ATxmega64D3 Automotive 8/16-bit Atmel AVR XMEGA D3 Microcontroller DATASHEET Features ● High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller ● Nonvolatile program and data memories ● ● ● ● 64Kbytes of in-system self-programmable flash 4Kbytes boot section 2Kbytes EEPROM 4Kbytes internal SRAM ● Peripheral features ● Four-channel event system ● Five 16-bit timer/counters ● Four timer/counters with four output compare or input capture channels ● One timer/counter with two output compare or input capture channels ● High resolution extension on two timer/counters ● Advanced waveform extension (AWeX) on one timer/counter ● Three USARTs with IrDA support for one USART ● Two two-wire interfaces with dual address match (I2C and SMBus compatible) ● Two serial peripheral interfaces (SPIs) ● CRC-16 (CRC-CCITT) and CRC-32 (IEEE®802.3) generator ● 16-bit real time counter (RTC) with separate oscillator ● One sixteen-channel, 12-bit, 300ksps Analog to Digital Converter ● Two Analog Comparators with window compare function, and current sources ● External interrupts on all general purpose I/O pins ● Programmable watchdog timer with separate on-chip ultra low power oscillator ● Atmel QTouch® library support ● Capacitive touch buttons, sliders and wheels ● Special microcontroller features ● ● ● ● ● Power-on reset and programmable brown-out detection Internal and external clock options with PLL and prescaler Programmable multilevel interrupt controller Five sleep modes Programming and debug interface ● PDI (program and debug interface) ● I/O and packages ● 50 programmable I/O pins ● 64-lead TQFP 9322A-AVR-03/14 ● Operating voltage ● 2.7 – 3.6V ● Operating frequency ● 0 – 32MHz Typical applications ● Capacitive touch sensing for buttons, sliders and wheels in ● ● ● ● centre stacks overhead modules dome modules general switch panels ● Automotive led control ● Low power key fob controller ● Motor control ● Sensor control 2 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Pinout/Block Diagram Figure 1-1. Block Diagram and Pinout PR0 _RESET/PDI PDI PF7 PF6 VCC GND PF5 PF4 PF3 57 56 55 54 53 52 51 50 49 GND 60 58 AVCC 61 PR1 PA0 62 59 PA1 63 External clock/Crystal pins General Purpose I/O PA2 Programming, debug, test Ground Digital function Analog function/Oscillators 64 Power Port R 1 PA4 2 PA5 3 PA6 4 PA7 5 XOSC DATA BUS OSC/CLK Control Internal oscillators Watchdog oscillator Power Supervision Sleep Controller Real Time Counter Watchdog Timer Reset Controller Event System Controller CRC OCD Prog/Debug Interface AREF Port A PA3 ADC 48 PF2 47 PF1 46 PF0 45 VCC 44 GND 43 PE7 42 PE6 41 PE5 40 PE4 39 PE3 38 PE2 37 PE1 36 PE0 35 VCC 34 GND 33 PD7 AC0:1 Note: 1. TC0 TOSC TWI USART0 TC0 SPI 29 30 31 32 PD4 PD5 PD6 28 PD2 Port F PD3 27 PD1 26 Port E PD0 25 Port D VCC Port C USART0 TC0 16 24 PC0 GND 15 SPI VCC TWI 14 23 GND EVENT ROUTING NETWORK PC7 13 USART0 PB7 DATA BUS 22 12 EEPROM PC6 PB6 FLASH TC0:1 11 SRAM 21 PB5 CPU PC5 10 IRCOM PB4 Internal references 20 9 PC4 PB3 AREF 19 8 BUS matrix PC3 PB2 Interrupt Controller 18 7 PC2 PB1 Port B 6 17 PB0 PC1 1. For full details on pinout and alternate pin functions refer to Section 27. “Pinout and Pin Functions” on page 45. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 3 2. Overview The Atmel AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit microcontrollers based on the AVR enhanced RISC architecture. By executing instructions in a single clock cycle, the AVR XMEGA devices achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz, allowing the system designer to optimize power consumption versus processing speed. The AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the arithmetic logic unit (ALU), allowing two independent registers to be accessed in a single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughput many times faster than conventional single-accumulator or CISC based microcontrollers. The XMEGA D3 devices provide the following features: in-system programmable flash with read-while-write capabilities; internal EEPROM and SRAM; four-channel event system and programmable multilevel interrupt controller, 50 general purpose I/O lines, 16-bit real-time counter (RTC); five, 16-bit timer/counters with compare and PWM channels; three USARTs; two two-wire serial interfaces (TWIs); two serial peripheral interfaces (SPIs); one sixteen-channel, 12-bit ADC with programmable gain; two analog comparators (ACs) with window mode; programmable watchdog timer with separate internal oscillator; accurate internal oscillators with PLL and prescaler; and programmable brown-out detection. The program and debug interface (PDI), a fast, two-pin interface for programming and debugging, is available. The ATxmega64D3 devices have five software selectable power saving modes. The idle mode stops the CPU while allowing the SRAM, event system, interrupt controller, and all peripherals to continue functioning. The power-down mode saves the SRAM and register contents, but stops the oscillators, disabling all other functions until the next TWI, or pin-change interrupt, or reset. In power-save mode, the asynchronous real-time counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In standby mode, the external crystal oscillator keeps running while the rest of the device is sleeping. This allows very fast start-up from the external crystal, combined with low power consumption. In extended standby mode, both the main oscillator and the asynchronous timer continue to run. To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in active mode and idle sleep mode. Atmel offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels functionality into AVR microcontrollers. The devices are manufactured using Atmel high-density, nonvolatile memory technology. The program flash memory can be reprogrammed in-system through the PDI. A boot loader running in the device can use any interface to download the application program to the flash memory. The boot loader software in the boot flash section will continue to run while the application flash section is updated, providing true read-while-write operation. By combining an 8/16-bit RISC CPU with insystem, self-programmable flash, the AVR XMEGA is a powerful microcontroller family that provides a highly flexible and cost effective solution for many embedded applications. All AVR XMEGA devices are supported with a full suite of program and system development tools, including: C compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits. 4 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Block Diagram Figure 2-1. XMEGA D3 Block Diagram PR[0..1] Power Ground Digital function Analog function/Oscillators XTAL1 Programming debug External clock/Crystal pins General Purpose I/O XTAL2 Oscillator Circuits/ Clock Generation PORT R (2) Real Time Counter Watchdog Oscillator DATA BUS Watchdog Timer ACA Event System Controller PA[0..7] Oscillator Control Sleep Controller Power Supervision POR/BOD & Reset PORT A (8) ADCA SRAM BUS Matrix VCC GND AREFA Interrupt Controller VCC/10 Prog/Debug Controller RESET/ PDI_CLK PDI PDI_DATA Int. Refs CPU OCD NVM Controller PORT B (8) Flash TCF0 EEPROM PF[0..7] DATA BUS PORT D (8) TWIE TCE0 USARTE0 SPID TCD0 USARTD0 SPIC PORT C (8) TWIC TCC0:1 EVENT ROUTING NETWORK USARTC0 PB[0..7] PORT F (8) CRC AREFB IRCOM 2.1 To Clock Generator PORT E (8) TOSC1 TOSC2 PC[0..7] PD[0..7] PE[0..7] ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 5 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on www.atmel.com/avr. 3.1 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 105°C. 3.2 Automotive Quality Grade The Atmel® ATxmega64D3 have been developed and manufactured according to the most stringent requirements of the international standard ISO-TS-16949. This data sheet contains limit values extracted from the results of extensive characterization (Temperature and Voltage). The quality and reliability of the Atmel ATxmega64D3 has been verified during regular product qualification as per AECQ100 grade 2 (–40°C to +105°C). 3.3 Recommended Reading ● ● Atmel AVR XMEGA D manual XMEGA application notes This device data sheet only contains part specific information with a short description of each peripheral and module. The XMEGA D manual describes the modules and peripherals in depth. The XMEGA application notes contain example code and show applied use of the modules and peripherals. All documentation are available from www.atmel.com/avr. 4. Capacitive Touch Sensing The Atmel QTouch library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The QTouch library includes support for the QTouch and Atmel QMatrix acquisition methods. Touch sensing can be added to any application by linking the appropriate Atmel QTouch library for the AVR microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to retrieve the channel information and determine the touch sensor states. The QTouch library is FREE and downloadable from the Atmel website at the following location: http://www.atmel.com/tools/qtouchlibrary.aspx. For implementation details and other information, refer to the QTouch library user guide - also available for download from the Atmel website. 6 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 5. AVR CPU 5.1 Features ● ● ● ● ● ● ● 5.2 8/16-bit, high-performance Atmel AVR RISC CPU ● 137 instructions ● Hardware multiplier 32x8-bit registers directly connected to the ALU Stack in RAM Stack pointer accessible in I/O memory space True 16/24-bit access to 16/24-bit I/O registers Efficient support for 8-, 16- and 32-bit arithmetic Configuration change protection of system-critical features Overview All Atmel AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to execute the code and perform all calculations. The CPU is able to access memories, perform calculations, control peripherals, and execute the program in the flash memory. Interrupt handling is described in a separate section, refer to Section 12. “Interrupts and Programmable Multilevel Interrupt Controller” on page 24. 5.3 Architectural Overview In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture with separate memories and buses for program and data. Instructions in the program memory are executed with single-level pipelining. While one instruction is being executed, the next instruction is pre-fetched from the program memory. This enables instructions to be executed on every clock cycle. For details of all AVR instructions, refer to www.atmel.com/avr. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 7 Figure 5-1. Block Diagram of the AVR CPU Architecture Register File R31 (ZH) R29 (YH) R27 (XH) R25 R23 R21 R19 R17 R15 R13 R11 R9 R7 R5 R3 R1 R30 (ZL) R28 (YL) R26 (XL) R24 R22 R20 R18 R16 R14 R12 R10 R8 R6 R4 R2 R0 Program Counter Flash Program Memory Instruction Register Instruction Decode Data Memory Stack Pointer Stack Pointer ALU The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single-register operations can also be executed in the ALU. After an arithmetic operation, the status register is updated to reflect information about the result of the operation. The ALU is directly connected to the fast-access register file. The 32 8-bit general purpose working registers all have single clock cycle access time allowing single-cycle arithmetic logic unit (ALU) operation between registers or between a register and an immediate. Six of the 32 registers can be used as three 16-bit address pointers for program and data space addressing, enabling efficient address calculations. The memory spaces are linear. The data memory space and the program memory space are two different memory spaces. The data memory space is divided into I/O registers, and SRAM. In addition, the EEPROM can be memory mapped in the data memory. All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This is referred to as the I/O memory space. The lowest 64 addresses can be accessed directly, or as the data space locations from 0x00 to 0x3F. The rest is the extended I/O memory space, ranging from 0x0040 to 0x0FFF. I/O registers here must be accessed as data space locations using load (LD/LDS/LDD) and store (ST/STS/STD) instructions. The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed through the five different addressing modes supported in the AVR architecture. The first SRAM address is 0x2000. Data addresses 0x1000 to 0x1FFF are reserved for memory mapping of EEPROM. 8 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 The program memory is divided in two sections, the application program section and the boot program section. Both sections have dedicated lock bits for write and read/write protection. The SPM instruction that is used for self-programming of the application flash memory must reside in the boot program section. The application section contains an application table section with separate lock bits for write and read/write protection. The application table section can be used for safe storing of nonvolatile data in the program memory. 5.4 ALU - Arithmetic Logic Unit The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a register. Single-register operations can also be executed. The ALU operates in direct connection with all 32 general purpose registers. In a single clock cycle, arithmetic operations between general purpose registers or between a register and an immediate are executed and the result is stored in the register file. After an arithmetic or logic operation, the status register is updated to reflect information about the result of the operation. ALU operations are divided into three main categories – arithmetic, logical, and bit functions. Both 8- and 16-bit arithmetic is supported, and the instruction set allows for efficient implementation of 32-bit aritmetic. The hardware multiplier supports signed and unsigned multiplication and fractional format. 5.4.1 Hardware Multiplier The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware multiplier supports different variations of signed and unsigned integer and fractional numbers: ● Multiplication of unsigned integers ● ● ● ● ● Multiplication of signed integers Multiplication of a signed integer with an unsigned integer Multiplication of unsigned fractional numbers Multiplication of signed fractional numbers Multiplication of a signed fractional number with an unsigned one A multiplication takes two CPU clock cycles. 5.5 Program Flow After reset, the CPU starts to execute instructions from the lowest address in the flash program memory ‘0.’ The program counter (PC) addresses the next instruction to be fetched. Program flow is provided by conditional and unconditional jump and call instructions capable of addressing the whole address space directly. Most AVR instructions use a 16-bit word format, while a limited number use a 32-bit format. During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is allocated in the general data SRAM, and consequently the stack size is only limited by the total SRAM size and the usage of the SRAM. After reset, the stack pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed through the five different addressing modes supported in the AVR CPU. 5.6 Status Register The status register (SREG) contains information about the result of the most recently executed arithmetic or logic instruction. This information can be used for altering program flow in order to perform conditional operations. Note that the status register is updated after all ALU operations, as specified in the instruction set reference. This will in many cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code. The status register is not automatically stored when entering an interrupt routine nor restored when returning from an interrupt. This must be handled by software. The status register is accessible in the I/O memory space. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 9 5.7 Stack and Stack Pointer The stack is used for storing return addresses after interrupts and subroutine calls. It can also be used for storing temporary data. The Stack Pointer (SP) register always points to the top of the stack. It is implemented as two 8-bit registers that are accessible in the I/O memory space. Data are pushed and popped from the stack using the PUSH and POP instructions. The stack grows from a higher memory location to a lower memory location. This implies that pushing data onto the stack decreases the SP, and popping data off the stack increases the SP. The SP is automatically loaded after reset, and the initial value is the highest address of the internal SRAM. If the SP is changed, it must be set to point above address 0x2000, and it must be defined before any subroutine calls are executed or before interrupts are enabled. During interrupts or subroutine calls, the return address is automatically pushed on the stack. The return address can be two or three bytes, depending on program memory size of the device. For devices with 128KB or less of program memory, the return address is two bytes, and hence the stack pointer is decremented/incremented by two. For devices with more than 128KB of program memory, the return address is three bytes, and hence the SP is decremented/incremented by three. The return address is popped off the stack when returning from interrupts using the RETI instruction, and from subroutine calls using the RET instruction. The SP is decremented by one when data are pushed on the stack with the PUSH instruction, and incremented by one when data is popped off the stack using the POP instruction. To prevent corruption when updating the stack pointer from software, a write to SPL will automatically disable interrupts for up to four instructions or until the next I/O memory write. After reset the stack pointer is initialized to the highest address of the SRAM. See Table 6-3 on page 13. 5.8 Register file The register file consists of 32 8-bit general purpose working registers with single clock cycle access time. The register file supports the following input/output schemes: ● One 8-bit output operand and one 8-bit result input ● ● ● Two 8-bit output operands and one 8-bit result input Two 8-bit output operands and one 16-bit result input One 16-bit output operand and one 16-bit result input Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing, enabling efficient address calculations. One of these address pointers can also be used as an address pointer for lookup tables in flash program memory. 10 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 6. Memories 6.1 Features ● ● Flash program memory ● One linear address space ● In-system programmable ● Self-programming and boot loader support ● Application section for application code ● Application table section for application code or data storage ● Boot section for application code or boot loader code ● Separate read/write protection lock bits for all sections ● Built in fast CRC check of a selectable flash program memory section Data memory ● One linear address space ● Single-cycle access from CPU ● SRAM ● EEPROM ● ● ● 6.2 ● Byte and page accessible ● Optional memory mapping for direct load and store I/O memory ● Configuration and status registers for all peripherals and modules ● Four bit-accessible general purpose registers for global variables or flags Production signature row memory for factory programmed data ● ID for each microcontroller device type ● Serial number for each device ● Calibration bytes for factory calibrated peripherals User signature row ● One flash page in size ● Can be read and written from software ● Content is kept after chip erase Overview The Atmel AVR architecture has two main memory spaces, the program memory and the data memory. Executable code can reside only in the program memory, while data can be stored in the program memory and the data memory. The data memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear and require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write operations. This prevents unrestricted access to the application software. A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can only be written by an external programmer. The available memory size configurations are shown in Section 33. “Ordering Information” on page 83. In addition, each device has a Flash memory signature row for calibration data, device identification, serial number etc. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 11 6.3 Flash Program Memory The Atmel AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The flash memory can be accessed for read and write from an external programmer through the PDI or from application software running in the device. All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The flash memory is organized in two main sections, the application section and the boot loader section. The sizes of the different sections are fixed, but device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store program memory (SPM) instruction, which is used to write to the flash from the application software, will only operate when executed from the boot loader section. The application section contains an application table section with separate lock settings. This enables safe storage of nonvolatile data in the program memory. Table 6-1. Flash Program Memory (Hexadecimal Address) Word address ATxmega Application section (64K) 64D3 0 ... 77FF Application table section (4K) Boot section (4K) 6.3.1 7800 7FFF 8000 87FF Application Section The Application section is the section of the flash that is used for storing the executable application code. The protection level for the application section can be selected by the boot lock bits for this section. The application section can not store any boot loader code since the SPM instruction cannot be executed from the application section. 6.3.2 Application Table Section The application table section is a part of the application section of the flash memory that can be used for storing data. The size is identical to the boot loader section. The protection level for the application table section can be selected by the boot lock bits for this section. The possibilities for different protection levels on the application section and the application table section enable safe parameter storage in the program memory. If this section is not used for data, application code can reside here. 6.3.3 Boot Loader Section While the application section is used for storing the application code, the boot loader software must be located in the boot loader section because the SPM instruction can only initiate programming when executing from this section. The SPM instruction can access the entire flash, including the boot loader section itself. The protection level for the boot loader section can be selected by the boot loader lock bits. If this section is not used for boot loader software, application code can be stored here. 6.3.4 Production Signature Row The production signature row is a separate memory section for factory programmed data. It contains calibration data for functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the corresponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to the corresponding peripheral registers from software. For details on calibration conditions, refer to Section 30. “Electrical Characteristics” on page 55. The production signature row also contains an ID that identifies each microcontroller device type and a serial number for each manufactured device. The serial number consists of the production lot number, wafer number, and wafer coordinates for the device. The device ID for the available devices is shown in Table 6-2. 12 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 The production signature row cannot be written or erased, but it can be read from application software and external programmers. Table 6-2. Device ID Bytes Device Device ID bytes Byte 2 Byte 1 Byte 0 4A 96 1E ATxmega64D3 6.3.5 User Signature Row The user signature row is a separate memory section that is fully accessible (read and write) from application software and external programmers. It is one flash page in size, and is meant for static user parameter storage, such as calibration data, custom serial number, identification numbers, random number seeds, etc. This section is not erased by chip erase commands that erase the flash, and requires a dedicated erase command. This ensures parameter storage during multiple program/erase operations and on-chip debug sessions. 6.4 Fuses and Lock Bits The fuses are used to configure important system functions, and can only be written from an external programmer. The application software can read the fuses. The fuses are used to configure reset sources such as brownout detector, watchdog, and start-up configuration. The lock bits are used to set protection levels for the different flash sections (that is, if read and/or write access should be blocked). Lock bits can be written by external programmers and application software, but only to stricter protection levels. Chip erase is the only way to erase the lock bits. To ensure that flash contents are protected even during chip erase, the lock bits are erased after the rest of the flash memory has been erased. An unprogrammed fuse or lock bit will have the value one, while a programmed fuse or lock bit will have the value zero. Both fuses and lock bits are reprogrammable like the flash program memory. 6.5 Data Memory The data memory contains the I/O memory, internal SRAM, optionally memory mapped EEPROM, and external memory if available. The data memory is organized as one continuous memory section, see Figure 6-3 on page 13. To simplify development, I/O Memory, EEPROM and SRAM will always have the same start addresses for all Atmel AVR XMEGA devices. Table 6-3. Data Memory Map (Hexadecimal Address) Byte Address 0 FFF 1000 17FF ATxmega64D3 I/O registers (4K) EEPROM (2K) RESERVED 2000 2FFF 6.6 Internal SRAM (4K) EEPROM All devices have EEPROM for nonvolatile data storage. It is either addressable in a separate data space (default) or memory mapped and accessed in normal data space. The EEPROM supports both byte and page access. Memory mapped EEPROM allows highly efficient EEPROM reading and EEPROM buffer loading. When doing this, EEPROM is accessible using load and store instructions. Memory mapped EEPROM will always start at hexadecimal address 0x1000. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 13 6.7 I/O Memory The status and configuration registers for peripherals and modules, including the CPU, are addressable through I/O memory locations. All I/O locations can be accessed by the load (LD/LDS/LDD) and store (ST/STS/STD) instructions, which are used to transfer data between the 32 registers in the register file and the I/O memory. The IN and OUT instructions can address I/O memory locations in the range of 0x00 to 0x3F directly. In the address range 0x00 - 0x1F, single-cycle instructions for manipulation and checking of individual bits are available. The I/O memory address for all peripherals and modules is shown in the Section 28. “Peripheral Module Address Map” on page 49. 6.7.1 General Purpose I/O Registers The lowest 16 I/O memory addresses are reserved as general purpose I/O registers. These registers can be used for storing global variables and flags, as they are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions. 6.8 Memory Timing Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes one cycle, and a read from SRAM takes two cycles. EEPROM page load (write) takes one cycle, and three cycles are required for read. For burst read, new data are available every second cycle. Refer to the instruction summary for more details on instructions and instruction timing. 6.9 Device ID and Revision Each device has a three-byte device ID. This ID identifies Atmel as the manufacturer of the device and the device type. A separate register contains the revision number of the device. 6.10 I/O memory Protection Some features in the device are regarded as critical for safety in some applications. Due to this, it is possible to lock the I/O register related to the clock system, the event system, and the advanced waveform extensions. As long as the lock is enabled, all related I/O registers are locked and they can not be written from the application software. The lock registers themselves are protected by the configuration change protection mechanism. 6.11 Flash and EEPROM Page Size The flash program memory and EEPROM data memory are organized in pages. The pages are word accessible for the flash and byte accessible for the EEPROM. Table 6-4 shows the Flash Program Memory organization and Program Counter (PC) size. Flash write and erase operations are performed on one page at a time, while reading the Flash is done one byte at a time. For Flash access the Z-pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) give the page number and the least significant address bits (FWORD) give the word in the page. Table 6-4. Number of Words and Pages in the Flash TBD Devices PC Size ATxmega64D3 Flash Size Page Size [bits] [bytes] [words] 16 64K + 4K 128 FWORD Z[7:1] FPAGE Z[16:8] Application Boot Size No. of pages Size No. of pages 64K 256 4K 16 Table 6-5 shows EEPROM memory organization. EEEPROM write and erase operations can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a time. For EEPROM access the NVM address register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page. Table 6-5. Number of Bytes and Pages in the EEPROM Devices EEPROM Size Page Size [bytes] [bytes] 2048 32 ATxmega64D3 14 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 E2BYTE E2PAGE No. of Pages ADDR[4:0] ADDR[10:5] 64 7. Event System 7.1 Features ● ● ● ● ● ● 7.2 System for direct peripheral-to-peripheral communication and signaling Peripherals can directly send, receive, and react to peripheral events ● CPU independent operation ● 100% predictable signal timing ● Short and guaranteed response time Four event channels for up to four different and parallel signal routing configurations Events can be sent and/or used by most peripherals, clock system, and software Additional functions include ● Quadrature decoders ● Digital filtering of I/O pin state Works in active mode and idle sleep mode Overview The event system enables direct peripheral-to-peripheral communication and signaling. It allows a change in one peripheral’s state to automatically trigger actions in other peripherals. It is designed to provide a system for short and predictable response times between peripherals. It allows for autonomous peripheral control and interaction without the use of interrupts or CPU resources, and is thus a powerful tool for reducing the complexity, size and execution time of application code. It also allows for synchronized timing of actions in several peripheral modules. A change in a peripheral’s state is referred to as an event, and usually corresponds to the peripheral’s interrupt conditions. Events can be directly passed to other peripherals using a dedicated routing network called the event routing network. How events are routed and used by the peripherals is configured in software. Figure 7-1 shows a basic diagram of all connected peripherals. The event system can directly connect together analog to digital converter, analog comparators, I/O port pins, the real-time counter, timer/counters, and IR communication module (IRCOM). Events can also be generated from software and the peripheral clock. Figure 7-1. Event System Overview and Connected Peripherals CPU/ Software Event Routing Network clkPER Prescaler ADC Event System Controller Real Time Counter AC Timer/ Counters Port pins IRCOM The event routing network consists of four software-configurable multiplexers that control how events are routed and used. These are called event channels, and allow for up to four parallel event routing configurations. The maximum routing latency is two peripheral clock cycles. The event system works in both active mode and idle sleep mode. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 15 8. System Clock and Clock Options 8.1 Features ● ● ● ● ● ● ● ● ● 8.2 Fast start-up time Safe run-time clock switching Internal oscillators: ● 32MHz run-time calibrated and tuneable oscillator ● 2MHz run-time calibrated oscillator ● 32.768kHz calibrated oscillator ● 32kHz ultra low power (ULP) oscillator with 1kHz output External clock options ● 0.4MHz - 16MHz crystal oscillator ● 32.768kHz crystal oscillator ● External clock PLL with 20MHz - 128MHz output frequency ● Internal and external clock options and 1× to 31× multiplication ● Lock detector Clock prescalers with 1× to 2048× division Fast peripheral clocks running at two and four times the CPU clock Automatic run-time calibration of internal oscillators External oscillator and PLL lock failure detection with optional non-maskable interrupt Overview Atmel AVR XMEGA D3 devices have a flexible clock system supporting a large number of clock sources. It incorporates both accurate internal oscillators and external crystal oscillator and resonator support. A high-frequency phase locked loop (PLL) and clock prescalers can be used to generate a wide range of clock frequencies. A calibration feature (DFLL) is available, and can be used for automatic run-time calibration of the internal oscillators to remove frequency drift over voltage and temperature. An oscillator failure monitor can be enabled to issue a non-maskable interrupt and switch to the internal oscillator if the external oscillator or PLL fails. When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled. After reset, the device will always start up running from the 2MHz internal oscillator. During normal operation, the system clock source and prescalers can be changed from software at any time. Figure 8-1 on page 17 presents the principal clock system. Not all of the clocks need to be active at a given time. The clocks for the CPU and peripherals can be stopped using sleep modes and power reduction registers, as described in Section 9. “Power Management and Sleep Modes” on page 19. 16 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Figure 8-1. The Clock System, Clock Sources and Clock Distribution Real Time Counter Peripherals RAM AVR CPU clkPER Non-Volatile Memory clkCPU clkPER2 clkPER4 System Clock Prescalers Watchdog Timer clkSYS clkRTC System Clock Multiplexer (SCLKSEL) PLL DIV32 DIV32 RTCSRC DIV32 PLLSRC 0.4 - 16MHz XTAL 32MHz Int. OSC 2MHz Int. OSC XTAL2 32.768kHz TOSC XTAL1 32.768kHz Int. OSC TOSC2 32kHz Int. ULP DIV4 XOSCSEL TOSC1 Brown-out Detector ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 17 8.3 Clock Sources The clock sources are divided in two main groups: internal oscillators and external clock sources. Most of the clock sources can be directly enabled and disabled from software, while others are automatically enabled or disabled, depending on peripheral settings. After reset, the device starts up running from the 2MHz internal oscillator. The other clock sources, DFLLs and PLL, are turned off by default. The internal oscillators do not require any external components to run. For details on characteristics and accuracy of the internal oscillators, refer to the device datasheet. 8.3.1 32kHz Ultra Low Power Internal Oscillator This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal oscillator is a very low power clock source, and it is not designed for high accuracy. The oscillator employs a built-in prescaler that provides a 1kHz output. The oscillator is automatically enabled/disabled when it is used as clock source for any part of the device. This oscillator can be selected as the clock source for the RTC. 8.3.2 32.768kHz Calibrated Internal Oscillator This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to provide a default frequency close to its nominal frequency. The calibration register can also be written from software for run-time calibration of the oscillator frequency. The oscillator employs a built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz output. 8.3.3 32.768kHz Crystal Oscillator A 32.768kHz crystal oscillator can be connected between the TOSC1 and TOSC2 pins and enables a dedicated low frequency oscillator input circuit. A low power mode with reduced voltage swing on TOSC2 is available. This oscillator can be used as a clock source for the system clock and RTC, and as the DFLL reference clock. Note that the possibly long oscillation start-up time of 1 to 5 seconds of the 32kHz crystal oscillator could make its usage as a system clock application restrictive. This oscillator is unsuitable for critical usage over the automotive operating range due to low safety factor. 8.3.4 0.4 - 16MHz Crystal Oscillator This oscillator can operate in four different modes optimized for different frequency ranges, all within 0.4 - 16MHz. 8.3.5 2MHz Run-time Calibrated Internal Oscillator The 2MHz run-time calibrated internal oscillator is the default system clock source after reset. It is calibrated during production to provide a default frequency close to its nominal frequency. A DFLL can be enabled for automatic run-time calibration of the oscillator to compensate for temperature and voltage drift and optimize the oscillator accuracy. 8.3.6 32MHz Run-time Calibrated Internal Oscillator The 32MHz run-time calibrated internal oscillator is a high-frequency oscillator. It is calibrated during production to provide a default frequency close to its nominal frequency. A digital frequency looked loop (DFLL) can be enabled for automatic runtime calibration of the oscillator to compensate for temperature and voltage drift and optimize the oscillator accuracy. This oscillator can also be adjusted and calibrated to any frequency between 30MHz and 55MHz. 8.3.7 External Clock Sources The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or a ceramic resonator. XTAL1 can be used as input for an external clock signal. The TOSC1 and TOSC2 pins is dedicated to driving a 32.768kHz crystal oscillator. 8.3.8 PLL with 1x-31x Multiplication Factor The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock. The PLL has a user-selectable multiplication factor of from 1 to 31. In combination with the prescalers, this gives a wide range of output frequencies from all clock sources. 18 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 9. Power Management and Sleep Modes 9.1 Features ● ● ● 9.2 Power management for adjusting power consumption and functions Five sleep modes ● Idle ● Power down ● Power save ● Standby ● Extended standby Power reduction register to disable clock and turn off unused peripherals in active and idle modes Overview Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements. This enables the Atmel AVR XMEGA microcontroller to stop unused modules to save power. All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application code. When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the device again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals and all enabled reset sources can restore the microcontroller from sleep to active mode. In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When this is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This reduces the power consumption in active mode and idle sleep modes and enables much more fine-tuned power management than sleep modes alone. 9.3 Sleep Modes Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA microcontrollers have five different sleep modes tuned to match the typical functional stages during application execution. A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to wake the device from sleep, and the available interrupt wake-up sources are dependent on the configured sleep mode. When an enabled interrupt occurs, the device will wake up and execute the interrupt service routine before continuing normal program execution from the first instruction after the SLEEP instruction. If other, higher priority interrupts are pending when the wake-up occurs, their interrupt service routines will be executed according to their priority before the interrupt service routine for the wake-up interrupt is executed. After wake-up, the CPU is halted for four cycles before execution starts. The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device will reset, start up, and execute from the reset vector. 9.3.1 Idle Mode In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed), but all peripherals, including the interrupt controller and event system are kept running. Any enabled interrupt will wake the device. 9.3.2 Power-down Mode In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only of asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the two-wire interface address match interrupt and asynchronous port interrupts. 9.3.3 Power-save Mode Power-save mode is identical to power down, with one exception. If the real-time counter (RTC) is enabled, it will keep running during sleep, and the device can also wake up from either an RTC overflow or compare match interrupt. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 19 9.3.4 Standby Mode Standby mode is identical to power down, with the exception that the enabled system clock sources are kept running while the CPU, peripheral, and RTC clocks are stopped. This reduces the wake-up time. 9.3.5 Extended Standby Mode Extended standby mode is identical to power-save mode, with the exception that the enabled system clock sources are kept running while the CPU and peripheral clocks are stopped. This reduces the wake-up time. 20 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 10. System Control and Reset 10.1 Features ● ● Reset the microcontroller and set it to initial state when a reset source goes active Multiple reset sources that cover different situations ● Power-on reset ● External reset ● Watchdog reset ● Brownout reset ● PDI reset ● Software reset ● Asynchronous operation ● Reset status register for reading the reset source from the application code ● 10.2 No running system clock in the device is required for reset Overview The reset system issues a microcontroller reset and sets the device to its initial state. This is for situations where operation should not start or continue, such as when the microcontroller operates below its power supply rating. If a reset source goes active, the device enters and is kept in reset until all reset sources have released their reset. The I/O pins are immediately tristated. The program counter is set to the reset vector location, and all I/O registers are set to their initial values. The SRAM content is kept. However, if the device accesses the SRAM when a reset occurs, the content of the accessed location can not be guaranteed. After reset is released from all reset sources, the default oscillator is started and calibrated before the device starts running from the reset vector address. By default, this is the lowest program memory address, 0, but it is possible to move the reset vector to the lowest address in the boot section. The reset functionality is asynchronous, and so no running system clock is required to reset the device. The software reset feature makes it possible to issue a controlled system reset from the user software. The reset status register has individual status flags for each reset source. It is cleared at power-on reset, and shows which sources have issued a reset since the last power-on. 10.3 Reset Sequence A reset request from any reset source will immediately reset the device and keep it in reset as long as the request is active. When all reset requests are released, the device will go through three stages before the device starts running again: ● Reset counter delay ● ● Oscillator start-up Oscillator calibration If another reset requests occurs during this process, the reset sequence will start over again. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 21 10.4 Reset Sources 10.4.1 Power-on Reset A power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when the VCC rises and reaches the POR threshold voltage (VPOT), and this will start the reset sequence. The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level. The VPOT level is higher for falling VCC than for rising VCC. Consult the datasheet for POR characteristics data. 10.4.2 Brownout Detection The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by comparing it to a fixed, programmable level that is selected by the BODLEVEL fuses. If disabled, BOD is forced on at the lowest level during chip erase and when the PDI is enabled. 10.4.3 External Reset The external reset circuit is connected to the external RESET pin. The external reset will trigger when the RESET pin is driven below the RESET pin threshold voltage, VRST, for longer than the minimum pulse period, tEXT. The reset will be held as long as the pin is kept low. The RESET pin includes an internal pull-up resistor. 10.4.4 Watchdog Reset The watchdog timer (WDT) is a system function for monitoring correct program operation. If the WDT is not reset from the software within a programmable timeout period, a watchdog reset will be given. The watchdog reset is active for one to two clock cycles of the 2MHz internal oscillator. For more details see Section 11. “WDT – Watchdog Timer” on page 23. 10.4.5 Software Reset The software reset makes it possible to issue a system reset from software by writing to the software reset bit in the reset control register.The reset will be issued within two CPU clock cycles after writing the bit. It is not possible to execute any instruction from when a software reset is requested until it is issued. 10.4.6 Program and Debug Interface Reset The program and debug interface reset contains a separate reset source that is used to reset the device during external programming and debugging. This reset source is accessible only from external debuggers and programmers. 22 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 11. WDT – Watchdog Timer 11.1 Features ● ● ● ● ● ● 11.2 Issues a device reset if the timer is not reset before its timeout period Asynchronous operation from dedicated oscillator 1kHz output of the 32kHz ultra low power oscillator 11 selectable timeout periods, from 8ms to 8s Two operation modes: ● Normal mode ● Window mode Configuration lock to prevent unwanted changes Overview The watchdog timer (WDT) is a system function for monitoring correct program operation. It makes it possible to recover from error situations such as runaway or deadlocked code. The WDT is a timer, configured to a predefined timeout period, and is constantly running when enabled. If the WDT is not reset within the timeout period, it will issue a microcontroller reset. The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application code. The window mode makes it possible to define a time slot or window inside the total timeout period during which WDT must be reset. If the WDT is reset outside this window, either too early or too late, a system reset will be issued. Compared to the normal mode, this can also catch situations where a code error causes constant WDR execution. The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a CPU-independent clock source, and will continue to operate to issue a system reset even if the main clocks fail. The configuration change protection mechanism ensures that the WDT settings cannot be changed by accident. For increased safety, a fuse for locking the WDT settings is also available. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 23 12. Interrupts and Programmable Multilevel Interrupt Controller 12.1 Features ● ● ● ● 12.2 Short and predictable interrupt response time Separate interrupt configuration and vector address for each interrupt Programmable multilevel interrupt controller ● Interrupt prioritizing according to level and vector address ● Three selectable interrupt levels for all interrupts: low, medium, and high ● Selectable, round-robin priority scheme within low-level interrupts ● Non-maskable interrupts for critical functions Interrupt vectors optionally placed in the application section or the boot loader section Overview Interrupts signal a change of state in peripherals, and this can be used to alter program execution. Peripherals can have one or more interrupts, and all are individually enabled and configured. When an interrupt is enabled and configured, it will generate an interrupt request when the interrupt condition is present. The programmable multilevel interrupt controller (PMIC) controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowledged by the PMIC, the program counter is set to point to the interrupt vector, and the interrupt handler can be executed. All peripherals can select between three different priority levels for their interrupts: low, medium, and high. Interrupts are prioritized according to their level and their interrupt vector address. Medium-level interrupts will interrupt low-level interrupt handlers. High-level interrupts will interrupt both medium- and low-level interrupt handlers. Within each level, the interrupt priority is decided from the interrupt vector address, where the lowest interrupt vector address has the highest interrupt priority. Low-level interrupts have an optional round-robin scheduling scheme to ensure that all interrupts are serviced within a certain amount of time. Non-maskable interrupts (NMI) are also supported, and can be used for system critical functions. 12.3 Interrupt Vectors The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in each peripheral. The base addresses for the Atmel AVR XMEGA D3 devices are shown in Table 12-1 on page 25. Offset addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA D manual. For peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 12-1 on page 25. The program address is the word address. 24 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Table 12-1. Reset and Interrupt Vectors Program Address (Base Address) Source 0x000 RESET 0x002 OSCF_INT_vect Crystal oscillator failure interrupt vector (NMI) 0x004 PORTC_INT_base Port C interrupt base 0x008 PORTR_INT_base Port R interrupt base 0x014 RTC_INT_base Real Time Counter Interrupt base Interrupt Description 0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base 0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base 0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base 0x030 SPIC_INT_vect SPI on port C Interrupt vector 0x032 USARTC0_INT_base USART 0 on port C Interrupt base 0x040 NVM_INT_base Non-Volatile Memory Interrupt base 0x044 PORTB_INT_base Port B Interrupt base 0x056 PORTE_INT_base Port E Interrupt base 0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base 0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base 0x074 USARTE0_INT_base USART 0 on port E Interrupt base 0x080 PORTD_INT_base Port D Interrupt base 0x084 PORTA_INT_base Port A Interrupt base 0x088 ACA_INT_base Analog Comparator on Port A Interrupt base 0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base 0x09A TCD0_INT_base Timer/Counter 0 on port D Interrupt base 0x0AE SPID_INT_vector SPI on port D Interrupt vector 0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base 0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base 0x0D0 PORTF_INT_base Port F Interrupt base 0x0D8 TCF0_INT_base Timer/Counter 0 on port F Interrupt base ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 25 13. I/O ports 13.1 Features ● ● ● ● ● ● ● ● ● ● ● 50 general purpose input and output pins with individual configuration Output driver with configurable driver and pull settings: ● Totem-pole ● Wired-AND ● Wired-OR ● Bus-keeper ● Inverted I/O Input with synchronous and/or asynchronous sensing with interrupts and events ● Sense both edges ● Sense rising edges ● Sense falling edges ● Sense low level Optional pull-up and pull-down resistor on input and Wired-OR/AND configuration Asynchronous pin change sensing that can wake the device from all sleep modes Two port interrupts with pin masking per I/O port Efficient and safe access to port pins ● Hardware read-modify-write through dedicated toggle/clear/set registers ● Configuration of multiple pins in a single operation ● Mapping of port registers into bit-accessible I/O memory space Peripheral clocks output on port pin Real-time counter clock output to port pin Event channels can be output on port pin Remapping of digital peripheral pin functions ● 13.2 Selectable USART, SPI, and timer/counter input/output pin locations Overview One port consists of up to eight port pins: pin 0 to 7. Each port pin can be configured as input or output with configurable driver and pull settings. They also implement synchronous and asynchronous input sensing with interrupts and events for selectable pin change conditions. Asynchronous pin-change sensing means that a pin change can wake the device from all sleep modes, included the modes where no clocks are running. All functions are individual and configurable per pin, but several pins can be configured in a single operation. The pins have hardware read-modify-write (RMW) functionality for safe and correct change of drive value and/or pull resistor configuration. The direction of one port pin can be changed without unintentionally changing the direction of any other pin. The port pin configuration also controls input and output selection of other device functions. It is possible to have both the peripheral clock and the real-time clock output to a port pin, and available for external use. The same applies to events from the event system that can be used to synchronize and control external functions. Other digital peripherals, such as USART, SPI, and timer/counters, can be remapped to selectable pin locations in order to optimize pin-out versus application needs. The notation of the ports are PORTA, PORTB, PORTC, PORTD, PORTE, PORTF and PORTR. 26 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 13.3 Output driver All port pins (Pn) have programmable output configuration. 13.3.1 Push-pull Figure 13-1. I/O Configuration - Totem-pole DIRn OUTn Pn INn 13.3.2 Pull-down Figure 13-2. I/O Configuration - Totem-pole with Pull-down (on Input) DIRn OUTn Pn INn 13.3.3 Pull-up Figure 13-3. I/O Configuration - Totem-pole with Pull-up (on Input) DIRn OUTn Pn INn ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 27 13.3.4 Bus-keeper The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level was ‘1’, and pull-down if the last level was ‘0’. Figure 13-4. I/O Configuration - Totem-pole with Bus-keeper DIRn OUTn Pn INn 13.3.5 Others Figure 13-5. Output Configuration - Wired-OR with Optional Pull-down OUTn Pn INn Figure 13-6. I/O Configuration - Wired-AND with Optional Pull-up INn Pn OUTn 28 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 13.4 Input Sensing Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is shown in Figure 13-7. Figure 13-7. Input Sensing System Overview Asynchronous sensing EDGE DETECT Interrupt Control IRQ Synchronous sensing Pxn Synchronizer INn D Q D Q R EDGE DETECT Synchronous Events R INVERTED I/O Asynchronous Events When a pin is configured with inverted I/O, the pin value is inverted before the input sensing. 13.5 Alternate Port Functions Most port pins have alternate pin functions in addition to being a general purpose I/O pin. When an alternate function is enabled, it might override the normal port pin function or pin value. This happens when other peripherals that require pins are enabled or configured to use pins. If and how a peripheral will override and use pins is described in the section for that peripheral. Section 27. “Pinout and Pin Functions” on page 45 shows which modules on peripherals that enable alternate functions on a pin, and which alternate functions that are available on a pin. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 29 14. TC0/1 – 16-bit Timer/Counter Type 0 and 1 14.1 Features ● ● ● ● ● ● ● ● ● ● ● Five 16-bit timer/counters ● Four timer/counters of type 0 ● One timer/counter of type 1 ● Split-mode enabling two 8-bit timer/counter from each timer/counter type 0 32-bit timer/counter support by cascading two timer/counters Up to four compare or capture (CC) channels ● Four CC channels for timer/counters of type 0 ● Two CC channels for timer/counters of type 1 Double buffered timer period setting Double buffered capture or compare channels Waveform generation: ● Frequency generation ● Single-slope pulse width modulation ● Dual-slope pulse width modulation Input capture: ● Input capture with noise cancelling ● Frequency capture ● Pulse width capture ● 32-bit input capture Timer overflow and error interrupts/events One compare match or input capture interrupt/event per CC channel Can be used with event system for: ● Quadrature decoding ● Count and direction control ● Capture High-resolution extension ● ● Advanced waveform extension: ● ● 14.2 Increases frequency and waveform resolution by 4× (2-bit) or 8× (3-bit) Low- and high-side output with programmable dead-time insertion (DTI) Event controlled fault protection for safe disabling of drivers Overview Atmel AVR XMEGA D3 devices have a set of five flexible 16-bit timer/counters (TC). Their capabilities include accurate program execution timing, frequency and waveform generation, and input capture with time and frequency measurement of digital signals. Two timer/counters can be cascaded to create a 32-bit timer/counter with optional 32-bit capture. A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The base counter can be used to count clock cycles or events. It has direction control and period setting that can be used for timing. The CC channels can be used together with the base counter to do compare match control, frequency generation, and pulse width waveform modulation, as well as various input capture operations. A timer/counter can be configured for either capture or compare functions, but cannot perform both at the same time. A timer/counter can be clocked and timed from the peripheral clock with optional prescaling or from the event system. The event system can also be used for direction control and capture trigger or to synchronize operations. There are two differences between timer/counter type 0 and type 1. Timer/counter 0 has four CC channels, and timer/counter 1 has two CC channels. All information related to CC channels 3 and 4 is valid only for timer/counter 0. Only Timer/Counter 0 has the split mode feature that split it into two 8-bit Timer/Counters with four compare channels each. 30 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Some timer/counters have extensions to enable more specialized waveform and frequency generation. The advanced waveform extension (AWeX) is intended for motor control and other power control applications. It enables low- and high-side output with dead-time insertion, as well as fault protection for disabling and shutting down external drivers. It can also generate a synchronized bit pattern across the port pins. The advanced waveform extension can be enabled to provide extra and more advanced features for the Timer/Counter. This are only available for Timer/Counter 0. See Section 16. “AWeX – Advanced Waveform Extension” on page 33 for more details. The high-resolution (hi-res) extension can be used to increase the waveform output resolution by four or eight times by using an internal clock source running up to four times faster than the peripheral clock. See Section 17. “Hi-Res – High Resolution Extension” on page 33 for more details. Figure 14-1. Overview of a Timer/Counter and Closely Related Peripherals Timer/Counter Base Counter Prescaler clkPER Timer Period Control Logic Counter Event System clkPER4 Comparator Buffer Dead-Time Insertion Pattern Generation Fault Protection PORT Capture Control Waveform Generation AWeX Hi-RES Compare/Capture Channel D Compare/Capture Channel C Compare/Capture Channel B Compare/Capture Channel A PORTC has one Timer/Counter 0 and one Timer/Counter1. PORTD, PORTE and PORTF each has one Timer/Counter 0. Notation of these are TCC0 (Time/Counter C0), TCC1, TCD0, TCE0, and TCF0, respectively. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 31 15. TC2 – Timer/Counter Type 2 15.1 Features ● ● Eight 8-bit timer/counters ● Four Low-byte timer/counter ● Four High-byte timer/counter Up to eight compare channels in each Timer/Counter 2 ● Four compare channels for the low-byte timer/counter ● Four compare channels for the high-byte timer/counter ● Waveform generation ● ● ● Timer underflow interrupts/events ● 15.2 Single slope pulse width modulation One compare match interrupt/event per compare channel for the low-byte timer/counter Can be used with the event system for count control Overview There are four Timer/Counter 2. These are realized when a Timer/Counter 0 is set in split mode. It is then a system of two eight-bit timer/counters, each with four compare channels. This results in eight configurable pulse width modulation (PWM) channels with individually controlled duty cycles, and is intended for applications that require a high number of PWM channels. The two eight-bit timer/counters in this system are referred to as the low-byte timer/counter and high-byte timer/counter, respectively. The difference between them is that only the low-byte timer/counter can be used to generate compare match interrupts and events. The two eight-bit timer/counters have a shared clock source and separate period and compare settings. They can be clocked and timed from the peripheral clock, with optional prescaling, or from the event system. The counters are always counting down. PORTC, PORTD, PORTE and PORTF each has one Timer/Counter 2. Notation of these are TCC2 (Timer/Counter C2), TCD2, TCE2 and TCF2, respectively. 32 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 16. AWeX – Advanced Waveform Extension 16.1 Features ● ● ● ● 16.2 Waveform output with complementary output from each compare channel Four dead-time insertion (DTI) units ● 8-bit resolution ● Separate high and low side dead-time setting ● Double buffered dead time ● Optionally halts timer during dead-time insertion Pattern generation unit creating synchronised bit pattern across the port pins ● Double buffered pattern generation ● Optional distribution of one compare channel output across the port pins Event controlled fault protection for instant and predictable fault triggering Overview The advanced waveform extension (AWeX) provides extra functions to the timer/counter in waveform generation (WG) modes. It is primarily intended for use with different types of motor control and other power control applications. It enables low- and high side output with dead-time insertion and fault protection for disabling and shutting down external drivers. It can also generate a synchronized bit pattern across the port pins. Each of the waveform generator outputs from the timer/counter 0 are split into a complimentary pair of outputs when any AWeX features are enabled. These output pairs go through a dead-time insertion (DTI) unit that generates the non-inverted low side (LS) and inverted high side (HS) of the WG output with dead-time insertion between LS and HS switching. The DTI output will override the normal port value according to the port override setting. The pattern generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition, the WG output from compare channel A can be distributed to and override all the port pins. When the pattern generator unit is enabled, the DTI unit is bypassed. The fault protection unit is connected to the event system, enabling any event to trigger a fault condition that will disable the AWeX output. The event system ensures predictable and instant fault reaction, and gives flexibility in the selection of fault triggers. The AWeX is available for TCC0. The notation of this is AWEXC. 17. Hi-Res – High Resolution Extension 17.1 Features ● ● ● 17.2 Increases waveform generator resolution up to 8× (three bits) Supports frequency, single-slope PWM, and dual-slope PWM generation Supports the AWeX when this is used for the same timer/counter Overview The high-resolution (hi-res) extension can be used to increase the resolution of the waveform generation output from a timer/counter by four or eight. It can be used for a timer/counter doing frequency, single-slope PWM, or dual-slope PWM generation. It can also be used with the AWeX if this is used for the same timer/counter. The hi-res extension uses the peripheral 4× clock (ClkPER4). The system clock prescalers must be configured so the peripheral 4× clock frequency is four times higher than the peripheral and CPU clock frequency when the hi-res extension is enabled. There is one hi-res extensions that can be enabled for timer/counters pair on PORTC. The notation of this is HIRESC. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 33 18. RTC – 16-bit Real-Time Counter 18.1 Features ● ● ● ● ● ● ● 18.2 16-bit resolution Selectable clock source ● 32.768kHz external crystal ● External clock ● 32.768kHz internal oscillator ● 32kHz internal ULP oscillator Programmable 10-bit clock prescaling One compare register One period register Clear counter on period overflow Optional interrupt/event on overflow and compare match Overview The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low-power sleep modes, to keep track of time. It can wake up the device from sleep modes and/or interrupt the device at regular intervals. The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz, and this is the configuration most optimized for low power consumption. The faster 32.768kHz output can be selected if the RTC needs a resolution higher than 1ms. The RTC can also be clocked from an external clock signal, the 32.768kHz internal oscillator or the 32kHz internal ULP oscillator. The RTC includes a 10-bit programmable prescaler that can scale down the reference clock before it reaches the counter. A wide range of resolutions and time-out periods can be configured. With a 32.768kHz clock source, the maximum resolution is 30.5µs, and time-out periods can range up to 2000 seconds. With a resolution of 1s, the maximum timeout period is more than18 hours (65536 seconds). The RTC can give a compare interrupt and/or event when the counter equals the compare register value, and an overflow interrupt and/or event when it equals the period register value. Figure 18-1. Real-time Counter Overview External Clock TOSC1 32.768kHz Crystal Osc TOSC2 DIV32 32kHz Int. ULP (DIV32) DIV32 32.768kHz Int. Osc PER RTCSRC clkRTC 10-bit Prescaler ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 TOP/ Overflow = “match”/ Compare CNT COMP 34 = 19. TWI – Two-Wire Interface 19.1 Features ● ● ● ● ● ● ● ● ● ● ● 19.2 Two Identical two-wire interface peripherals Bidirectional, two-wire communication interface ● Phillips I2C compatible ● System Management Bus (SMBus) compatible Bus master and slave operation supported ● Slave operation ● Single bus master operation ● Bus master in multi-master bus environment ● Multi-master arbitration Flexible slave address match functions ● 7-bit and general call address recognition in hardware ● 10-bit addressing supported ● Address mask register for dual address match or address range masking ● Optional software address recognition for unlimited number of addresses Slave can operate in all sleep modes, including power-down Slave address match can wake device from all sleep modes 100kHz and 400kHz bus frequency support Slew-rate limited output drivers Input filter for bus noise and spike suppression Support arbitration between start/repeated start and data bit (SMBus) Slave arbitration allows support for address resolve protocol (ARP) (SMBus) Overview The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and System Management Bus (SMBus) compatible. The only external hardware needed to implement the bus is one pull-up resistor on each bus line. A device connected to the bus must act as a master or a slave. The master initiates a data transaction by addressing a slave on the bus and telling whether it wants to transmit or receive data. One bus can have many slaves and one or several masters that can take control of the bus. An arbitration process handles priority if more than one master tries to transmit data at the same time. Mechanisms for resolving bus contention are inherent in the protocol. The TWI module supports master and slave functionality. The master and slave functionality are separated from each other, and can be enabled and configured separately. The master module supports multi-master bus operation and arbitration. It contains the baud rate generator. Both 100kHz and 400kHz bus frequency is supported. Quick command and smart mode can be enabled to auto-trigger operations and reduce software complexity. The slave module implements 7-bit address match and general address call recognition in hardware. 10-bit addressing is also supported. A dedicated address mask register can act as a second address match register or as a register for address range masking. The slave continues to operate in all sleep modes, including power-down mode. This enables the slave to wake up the device from all sleep modes on TWI address match. It is possible to disable the address matching to let this be handled in software instead. The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitration lost, errors, collision, and clock hold on the bus are also detected and indicated in separate status flags available in both master and slave modes. It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for connecting to an external TWI bus driver. This can be used for applications where the device operates from a different VCC voltage than used by the TWI bus. PORTC and PORTE each has one TWI. Notation of these peripherals are TWIC and TWIE. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 35 20. SPI – Serial Peripheral Interface 20.1 Features ● ● ● ● ● ● ● ● ● 20.2 Two identical SPI peripherals Full-duplex, three-wire synchronous data transfer Master or slave operation Lsb first or msb first data transfer Eight programmable bit rates Interrupt flag at the end of transmission Write collision flag to indicate data collision Wake up from idle sleep mode Double speed master mode Overview The Serial Peripheral Interface (SPI) is a high-speed synchronous data transfer interface using three or four pins. It allows fast communication between an Atmel AVR XMEGA device and peripheral devices or between several microcontrollers. The SPI supports full-duplex communication. A device connected to the bus must act as a master or slave. The master initiates and controls all data transactions. PORTC and PORTD each has one SPI. Notation of these peripherals are SPIC and SPID, respectively. 36 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 21. USART 21.1 Features ● ● ● ● ● ● ● ● ● ● 21.2 Three identical USART peripherals Full-duplex operation Asynchronous or synchronous operation ● Synchronous clock rates up to 1/2 of the device clock frequency ● Asynchronous clock rates up to 1/8 of the device clock frequency Supports serial frames with 5, 6, 7, 8 or 9 data bits and 1 or 2 stop bits Fractional baud rate generator ● Can generate desired baud rate from any system clock frequency ● No need for external oscillator with certain frequencies Built-in error detection and correction schemes ● Odd or even parity generation and parity check ● Data overrun and framing error detection ● Noise filtering includes false start bit detection and digital low-pass filter Separate interrupts for ● Transmit complete ● Transmit data register empty ● Receive complete Multiprocessor communication mode ● Addressing scheme to address a specific devices on a multidevice bus ● Enable unaddressed devices to automatically ignore all frames Master SPI mode ● Double buffered operation ● Operation up to 1/2 of the peripheral clock frequency IRCOM module for IrDA compliant pulse modulation/demodulation Overview The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast and flexible serial communication module. The USART supports full-duplex communication and asynchronous and synchronous operation. The USART can be configured to operate in SPI master mode and used for SPI communication. Communication is frame based, and the frame format can be customized to support a wide range of standards. The USART is buffered in both directions, enabling continued data transmission without any delay between frames. Separate interrupts for receive and transmit complete enable fully interrupt driven communication. Frame error and buffer overflow are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also be enabled. The clock generator includes a fractional baud rate generator that is able to generate a wide range of USART baud rates from any system clock frequencies. This removes the need to use an external crystal oscillator with a specific frequency to achieve a required baud rate. It also supports external clock input in synchronous slave operation. When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the transmit and receive buffers, shift registers, and baud rate generator enabled. Pin control and interrupt generation are identical in both modes. The registers are used in both modes, but their functionality differs for some control settings. An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse modulation and demodulation for baud rates up to 115.2kbps. PORTC, PORTD, and PORTE each has one USART. Notation of these peripherals are USARTC0, USARTD0 and USARTE0, respectively. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 37 22. IRCOM – IR Communication Module 22.1 Features ● ● ● ● ● 22.2 Pulse modulation/demodulation for infrared communication IrDA compatible for baud rates up to 115.2kbps Selectable pulse modulation scheme ● 3/16 of the baud rate period ● Fixed pulse period, 8-bit programmable ● Pulse modulation disabled Built-in filtering Can be connected to and used by any USART Overview Atmel AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA compatible for baud rates up to 115.2kbps. It can be connected to any USART to enable infrared pulse encoding/decoding for that USART. 38 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 23. CRC – Cyclic Redundancy Check Generator 23.1 Features ● ● ● ● 23.2 Cyclic redundancy check (CRC) generation and checking for ● Communication data ● Program or data in flash memory ● Data in SRAM and I/O memory space Integrated with flash memory and CPU ● Automatic CRC of the complete or a selectable range of the flash memory ● CPU can load data to the CRC generator through the I/O interface CRC polynomial software selectable to ● CRC-16 (CRC-CCITT) ● CRC-32 (IEEE 802.3) Zero remainder detection Overview A cyclic redundancy check (CRC) is an error detection technique test algorithm used to find accidental errors in data, and it is commonly used to determine the correctness of a data transmission, and data present in the data and program memories. A CRC takes a data stream or a block of data as input and generates a 16- or 32-bit output that can be appended to the data and used as a checksum. When the same data are later received or read, the device or application repeats the calculation. If the new CRC result does not match the one calculated earlier, the block contains a data error. The application will then detect this and may take a corrective action, such as requesting the data to be sent again or simply not using the incorrect data. Typically, an n-bit CRC applied to a data block of arbitrary length will detect any single error burst not longer than n bits (any single alteration that spans no more than n bits of the data), and will detect the fraction 1-2-n of all longer error bursts. The CRC module in Atmel AVR XMEGA devices supports two commonly used CRC polynomials; CRC-16 (CRC-CCITT) and CRC-32 (IEEE 802.3). CRC-16: Polynominal: x16+x12+x5+1 Hex value: 0x1021 CRC-32: Polynominal: x32+x26+x23+x22+x16+x12+x11+x10+x8+x7+x5+x4+x2+x+1 Hex value: 0x04C11DB7 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 39 24. ADC – 12-bit Analog to Digital Converter 24.1 Features ● ● ● ● ● One Analog to Digital Converter (ADC) 12-bit resolution Up to 300 thousand samples per second ● Down to 2.3µs conversion time with 8-bit resolution ● Down to 3.35µs conversion time with 12-bit resolution Differential and single-ended input ● 16 single-ended inputs ● 16 4 differential inputs without gain ● 8 4 differential input with gain Built-in differential gain stage ● ● ● ● ● ● ● 24.2 1/2×, 1×, 2×, 4×, 8×, 16×, 32× and 64× gain options Single, continuous and scan conversion options Two internal inputs ● VCC voltage divided by 10 ● 1.1V bandgap voltage Internal and external reference options Compare function for accurate monitoring of user defined thresholds Optional event triggered conversion for accurate timing Optional interrupt/event on compare result Overview The ADC converts analog signals to digital values. The ADC has 12-bit resolution and is capable of converting up to 300 thousand samples per second (ksps). The input selection is flexible, and both single-ended and differential measurements can be done. For differential measurements, an optional gain stage is available to increase the dynamic range. In addition, several internal signal inputs are available. The ADC can provide both signed and unsigned results. The ADC measurements can either be started by application software or an incoming event from another peripheral in the device. The ADC measurements can be started with predictable timing, and without software intervention. Both internal and external reference voltages can be used. The VCC/10 and the bandgap voltage can also be measured by the ADC. The ADC has a compare function for accurate monitoring of user defined thresholds with minimum software intervention required. 40 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Figure 24-1. ADC Overview Compare Register .. . ADC15 ADC0 ADC Internal Signals .. . ADC7 ADC0 < > VINP Threshold (Int Req) CH0 Result VINP Internal 1.00V Internal VCC/1.6V Internal VCC/2 AREFA AREFB Reference Voltage The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.35µs for 12-bit to 2.3µs for 8-bit result. ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when the result is represented as a signed integer (signed 16-bit number). PORTA has one ADC. Notation of this peripheral is ADCA. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 41 25. AC – Analog Comparator 25.1 Features ● ● ● ● ● ● ● 25.2 Two analog comparators (AC) Selectable hysteresis ● No ● Small ● Large Analog comparator output available on pin Flexible input selection ● All pins on the port ● Bandgap reference voltage ● A 64-level programmable voltage scaler of the internal VCC voltage Interrupt and event generation on: ● Rising edge ● Falling edge ● Toggle Window function interrupt and event generation on: ● Signal above window ● Signal inside window ● Signal below window Constant current source with configurable output pin selection Overview The analog comparator (AC) compares the voltage levels on two inputs and gives a digital output based on this comparison. The analog comparator may be configured to generate interrupt requests and/or events upon several different combinations of input change. The analog comparator hysteresis can be adjusted in order to achieve the optimal operation for each application. The input selection includes analog port pins, several internal signals, and a 64-level programmable voltage scaler. The analog comparator output state can also be output on a pin for use by external devices. A constant current source can be enabled and output on a selectable pin. This can be used to replace, for example, external resistors used to charge capacitors in capacitive touch sensing applications. The analog comparators are always grouped in pairs on each port. These are called analog comparator 0 (AC0) and analog comparator 1 (AC1). They have identical behavior, but separate control registers. Used as pair, they can be set in window mode to compare a signal to a voltage range instead of a voltage level. PORTA has one AC pair. Notation is ACA. 42 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Figure 25-1. Analog Comparator Overview Pin Input + AC0 AC0OUT Pin Input Hysteresis Enable Voltage Scaler ACnMUXCTRL ACnCTRL Interrupt Mode Interrupt Sensitivity Control and Window Function WINCTRL Enable Bandgap Interrupts Events Hysteresis + Pin Input AC1OUT AC1 - Pin Input The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Figure 25-2. Figure 25-2. Analog Comparator Window Function + AC0 Upper limit of window - Interrupts Interrupt Sensitivity Control Input Signal Events + AC1 Lower limit of window - ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 43 26. Programming and Debugging 26.1 Features ● Programming ● ● ● External programming through PDI interface ● Minimal protocol overhead for fast operation ● Built-in error detection and handling for reliable operation Boot loader support for programming through any communication interface Debugging ● Nonintrusive, real-time, on-chip debug system ● No software or hardware resources required from device except pin connection ● Program flow control ● Unlimited number of user program breakpoints ● User data breakpoints, break on: ● ● ● 26.2 Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor ● Data location read, write, or both read and write ● Data location content equal or not equal to a value ● Data location content is greater or smaller than a value ● Data location content is within or outside a range No limitation on device clock frequency Program and Debug Interface (PDI) ● Two-pin interface for external programming and debugging ● Uses the Reset pin and a dedicated pin ● No I/O pins required during programming or debugging Overview The Program and Debug Interface (PDI) is an Atmel proprietary interface for external programming and on-chip debugging of a device. The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses, lock bits, and the user signature row. Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug. It does not require any software or hardware resources except for the device pin connection. Using the Atmel tool chain, it offers complete program flow control and support for an unlimited number of program and complex data breakpoints. Application debug can be done from a C or other high-level language source code level, as well as from an assembler and disassembler level. Programming and debugging can be done through the PDI physical layer. This is a two-pin interface that uses the Reset pin for the clock input (PDI_CLK) and one other dedicated pin for data input and output (PDI_DATA). Any external programmer or on-chip debugger/emulator can be directly connected to this interface. 44 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 27. Pinout and Pin Functions The device pinout is shown in Section 1. “Pinout/Block Diagram” on page 3. In addition to general purpose I/O functionality, each pin can have several alternate functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of the pin functions can be used at time. 27.1 Alternate Pin Function Description The tables below show the notation for all pin functions available and describe its function. 27.1.1 Operation/Power Supply VCC Digital supply voltage AVCC Analog supply voltage GND Ground 27.1.2 Port Interrupt Functions SYNC Port pin with full synchronous and limited asynchronous interrupt function ASYNC Port pin with full synchronous and full asynchronous interrupt function 27.1.3 Analog Functions ACn Analog comparator input pin n ACnOUT Analog comparator n output ADCn Analog to digital converter input pin n AREF Analog reference input pin 27.1.4 Timer/Counter and AWEX Functions OCnxLS Output compare channel x low side for Timer/Counter n OCnxHS Output compare channel x high side for Timer/Counter n 27.1.5 Communication Functions SCL Serial Clock for TWI SDA Serial Data for TWI SCLIN Serial Clock In for TWI when external driver interface is enabled SCLOUT Serial Clock Out for TWI when external driver interface is enabled SDAIN Serial Data In for TWI when external driver interface is enabled SDAOUT Serial Data Out for TWI when external driver interface is enabled XCKn Transfer Clock for USART n RXDn Receiver Data for USART n TXDn Transmitter Data for USART n SS Slave Select for SPI MOSI Master Out Slave In for SPI MISO Master In Slave Out for SPI SCK Serial Clock for SPI ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 45 27.1.6 Oscillators, Clock and Event TOSCn Timer Oscillator pin n XTALn Input/Output for Oscillator pin n CLKOUT Peripheral Clock Output EVOUT Event Channel Output RTCOUT RTC Clock Source Output 27.1.7 Debug/System Functions 27.2 RESET Reset pin PDI_CLK Program and Debug Interface Clock pin PDI_DATA Program and Debug Interface Data pin Alternate Pin Functions The tables below show the primary/default function for each pin on a port in the first column, the pin number in the second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that enable and use the alternate pin functions. For better flexibility, some alternate functions also have selectable pin locations for their functions, this is noted under the first table where this apply. Table 27-1. Port A - Alternate Functions PIN # GND 60 AVCC 61 PA0 62 SYNC ADC0 PA1 63 SYNC ADC1 PA2 64 SYNC/ASYNC PA3 1 PA4 PA5 46 INTERRUPT ADCA POS/ GAINPOS ADCA NEG PORT A ADCA GAINNEG ACA POS ACA NEG ADC0 AC0 AC0 ADC1 AC1 AC1 ADC2 ADC2 AC2 SYNC ADC3 ADC3 AC3 2 SYNC ADC4 ADC4 AC4 3 SYNC ADC5 ADC5 AC5 PA6 4 SYNC ADC6 ADC6 AC6 PA7 5 SYNC ADC7 ADC7 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 ACA OUT AREFA AC3 AC5 AC1OUT AC7 REFA AC0OUT Table 27-2. Port B - Alternate Functions PORT B PIN # INTERRUPT ADCA POS REFB PB0 6 SYNC ADC8 AREFB PB1 6 SYNC ADC9 PB2 8 SYNC/ASYNC ADC10 PB3 9 SYNC ADC11 PB4 10 SYNC ADC12 PB5 11 SYNC ADC13 PB6 12 SYNC ADC14 PB7 13 SYNC ADC15 GND 14 VCC 15 Table 27-3. Port C - Alternate Functions PIN # INTERRUPT TCC0(1)(2) AWEXC PC0 16 SYNC OC0A OC0ALS PC1 17 SYNC OC0B OC0AHS XCK0 PC2 18 SYNC/ASYNC OC0C OC0BLS RXD0 PC3 19 SYNC OC0D OC0BHS TXD0 PC4 20 SYNC OC0CLS PC5 21 SYNC OC0CHS OC1B MOSI PC6 22 SYNC OC0DLS MISO RTCOUT PC7 23 SYNC OC0DHS SCK clkPER GND 24 VCC 25 Notes: TCC1 USARTC0(3) SPIC(4) TWIC CLOCKOUT(5) EVENTOUT(6) PORT C SDA SCL OC1A SS EVOUT 1. Pin mapping of all TC0 can optionally be moved to high nibble of port. 2. If TC0 is configured as TC2 all eight pins can be used for PWM output. 3. Pin mapping of all USART0 can optionally be moved to high nibble of port. 4. Pins MOSI and SCK for all SPI can optionally be swapped. 5. CLKOUT can optionally be moved between port C, D, and E and between pin 4 and 7. 6. EVOUT can optionally be moved between port C, D, and E and between pin 4 and 7. Table 27-4. Port D - Alternate Functions PORT D PIN # INTERRUPT TCD0 USARTD0 SPID PD0 26 SYNC OC0A PD1 27 SYNC OC0B XCK0 PD2 28 SYNC/ASYNC OC0C RXD0 PD3 29 SYNC OC0D TXD0 PD4 30 SYNC SS PD5 31 SYNC MOSI PD6 32 SYNC MISO PD7 33 SYNC SCK GND 34 VCC 35 CLOCKOUT EVENTOUT ClkPER EVOUT ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 47 Table 27-5. Port E - Alternate Functions PORT E PIN # INTERRUPT TCE0 USARTE0 TOSC PE0 36 SYNC OC0A PE1 37 SYNC OC0B XCK0 PE2 38 SYNC/ASYNC OC0C RXD0 PE3 39 SYNC OC0D TXD0 PE4 40 SYNC PE5 41 SYNC PE6 42 SYNC TOSC2 PE7 43 SYNC TOSC1 GND 44 VCC 45 TWIE CLOCKOUT EVENTOUT ClkPER EVOUT SDA SCL Table 27-6. Port F - Alternate Functions PORT F PIN # INTERRUPT TCF0 PF0 46 SYNC OC0A PF1 47 SYNC OC0B PF2 48 SYNC/ASYNC OC0C PF3 49 SYNC OC0D PF4 50 SYNC PF5 51 SYNC PF6 54 SYNC PF7 55 SYNC GND 52 VCC 53 Table 27-7. Port R - Alternate Functions PORT R PIN # PDI 56 PDI_DATA RESET 57 PDI_CLOCK PR0 58 SYNC XTAL2 PR1 59 SYNC XTAL1 48 INTERRUPT ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 PDI XTAL 28. Peripheral Module Address Map The address maps show the base address for each peripheral and module in Atmel AVR XMEGA D3. For complete register description and summary for each peripheral module, refer to the XMEGA D manual. Table 28-1. Peripheral Module Address Map Base Address Name Description 0x0000 GPIO General Purpose IO Registers 0x0010 VPORT0 Virtual Port 0 0x0014 VPORT1 Virtual Port 1 0x0018 VPORT2 Virtual Port 2 0x001C VPORT3 Virtual Port 2 0x0030 CPU CPU 0x0040 CLK Clock Control 0x0048 SLEEP Sleep Controller 0x0050 OSC Oscillator Control 0x0060 DFLLRC32M DFLL for the 32MHz Internal Oscillator 0x0068 DFLLRC2M DFLL for the 2MHz Internal Oscillator 0x0070 PR Power Reduction 0x0078 RST Reset Controller 0x0080 WDT Watchdog Timer 0x0090 MCU MCU Control 0x00A0 PMIC Programmable Multilevel Interrupt Controller 0x00B0 PORTCFG Port Configuration 0x00D0 CRC CRC Module 0x0180 EVSYS Event System 0x01C0 NVM Non Volatile Memory (NVM) Controller 0x0200 ADCA Analog to Digital Converter on port A 0x0380 ACA Analog Comparator pair on port A 0x0400 RTC Real-Time Counter 0x0480 TWIC Two-Wire Interface on port C 0x04A0 TWIE Two-Wire Interface on port E 0x0600 PORTA Port A 0x0620 PORTB Port B 0x0640 PORTC Port C 0x0660 PORTD Port D 0x0680 PORTE Port E 0x06A0 PORTF Port F 0x07E0 PORTR Port R 0x0800 TCC0 Timer/Counter 0 on port C 0x0840 TCC1 Timer/Counter 1 on port C 0x0880 AWEXC Advanced Waveform Extension on port C 0x0890 HIRESC High Resolution Extension on port C 0x08A0 USARTC0 USART 0 on port C 0x08C0 SPIC Serial Peripheral Interface on port C ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 49 Table 28-1. Peripheral Module Address Map (Continued) 50 Base Address Name Description 0x08F8 IRCOM Infrared Communication Module 0x0900 TCD0 Timer/Counter 0 on port D 0x09A0 USARTD0 USART 0 on port D 0x09C0 SPID Serial Peripheral Interface on port D 0x0A00 TCE0 Timer/Counter 0 on port E 0x0A80 AWEXE Advanced Waveform Extension on port E 0x0AA0 USARTE0 USART 0 on port E 0x0AC0 SPIE Serial Peripheral Interface on port E 0x0B00 TCF0 Timer/Counter 0 on port F ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 29. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks Arithmetic and logic instructions ADD Rd, Rr Add without Carry Rd Rd + Rr Z,C,N,V,S,H 1 ADC Rd, Rr Add with Carry Rd Rd + Rr + C Z,C,N,V,S,H 1 ADIW Rd, K Add Immediate to Word Rd Rd + 1:Rd + K Z,C,N,V,S 2 SUB Rd, Rr Subtract without Carry Rd Rd - Rr Z,C,N,V,S,H 1 SUBI Rd, K Subtract Immediate Rd Rd - K Z,C,N,V,S,H 1 SBC Rd, Rr Subtract with Carry Rd Rd - Rr - C Z,C,N,V,S,H 1 SBCI Rd, K Subtract Immediate with Carry Rd Rd - K - C Z,C,N,V,S,H 1 SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd Rd + 1:Rd - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Rd Rd Rr Z,N,V,S 1 ANDI Rd, K Logical AND with Immediate Rd Rd K Z,N,V,S 1 OR Rd, Rr Logical OR Rd Rd v Rr Z,N,V,S 1 ORI Rd, K Logical OR with Immediate Rd Rd v K Z,N,V,S 1 EOR Rd, Rr Exclusive OR Rd Rd Rr Z,N,V,S 1 COM Rd One’s Complement Rd $FF - Rd Z,C,N,V,S 1 NEG Rd Two’s Complement Rd $00 - Rd Z,C,N,V,S,H 1 SBR Rd, K Set Bit(s) in Register Rd Rd v K Z,N,V,S 1 CBR Rd, K Clear Bit(s) in Register Rd Rd ($FFh - K) Z,N,V,S 1 INC Rd Increment Rd Rd + 1 Z,N,V,S 1 DEC Rd Decrement Rd Rd - 1 Z,N,V,S 1 TST Rd Test for Zero or Minus Rd Rd Rd Z,N,V,S 1 CLR Rd Clear Register Rd Rd Rd Z,N,V,S 1 SER Rd Set Register Rd $FF None 1 MUL Rd, Rr Multiply Unsigned R1:R0 Rd x Rr (UU) Z,C 2 MULS Rd, Rr Multiply Signed R1:R0 Rd x Rr (SS) Z,C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 Rd x Rr (SU) Z,C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 Rd x Rr<<1 (UU) Z,C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0 Rd x Rr<<1 (SS) Z,C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 Rd x Rr<<1 (SU) Z,C 2 PC + k + 1 None 2 Branch instructions RJMP k PC Relative Jump IJMP Indirect Jump to (Z) PC(15:0) PC(21:16) Z, 0 None 2 EIJMP Extended Indirect Jump to (Z) PC(15:0) PC(21:16) Z, EIND None 2 JMP k Jump PC k None 3 RCALL k Relative Call Subroutine PC PC + k + 1 None 2 / 3(1) ICALL Indirect Call to (Z) PC(15:0) PC(21:16) Z, 0 None 2 / 3(1) EICALL Extended Indirect Call to (Z) PC(15:0) PC(21:16) Z, EIND None 3(1) Notes: 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface if available. 2. One extra cycle must be added when accessing internal SRAM. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 51 29. Instruction Set Summary (Continued) Mnemonics Operands Description Flags #Clocks CALL k call Subroutine Operation PC k None 3 / 4(1) RET Subroutine Return PC STACK None 4 / 5(1) RETI Interrupt Return PC STACK I 4 / 5(1) PC + 2 or 3 None 1/2/3 if (Rd = Rr) PC CPSE Rd, Rr Compare, Skip if Equal CP Rd, Rr Compare CPC Rd, Rr Compare with Carry CPI Rd, K Compare with Immediate SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC PC + 2 or 3 None 1/2/3 SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC PC + 2 or 3 None 2/3/4 SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC PC + 2 or 3 None 2/3/4 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC PC + k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC PC + k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1/2 BRLT k Branch if Less Than, Signed if (N V= 1) then PC PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if (I = 1) then PC PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if (I = 0) then PC PC + k + 1 None 1/2 Rr None 1 Rr+1:Rr None 1 K None Rd - Rr Z,C,N,V,S,H 1 Rd - Rr - C Z,C,N,V,S,H 1 Rd - K Z,C,N,V,S,H 1 Data transfer instructions MOV Rd, Rr Copy Register MOVW Rd, Rr Copy Register Pair LDI Rd, K Load Immediate Rd Rd+1:Rd Rd 1 (1)(2) LDS Rd, k Load Direct from data space Rd (k) None 2 LD Rd, X Load Indirect Rd (X) None 1(1)(2) LD Rd, X+ Load Indirect and Post-Increment Rd X (X) X+1 None 1(1)(2) LD Rd, -X Load Indirect and Pre-Decrement X X - 1, Rd (X) X-1 (X) None 2(1)(2) LD Rd, Y Load Indirect (Y) None 1 (1)(2) Notes: Rd (Y) 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface if available. 2. One extra cycle must be added when accessing internal SRAM. 52 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 29. Instruction Set Summary (Continued) Mnemonics Operands Description Operation Flags #Clocks (Y) Y+1 None 1(1)(2) LD Rd, Y+ Load Indirect and Post-Increment Rd Y LD Rd, -Y Load Indirect and Pre-Decrement Y Rd Y-1 (Y) None 2(1)(2) LDD Rd, Y+q Load Indirect with Displacement Rd (Y + q) None 2(1)(2) LD Rd, Z Load Indirect Rd (Z) None 1(1)(2) LD Rd, Z+ Load Indirect and Post-Increment Rd Z (Z), Z+1 None 1(1)(2) LD Rd, -Z Load Indirect and Pre-Decrement Z Rd Z - 1, (Z) None 2(1)(2) LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2(1)(2) STS k, Rr Store Direct to Data Space (k) Rd None 2(1) ST X, Rr Store Indirect (X) Rr None 1(1) ST X+, Rr Store Indirect and Post-Increment (X) X Rr, X+1 None 1(1) ST -X, Rr Store Indirect and Pre-Decrement X (X) X - 1, Rr None 2(1) ST Y, Rr Store Indirect (Y) Rr None 1(1) ST Y+, Rr Store Indirect and Post-Increment (Y) Y Rr, Y+1 None 1(1) ST -Y, Rr Store Indirect and Pre-Decrement Y (Y) Y - 1, Rr None 2(1) STD Y+q, Rr Store Indirect with Displacement (Y + q) Rr None 2(1) ST Z, Rr Store Indirect (Z) Rr None 1(1) ST Z+, Rr Store Indirect and Post-Increment (Z) Z Rr Z+1 None 1(1) ST -Z, Rr Store Indirect and Pre-Decrement Z Z-1 None 2(1) STD Z+q, Rr Store Indirect with Displacement (Z + q) Rr None 2(1) Load Program Memory R0 (Z) None 3 Rd, Z Load Program Memory Rd (Z) None 3 Rd, Z+ Load Program Memory and PostIncrement Rd Z (Z), Z+1 None 3 Extended Load Program Memory R0 (RAMPZ:Z) None 3 Rd, Z Extended Load Program Memory Rd (RAMPZ:Z) None 3 Rd, Z+ Extended Load Program Memory and Post-Increment Rd Z (RAMPZ:Z), Z+1 None 3 LPM LPM LPM ELPM ELPM ELPM SPM Store Program Memory (RAMPZ:Z) R1:R0 None - (RAMPZ:Z) Z R1:R0, Z+2 None - SPM Z+ Store Program Memory and PostIncrement by 2 IN Rd, A In From I/O Location OUT A, Rr Out To I/O Location PUSH Rr Push Register on Stack POP Rd Pop Register from Stack Notes: Rd I/O(A) None 1 I/O(A) Rr None 1 STACK Rr None 1(1) STACK None 2(1) Rd 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface if available. 2. One extra cycle must be added when accessing internal SRAM. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 53 29. Instruction Set Summary (Continued) Mnemonics Operands Description Operation Flags #Clocks Bit and bit-test instructions LSL Rd Logical Shift Left LSR Rd Logical Shift Right ROL Rd Rotate Left Through Carry ROR Rd Rotate Right Through Carry ASR Rd Arithmetic Shift Right SWAP Rd Swap Nibbles Rd(n+1) Rd(0) C Rd(n), 0, Rd(7) Z,C,N,V,H 1 Rd(n+1), 0, Rd(0) Z,C,N,V 1 C, Rd(n), Rd(7) Z,C,N,V,H 1 Rd(7) Rd(n) C C, Rd(n+1), Rd(0) Z,C,N,V 1 Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1 Rd(7..4) None 1 Rd(n) Rd(7) C Rd(0) Rd(n+1) C Rd(3..0) BSET s Flag Set SREG(s) 1 SREG(s) 1 BCLR s Flag Clear SREG(s) 0 SREG(s) 1 1 None 1 0 None 1 SBI A, b Set Bit in I/O Register I/O(A, b) CBI A, b Clear Bit in I/O Register I/O(A, b) BST Rr, b Bit Store from Register to T BLD Rd, b Bit load from T to Register T Rr(b) T 1 Rd(b) T None 1 SEC Set Carry C 1 C 1 CLC Clear Carry C 0 C 1 SEN Set Negative Flag N 1 N 1 CLN Clear Negative Flag N 0 N 1 SEZ Set Zero Flag Z 1 Z 1 CLZ Clear Zero Flag Z 0 Z 1 SEI Global Interrupt Enable I 1 I 1 CLI Global Interrupt Disable I 0 I 1 SES Set Signed Test Flag S 1 S 1 CLS Clear Signed Test Flag S 0 S 1 SEV Set Two’s Complement Overflow V 1 V 1 CLV Clear Two’s Complement Overflow V 0 V 1 SET Set T in SREG T 1 T 1 CLT Clear T in SREG T 0 T 1 SEH Set Half Carry Flag in SREG H 1 H 1 CLH Clear Half Carry Flag in SREG H 0 H 1 None 1 MCU control instructions BREAK Break NOP No Operation None 1 SLEEP Sleep (See specific descr. for Sleep) None 1 Watchdog Reset (See specific descr. for WDR) None 1 WDR Notes: (See specific descr. for BREAK) 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface if available. 2. One extra cycle must be added when accessing internal SRAM. 54 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 30. Electrical Characteristics All typical values are measured at T = 25C unless other temperature condition is given. All minimum and maximum values are valid across operating temperature and voltage unless other conditions are given. 30.1 Atmel ATxmega64D3 30.1.1 Absolute Maximum Ratings Stresses beyond those listed in Table 30-1 under may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 30-1. Absolute Maximum Ratings Parameter Symbol Min. Power supply voltage Condition VCC –0.3 Current into a VCC pin Typ. Max. Unit 4 V IVCC 200 mA Current out of a Gnd pin IGND 200 mA Pin voltage with respect to Gnd and VCC VPIN –0.5 VCC + 0.5 V I/O pin sink/source current IPIN –25 25 mA Storage temperature TA –65 150 °C 30.1.2 General Operating Ratings The device must operate within the ratings listed in Table 30-2 in order for all other electrical characteristics and typical characteristics of the device to be valid. Table 30-2. General Operating Conditions Parameter Symbol Min. Max. Unit Power supply voltage Condition VCC 2.7 3.6 V Analog supply voltage AVCC 2.7 3.6 V TA –40 105 °C Symbol Min. Max. Unit Temperature range Typ. Table 30-3. Operating Voltage and Frequency Parameter CPU clock frequency Condition VCC = 2.7V VCC = 3.6V ClkCPU Typ. 0 32 0 32 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 MHz 55 Figure 30-1. Maximum Frequency versus VCC MHz 32 Safe operating area 2.7V 3.6 V 30.1.3 Current Consumption Table 30-4. Current Consumption for Active Mode and Sleep Modes Parameter Condition Active power consumption(1) 32kHz, external Clk Idle power consumption(1) 32kHz, external Clk Power-down power consumption Typ. Max. 130 220 µA 8 12 mA 7 31 µA 3 6 mA T = 25°C 0.2 1.0 T = 105°C 4 12 1.5 2.0 5 14 32MHz, external Clk 32MHz, external Clk WDT and sampled BOD enabled, T = 25°C Symbol VCC = 3.0V ICC VCC = 3.0V ICC VCC = 3.0V ICC WDT and sampled BOD enabled, T = 105°C Power-save power consumption(2) Reset power consumption Notes: 56 RTC from ULP clock, WDT and sampled BOD enabled, T = 25°C VCC = 3.0V RTC from 1.024kHz low power 32.768kHz TOSC, T = 25°C VCC = 3.0V RTC from low power 32.768kHz TOSC, T = 25°C VCC = 3.0V Current through RESET pin substracted VCC = 3.0V ICC ICC All Power Reduction Registers set. 2. Maximum limits are based on characterization, and not tested in production. 9322A–AVR–03/14 Unit µA 1.8 1. ATxmega64D3 [DATASHEET] Min. 0.8 4.0 1.0 4.0 120 µA µA Table 30-5. Current Consumption for Modules and Peripherals Condition(1) Parameter Symbol Min. Typ. ULP oscillator 0.9 32.768kHz int. oscillator 29 Max. Unit 82 2MHz int. oscillator DFLL enabled with 32.768kHz int. osc. as reference 114 250 32MHz int. oscillator PLL DFLL enabled with 32.768kHz int. osc. as reference 400 20× multiplication factor, 32MHz int. osc. DIV4 as reference 300 Continuous mode 140 Watchdog timer BOD µA 1.0 ICC Sampled mode, includes ULP oscillator Internal 1.0V reference 1.4 180 1.23 16ksps VREF = Ext. ref. ADC 75ksps VREF = Ext. ref. 300ksps VREF = Ext. ref. Flash memory and EEPROM programming Note: 1. CURRLIMIT = LOW 1.1 CURRLIMIT = MEDIUM 0.98 CURRLIMIT = HIGH 0.87 CURRLIMIT = LOW 1.7 mA 3.1 5 11 mA All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC = 3.0V, ClkSYS = 1MHz external clock without prescaling, T = 25°C unless other conditions are given. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 57 30.1.4 Wake-up Time from Sleep Modes Table 30-6. Device Wake-up Time from Sleep Modes with Various System Clock Sources Parameter Condition Wake-up time from idle, standby, and extended standby mode Symbol 2.0 32.768kHz internal oscillator 125 2MHz internal oscillator 2.0 External 2MHz clock Note: 1. twakeup 0.2 4.6 32.768kHz internal oscillator 330 2MHz internal oscillator 9.5 32MHz internal oscillator 5.6 Max. Unit µs The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 30-2. All peripherals and modules start execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts. This is guaranteed by design. Figure 30-2. Wake-up Time Definition Wakeup Time Wakeup request Clock output 58 Typ.(1) External 2MHz clock 32MHz internal oscillator Wake-up time from powersave and power-down mode Min. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 30.1.5 I/O Pin Characteristics The I/O pins complies with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and output voltage limits reflect or exceed this specification. Table 30-7. I/O Pin Characteristics Parameter Condition I/O pin source/sink current Symbol Min. IOH(1)/ IOL(2) –15 0.7 VCC High level input voltage VCC = 2.7V - 3.6V VIH Low level input voltage VCC = 2.7V - 3.6V VIL High level output voltage Low level output voltage VCC = 3.3V IOH = -4mA VCC = 3.0V IOH = -3mA VCC = 3.3V IOL = 8mA VCC = 3.0V IOL = 5mA VOH 2.6 2.9 2.1 2.6 VOL Input leakage current I/O pin T = 25°C IIN Pull/buss keeper resistor RP Notes: Typ. 20 Max. Unit 15 mA VCC + 0.5 V 0.3 VCC V V 0.4 0.76 0.3 0.64 <0.01 1 µA 27 40 k Max. Unit 1. The sum of all IOH for PORTA and PORTB must not exceed 100mA. The sum of all IOH for PORTC, PORTD, PORTE must for each port not exceed 200mA. The sum of all IOH for pins PF[0-5] on PORTF must not exceed 200mA. The sum of all IOL for pins PF[6-7] on PORTF, PORTR and PDI must not exceed 100mA. 2. The sum of all IOL for PORTA and PORTB must not exceed 100mA. The sum of all IOL for PORTC, PORTD, PORTE must for each port not exceed 200mA. The sum of all IOL for pins PF[0-5] on PORTF must not exceed 200mA. The sum of all IOL for pins PF[6-7] on PORTF, PORTR and PDI must not exceed 100mA. V 30.1.6 ADC Characteristics Table 30-8. Power Supply, Reference and Input Range Parameter Condition Symbol Min. Typ. Analog supply voltage AVCC VCC – 0.3 or 2.7V VCC + 0.3 Reference voltage VREF 1 AVCC – 0.6 V Input resistance Switched Rin 4.5 k Input capacitance Switched Cin 5 pF Reference input resistance (leakage only) Reference input capacitance Static load Input range RAREF >10 M CAREF 7 pF Vin Conversion range Conversion range Differential mode, Vinp - Vinn 0 VREF –VREF/GAIN VREF/GAIN –V VREF/GAIN – V Single ended unsigned mode, Vinp Fixed offset voltage V Notes: 1. Maximum input common mode voltage for VREF > 1V is (AVCC – 2.7)+1.8 2. 200 V lsb Maximum input common mode voltage for VREF = 1.0V is 1.33 (AVCC – 2.7) + 2.1 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 59 Table 30-9. Clock and Timing Parameter Condition Symbol ADC clock frequency Maximum is 1/4 of peripheral clock frequency ClkADC Measuring internal signals Sample rate Min. Typ. Max. 100 1800 100 125 Free running fClkADC 16 300 Single shot fClkADC 16 250 Current limitation (CURRLIMIT) off 16 300 CURRLIMIT = LOW 16 250 16 150 16 50 CURRLIMIT = MEDIUM fADC CURRLIMIT = HIGH Unit kHz ksps Sampling time Configurable in steps of 1/2 ClkADC cycle up to 32 ClkADC cycles 1.67 320 Conversion time (latency) (RES+2)/2 + 1 + GAIN RES (Resolution) = 8 or 12, GAIN = 0 to 3 5.5 10 Start-up time ADC clock cycles 12 24 ADC settling time After changing reference or input mode 7 7 Typ. Max. Unit 12 Bit µs ClkADC cycles Table 30-10. Accuracy Characteristics: Differential Mode Parameter(1) Condition Resolution Symbol Min. RES 8 16ksps, VREF = 3V – 1X 0.6 1.1 1.7 0.5 0.8 1.5 300ksps, all VREF – 1X 0.5 0.9 2.0 16ksps, VREF = 3V – 1X ±0.6 ±0.8 ±0.95 ±0.6 ±0.7 ±0.95 ±0.4 ±0.5 ±0.95 300ksps, all VREF – 1X ±0.4 ±0.6 ±0.95 External reference –30 –5 +10 AVCC/1.6 –50 –20 –10 AVCC/2.0 –50 –25 –15 Bandgap –80 –40 –15 External reference 0.5X ±0.9 ±1.5 ±2.0 16ksps, all VREF – 1X 300ksps, VREF = 3V – 1X Gain error INL DNL External reference 2X to 16X ±0.15 ±0.3 ±0.45 External reference 32X to 64X ±0.05 ±0.1 ±0.5 External reference –5.0 +0.7 +10.0 AVCC/1.6 –5.0 +1.0 +10.0 AVCC/2.0 –5.0 +1.0 +10.0 Offset error 60 1.5 300ksps, VREF = 3V – 1X Differential non linearity(2) Notes: 1.0 16ksps, all VREF – 1X Integral non linearity Gain accuracy 0.6 LSB LSB mV % mV 1. Bandgap –5.0 +1.0 +10.0 Maximum numbers are based on characterisation and not tested in production, and valid for –90% to +90% input voltage range. 2. The step errors are calculated in averaging the ADC samples 8 times. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Table 30-11. Accuracy Characteristics: Single-ended Mode Parameter(1) Condition Symbol Min. RES 8 Resolution Integral non linearity Differential non linearity(2) VREF = 3V – 1X Max. Unit 12 Bit 0.8 2.1 6.0 1.0 2.5 8.0 ±0.5 ±0.8 ±0.95 ±0.4 ±0.9 ±0.95 External reference –20.0 –10.0 –5.0 AVCC/1.6 –30.0 –15.0 –5.0 AVCC/2.0 –30.0 –15.0 –7.0 Bandgap –50.0 –25.0 –10.0 External reference 1.0 10.0 25.0 AVCC/1.6 3.0 10.0 20.0 AVCC/2.0 3.0 10.0 20.0 INL All VREF – 1X VREF = 3V – 1X DNL All VREF – 1X Gain error Offset error Notes: Typ. LSB LSB mV mV 1. Bandgap 3.0 10.0 15.0 Maximum numbers are based on characterisation and not tested in production, and valid for V to 90% input voltage range. 2. The step errors are calculated in averaging the ADC samples 8 times. Table 30-12. Accuracy Characteristics: Differential Mode 0.5X Gain Parameter(1) Condition Symbol Resolution Min. RES Max. 16ksps, all VREF – 0.5X INL 300ksps, all VREF – 0.5X 16ksps, all VREF – 0.5X Differential non linearity(2) 300ksps, all VREF – 0.5X Gain error 0.5X External reference Unit 12 Bit –2 VREF Conversion range Integral non linearity Typ. DNL +2 VREF 1.3 1.9 2.3 0.46 0.65 1.5 ±0.8 ±0.9 ±0.95 ±0.45 ±0.6 ±0.95 –30 –15 –10 V LSB LSB mV Offset error 0.5X External reference –40 –10 +40 Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for –90% to 90% input voltage range. 2. The step errors are calculated in averaging the ADC samples 8 times Table 30-13. Gain Stage Characteristics Parameter Condition Symbol Min. Typ. Input resistance Switched in normal mode Rin 4.0 k Input capacitance Switched in normal mode Csample 4.4 pF Signal range Gain stage output Propagation delay ADC conversion rate 1/2 Clock frequency Same as ADC 100 0 1 Max. Unit AVCC – 0.6 V 3 ClkADC cycles 1800 kHz ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 61 30.1.7 Analog Comparator Characteristics Table 30-14. Analog Comparator Characteristics Parameter Condition Symbol Min. Typ. Max. Unit Voff –26 +10 +52 mV <10 50 nA AVCC V Input offset voltage Input leakage current Ilk Input voltage range –0.1 AC start-up time 50 (1) µs Hysteresis, none VCC = 3V at 25°C Vhys1 0 Hysteresis, small VCC = 3V at 25°C Vhys2 15 Hysteresis, large VCC = 3V at 25°C Vhys3 30 Propagation delay VCC = 2.7V - 3.6V, T = –40°C to +105°C tdelay 20 31 ns 64-level voltage scaler Integral non-linearity (INL) 0.3 0.5 lsb Current source accuracy after calibration Current source calibration range Note: 1. Guaranteed by design. mV 5 Single mode % 4 6 µA 30.1.8 Bandgap and Internal 1.0V Reference Characteristics Table 30-15. Bandgap and Internal 1.0V Reference Characteristics Parameter Condition Symbol Min. As reference for ADC Start-up time Variation over voltage and temperature Calibrated at T = 25°C INT1V Unit µs 1.5 µs 1.1 V Bandgap voltage T = 25°C, after calibration Max. 1 ClkPER + 2.5µs As input voltage to ADC and AC Internal 1.00V reference Typ. 0.99 1 1.01 2 V % 30.1.9 Brownout Detection Characteristics Table 30-16. Brownout Detection Characteristics(1) Parameter Condition BOD level 5 falling VCC BOD level 6 falling VCC 62 Unit VBOT 2.4 2.6 2.8 V (2) 2.8 V (2) 3.0 V tBOD 0.4 Sampled mode tBOD 1000 µs VHYST 1.0 % BOD is calibrated at 25°C BOD level 5 is the default level. 2. Characterized but not tested. 9322A–AVR–03/14 Max. VBOT 1. ATxmega64D3 [DATASHEET] Typ. Continuous mode Hysteresis Notes: Min. VBOT BOD level 7 falling VCC Detection time Symbol 5 µs 30.1.10 External Reset Characteristics Table 30-17. External Reset Characteristics Parameter Condition Symbol Minimum reset pulse width Reset threshold voltage VCC = 2.7 - 3.6V Reset pin pull-up resistor Typ. Max. Unit tEXT Min. 90 1000 ns VRST 0.45 VCC RRST 15 Symbol V 25 35 Min. Typ. Max. 0.4 1.0 0.8 1.3 k 30.1.11 Power-on Reset Characteristics Table 30-18. Power-on Reset Characteristics Parameter Condition POR threshold voltage falling VCC VCC falls faster than 1V/ms VCC falls at 1V/ms or slower POR threshold voltage rising VCC Note: 1. VPOT- (1) VPOT+ 1.3 Unit V 1.59 VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+. 30.1.12 Flash and EEPROM Memory Characteristics Table 30-19. Endurance and Data Retention Parameter Condition Write/erase cycles Flash Data retention Write/erase cycles EEPROM Data retention Symbol Min. 25°C 10K 105°C 2K 25°C 100 105°C 10 25°C 100K 105°C 30K 25°C 100 105°C 10 Typ. Max. Unit Cycle Year Cycle Year Table 30-20. Programming Time Condition Chip erase(2) 64KB Flash, EEPROM 55 Application erase Section erase 6 Page erase 4 Page write 4 Atomic page erase and write 8 Page erase 4 Page write 4 Atomic page erase and write 8 Flash EEPROM Notes: Symbol Min. Typ.(1) Parameter Max. 1. Programming is timed from the 2MHz internal oscillator. Minimum and maximum times will be affected accordingly. 2. EEPROM is not erased if the EESAVE fuse is programmed. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Unit ms 63 30.1.13 Clock and Oscillator Characteristics 18.104.22.168 Calibrated 32.768kHz Internal Oscillator Characteristics Table 30-21. 32.768kHz Internal Oscillator Characteristics Parameter Condition Frequency T = 25C, VCC = 3.0V Symbol Min. Typ. Max. Factory calibration accuracy T = –40C to +105°C, VCC = 2.7 V to 3.6V –5 +5 T = 25C, VCC = 3.0V –1.0 +1.0 –0.5 +0.5 32.768 User calibration accuracy Unit kHz % 22.214.171.124 Calibrated 2MHz RC Internal Oscillator Characteristics Table 30-22. 2MHz Internal Oscillator Characteristics Parameter Condition Frequency range DFLL can tune to this frequency over voltage and temperature Symbol Min. Typ. Max. 1.8 2.0 2.3 Factory calibrated frequency Factory calibration accuracy Unit MHz 2.0 T = –40C to +105°C, VCC = 2.7 V to 3.6V –14 +14 T = 25C, VCC = 3.0V –2.0 +2.0 –0.2 +0.2 User calibration accuracy DFLL calibration step size % 0.18 126.96.36.199 Calibrated 32MHz Internal Oscillator Characteristics Table 30-23. 32MHz Internal Oscillator Characteristics Parameter Condition Frequency range DFLL can tune to this frequency over voltage and temperature Symbol Min. Typ. Max. 30 32 55 Factory calibrated frequency Factory calibration accuracy Unit MHz 32 T = –40C to +105°C, VCC = 2.7 V to 3.6V –14 +14 T = 25C, VCC = 3.0V –2.0 +2.0 User calibration accuracy –0.2 DFLL calibration step size % +0.2 0.19 188.8.131.52 32kHz Internal ULP Oscillator Characteristics Table 30-24. 32kHz Internal ULP Oscillator Characteristics Parameter Condition Symbol Min. Factory calibrated frequency Factory calibration accuracy Accuracy 64 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Typ. Max. 32 T = 25°C, VCC = 3.0V Unit kHz –12 +12 % –30 +30 % 184.108.40.206 Internal Phase Locked Loop (PLL) Characteristics Table 30-25. Internal PLL Characteristics Parameter Condition Input frequency Output frequency must be within fOUT Output frequency VCC = 2.7 - 3.6V Symbol Min. fIN fOUT Typ. Max. Unit 0.4 32 MHz 10 64 MHz Start-up time 25 160 µs Re-lock time 25 100 µs Max. Unit 32 MHz Note: Characterized not tested to start-up and re-lock time. 220.127.116.11 External Clock Characteristics Figure 30-3. External Clock Drive Waveform tCH tCR tCH tCF VIH1 VIL1 tCL tCK Table 30-26. External Clock used as System Clock without Prescaling Parameter Condition Symbol Clock Frequency VCC = 2.7 - 3.6V 1/tCK Clock Period VCC = 2.7 - 3.6V Clock High Time VCC = 2.7 - 3.6V Clock Low Time VCC = 2.7 - 3.6V Rise Time (for maximum frequency) VCC = 2.7 - 3.6V tCR 3 ns Fall Time (for maximum frequency) VCC = 2.7 - 3.6V tCF 3 ns tCK 10 % Max. Unit 142 MHz Change in period from one clock cycle to the next Min. Typ. 0 31.5 ns tCH 12.5 ns tCL 12.5 ns Table 30-27. External Clock with Prescaler(1) for System Clock Parameter Condition Symbol Min. Clock Frequency VCC = 2.7 - 3.6V 1/tCK 0 Clock Period VCC = 2.7 - 3.6V tCK 7 ns Clock High Time VCC = 2.7 - 3.6V tCH 2.4 ns Clock Low Time VCC = 2.7 - 3.6V tCL 2.4 ns Rise Time (for maximum frequency) VCC = 2.7 - 3.6V tCR 1.0 ns Fall Time (for maximum frequency) VCC = 2.7 - 3.6V tCF 1.0 ns tCK 10 % Change in period from one clock cycle to the next Notes: 1. Typ. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded. ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 65 18.104.22.168 External 32.768kHz Crystal Oscillator and TOSC Characteristics Table 30-28. External Full-swing 32.768kHz Crystal Oscillator and TOSC Characteristics Parameter Condition Symbol Recommended crystal equivalent series resistance (ESR) Crystal load capacitance 12pF Min. Typ. ESR Parasitic capacitance TOSC1 pin CTOSC1 3.3 Parasitic capacitance TOSC2 pin CTOSC2 3.3 Capacitance load matched to crystal specification Safety factor Notes: Max. Unit 50 k pF 2 1. See Figure 30-4 for definition. 2. 32.768kHz crystal oscillator start-up times can be of the order of 5 seconds component dependent. Figure 30-4. TOSC Input Capacitance CL1 TOSC1 CL2 Device internal TOSC2 External 32.768kHz crystal The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without external capacitors. 22.214.171.124 External 0.4MHz to 16MHz Crystal Oscillator Characteristics Table 30-29. External 0.4MHz to 16MHz Crystal Oscillator Characteristics Parameter Condition Symbol Min. Typ. Crystal load capacitance 20pF, 16MHz Recommended crystal equivalent series resistance (ESR) ESR/R1 0.138 Crystal load capacitance 20pF, 2MHz 1.200 Crystal load capacitance 100pF, 400kHz 11.500 Parasitic capacitance XTAL1 4.6 Parasitic capacitance XTAL2 6.5 Recommended safety factor 66 Crystal load capacitance 20pF, 8MHz ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Max. Capacitance load matched to crystal specification Unit 0.052 3 k pF 30.1.14 SPI Characteristics Figure 30-5. SPI Timing Requirements in Master Mode SS tMOS tSCKR tSCKF SCK (CPOL = 0) tSCKW SCK (CPOL = 1) tSCKW tMIS MISO (Data Input) tMIH tSCK MSB LSB tMOH tMOH MOSI (Data Output) Figure 30-6. MSB LSB SPI Timing Requirements in Slave Mode SS tSCKR tSSS tSCKF tSSH SCK (CPOL = 0) tSSCKW SCK (CPOL = 1) tSSCKW tSIS MOSI (Data Input) ... MSB tSOSSS MISO (Data Output) tSSCK tSIH LSB tSOSSH tSOS MSB ... LSB ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 67 Table 30-30. SPI Timing Characteristics and Requirements Parameter Condition Symbol Min. Typ. Max. SCK period Master tSCK (See Table 20-3 in XMEGA D manual) SCK high/low width Master tSCKW 0.5 SCK SCK rise time Master tSCKR 2.7 SCK fall time Master tSCKF 2.7 MISO setup to SCK Master tMIS 10 MISO hold after SCK Master tMIH 10 MOSI setup SCK Master tMOS 0.5 SCK MOSI hold after SCK Master tMOH 1 Slave SCK Period Slave tSSCK 4 t ClkPER SCK high/low width Slave tSSCKW 2 t ClkPER SCK rise time Slave tSSCKR 1600 SCK fall time Slave tSSCKF 1600 MOSI setup to SCK Slave tSIS 3 MOSI hold after SCK Slave tSIH t ClkPER SS setup to SCK Slave tSSS 21 SS hold after SCK Slave tSSH 20 MISO setup SCK Slave tSOS 8 MISO hold after SCK Slave tSOH 13 MISO setup after SS low Slave tSOSS 11 MISO hold after SS high Slave tSOSH 8 Unit ns 30.1.15 Two-wire Interface Characteristics Table 30-31 on page 69 describes the requirements for devices connected to the two-wire interface bus. The Atmel AVR XMEGA two-wire interface meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 30-7 on page 68. Figure 30-7. Two-wire Interface Bus Timing tof tHIGH tr tLOW SCL tSU,STA tHD,STA tHD,DAT tSU,DAT tSU,STO SDA tBUF 68 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 Table 30-31. Two-wire Interface Characteristics Parameter Condition Input high voltage Symbol Min. Typ. VIH 0.7VCC VCC + 0.5 0.3VCC Input low voltage VIL –0.1 Hysteresis of Schmitt trigger inputs Vhys 0.05VCC(1) VOL 0 Output low voltage 3mA, sink current Rise time for both SDA and SCL tr Output fall time from VIHmin to VILmax 10pF < Cb < 400pF (2) Spikes suppressed by input filter Input current for each I/O pin 0.1VCC < VI < 0.9VCC Capacitance for each I/O pin SCL clock frequency tof Hold time (repeated) START condition Low period of SCL clock High period of SCL clock Set-up time for a repeated START condition Data hold time Data setup time Setup time for STOP condition fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz fSCL ≤ 100kHz fSCL > 100kHz Bus free time between a STOP and fSCL ≤ 100kHz START condition fSCL > 100kHz Notes: 1. Required only for fSCL > 100kHz. 2. Cb = Capacitance of one bus line in pF. 3. fPER = Peripheral clock frequency. V 20 + 0.1Cb 300 20 + 0.1Cb (1)(2) 250 ns tSP 0 50 II -10 10 µA 10 pF 400 kHz fSCL fSCL ≤ 100kHz Value of pull-up resistor Unit 0.4 (1)(2) CI fPER(3) > max(10fSCL, 250kHz) Max. RP tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tSU;STO tBUF 0 V CC – 0,4V ---------------------------3mA 100ns --------------Cb 300ns --------------Cb 4.0 0.6 4.7 1.3 µs 4.0 0.6 4.7 0.6 0 3.45 0 0.9 250 100 µs 4.0 0.6 4.7 1.3 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 69 31. Typical Characteristics 31.1 Atmel ATxmega64D3 31.1.1 Active Supply Current Figure 31-1. Active Supply Current versus Frequency fSYS = 0 - 1MHz External Clock, T = 25°C 660 3.6V 590 3.3V ICC (µA) 520 3.0V 450 2.7V 380 310 240 170 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Figure 31-2. Active Supply Current versus Frequency fSYS = 1 - 32MHz External Clock, T = 25°C 10000 3.6V 9000 3.3V 8000 3.0V ICC (µA) 7000 2.7V 6000 5000 4000 3000 2000 1000 0 0 4 8 12 16 20 24 28 32 Frequency (MHz) Figure 31-3. Active Supply Current versus VCC fSYS = 1MHz External Clock 880 -40°C 830 25°C ICC (µA) 780 85°C 105°C 730 680 630 580 530 480 2.7 2.8 2.9 3 3.1 3.2 VCC (V) 70 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 3.3 3.4 3.5 3.6 Figure 31-4. Active Supply Current versus VCC fSYS = 32.768kHz Internal Oscillator 270 250 -40°C ICC (µA) 230 25°C 210 85°C 105°C 190 170 150 130 110 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-5. Active Supply Current versus VCC fSYS = 2MHz Internal Oscillator ICC (µA) 1310 1240 -40°C 1170 25°C 85°C 105°C 1100 1030 960 890 820 750 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Active Supply Current versus VCC fSYS = 32MHz Internal Oscillator Prescaled to 8MHz 4900 ICC (µA) Figure 31-6. 4600 -40°C 4300 25°C 4000 85°C 105°C 3700 3400 3100 2800 2500 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 71 Figure 31-7. Active Supply Current versus VCC fSYS = 32MHz Internal Oscillator 11000 -40°C 10500 25°C 9500 85°C 105°C ICC (µA) 10000 9000 8500 8000 7500 7000 6500 6000 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) 31.1.2 Idle Supply Current Figure 31-8. Idle Supply Current versus Frequency fSYS = 0 - 1MHz External Clock, T = 25°C 140 3.6V 120 3.3V ICC (µA) 100 3.0V 80 2.7V 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (MHz) Idle Supply Current versus Frequency fSYS = 1 - 32MHz External Clock, T = 25°C ICC (µA) Figure 31-9. 4000 3.6V 3500 3.3V 3000 3.0V 2.7V 2500 2000 1500 1000 500 0 0 4 8 12 16 20 Frequency (MHz) 72 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 24 28 32 Figure 31-10. Idle Supply Current versus VCC fSYS = 1MHz External Clock 131 105°C 85°C 25°C -40°C 123 ICC (µA) 115 107 99 91 83 75 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-11. Idle Supply Current versus VCC fSYS = 32.768kHz Internal Oscillator 34.0 105°C 33.5 33.0 ICC (µA) 32.5 32.0 85°C 31.5 25°C 31.0 30.5 30.0 29.5 29.0 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-12. Idle Supply Current versus VCC fSYS = 2.0MHz Internal Oscillator 340 -40°C 25°C 85°C 105°C 325 ICC (µA) 310 295 280 265 250 235 220 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 73 Figure 31-13. Idle Supply Current versus VCC fSYS = 32MHz Internal Oscillator Prescaled to 8MHz 1590 -40°C 25°C 85°C 105°C 1510 ICC (µA) 1430 1350 1270 1190 1110 1030 950 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-14. Idle Supply Current versus VCC fSYS = 32MHz Internal Oscillator 4300 -40°C 25°C 4100 85°C 105°C 3900 ICC (µA) 3700 3500 3300 3100 2900 2700 2500 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) 31.1.3 Power-down Supply Current Figure 31-15. Power-down Supply Current versus Temperature All Functions Disabled 4.5 3.6V 3.4V 3.3V 3.2V 3.0V 2.8V 2.7V 4.0 3.5 ICC (µA) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -25 -10 5 20 35 50 Temperature (°C) 74 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 65 80 95 110 Figure 31-16. Power-down Supply Current versus Temperature Watchdog and Sampled BOD Enabled and Running from Internal ULP Oscillator 6.0 3.6V 3.4V 3.3V 3.2V 3.0V 2.8V 2.7V 5.5 5.0 ICC (µA) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 -40 -25 -10 5 20 35 50 65 80 95 110 Temperature (°C) 31.1.4 Power-save Supply Current Figure 31-17. Power-save Supply Current versus Temperature with WDT, Sampled BOD, and RTC from ULP Enabled 3.3V 3.0V 2.7V 1.8V 2.2V 3.0 2.5 ICC (µA) 2.0 1.5 1.0 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (°C) 31.1.5 Pin Pull-up Figure 31-18. Reset Pull-up Resistor Current versus Reset Pin Voltage, VCC = 3.0V 140 -40°C 120 25°C IRESET (µA) 100 85°C 80 105°C 60 40 20 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 VRESET (V) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 75 Figure 31-19. Reset Pull-up Resistor Current versus Reset Pin Voltage VCC = 3.3V 140 -40°C 25°C 120 IRESET (µA) 100 85°C 80 105°C 60 40 20 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 VRESET (V) 31.1.6 Pin Output Voltage versus Sink/Source Current Figure 31-20. I/O Pin Output Voltage versus Source Current VCC = 3.0V 3.2 2.8 VPIN (V) 2.4 -40°C 2.0 1.6 25°C 1.2 85°C 0.8 0.4 105°C 0 -16 -14 -12 -10 -8 -6 -4 -2 0 IPIN (mA) Figure 31-21. I/O Pin Output Voltage versus Source Current VCC = 3.3V 3.6 3.2 2.8 VPIN (V) 2.4 2.0 1.6 25°C 105°C 1.2 0.8 0.4 85°C -40°C 0 -20 -18 -16 -14 -12 -10 IPIN (mA) 76 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 -8 -6 -4 -2 0 Figure 31-22. I/O Pin Output Voltage versus Sink Current VCC = 3.0V 1 105°C 85°C VPIN (V) 0.9 0.8 25°C 0.7 -40°C 0.6 0.5 0.4 0.3 0.2 0.1 0 0 2 4 6 8 10 12 14 16 IPIN (mA) Figure 31-23. I/O Pin Output Voltage versus Sink Current VCC = 3.3V 1.4 105°C 85°C 1.2 VPIN (V) 1.0 25°C -40°C 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 18 20 IPIN (mA) 31.1.7 Thresholds and Hysteresis Figure 31-24. I/O Pin Input Threshold Voltage versus VCC VIH - Pin Read as “1” 1.76 -40°C 25°C 85°C 105°C 1.69 Vthreshold (V) 1.62 1.55 1.48 1.41 1.34 1.27 1.20 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 77 Figure 31-25. I/O Pin Input Threshold Voltage versus VCC VIL - Pin Read as “0” 1.61 -40°C 25°C 85°C 105°C 1.53 Vthreshold (V) 1.45 1.37 1.29 1.21 1.13 1.05 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-26. I/O Pin Input Hysteresis versus VCC 0.205 0.202 Vthreshold (V) 0.199 0.196 0.193 -40°C 0.190 25°C 0.187 85°C 0.184 0.181 105°C 0.178 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) Figure 31-27. Reset Input Threshold Voltage versus VCC VIH - Pin Read as “1” 1.75 25°C 85°C 105°C Vthreshold (V) 1.65 1.55 1.45 1.35 1.25 1.15 2.7 2.8 2.9 3 3.1 3.2 VCC (V) 78 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 3.3 3.4 3.5 3.6 Figure 31-28. Reset Input Threshold Voltage versus VCC VIL - Pin Read as “0” 1.75 25°C 85°C 105°C Vthreshold (V) 1.65 1.55 1.45 1.35 1.25 1.15 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 VCC (V) 31.1.8 BOD Thresholds Figure 31-29. BOD Thresholds versus Temperature BOD Level = 2.6V 2.61 2.60 2.59 Rising VCC VBOT (V) 2.58 2.57 2.56 Falling VCC 2.55 2.54 2.53 2.52 2.51 -40 -25 -10 5 20 35 50 65 80 95 110 Temperature (°C) 31.1.9 Oscillators and Wake-up Time 126.96.36.199 Internal 32.768kHz Oscillator Figure 31-30. Internal 32.768kHz Oscillator Calibration Step Size T = –40 to 105°C, VCC = 3V Frequency Step Size (%) 1.0 -40°C 25°C 85°C 105°C 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 0 32 64 96 128 160 192 224 256 RC32KCAL (7..0) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 79 188.8.131.52 Internal 2MHz Oscillator Figure 31-31. Internal 2MHz Oscillator CALA Calibration Step Size VCC = 3V Frequency Step Size (%) 0.260 0.245 0.230 0.215 0.200 0.185 -40°C 0.170 25°C 0.155 85°C 105°C 0.140 0 20 40 60 80 100 120 140 CALA Figure 31-32. Internal 2MHz Oscillator CALB Calibration Step Size VCC = 3V, CALA = Mid Value Frequency Step Size (%) 2.95 2.70 2.45 2.20 1.95 1.70 1.45 1.20 -40°C 25°C 85°C 105°C 0.95 0.70 0 8 16 24 32 40 48 56 64 CALB 184.108.40.206 Internal 32MHz Oscillator Figure 31-33. Internal 32MHz Oscillator CALA Calibration Step Size, VCC = 3V Frequency Step Size (%) 0.27 0.25 0.23 0.21 25°C 0.19 -40°C 0.17 85°C 0.15 105°C 0.13 0 16 32 48 64 CALA 80 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 80 96 112 128 Figure 31-34. Internal 32MHz Oscillator CALB Calibration Step Size VCC = 3V, CALA = Mid Value 2.80 Frequency Step Size (%) 2.55 2.30 2.05 1.80 1.55 1.30 -40°C 25°C 85°C 105°C 1.05 0.80 0 8 16 24 32 40 48 56 64 CALB Module Current Consumption Figure 31-35. Power-up Current Consumption versus VCC 700 -40°C 25°C 85°C 600 500 ICC (µA) 31.1.10 400 300 200 100 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VCC (V) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 81 32. Errata 32.1 Atmel ATxmega64D3 32.1.1 Rev. I ● 1. AC system status flags are only valid if AC-system is enabled AC System Status Flags are only Valid if AC-system is Enabled The status flags for the ac-output are updated even though the AC is not enabled which is invalid. Also, it is not possible to clear the AC interrupt flags without enabling either of the Analog comparators. Problem Fix/Workaround Software should clear the AC system flags once, after enabling the AC system before using the AC system status flags. 32.1.2 Rev. H - Rev. A Not sampled. 82 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 33. Ordering Information Flash [bytes] EEPROM [bytes] SRAM [bytes] Speed [MHz] Power supply Package Ordering Code (1)(2) Temp. ATxMega64D3-15AT1(3) 65536 2048 4096 Up to 32MHz 2.7V to 3.6V MD –40°C to +105°C ATxMega64D315A2T1(3) 65536 2048 4096 Up to 32MHz 2.7V to 3.6V MF –40°C to +105°C Notes: 1. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 2. For packaging information, see Section 34.1 “Packaging Information” on page 84. 3. Tape and Reel. 34. Package Information Package Type MD 64-lead, 1414mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP) MF 64-lead, 1010mm body size, 1.0mm body thickness, 0.5mm lead pitch, thin profile plastic quad flat package (TQFP) ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 83 34.1 Packaging Information Figure 34-1. Package MD Drawings not scaled 64 D1 A A2 A1 E1 e L 0°~7° C Top View Side View D COMMON DIMENSIONS (Unit of Measure = mm) Symbol MIN NOM A E b Bottom View MAX NOTE 1.20 A1 0.05 A2 0.95 0.15 1.00 1.05 D/E 15.75 16.00 16.25 D1/E1 13.90 14.00 14.10 C 0.09 0.20 L 0.45 0.75 b 0.30 0.37 e 0.80 TYP. n 44 2 0.45 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. 03/30/12 Package Drawing Contact: email@example.com 84 ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 TITLE GPC DRAWING NO. REV. MD, 64 Lds - 0.80mm Pitch, 14x14x1.00mm Body size Thin Profile Plastic Quad Flat Package (TQFP) ADY MD G Figure 34-2. Package MF Drawings not scaled D A 0° to 7° D1 e 64 E E1 f J C Side View Top View COMMON DIMENSIONS (Unit of Measure = mm) Symbol NOM A 12° A1 Detail View MIN 0.102 max. Lead coplanarity MAX 1.20 A1 0.95 1.05 C 0.09 0.20 D/E 12.00 D1/E1 10.00 2 J 0.05 0.15 L 0.45 0.75 e f n NOTE 0.50 BSC 0.17 0.27 64 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MS-026, Variation ACD. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. 05/03/13 Package Drawing Contact: firstname.lastname@example.org TITLE GPC DRAWING NO. REV. MF, 64 Lds - 0.50mm Pitch, 10x10x1.00mm Body size Thin Profile Plastic Quad Flat Package (TQFP) AIN MF D ATxmega64D3 [DATASHEET] 9322A–AVR–03/14 85 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2014 Atmel Corporation. / Rev.: 9322A–AVR–03/14 Atmel®, Atmel logo and combinations thereof, Adjacent Key Suppression®, AKS®, AVR®, Enabling Unlimited Possibilities®, QTouch®, XMEGA®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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