial flash and a crypto authentication device. Features • • • • • • • • • • ATSAMR21G18 system in package ® ® – Single-chip ARM Cortex -M0+ based 32-bit Microcontroller – Low power 2.4GHz transceiver for IEEE 802.15.4 and ZigBee applications – 256KB Flash – Maximum Operating Frequency: 48 MHz – 128-bit AES crypto engine – 32-bit MAC symbol counter – Temperature sensor – Automatic transmission modes AT45DB041E 4-Mbit DataFlash ATECC508A CryptoAuthentication Device – Secure Hardware-based Key Storage – Performs High-Speed Public Key Algorithms – NIST Standard P256 Elliptic Curve Support – SHA-256 Hash Algorithm with HMAC Option – Guaranteed Unique 72-bit Serial Number – High-quality FIPS Random Number Generator (RNG) – Intrusion Latch for External Tamper Switch Single 1.8V - 3.6V supply Radio module with a link budget of 103dBm FCC / ETSI compliant RF front end with harmonic filter Three SERCOM units left for external applications 32.768kHz crystal oscillator High precision 16MHz crystal oscillator 12-bit, 350ksps Analog-to-Digital Converter (ADC) Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 • • • • I2C up to 3.4MHz Full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface 17 external GPIO lines One GPIO for ATECC508A intrusion latch Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 2 Table of Contents Description.......................................................................................................................1 Features.......................................................................................................................... 1 1. Integrated Devices and Block Diagram..................................................................... 4 1.1. 1.2. Module Block Diagram................................................................................................................. 4 Integrated Peripherals.................................................................................................................. 4 1.3. RF Front End Control................................................................................................................... 5 2. Mechanical Description..............................................................................................7 2.1. 2.2. Mechanical Dimensions................................................................................................................7 Footprint and Layout Recommendation....................................................................................... 7 3. I/O Pin Assignment.................................................................................................... 9 4. Electrical Characteristics..........................................................................................11 4.1. 4.2. 4.3. Absolute Maximum Ratings........................................................................................................ 11 Recommended Operating Ratings............................................................................................. 11 Module Performance Data..........................................................................................................11 5. Non-Volatile Memory Information............................................................................ 13 6. Radio Certification................................................................................................... 14 6.1. 6.2. 6.3. 6.4. United States (FCC)................................................................................................................... 14 Europe (ETSI).............................................................................................................................14 Industry Canada (IC) Compliance Statements...........................................................................15 Approved Antennas....................................................................................................................16 7. Boot Loader............................................................................................................. 17 8. Ordering Information................................................................................................18 9. References.............................................................................................................. 19 10. Revision History.......................................................................................................20 1. Integrated Devices and Block Diagram 1.1. Module Block Diagram Figure 1-1 Module Block Diagram ATSAMR21G18-MR210UA AT45DB041E U.Fl 50Ohm SPI 4-Mbit DataFlash ATSAMR21G18 ARM® Cortex®-M0+ Balun & Harmonic Filter Antenna Diversity Switch ATECC508 CryptoAuthentication Device U.Fl 50Ohm SWI 17 GPIO 1 GPIO 1.2. Integrated Peripherals 1.2.1. Serial Flash Interconnection Table 1-1 Serial Flash Interconnection DataFlash Signal MCU Function MCU Pin Port and SERCOM Configuration SO MISO 37 PA22 SERCOM5 PAD[2] DIPO=0x2 SI MOSI 38 PA23 SERCOM5 PAD[3] DOPO=0x2 SCK SCK 48 PB03 SERCOM5 PAD[1] DOPO=0x2 #CS GPIO 47 PB02 to be set low in software before SPI access The signals in this table are not available as module I/O. More information about the FLASH IC can be found in its related datasheet [ADESTO]. 1.2.2. UART with Hardware Flow Control (RTS/CTS) For an Application where the ADC is not in use, SERCOM0 can be multiplexed as shown in the table below. Table 1-2 UART with Hardware Flow Control (RTS/CTS) Module Pin MCU Function MCU Pin Port and SERCOM Configuration 14 UART TX 15 SERCOM0; MUX=C; PAD[0] TXPO=0x2 25 UART RX 10 SERCOM0; MUX=D; PAD[1] RXPO=0x1 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 4 Module Pin MCU Function MCU Pin Port and SERCOM Configuration 26 UART RTS 11 SERCOM0; MUX=D; PAD[2] TXPO=0x2 13 UART CTS 12 SERCOM0; MUX=D; PAD[3] TXPO=0x2 The signals in this table are not available as module IO. More information about the FLASH IC can be found in its related datasheet. (ADESTO) 1.2.3. 32kHz Crystal PA00 and PA01 are used for the 32kHz crystal. This pins are not available as module IO. 1.2.4. SAM R21 USB Availability The USB pins are made available as differential pair routed GPIO’s. A base board with the required connection hardware can support an USB interface. Table 1-3 SAM R21 USB Availability Module Pin Function MCU Pin Port Configuration or Xplain Function 19 GPIO or USB_D+ 33 PA24: For USB MUX=G 20 SPIO or USB_D- 34 PA25: For USB MUX=G The module power supply can’t be operated directly from a 5V USB source. The module base board has to implement the required voltage regulator. 1.3. RF Front End Control The antenna diversity signals ANT_DIV_P/N are used to control the diversity switch U4. The signal ANT_DIV_P is available at the IO ring pin 18 to indicate the antenna currently in use. In addition at pin 17, the RX_TX indicator signal is available to indicate if the module is currently in transmit mode. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 5 Table 1-4 RF Front End Control RF Front End Signal MCU Function MCU Pin ANT_DIV_P FECTRL2 21 Port and SERCOM Configuration PA12; MUX=F; F3CFG=DIG1 Available at module pin 18 ANT_DIV_N FECTRL1 16 PA09; MUX=F; F1CFG=DIG2 FEM_RX_TX FECTRL3 22 PA13; MUX=F; F0CFG=DIG3 for High active TX indication F0CFG=DIG4 for Low active TX indication Available at module pin 17 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 6 2. Mechanical Description 2.1. Mechanical Dimensions Dimensions are in mm. The module pins are arranged with a 1mm pitch distance. The module is designed in a symmetric way. Figure 2-1 Module Bottom Dimensions ( Seen from a CAD top perspective ) The module can be mounted to a base board with a soldered RF connection. For this case one or both U.Fl connectors are left unconnected and the RF pads on the bottom side are used to feed an antenna located on the base board. 2.2. Footprint and Layout Recommendation Since the module does not contain an antenna, the module does not set any limits for the base board material selection or the board stack-up construction. The module does also not require a certain positioning on the board in relation to the board edge. The module must be placed away from interference sources on the base board like clock oscillators or step converters. The area underneath the module must be filled with a grounded copper plane. The RF-Pad area needs special attention. The following sections provide more information on that. A typical design is supposed to connect the I/O ring to the base board while the antenna feeds are using the U.Fl connectors. Using the antennas in Approved Antennas on page 16, the modular approval for the final product can be used without re-certification. 2.2.1. Design without RF-Pads For a design without U.Fl connected antennas, the base board design has to have no copper fill within the RF-Pad area (*!). All layers with less than 0.5mm distance from top shall not be filled with copper underneath the RF-Pad area. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 7 For all other I/O pads the geometry in below figure should be used. Figure 2-2 Recommended Base Board Layout 2.2.2. Design without RF-Pads For applications where the antenna is implemented on the base PCB, the RF-Pads can be used to connect the RF signals. The pad layout is available in Figure 2-2 Recommended Base Board Layout on page 8. The base board traces shall be designed with a line impedance of 50Ohm. Depending on the base board stack construction a microstrip or a grounded coplanar design can be implemented. The best choice will be the line type with the best match in between line width and the 0.8mm pad width. For all other IO pads the geometry in Figure 2-2 Recommended Base Board Layout on page 8 should be used. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 8 3. I/O Pin Assignment The module pin assignment is shown in below table. The Column "MCU pin" is referring to the ATSAMR21G18 datasheet [SAMR21]. The column “Port Configuration” is intended to help determine the required SAMR21 port configuration.. Table 3-1 RF Front End Control Module Pin Function MCU Pin Port Configuration 1 GND 2 GND 3 VCC 4 VCC 5 RSTN 40 6 SPI_CS 26 SERCOM1; MUX=C; DOPO=0x1; Master PAD1 7 SPI_MOSI 27 SERCOM1; MUX=C; DOPO=0x1 Master PAD2 For slave operation this pin is MISO 8 SPI_MISO 25 SERCOM1; MUX=C; DIPO=0x0 Master PAD0 For slave operation this pin is MOSI 9 SPI_SCLK 28 SERCOM1; MUX=C; DOPO=0x1 Master PAD3 10 GPIO 41 PA28 (Yellow LED; low active) 11 - 12 GND 13 RXD1 Not connected 12 SERCOM0; MUX=D; PAD[3] RXPO=0x3 Can be used for UART with RTS/CTS 14 TXD1 15 SERCOM0; MUX=C; PAD[0] TXPO=0x0 Can be used for UART with RTS/CTS 15 - Not connected 16 - Not connected 17 FEM_RX_TX 22 PA13; MUX=F; FECTRL3 (LED red) 18 ANT_DIV_P 21 PA12; MUX=F; FECTRL2 (LED green) 19 GPIO/USB_DM 33 PA24 for USB MUX=G 20 GPIO/USB_DP 34 PA25 for USB MUX=G 21 - 22 RXD0 24 SERCOM2; MUX=C; PAD[3]; RXPO=0x3 23 TXD0 23 SERCOM2; MUX=C; PAD[2]; TXPO=0x1 Not connected Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 9 Module Pin Function MCU Pin Port Configuration 24 AREF 9 MUX=B; disable digital 25 ADC0 10 MUX=B; AIN[1]; disable digital Can be used for UART with RTS/CTS 26 ADC1 11 MUX=B; AIN[2]¸ disable digital Can be used for UART with RTS/CTS 27 - Not connected 28 - Not connected 29 GND 30 SWCLK 45 Programming interface 31 SWDIO 46 Programming interface 32 - 33 ATECC508 GPIO 34 - Not connected 35 - Not connected 36 I2C SCL 32 SERCOM3 PAD1 MUX=C 37 I2C SDA 31 SERCOM3 PAD0 MUX=C 38 - Not connected 39 - Not connected 40 - Not connected 41 GND 42 GND Not connected Crypto IC GPIO with intrusion detection feature Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 10 4. Electrical Characteristics This section will outline the main parameters required to build applications. The module characteristics are determined by the implemented parts. See References on page 19 for required datasheet references. 4.1. Absolute Maximum Ratings Table 4-1 Absolute Maximum Ratings Symbol Parameter Min. Typ. Max. Unit TSTOR Storage temperature -40 +125 VPIN Pin voltage with respect to GND and VDD GND-0.3V VDD+0.3V V VESD ESD robustness PRF 4.2. Condition Modules I/O's routed to SAM R21 Human Body Model °C 4 kV Charged 550 Device Model V Input RF level +10 dBm Recommended Operating Ratings Table 4-2 Recommended Operating Ratings 4.3. Symbol Parameter Condition TOP Operating temperature range VDD Supply voltage Min. Typ. Max. Unit -40 85 °C 1.8 3.6 V Module Performance Data If not otherwise stated the measurements are done with VDD=3.3V at 25°C. Table 4-3 Module Performance Data Symbol Parameter Condition Min. Typ. Max. Unit IDD Supply current MCU at TBD MHz(1) 4 With transceiver in RX_ON state 10 With transceiver in TX state 10 PRF RF transmit power U.Fl interface Pemit Radiated transmit power Using antenna ANT-24G-S21-P5FL(2) Using antenna 2 M07-FL(3) mA 3.5 3.5 dBm 8 8 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 dBm EIRP 11 Symbol Parameter Condition Min. Typ. Max. Unit PSPUR_TX Transmitter spurious emissions U.Fl connector, conducted, >2.5GHz PSENS Receiver sensitivity U.Fl interface -98 dBm dod Outdoor range Using antenna ANT-24G-S21-P5FL TBD m ANT-24G-S21-P5FL in Ch26(2) TBD Using antenna M07-FL TBD M07-FL in Ch26(3) TBD fRef_0 -50 Reference crystal deviation T = 25°C default XTAL_TRIM setting T = 25°C NV memory XTAL_TRIM setting -5 +5 fRef_T Reference crystal drift over temperature -40°C <TOP< +85°C +15 f32k_0 Watch crystal deviation T = 25°C default XTAL_TRIM setting TBD T = 25°C NV memory XTAL_TRIM setting TBD -40°C <TOP< +85°C TBD f32lk_T Watch crystal drift over temperature -5 +20 -15 dBm ppm ppm ppm ppm Note: 1. Transceiver state TRX_OFF, FLASH deselect. 2. For FCC band edge compliance it is required to operate Ch26 with not more than power level 13. 3. For FCC band edge compliance it is required to operate Ch26 with not more than power level 14 Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 12 5. Non-Volatile Memory Information The SAM R21 provides a user readable Non-Volatile Memory (NVM) space referred to as the user row in the data sheet. The base address for the application is 0x804008. Table 5-1 NVM (User Row) Data Offset Address Field Name Field Description Length +0x00 MIB_REVISION Data structure revision 0x1501 2 Bytes +0x02 MAC_IEEE_ADDRESS Module specific IEEE MAC Address 8 Bytes +0x0A BOARD_SERIAL Module specific serial number 10 Bytes +0x14 ATMEL_PART_NO Product specific part number 8 Bytes +0x1C PCBA_REV Product PCB/assembly revision 1 Byte +0x1D XTAL_TRIM Reference crystal calibration value 1 Byte +0x1E CRC16 Checksum for this data structure 2 Bytes The end user application software has to copy two data fields to radio transceiver registers. The data in MAC_IEEE_ADDRESS have to be copied to the registers IEEE_ADDR_0 to _7. The MAC_IEEE_ADDRESS is stored little endian with the first byte stored at the lowest address. The XTAL_TRIM value has been determined during production test and needs to be copied to the transceiver XTAL_TRIM section inside the XOSC_CTRL register. This will reduce the absolute deviation for the 16MHz reference crystal. See Module Performance Data on page 11 for parameter details. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 13 6. Radio Certification The module ATSAMR21G18-MR210UA in combination with the approved antennas listed in Approved Antennas on page 16 have received regulatory approvals for modular devices in the United States and European countries. 6.1. United States (FCC) The module ATSAMR21G18-MR210UA complies with the requirements of FCC part 15. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations: • • The modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following. Any similar wording that expresses the same meaning may be used. Sample Label for integration of ATSAMR21G18-MR210UA: Contains FCC-ID: VNR-ATSAMR210UA-0 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization. Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21). To be compliant with FCC part 15 the transmit power setting (register 0x05, PHY_TX_PWR) for channel 26 must not exceed the values in Table 6-1 Approved Antennas on page 16. The module application software must ensure this settings for operation within the FCC territory. 6.2. Europe (ETSI) The module ATSAMR21G18-MR210UA is conform for use in European Union countries. If the ATSAMR21G18-MR210UA module is incorporated into a product, the manufacturer must ensure the compliance of the final product to the European harmonized EMC and low-voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 14 The manufacturer must maintain a copy of the ATSAMR21G18-MR210UA module documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. The CE marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form: • • • If the CE marking is reduced or enlarged, the proportions must be respected. The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. More detailed information about CE marking requirements can be found at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12. For the operation in Europe, there is no power setting limit. 6.3. Industry Canada (IC) Compliance Statements This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the device and the user or bystanders. Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le dispositif et l'utilisateur ou des tiers. CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This Module is labeled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. In that case, the final end product must be labelled in a visible area with the following: “Contains Transmitter Module IC: 20266-ATSAMR210UA0” OR “Contains IC: 20266-ATSAMR210UA0” Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence cijoint. Dans ce cas, le produit final doit être étiqueté dans un endroit visible par le texte suivant: “Contains Transmitter Module IC: 20266-ATSAMR210UA0” Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 15 OR “Contains IC: 20266-ATSAMR210UA0” 6.4. Approved Antennas The device has been tested and approved for use with the antenna type listed below. The device may be integrated with other custom design antennas which OEM installer must authorize with respective regulatory agencies. The used antenna is to be connected to the Radio PCB via U.Fl connection. Table 6-1 Approved Antennas Manufacturer Part Number RF Solutions Description Gain FCC Max. Ch26 Power Register Settings ANT-24G-S21-P5FL 21mm quarter wave monopole with 0dBi 13..15 U.Fl pigtail TekfunCo.,LTD M07-FL 170mm quarter wave monopole with U.Fl pigtail 5dBi 14..15 The above table shows the allowed power settings for Channel 26 if the equipment is operated under FCC conditions. According to KDB 178919 [Policy] it is allowed to substitute approved antennas through equivalent antennas of the same type with equal or less antenna gain: ‘Equivalent antennas must be of the same type (e.g., yagi, dish, etc.), must be of equal or less gain than an antenna previously authorized under the same FCC ID, and must have similar in band and out-of-band characteristics (consult specification sheet for cutoff frequencies).’ Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 16 7. Boot Loader The module will be delivered with a pre flashed boot loader. Refer to the boot loader manual for detailed information. It is online available under the Application Note code AVR2054. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 17 8. Ordering Information Module Type ATSAMR21G18MR210UA Packaging(1) Ordering Code Tape & Reel ATSAMR21G18MR210UA-T Package Operational Range 19mm x 20mm SMT Industrial (-40oC to 85°C) Note: 1. MOQ is a reel with 200 modules. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 18 9. References 1. 2. 3. 4. ADESTO. (n.d.). Adesto Technologies. Retrieved from AT45DB041E Datasheet: http:// www.adestotech.com ATECC508. (n.d.). www.atmel.com. Retrieved from ECC-based Devices: http://www.atmel.com/ products/security-ics/cryptoauthentication/ecc-256.aspx Policy, P. C. (n.d.). 178919 D01 Permissive Change Policy. Retrieved from FCC OET: https:// apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?id=33013&switch=P SAM R21. (n.d.). www.atmel.com. Retrieved from http://www.atmel.com/Images/Atmel-42223-SAMR21_Datasheet.pdf Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 19 10. Revision History Doc Rev. Date 42475B 09/2015 42475A 07/2015 Description • • Updated United States (FCC) on page 14. Added Industry Canada (IC) Compliance Statements on page 15 Initial document release. Atmel ATSAMR21G18-MR210UA [DATASHEET] Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 20 Atmel Corporation © 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com 2015 Atmel Corporation. / Rev.: Atmel-42475B-ATSAMR21G18-MR210UA_Datasheet_Preliminary-09/2015 ® ® Atmel , Atmel logo and combinations thereof, Enabling Unlimited Possibilities , and others are registered trademarks or trademarks of Atmel Corporation in U.S. and ® ® other countries. ARM , ARM Connected logo, and others are the registered trademarks or trademarks of ARM Ltd. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. 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