AT93C56B and AT93C66B 3-wire Automotive Temperature Serial EEPROM 2K (256 x 8 or 128 x 16) and 4K (512 x 8 or 256 x 16) DATASHEET Features Medium-voltage and Standard-voltage Operation ̶ VCC = 2.5V to 5.5V Automotive Temperature Range -40C to 125C User-selectable Internal Organization ̶ ̶ 2K: 256 x 8 or 128 x 16 4K: 512 x 8 or 256 x 16 3-wire Serial Interface Sequential Read Operation 2MHz Clock Rate Self-timed Write Cycle (5ms max) High Reliability ̶ ̶ Endurance: 1,000,000 Write Cycles Data Retention: 100 Years Lead-free/Halogen-free Devices Available 8-lead JEDEC SOIC and 8-lead TSSOP Packages Description The Atmel® AT93C56B/66B provides 2,048/4,096 bits of Serial Electrically Erasable Programmable Read-Only Memory (EEPROM). The EEPROM is organized as 128/256 words of 16 bits each when the ORG pin is connected to VCC and 256/512 words of 8 bits each when it is tied to ground. The device is optimized for use in many automotive applications where low-power and low-voltage operations are essential. AT93C56B/66B is available in space-saving 8-lead JEDEC SOIC and 8-lead TSSOP packages. AT93C56B/66B is enabled through the Chip Select (CS) pin and accessed via a 3-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the data is clocked out serially on the data output pin DO. The write cycle is completely self-timed and no separate erase cycle is required before write. The write cycle is only enabled when the part is in the Erase/Write Enable state. When CS is brought high following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of the part. AT93C56B/66B operates from 2.5V to 5.5V. Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 1. Pin Configuration and Pinouts Figure 1. Pin Name 2. Pin Configurations Function 8-lead TSSOP (Top View) (Top View) CS Chip Select CS 1 8 SK Serial Data Clock VCC SK 2 7 DC DI Serial Data Input DI 3 6 ORG DO 4 5 GND DO Serial Data Output GND Ground VCC Power Supply ORG Internal Organization DC Don’t Connect Note: CS SK DI DO 1 2 3 4 8 7 6 5 VCC DC ORG GND Drawings are not to scale. Absolute Maximum Ratings* Operating Temperature 55C to +125C Storage Temperature 65C to +150C Voltage on any pin with respect to ground 1.0V to +7.0V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA 2 8-lead SOIC AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability 3. Block Diagram Figure 3-1. Block Diagram VCC GND Memory Array ORG 256/512 x 8 or 128/256 x 16 Address Decoder Data Register Output Buffer DI CS SK Note: Mode Decode Logic Clock Generator DO When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is connected to ground, the “x 8” organization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the internal 1m pullup, then the “x 16” organization is selected. AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 3 4. Electrical Characteristics 4.1 Pin Capacitance Table 4-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = +5.0V (unless otherwise noted). Symbol Test Conditions COUT CIN Note: 4.2 1. Max Units Conditions Output Capacitance (DO) 5 pF VOUT = 0V Input Capacitance (CS, SK, DI) 5 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Table 4-2. DC Characteristics Applicable over recommended operating range from: TA = 40C to +125C, VCC = +2.5V to +5.5V (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Supply Voltage ICC Supply Current VCC = 5.0V ISB1 Standby Current ISB2 Min Typ Max Unit 2.5 5.5 V 4.5 5.5 V Read at 1.0MHz 0.5 2.0 mA Write at 1.0MHz 0.5 2.0 mA VCC = 2.5V CS = 0V 3.0 10.0 μA Standby Current VCC = 5.0V CS = 0V 10.0 15.0 μA IIL Input Leakage VIN = 0V to VCC 0.1 3.0 μA IOL Output Leakage VIN = 0V to VCC 0.1 3.0 μA VIL1(1) Input Low Voltage 0.6 0.8 V VIH1(1) Input High Voltage 2.0 VCC + 1 VOL1 Output Low Voltage VOH1 Output High Voltage Note: 4 Test Condition 1. 2.5V VCC 5.5V 2.5V VCC 5.5V IOL = 2.1m IOH = 0.4mA VIL min and VIH max are reference only and are not tested. AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 0.4 2.4 V V 4.3 AC Characteristics Table 4-3. AC Characteristics Applicable over recommended operating range from TA = 40°C to + 125°C, VCC = As Specified, CL = 1 TTL Gate and 100pF (unless otherwise noted). Symbol Parameter fSK SK Clock Frequency tSKH SK High Time tSKL SK Low Time tCS Minimum CS Low Time tCSS CS Setup Time Relative to SK tDIS DI Setup Time Relative to SK tCSH CS Hold Time Relative to SK tDIH DI Hold Time Relative to SK tPD1 Output Delay to “1” AC Test tPD0 Output Delay to “0” AC Test tSV CS to Status Valid AC Test tDF CS to DO in High Impedance tWP Write Cycle Time Endurance(1) 5.0V, 25°C Note: 1. Test Condition Min Typ Max 4.5V VCC 5.5V 0 2 2.5V VCC 5.5V 0 1 4.5V VCC 5.5V 250 2.5V VCC 5.5V 250 4.5V VCC 5.5V 250 2.5V VCC 5.5V 250 4.5V VCC 5.5V 250 2.5V VCC 5.5V 250 4.5V VCC 5.5V 50 2.5V VCC 5.5V 50 4.5V VCC 5.5V 100 2.5V VCC 5.5V 100 Units MHz ns ns ns ns ns 0 4.5V VCC 5.5V 100 2.5V VCC 5.5V 100 ns ns 4.5V VCC 5.5V 250 2.5V VCC 5.5V 500 4.5V VCC 5.5V 250 2.5V VCC 5.5V 500 4.5V VCC 5.5V 250 2.5V VCC 5.5V 250 AC Test 4.5V VCC 5.5V 100 CS = VIL 2.5V VCC 5.5V 150 2.5V VCC 5.5V 5 1M ns ns ns ns ms Write Cycles This parameter is characterized and is not 100% tested. AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 5 5. Instruction Set Table 5-1. Instruction Set for the AT93C56B/66B Address Instruction Opcode x8 x 16 Read 1 10 A8 – A0 A7 A0 EWEN 1 00 11XXXXXXX 11XXXXXX Erase 1 11 A8 A0 A7 A0 Write 1 01 A8 A0 A7 A0 ERAL 1 00 10XXXXXXX 10XXXXXX WRAL 1 00 01XXXXXXX 01XXXXXX EWDS 1 00 00XXXXXXX 00XXXXXX Note: 6 Data SB x8 x 16 Reads data stored in memory, at specified address. Write enable must precede all programming modes. Erase memory location An A0. D7 D0 D15 D0 Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 Writes memory location An A0. Erases all memory locations. Valid only at VCC = 4.5V to 5.5V. D7 D0 D15 D0 The X in the address field represent don’t care values and must be clocked. AT93C56B/66B Automotive [DATASHEET] Comments Writes all memory locations. Valid only at VCC = 5.0V ±10% and Disable Register cleared. Disables all programming instructions. 6. Functional Description AT93C56B/66B is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the host processor. A valid instruction starts with a rising edge of CS and consists of a start bit (Logic 1) followed by the appropriate opcode and the desired memory address location. Read: The Read instruction contains the address code for the memory location to be read. After the instruction and address are decoded, data from the selected memory location is available at the serial output pin DO. Output data changes are synchronized with the rising edges of serial clock SK. It should be noted that a dummy bit (Logic 0) precedes the 8- or 16-bit data output string. AT93C56B/66B supports sequential read operations. The device will automatically increment the internal address pointer and clock out the next memory location as long as Chip Select (CS) is held high. In this case, the dummy bit (Logic 0) will not be clocked out between memory locations, thus allowing for a continuous stream of data to be read. Figure 6-1. Read Timing tCS CS SK DI DO A0 AN High Impedance DN D0 Erase/Write Enable (EWEN): To assure data integrity, the part automatically goes into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable (EWEN) instruction must be executed first before any programming instructions can be carried out. Please note that once in the EWEN state, programming remains enabled until an EWDS instruction is executed or VCC power is removed from the part. Figure 6-2. EWEN Timing tCS CS SK DI 1 0 0 1 1 ... AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 7 Erase: The Erase instruction programs all bits in the specified memory location to the Logical 1 state. The self-timed erase cycle starts once the Erase instruction and address are decoded. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250ns (tCS). A Logic 1 at pin DO indicates that the selected memory location has been erased, and the part is ready for another instruction. Figure 6-3. Erase Timing tCS CS STANDBY CHECK STATUS SK DI 1 1 1 AN AN-1 AN-2 ... A0 tDF tSV DO High Impedance High Impedance BUSY READY tWP Write: The Write instruction contains the 8 or 16 bits of data to be written into the specified memory location. The self-timed programming cycle, tWP, starts after the last bit of data is received at serial data input pin DI. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250ns (tCS). A Logic 0 at DO indicates that programming is still in progress. A Logic 1 indicates that the memory location at the specified address has been written with the data pattern contained in the instruction and the part is ready for further instructions. A Ready/Busy status cannot be obtained if the CS is brought high after the end of the self-timed programming cycle, tWP.. Figure 6-4. Write Timing tCS CS SK DI DO 1 0 1 AN ... A0 DN ... D0 High Impedance BUSY tWP 8 AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 READY Erase All (ERAL): The Erase All (ERAL) instruction programs every bit in the memory array to the Logic 1 state and is primarily used for testing purposes. The DO pin outputs the ready/busy status of the part if CS is brought high after being kept low for a minimum of 250ns (tCS). The ERAL instruction is valid only at VCC = 5.0V 10%. Figure 6-5. ERAL Timing tCS CS CHECK STATUS STANDBY tSV tDF SK DI 1 DO 0 0 1 0 BUSY High Impedance High Impedance READY tWP Note: 1. Valid only at VCC = 4.5V to 5.5V. Write All (WRAL): The Write All (WRAL) instruction programs all memory locations with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy status of the part if CS is brought high after being kept low for a minimum of 250ns (tCS). The WRAL instruction is valid only at VCC = 5.0V ±10%. Figure 6-6. WRAL Timing tCS CS SK DI 1 0 0 0 1 ... DN ... D0 BUSY High Impedance DO READY tWP Note: 1. Valid only at VCC = 4.5V to 5.5V AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 9 Erase/Write Disable (EWDS): To protect against accidental data disturb, the Erase/Write Disable (EWDS) instruction disables all programming modes and should be executed after all programming operations. The operation of the Read instruction is independent of both the EWEN and EWDS instructions and can be executed at any time. Figure 6-7. EWDS Timing tCS CS SK DI 10 1 0 0 0 0 AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 ... 7. Timing Diagrams Figure 7-1. Synchronous Data Timing CS VIH 1µs(1) VIL tCSS SK DI tSKL tSKH VIL VIH tDIS tDIH VIL tPD0 DO (READ) DO (PROGRAM) Note: tCSH VIH tDF tPD1 VOH VOL VOH tDF tSV Status Valid VOL This is the minimum SK period. Table 7-1. Organization Key for Timing Diagrams AT93C56B (2K) Notes: 7.1 1. 2. AT93C66B (4K) I/O x8 x 16 x8 x 16 AN A8(1) A7(2) A8 A7 DN D7 D15 D7 D15 A8 is a don’t care value, but the extra clock is required. A7 is a don’t care value, but the extra clock is required. Power Recommendation The device internal POR (Power-On Reset) threshold is just below the minimum device operating voltage. Power shall rise monotonically from 0.0Vdc to full VCC in less than 1ms. Hold at full VCC for at least 100μs before the first operation. Power shall drop from full VCC to 0.0Vdc in less than 1ms. Power dropping to a non-zero level and then slowly going to zero is not recommended. Power shall remain off (0.0Vdc) for 0.5s minimum. Please consult Atmel if your power conditions do not meet the above recommendations. AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 11 8. Ordering Information 8.1 Ordering Code Detail AT 9 3 C 5 6 B - S S P D - T Atmel Designator Shipping Carrier Option T = Tape and Reel Product Family Operating Voltage 93C = 3-wire Automotive Serial EEPROM D = 2.5V to 5.5V Package Device Grade Device Density P = Lead-free / Halogen-free AutomotiveTemperature Range (-40°C to +125°C) 56 = 2 kilobit 66 = 4 kilobit Device Revision Package Type SS = JEDEC SOIC X = TSSOP 8.2 Atmel Ordering Code Information Delivery Information Ordering Code Lead Finish AT93C56B-SSPD-T AT93C56B-XPD-T AT93C66B-SSPD-T AT93C66B-XPD-T Package Lead-free Halogen-free Lead-free Halogen-free Form 8S1 8X Tape and Reel 8S1 8X Quantity Operation Range 4,000 per Reel Automotive Temperature (40C to 125C) 5,000 per Reel 4,000 per Reel Tape and Reel 5,000 per Reel Package Type 12 8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP) AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 Automotive Temperature (40C to 125C) 9. Product Markings AT93C56B and AT93C66B: Package Marking Information 8-lead TSSOP 8-lead SOIC ATPYWW ###D @ AAAAAAA ATMLPYWW ###D @ AAAAAAAA Note 1: designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT93C56B Truncation Code ###: 56B AT93C66B Truncation Code ###: 66B Date Codes Y = Year 2: 2012 3: 2013 4: 2014 5: 2015 Voltages 6: 2016 7: 2017 8: 2018 9: 2019 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code D: 2.5V min Grade/Lead Finish Material P: Automotive/NiPdAu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 3/15/12 TITLE Package Mark Contact: [email protected] 93C56-66BAM, AT93C56B and AT93C66B Automotive Package Marking Information DRAWING NO. REV. 93C56-66BAM C AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 13 10. Packaging Information 10.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. MIN NOM MAX – – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 SYMBOL A D 4.90 BSC E 6.00 BSC E1 3.90 BSC e 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° NOTE 3/6/2015 Package Drawing Contact: [email protected] 14 TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 GPC SWB DRAWING NO. REV. 8S1 H 10.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e COMMON DIMENSIONS (Unit of Measure = mm) A2 D SYMBOL Side View Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E NOTE 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] GPC 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) TNR DRAWING NO. 8X AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 REV. E 15 11. 16 Revision History Doc. Rev. Date 8811C 02/2016 8811B 08/2012 8811A 06/2012 Comments Updated 8S1 and 8X package drawings and ordering information. Added the ordering code detail. Removed bulk(tube) options. Document reorganization. Removed preliminary status. Updated Atmel logos and disclaimer/copy page. Initial document release AT93C56B/66B Automotive [DATASHEET] Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2016 Atmel Corporation. / Rev.: Atmel-8811C-SEEPROM-AT93C56B-66B-Auto-Datasheet_022016. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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