AT30TSE752/754/758 - Mature

AT30TSE752, AT30TSE754, AT30TSE758
NOT RECOMMENDED
FOR NEW DESIGNS
9- to 12-bit Selectable, ±0.5°C Accurate
Digital Temperature Sensor with Nonvolatile Registers
and Serial EEPROM
AT30TSE752
Replaced by
AT30TSE752A
AT30TSE754
Replaced by
AT30TSE754A
AT30TSE758
Replaced by
AT30TSE758A
DATASHEET
See Applicable Errata in Section 16.
Features
 Integrated Temperature Sensor + Nonvolatile Registers + Serial EEPROM
 2-Wire I2C and SMBus™ compatible serial interface
Supports SMBus Timeout
Supports SMBus Alert and Alert Response Address (ARA)
 Selectable addressing allows up to eight devices on the same bus


 Single 2.7V – 5.5V supply
 100kHz and 400kHz compatibility
 Industry standard green (Pb/Halide-free/RoHS compliant) package options
8-lead SOIC (150-mil)
8-lead MSOP (3.0mm x 3mm)
 8-pad Ultra Thin DFN (UDFN — 2.0mm x 3.0mm x 0.6mm)


Digital Temperature Sensor Features
 Measures temperature from -55C to +125C
 Highly accurate temperature measurements requiring no external components
±1.0°C accuracy (typical) over the -5C to +90C range
±2.0°C accuracy (typical) over the -20C to +125C range
 ±3.0°C accuracy (typical) over the -40C to +125C range


 Pin and software compatible to industry-standard LM75-type devices
 User-configurable resolution

9 to 12 bits (0.5000C to 0.0625C)
 User-configurable high and low temperature limits
 Nonvolatile registers to retain user-configured or pre-defined power-up defaults
 Register locking to prevent erroneous misconfiguration
 Register lockdown for permanent, non-changeable device configuration
 One-Shot mode for single temperature measurement while in Shutdown mode
 ALERT output pin for indicating temperature alarms
 Low power dissipation

75μA active current (typical) during temperature measurements
 Shutdown mode to minimize power consumption

1μA active current (typical)
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Serial EEPROM Features
 Atmel® AT30TSE752 Integrates 2Kb of EEPROM
 Atmel AT30TSE754 Integrates 4Kb of EEPROM
 Atmel AT30TSE758 Integrates 8Kb of EEPROM
 Reversible software Write protection for full array
 Supports byte and Page Write operations
 Self-timed Write cycle (5ms maximum)
 High-reliability


2
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Endurance: 1,000,000 Write cycles
Data retention: 100 years
T ab le of Cont ent s
1. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Pin Descriptions and Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Device Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
4.2
4.3
4.4
Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acknowledge (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
No-Acknowledge (NACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
8
8
9
5. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1
5.2
5.3
Temperature Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.1
Fault Tolerance Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.2
Comparator Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.3
Interrupt Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Shutdown Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3.1
One-Shot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
11
11
12
13
14
14
6. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1
6.2
6.3
6.4
6.5
6.6
Pointer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.1
OS Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.2
R1:R0 Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.3
FT1:FT0 Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.4
POL Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.5
CMP/INT Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.6
SD Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.7
NVRBSY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Nonvolatile Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.1
NVR1: NVR0 Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.2
NVFT1:NVFT0 Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.3
NVPOL Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.4
NVCMP/INT Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.5
NVSD Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.6
RLCKDWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.7
RLCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TLOW and THIGH Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Nonvolatile TLOW and THIGH Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . .
15
17
19
20
20
21
21
21
21
22
23
24
25
25
25
25
25
26
27
29
7. Register Locking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8. Operations Allowed During Nonvolatile Busy Status . . . . . . . . . . . . . . . 32
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
3
9. Other Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.1
9.2
Copy Nonvolatile Registers to Volatile Registers . . . . . . . . . . . . . . . . . . . . . . 33
Copy Volatile Registers to Nonvolatile Registers . . . . . . . . . . . . . . . . . . . . . . 34
10. Serial EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.1
10.2
10.3
10.4
10.5
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.3.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.3.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.3.3 Acknowledge Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.4.1 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.4.2 Random Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.4.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
35
36
36
36
37
38
38
39
40
41
11. SMBus Features and I2C General Call . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
11.1
11.2
11.3
SMBus Alert . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
SMBus Timeout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
General Call . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
12.9
12.10
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC and AC Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Sensor Accuracy and Conversion Characteristics . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Nonvolatile Register and Serial EEPROM Characteristics . . . . . . . . . . . . . . .
Power-Up Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Test Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . .
Output Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
45
45
46
47
48
49
49
50
50
50
13. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
13.1
13.2
Atmel Ordering Code Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Green Package Options (Pb/Halide-free/RoHS Compliant) . . . . . . . . . . . . . . 52
14. Part Marking Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
15. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
15.1
15.2
15.3
8S1 — 8-lead JEDEC SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8XM — 8-lead MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
8MA2 — 8-pad UDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
16. Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
16.1
16.2
16.3
Fault Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
ALERT Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
ALERT Pin State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
17. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
1.
Description
The Atmel® AT30TSE752/754/758 are a complete, precise temperature monitoring device designed for use in a variety
of applications that require the measuring of local temperatures as an integral part of the system's function and/or
reliability. The AT30TSE752/754/758 devices combine a high-precision digital temperature sensor, programmable high
and low temperature alarms, and a 2-wire I2C and SMBus (System Management Bus) compatible serial interface into a
single, compact package.
The temperature sensor can measure temperatures over the full -55°C to +125°C temperature range and has a typical
accuracy as precise as ±0.5°C from 0°C to +85°C. The result of the digitized temperature measurements are stored in
one of the AT30TSE752/754/758's internal registers, which is readable at any time through the device's serial interface.
The AT30TSE752/754/758 utilizes flexible, user-programmable internal registers to configure the temperature sensor's
performance and response to high and low temperature conditions. The device also contains a set of Nonvolatile
Registers to retain the configuration and temperature limit settings even after the device has been power cycled, thereby
eliminating the need for the device to be reconfigured after each Power-up operation. This additional flexibility permits
the device to run self-contained and not rely upon a host controller for device configuration.
In addition, the AT30TSE752/754/758 contain a 2Kb, 4Kb, or 8Kb Serial EEPROM that can be used to store vital user
system configuration and preference data. This additional feature permits the device to replace an existing
2-wire I2C Serial EEPROM in an application saving board space and component cost.
A dedicated alarm output activates if the temperature measurement exceeds the user-defined temperature and fault
count limits. To reduce current consumption and save power, the AT30TSE752/754/758 features a Shutdown mode that
turns off all internal circuitry except for the internal Power-On Reset (POR) and serial interface circuits. The device can
also be configured to power-up in the Shutdown mode to ensure that the device remains in a low-power state until the
user wishes to perform temperature measurements.
The AT30TSE752/754/758 are factory-calibrated and requires no external components to measure temperature. With it’s
flexibility and high-degree of accuracy, the AT30TSE752/754/758 are ideal for extended temperature measurements in a
wide variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
5
2.
Pin Descriptions and Pinouts
Table 1.
Pin Description
Symbol
Name and Function
SCL
Serial Clock: This pin is used to provide a clock to the device and is used to control
the flow of data to and from the device. Command and input data present on the SDA
pin is always latched in on the rising edge of SCL, while output data on the SDA pin is
always clocked out on the falling edge of SCL.
Asserted
State
Type
—
Input
—
Input/Output
—
Output
—
Input
—
Power
—
Power
The SCL pin must either be forced high when the serial bus is idle or pulled-high using
an external pull-up resistor.
SDA
Serial Data: The SDA pin is an open-drain bidirectional input/output pin used to
serially transfer data to and from the device.
The SDA pin must be pulled-high using an external pull-up resistor and may be
wire-ANDed with any number of other open-drain or open-collector pins from other
devices on the same bus.
ALERT
ALERT: The ALERT pin is an open-drain output pin used to indicate when the
temperature goes beyond the user-programmed temperature limits. The ALERT pin
can be operated in one of two different modes (Interrupt or Comparator mode) as
defined by the CMP/INT bit in the Configuration Register. The ALERT pin defaults to
an active-low output upon device power-up or reset but can be reconfigured as an
active-high output by setting the POL bit in the Configuration Register.
This pin can be wire-ANDed together with ALERT pins from other devices on the same
bus. When wire-ANDing pins together, the ALERT pin should be configured as an
active-low output so that when a single ALERT pin on the common alert bus goes
active, the entire common alert bus will go low and the host controller will be properly
notified since other ALERT pins that may be in the inactive-high state will not mask the
true alert signal. In an SMBus environment, the SMBus host can respond by sending
an SMBus ARA (Alert Response Address) command to determine which device on the
SMBus generated the alert signal.
The ALERT pin must be pulled-high using an external pull-up resistor even when it is
not used. Care must also be taken to prevent this pin from being shorted directly to
ground without a resistor at any time whether during testing or normal operation.
A2-0
Address Inputs: The A2-0 pins are used to select the device address and correspond
to the three least-significant bits (LSBs) of the I2C/SMBus 7-bit slave address. These
pins can be directly connected in any combination to VCC or GND, and by utilizing the
A2-0 pins, up to eight devices may be addressed on a single bus.
The A2-0 pins are internally pulled to GND and may be left floating. However, it is highly
recommended that the A2-0 pins always be directly connected to VCC or GND to ensure
a known address state.
VCC
Device Power Supply: The VCC pin is used to supply the source voltage to the device.
Operations at invalid VCC voltages may produce spurious results and should not be
attempted.
GND
6
Ground: The ground reference for the power supply. GND should be connected to the
system ground.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Figure 1.
Pin Configurations
8-MSOP
8-UDFN
(Top View)
(Top View)
1
SDA
8
2
SCL
3.
8-SOIC
(Top View)
7
VCC
A0
ALERT
3
6
A1
GND
4
5
A2
SDA
1
8
SCL
2
7
ALERT
GND
6
3
5
4
VCC
A0
A1
A2
SDA
1
8
VCC
SCL
2
7
A0
ALERT
3
6
A1
GND
4
5
A2
Block Diagram
Figure 3-1. Block Diagram
Pointer
Register
2
I C/SMBus
Interface
Control
and
Logic
SCL
SDA
A2-0
Nonvolatile
Configuration
Register
Configuration
Register
Nonvolatile
THIGH Limit
Register
THIGH Limit
Register
Nonvolatile
TLOW Limit
Register
TLOW Limit
Register
Temperature
Register
A/D
Converter
3
Temperature
Sensor
Digital
Comparator
Serial
EEPROM
ALERT
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
7
4.
Device Communication
The AT30TSE752/754/758 operates as a slave device and utilizes a simple 2-wire I2C and SMBus compatible digital
serial interface to communicate with a host controller, commonly referred to as the bus Master. The Master initiates and
controls all Read and Write operations to the slave devices on the serial bus, and both the Master and the slave devices
can transmit and receive data on the bus.
The serial interface is comprised of just two signal lines: Serial Clock (SCL) and Serial Data (SDA). The SCL pin is used
to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive command and data
information from the Master as well as to send data back to the Master. Data is always latched into the
AT30TSE752/754/758 on the rising edge of SCL and always output from the device on the falling edge of SCL. Both the
SCL and SDA pin incorporate integrated spike suppression filters and Schmitt triggers to minimize the effects of input
spikes and bus noise.
All command and data information is transferred with the Most-Significant Bit (MSB) first. During bus communication, one
data bit is transmitted every clock cycle, and after eight bits (one byte) of data has been transferred, the receiving device
must respond with either an acknowledge (ACK) or a no-acknowledge (NACK) response bit during a ninth clock cycle
(ACK/NACK clock cycle) generated by the Master. Therefore, nine clock cycles are required for every one byte of data
transferred. There are no unused clock cycles during any Read or Write operation, so there must not be any interruptions
or breaks in the data stream during each data byte transfer and ACK or NACK clock cycle.
During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable while
SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will occur. Start and
Stop conditions are used to initiate and end all serial bus communication between the Master and the slave devices. The
number of data bytes transferred between a Start and a Stop condition is not limited and is determined by the Master.
In order for the serial bus to be idle, both the SCL and SDA pins must be in the logic-high state at the same time.
4.1
Start Condition
A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is stable in the logic-high
state. The Master uses a Start condition to initiate any data transfer sequence, and the Start condition must precede any
command. The AT30TSE752/754/758 will continuously monitor the SDA and SCL pins for a Start condition, and the
device will not respond unless one is given.
4.2
Stop Condition
A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the logic-high
state. The Master uses the Stop condition to end a data transfer sequence to the AT30TSE752/754/758 which will
subsequently return to the idle state. The Master can also utilize a repeated Start condition instead of a Stop condition to
end the current data transfer if the Master will perform another operation.
4.3
Acknowledge (ACK)
After every byte of data received, the AT30TSE752/754/758 must acknowledge to the Master that it has successfully
received the data byte by responding with an ACK. This is accomplished by the Master first releasing the SDA line and
providing the ACK/NACK clock cycle (a ninth clock cycle for every byte). During the ACK/NACK clock cycle, the
AT30TSE752/754/758 must output a Logic 0 (ACK) for the entire clock cycle such that the SDA line must be stable in the
logic-low state during the entire high period of the clock cycle.
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4.4
No-Acknowledge (NACK)
When the AT30TSE752/754/758 are transmitting data to the Master, the Master can indicate that it is done receiving data
and wants to end the operation by sending a NACK response to the AT30TSE752/754/758 instead of an ACK response.
This is accomplished by the Master outputting a Logic 1 during the ACK/NACK clock cycle, at which point the
AT30TSE752/754/758 will release the SDA line so that the Master can then generate a Stop condition.
In addition, the AT30TSE752/754/758 can use a NACK to respond to the Master instead of an ACK for certain invalid
operation cases such as an attempt to write to a Read-only Register (e.g. an attempt to write to the Temperature
Register).
Figure 4-1. Start, Stop, and ACK
SCL
Data
Must be
Stable
Data
Must be
Stable
Data
Must be
Stable
1
2
8
9
SDA
Start
Condition
Data
Change
Allowed
Data
Change
Allowed
Data
Change
Allowed
Data
Change
Allowed
ACK
Stop
Condition
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9
5.
Device Operation
Commands used to configure and control the operation of the AT30TSE752/754/758 are sent to the device from the
Master via the serial interface. Likewise, the Master can read the temperature data from the AT30TSE752/754/758 via
the serial interface. However, since multiple slave devices can reside on the serial bus, each slave device must have its
own unique 7-bit address so that the Master can access each device independently.
For the AT30TSE752/754/758, the first four MSBs of its 7-bit address are the device type identifier and are fixed at 1001
for temperature sensor and 1010 for Serial EEPROM. The remaining three LSBs correspond to the states of the
hard-wired A2-0 address pins.
Example:
If the A2-0 pins are connected to GND, then the 7-bit device address would be 1001000 or 1010000.
In order for the Master to select and access the AT30TSE752/754/758, the Master must first initiate a Start condition.
Following the Start condition, the Master must output the device address byte. The device address byte consists of the
7-bit device address plus a Read/Write (R/W) control bit, which indicates whether the Master will be performing a Read or
a Write to the AT30TSE752/754/758. If the R/W control bit is a Logic 1, then the Master will be reading data from the
AT30TSE752/754/758. Alternatively, if the R/W control bit is a Logic 0, then the Master will be writing data to the
AT30TSE752/754/758.
Table 5-1.
AT30TSE752/754/758 Address Byte
Bit 7
Function
Bit 6
Bit 5
Bit 4
Bit 3
Device Type Identifier
Bit 2
Bit 1
Device Address
Bit 0
Read/Write
Temp Sensor
1
0
0
1
A2
A1
A0
R/W
Serial EEPROM
1
0
1
0
A2
A1
A0
R/W
Software Write Protection
0
1
1
0
A2
A1
A0
R/W
Note:
1.
See Section 10.5 “Software Write Protect” on page 41 for more information.
If the 7-bit address sent by the Master matches that of the AT30TSE752/754/758, then the device will respond with an
ACK after it has received the full address byte. If there is an address mismatch, then the AT30TSE752/754/758 will
respond with a NACK and return to the idle state.
5.1
Temperature Measurements
The AT30TSE752/754/758 utilizes a band-gap type temperature sensor with an internal sigma-delta Analog-to-Digital
Converter (ADC) to measure and convert the temperature reading into a digital value with a selectable resolution as high
as 0.0625C. The measured temperature is calibrated in degrees Celsius; therefore, a lookup table or conversion routine
is necessary for applications that wish to deal in degrees Fahrenheit.
The result of the digitized temperature measurements are stored in the internal Temperature Register of the
AT30TSE752/754/758, which is readable at any time through the device's serial interface. When in the normal operating
mode, the device performs continuous temperature measurements and updates the contents of the Temperature
Register (see Section 6.2 “Temperature Register” on page 17) after each analog-to-digital conversion.
The resolution of the temperature measurement data can be configured to 9, 10, 11, or 12 bits which corresponds to
temperature increments of 0.5C, 0.25C, 0.125C, and 0.0625C, respectively. Selecting the temperature resolution is
done by setting the R1 and R0 bits in the Configuration Register (see Section 6.3 “Configuration Register” on page 19).
The ADC conversion time does increase with each bit of higher resolution, so careful consideration should be given to
the resolution versus conversion time relationship. The resolution after device power-up or reset will revert to what was
previously selected using the NVR1 and NVR0 bits of the Nonvolatile Configuration Register bits prior to when the device
was powered-down or reset.
With 12 bits of resolution, the AT30TSE752/754/758 can theoretically measure a temperature range of 255C (-128C to
+127C); however, the device is only designed to measure temperatures over a range of -55C to +125C.
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5.2
Temperature Alarm
After the measured temperature value has been stored into the Temperature Register, the data will be compared with
both the high and low temperature limits defined by the values stored in the THIGH Limit Register and TLOW Limit Register.
If the comparison results in a valid fault condition (see Section 5.2.1 “Fault Tolerance Limits” on page 11), then the device
will activate the ALERT output pin.
The polarity and function of the ALERT pin can be configured by using specific bits in the Configuration Register. The
polarity of the ALERT pin is controlled by the POL bit in the Configuration Register while the function of the ALERT pin
changes based on the Alarm Thermostat mode, which can be configured to either Comparator mode (see Section 5.2.2
“Comparator Mode” on page 12) or Interrupt mode (see Section 5.2.3 “Interrupt Mode” on page 13) by using the
CMP/INT bit in the Configuration Register. After the device powers up or resets, the NVPOL and NVCMP/INT bits of the
Nonvolatile Configuration Register are automatically copied into the POL and CMP/INT bits of the Configuration
Register; therefore, the ALERT pin polarity and function will revert back to the settings defined by the NVPOL and
NVCMP/INT bits prior to when the device was powered-down or reset.
The value of the high temperature limit stored in the THIGH Limit Register must be greater than the value of the low
temperature limit stored in the TLOW Limit Register in order for the ALERT function to work properly; otherwise, the
ALERT pin will output erroneous results and will falsely signal temperature alarms.
5.2.1
Fault Tolerance Limits
A temperature fault occurs if the measured temperature meets or exceeds either the high temperature limit set by the
THIGH Limit Register or the low temperature limit set by the TLOW Limit Register. To prevent false alarms due to
environmental or temperature noise, the device incorporates a fault tolerance queue that requires consecutive
temperature faults to occur before resulting in a valid fault condition. The fault tolerance queue value is controlled by the
FT1 and FT0 bits in the Configuration Register and can be set to a single fault count of one or a count of two, four, or six
consecutive faults.
An internal counter that automatically increments after a temperature fault is used to determine if the fault tolerance
queue setting has been met. After incrementing the fault counter, the device will compare the count to the fault tolerance
queue setting to see if a valid fault condition should be triggered. Once a valid fault condition occurs, the device will
activate the ALERT output pin. If the most recent measured temperature does not meet or exceed the high or low
temperature limit, then the internal fault counter will be reset back to zero.
Figure 5-1 shows a sample temperature profile and how each temperature fault would impact the internal fault counter.
Figure 5-1. Fault Count Example
THIGH Limit
Temperature
TLOW Limit
Temperature Measurements/Conversions
After the device powers up or resets, the NVFT1 and NVFT0 bits of the Nonvolatile Configuration Register are
automatically copied into the FT1 and FT0 bits of the Configuration Register. Therefore, the Fault Tolerance Queue
setting will revert back to the settings defined by the NVFT1 and NVFT0 bits prior to when the device was powered-down
or reset.
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11
5.2.2
Comparator Mode
When the device operates in the Comparator mode, then the ALERT pin goes active if the measured temperature meets
or exceeds the high temperature limit set by the THIGH Limit Register and a valid fault condition exists (the consecutive
number of temperature faults has been reached). The ALERT pin will return to the inactive state after the measured
temperature drops below the TLOW Limit Register value the appropriate number of times to create a subsequent valid
fault condition. The ALERT pin only changes state based on the high and low temperature limits and fault conditions;
reading from or writing to any register or putting the device into Shutdown mode will not affect the state of the ALERT pin.
The high temperature limit set by the THIGH Limit Register must be greater than the low temperature limit set by the TLOW
Limit Register in order for the ALERT pin to activate correctly.
If switching from Interrupt mode to Comparator mode while the ALERT pin is already active, then the ALERT pin will
remain active until the measured temperature is below the TLOW Limit Register value the appropriate number of times to
create a valid fault condition.
The ALERT pin will return to the inactive state if the device receives the General Call Reset command. When reset, the
contents of the Nonvolatile Configuration Register will be copied into the Configuration Register; therefore, the device
may or may not return to the Comparator mode depending on the setting of the NVCMP/INT bit in the Nonvolatile
Configuration Register.
Figure 5-2 illustrates both the active high and active low ALERT pin response for a sample temperature profile with the
device configured for the Comparator mode and a fault tolerance queue setting of two.
Figure 5-2. Comparator Mode (Fault Tolerance Queue = 2)
THIGH Limit
Temperature
TLOW Limit
ALERT
(Active High, POL = 1)
ALERT
(Active Low, POL = 0)
Temperature Measurements/Conversions
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5.2.3
Interrupt Mode
Similar to the Comparator mode, when the device operates in the Interrupt mode, the ALERT pin will go active if the
measured temperature meets or exceeds the high temperature limit set by the THIGH Limit Register and a valid fault
condition exists (the consecutive number of temperature faults has been reached). Unlike the Comparator mode,
however, the ALERT pin will remain active until one of three normal operation events takes place: any one of the device's
registers is read, the device responds to an SMBus Alert Response Address (ARA), or the device is put into Shutdown
mode.
Once the ALERT pin returns to the inactive state, it will not go active again until the measured temperature drops below
the low temperature limit set by the TLOW Limit Register for the appropriate number of consecutive faults. Again, the
ALERT pin will remain active until one of the device's registers is read, the device responds to an SMBus ARA, or the
device is placed into the Shutdown mode.
After the ALERT pin becomes inactive again, the cycle will repeat itself with the ALERT pin going active after the
measured temperature meets or exceeds the THIGH Limit Register value for the proper number of consecutive faults. This
process is cyclical between THIGH and TLOW temperature alarms (e.g. THIGH event, ALERT clear, TLOW event, ALERT
clear, THIGH event, ALERT clear, TLOW event, etc.).
In order for the ALERT pin to normally become active for the first time in the Interrupt Mode, the first event must be a
THIGH temperature alarm event. Therefore, even if the measured temperature initially starts off between the THIGH and
TLOW limits and then drops below the TLOW temperature limit and has met valid fault conditions, the ALERT pin will still not
go active. The high temperature limit set by the THIGH Limit Register must be greater than the low temperature limit set by
the TLOW Limit Register in order for the ALERT pin to activate correctly.
If switching from Comparator mode to Interrupt Mode while the ALERT pin is already active, then the ALERT pin will
remain active until it is cleared by one of the events already detailed: any one of the device's registers is read, the device
responds to an SMBus Alert Response Address (ARA), or the device is put into Shutdown Mode. The ALERT pin will
also return to the inactive state if the device receives the General Call Reset command. When reset, the contents of the
Nonvolatile Configuration Register will be copied into the Configuration Register; therefore, the device may or may not
return to the Interrupt mode depending on the setting of the NVCMP/INT bit in the Nonvolatile Configuration Register.
Figures 5-3 and Figure 5-4 show both the active high and active low ALERT pin response for a sample temperature
profile with the device configured for the Interrupt mode and a fault tolerance queue setting of two. Figure 5-4 illustrates
how the ALERT pin output would look if there was a longer delay between the ALERT trigger and the reading of a
register.
Figure 5-3. Interrupt Mode (Fault Tolerance Queue = 2)
THIGH Limit
Temperature
TLOW Limit
ALERT
(Active High, POL = 1)
Read Register
Read Register
Read Register
ALERT
(Active Low, POL = 0)
Temperature Measurements/Conversions
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13
Figure 5-4. Interrupt Mode (Fault Tolerance Queue = 2) Delay Before Reading Register
THIGH Limit
Temperature
TLOW Limit
ALERT
(Active High, POL = 1)
Read Register
Read Register
ALERT
(Active Low, POL = 0)
Temperature Measurements/Conversions
5.3
Shutdown Mode
To reduce current consumption and save power, the device features a Shutdown mode that disables all internal device
circuitry except for the serial interface and POR circuits. While in the Shutdown mode, the internal temperature sensor is
not active, so no temperature measurements will be made. Entering and exiting the Shutdown mode is controlled by the
SD bit in the Configuration Register.
Entering the Shutdown mode can affect the ALERT pin depending on the Alarm Thermostat mode. If the device is
configured to operate in the Interrupt mode, then the ALERT pin will go inactive when the device enters the Shutdown
mode. However, the ALERT pin will not change states if the device is operating in the Comparator mode.
The fault count information will not change when the device enters or exits the Shutdown mode; therefore, the number of
previous temperature faults recorded by the internal fault counter will be retained unless the device is power-cycled or
reset. When exiting the Shutdown mode, the ALERT pin will go active if operating in Interrupt mode, a valid fault
condition exists, and the THIGH and TLOW event cycles are maintained (i.e. THIGH event before entering Shutdown mode
followed by a TLOW event when exiting Shutdown mode).
The device can be powered-down while in the Shutdown mode so that it will remain in the Shutdown mode after the
subsequent Power-up operation. This is accomplished by setting the NVSD bit in the Nonvolatile Configuration Register
to the Logic 1 state prior to power-down. Upon power-up or reset, the device will first copy the contents of the Nonvolatile
Data Registers into the Volatile Data Registers, after which the device will perform a single temperature measurement
and store the result in the Temperature Register. After this process is complete, the device will re-enter the Shutdown
mode.
5.3.1
One-Shot Mode
The AT30TSE752/754/758 features a One-Shot Temperature mode that allows the device to perform a single
temperature measurement while in the Shutdown mode. By keeping the device in the Shutdown mode and utilizing the
One-Shot mode, the AT30TSE752/754/758 can remain in a lower power state and only go active to take temperature
measurements on an as-needed basis. The internal fault counter will be updated when taking a temperature
measurement using the One-Shot mode; therefore, a valid fault condition can be generated by the One-Shot temperature
measurements. If operating in Comparator mode, then the fault condition will cause the ALERT pin to go either active or
inactive depending on if the fault condition is a result of a THIGH or TLOW event. If operating in Interrupt mode, the fault
condition will cause the ALERT pin to pulse active for a short duration of time to indicate a THIGH or TLOW event has
occurred. The ALERT pin will then return to the inactive state.
The One-Shot mode is controlled using the OS bit in the Configuration Register (see Section 6.3.1 “OS Bit” on page 20).
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6.
Registers
The AT30TSE752/754/758 contains eight registers (a Pointer Register and seven data registers) that are used to control
the operational mode and performance of the temperature sensor, store the user-defined high and low temperature
limits, and store the digitized temperature measurements. All accesses to the device are performed using these eight
registers. In order to read from and write to one of the device's seven data registers, the user must first select a desired
data register by utilizing the Pointer Register.
The device incorporates both volatile and nonvolatile versions of the Configuration Register, the TLOW Limit Register, and
the THIGH Limit Register. Upon device power-up or reset, the AT30TSE752/754/758 will copy the contents of the
Nonvolatile Data Registers into the Volatile Data Registers. Both the volatile and Nonvolatile Data Registers can be
modified separately provided that the registers are not locked or locked down; however, all temperature sensor related
operations, such as responses to high and low temperature conditions, are based on the settings stored in the volatile
versions of the registers only; therefore, if the Nonvolatile Data Registers are updated with new values, then the contents
of the Nonvolatile Data Registers should be copied to the Volatile Data Registers (see Section 9.1 “Copy Nonvolatile
Registers to Volatile Registers” on page 33)
Table 6-1.
Registers
Address
Read/
Write
Size
Power-on Default
Pointer Register
n/a
W
8-bit
00h
n/a
Temperature Register
00h
R
16-bit
0000h
n/a
Configuration Register
01h
R/W
16-bit
Copy of Nonvolatile Configuration Register
n/a
TLOW Limit Register
02h
R/W
16-bit
Copy of Nonvolatile TLOW Limit Register
n/a
THIGH Limit Register
03h
R/W
16-bit
Copy of Nonvolatile THIGH Limit Register
n/a
Nonvolatile Configuration Register
11h
R/W
16-bit
Last Programmed State
0000h
Nonvolatile TLOW Limit Register
12h
R/W
16-bit
Last Programmed State
4B00h (75C)
Nonvolatile THIGH Limit Register
13h
R/W
16-bit
Last Programmed State
5000h (80C)
Register
Factory
Default
The Configuration Register, despite being 16-bits wide, is compatible to industry standard LM75-type temperature
sensors that use an 8-bit wide register in that only the first 8-bits of the Configuration Register need to be written to or
read from.
6.1
Pointer Register
The 8-bit Write-only Pointer Register is used to address and select which one of the device's seven data registers
(Temperature Register, Configuration Register, TLOW Limit Register, THIGH Limit Register, Nonvolatile Configuration
Register, Nonvolatile TLOW Limit Register, or Nonvolatile THIGH Limit Register) will be read from or written to.
For Read operations from the AT30TSE752/754/758, once the Pointer Register is set to point to a particular data
register, it remains pointed to that same data register until the Pointer Register value is changed.
Example:
If the user sets the Pointer Register to point to the Temperature Register, then all subsequent reads from
the device will output data from the Temperature Register until the Pointer Register value is changed.
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15
For Write operations to the AT30TSE752/754/758, the Pointer Register value must be refreshed each time a Write to the
device is to be performed, even if the same data register is going to be written to a second time in a row.
Example:
If the Pointer Register is set to point to the Configuration Register, once the subsequent Write operation to
the Configuration Register has completed, the user cannot write again into the Configuration Register
without first setting the Pointer Register value again. As long as a Write operation is to be performed, the
device will assume that the Pointer Register value is the first data byte received after the address byte.
Since only seven data registers are available for access, only the five LSBs (P4 to P0) of the Pointer Register are used;
the remaining three bits (P7 to P5) of the Pointer Register should always be set to zero to allow for future migration paths
to other temperature sensor devices that have more than seven data registers. In addition, the device incorporates
additional commands that are decoded in lieu of the Pointer Register byte. Therefore, if bits P7 to P5 are not set as zero
when setting the value of the Pointer Register byte, the device may interpret the data as one of the additional commands.
Table 6-2 shows the bit assignments of the Pointer Register and the associated pointer addresses of the data registers
available. Attempts to write any values other than those listed in Table 6-2 into the Pointer Register will be ignored by the
device, and the contents of the Pointer Register will not be changed. The device will respond back to the Master with a
NACK to indicate that the device received an invalid Pointer Register byte.
Table 6-2.
Pointer Register and Address Assignments
Pointer Register Value
P7
P6
P5
P4
P3
P2
P1
P0
Associated
Address
0
0
0
0
0
0
0
0
00h
Temperature Register
0
0
0
0
0
0
0
1
01h
Configuration Register
0
0
0
0
0
0
1
0
02h
TLOW Limit Register
0
0
0
0
0
0
1
1
03h
THIGH Limit Register
0
0
0
1
0
0
0
1
11h
Nonvolatile Configuration Register
0
0
0
1
0
0
1
0
12h
Nonvolatile TLOW Limit Register
0
0
0
1
0
0
1
1
13h
Nonvolatile THIGH Limit Register
Register Selected
To set the value of the Pointer Register, the Master must first initiate a Start condition followed by the
AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the hard-wired A2-0 address pins).
After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the Master. The
Master must then send the appropriate data byte to the AT30TSE752/754/758 to set the value of the Pointer Register.
After device power-up or reset, the Pointer Register defaults to 00h which is the Temperature Register location;
therefore, the Temperature Register can be read from immediately after device power-up or reset without having to set
the Pointer Register. If the device is configured to power-up in the Shutdown mode, then the device will make a single
temperature measurement immediately after power-up so that valid temperature data can be output from the
Temperature Register.
Figure 6-1. Write Pointer Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P1
P0
0
SCK
Address Byte
SDA
1
0
0
1
A
Pointer Register Byte
A
A
0
0
MSB
Start
by
Master
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P7
P6
P5
P4
P3
P2
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
6.2
Temperature Register
The Temperature Register is a 16-bit Read-only Register that stores the digitized value of the most recent temperature
measurement. The temperature data value is represented in the twos complement format, and, depending on the
resolution selected, up to 12 bits of data will be available for output with the remaining LSBs being fixed in the Logic 0
state. The Temperature Register can be read at any time, and since temperature measurements are performed in the
background, reading the Temperature Register does not affect any other operation that may be in progress.
The MSB (bit 15) of the Temperature Register contains the sign bit of the measured temperature value with a zero
indicating a positive number and a one indicating a negative number. The remaining MSBs of the Temperature Register
contain the temperature value in the twos complement format. Table 6-3 details the Temperature Register format for the
different selectable resolutions, and Table 6-4 shows some examples for 12-bit resolution Temperature Register data
values and the associated temperature readings.
Table 6-3.
Temperature Register Format
Upper Byte
Lower Byte
Resolution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
12 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
11 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
10 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
9 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
0
Note:
TD = Temperature Data
Table 6-4.
12-bit Resolution Temperature Data/Values Examples
Temperature Register Data
Temperature
Binary Value
Hex Value
+125°C
0111 1101 0000 0000
7D00h
+100°C
0110 0100 0000 0000
6400h
+75°C
0100 1011 0000 0000
4B00h
+50.5°C
0011 0010 1000 0000
3200h
+25.25°C
0001 1001 0100 0000
1940h
+10.125°C
0000 1010 0010 0000
0A20h
+0.0625°C
0000 0000 0001 0000
0010h
0°C
0000 0000 0000 0000
0000h
-0.0625°C
1111 1111 1111 0000
FFF0h
-10.125°C
1111 0101 1110 0000
F5E0h
-25.25°C
1110 0111 1100 0000
E7C0h
-50.5°C
1100 1110 1000 0000
CE80h
-55°C
1100 1001 0000 0000
C900h
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17
After each temperature measurement and digital conversion is complete, the new temperature data is loaded into the
Temperature Register if the register is not currently being read. If a Read is in progress, then the previous temperature
data will be output. Accessing the Temperature Register continuously without waiting the maximum conversion time
(tCONV) for the selected resolution may prevent the device from properly updating the Temperature Register with new
temperature data.
In order to read the most recent temperature measurement data, the Pointer Register must be set or have been
previously set to 00h. If the Pointer Register has already been set to 00h, the Temperature Register can be read by
having the Master first initiate a Start condition followed by the AT30TSE752/754/758 device address byte (1001AAA1
where “AAA” corresponds to the hard-wired A2-0 address pins). After the AT30TSE752/754/758 has received the proper
address byte, the device will send an ACK to the Master. The Master can then read the upper byte of the Temperature
Register. After the upper byte of the Temperature Register has been clocked out of the AT30TSE752/754/758, the
Master must send an ACK to indicate that it is ready for the lower byte of the temperature data. The
AT30TSE752/754/758 will then clock out the lower byte of the Temperature Register, after which the Master must send a
NACK to end the operation. When the AT30TSE752/754/758 receives the NACK, it will release the SDA line so that the
Master can send a Stop or repeated Start condition. If the Master does not send a NACK but instead sends an ACK after
the lower byte of the Temperature Register has been clocked out, then the device will repeat the sequence by outputting
new temperature data starting with the upper byte of the Temperature Register.
If 8-bit temperature resolution is satisfactory, then the lower byte of the Temperature Register does not need to be read.
In this case, the Master would send a NACK instead of an ACK after the upper byte of the Temperature Register has
been clocked out of the AT30TSE752/754/758. When the AT30TSE752/754/758 receives the NACK, the device will
know that it should not send out the lower byte of the Temperature Register and will instead release the SDA line so the
Master can send a Stop or repeated Start condition.
The Temperature Register defaults to 0000h after device power-up or reset; therefore, the system should wait the
maximum conversion time (tCONV) for the selected resolution before attempting to read valid temperature data. If the
device is configured to power-up in the Shutdown mode, then the device will make a single temperature measurement
immediately after power-up so that valid temperature data can be output from the Temperature Register after the
maximum tCONV time. Since the Temperature Register is a Read-only Register, any attempts to write to the register will
be ignored, and the device will subsequently respond by sending a NACK back to the Master for any data bytes that are
sent.
Figure 6-2. Read Temperature Register — 16 Bits
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D0
1
SCK
Address Byte
SDA
1
0
0
1
A
Temperature Register Upper Byte
A
A
1
0
MSB
D8
0
MSB
Start
by
Master
Note:
D15 D14 D13 D12 D11 D10 D9
Temperature Register Lower Byte
D7
D6
D5
D4
D3
D2
ACK
from
Slave
NACK
from
Master
ACK
from
Master
Assumes the Pointer Register was previously set to point to the Temperature Register.
Figure 6-3. Read Temperature Register — 8 Bits
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D8
1
SCK
Address Byte
SDA
1
0
0
1
A
Temperature Register Upper Byte
A
A
1
0
MSB
Start
by
Master
Note:
18
D15 D14 D13 D12 D11 D10 D9
MSB
ACK
from
Slave
NACK
from
Master
Stop
by
Master
Assumes the Pointer Register was previously set to point to the Temperature Register.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
D1
MSB
Stop
by
Master
6.3
Configuration Register
The Configuration Register is used to control key operational modes and settings of the device such as the One-Shot
mode, the temperature conversion resolution, the fault tolerance queue, the ALERT pin polarity, the Alarm Thermostat
mode, and the Shutdown mode. The Configuration Register is a 16-bit wide Read/Write Register; however, only the first
8-bits of the register are actually used while the least-significant 8-bits are reserved for future use to provide an upward
migration path to other temperature sensor devices that have enhanced features. Since only the most-significant 8-bits of
the Configuration Register are used, the device is backwards compatible to industry standard LM75-type temperature
sensors that use 8-bit wide registers.
After device power-up or reset, the contents of the most-significant byte (bits 15 through 8) of the Nonvolatile
Configuration Register will always be automatically copied into the Configuration Register. Therefore, the Configuration
Register settings will match the settings of the Nonvolatile Configuration Register prior to when the device was powereddown or reset. Since the Configuration Register value will always be copied from the Nonvolatile Configuration Register,
the Configuration Register can be temporarily changed without affecting subsequent power-up/reset settings. If it is
desired for the new Configuration Register settings to become the new power-up/reset settings, then the contents of the
Configuration Register can be copied into the most-significant byte of the Nonvolatile Configuration Register by using the
copy Volatile Registers to Nonvolatile Registers command (see Section 9.2 “Copy Volatile Registers to Nonvolatile
Registers” on page 34). Please note that when using the copy Volatile Registers to Nonvolatile Registers command, the
contents of the THIGH and TLOW Limit Registers will also be copied into the nonvolatile THIGH and TLOW Limit Registers.
Table 6-5.
Configuration Register
Bit
Name
15
OS
14:13
12:11
R1:R0
FT1:FT0
Type
One-Shot Mode
Conversion Resolution
Fault Tolerance Queue
R/W
R/W
R/W
10
POL
ALERT Pin Polarity
R/W
9
CMP/INT
Alarm Thermostat Mode
R/W
8
SD
Shutdown Mode
R/W
7:1
RFU
Reserved for Future Use
NVRBSY
Nonvolatile Registers
Busy
0
R
R
Description
0
Normal Operation (Default)
1
Perform One-Shot Measurement (Valid in Shutdown Mode Only)
00
9-bits (Default)
01
10-bits
10
11-bits
11
12-bits
00
Alarm after 1 Fault (Default)
01
Alarm after 2 Consecutive Faults.
10
Alarm after 4 Consecutive Faults.
11
Alarm after 6 Consecutive Faults.
0
ALERT Pin is Active Low (Default).
1
ALERT Pin is Active High.
0
Comparator Mode (Default).
1
Interrupt Mode.
0
Temperature Sensor Performing Active Measurements (Default)
1
Temperature Sensor Disabled and Device In Shutdown Mode.
0
Reserved for Future Use
0
Nonvolatile Registers are ready for access.
1
Nonvolatile Registers are busy and cannot be read from or
written to.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
19
To set the value of the Configuration Register, the Master must first initiate a Start condition followed by the
AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the hard-wired A2-0 address pins).
After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the Master. The
Master must then send the appropriate Pointer Register byte of 01h to select the Configuration Register. After the Pointer
Register byte of 01h has been sent, the AT30TSE752/754/758 will send another ACK to the Master. After receiving the
ACK from the AT30TSE752/754/758, the Master must then send the appropriate data byte to the AT30TSE752/754/758
to set the value of the Configuration Register. Only the first data byte sent to the AT30TSE752/754/758 will be
recognized as valid data; any subsequent bytes received by the device will simply be ignored. If the Master does not
send a complete byte of Configuration Register data prior to issuing a Stop or repeated Start condition, then the
AT30TSE752/754/758 will ignore the data and the contents of the Configuration Register will be unchanged.
In addition to the Master not sending a complete byte of Configuration Register data, writing to the Configuration Register
will be ignored and no operation will be performed if the Volatile and Nonvolatile Registers are currently locked (the
RLCK bit of the Nonvolatile Configuration Register is in the Logic 1 state) or the Volatile and Nonvolatile Registers are
permanently locked down (the RLCKDWN bit of the Nonvolatile Configuration Register is in the Logic 1 state). However,
the device will still respond with an ACK to indicate that it received the proper data byte even though the contents of the
Configuration Register will not be changed.
Updating the Configuration Register, whether actually changing the Fault Tolerance Queue setting or not, will clear the
internal fault counter and reset the count back to zero.
6.3.1
OS Bit
The OS bit is used to enable the One-Shot Temperature Measurement mode. When a Logic 1 is written to the OS bit
while the AT30TSE752/754/758 is in the Shutdown mode, the device will become active and perform a single
temperature measurement and conversion. After the Temperature Register has been updated with the measured
temperature data, the device will return to the low-power Shutdown mode and clear the OS bit.
Writing a one to the OS bit when the device is not in the Shutdown mode will have no effect. When reading the
Configuration Register, the OS bit will always be read as a Logic 0.
6.3.2
R1:R0 Bits
The R1 and R0 bits are used to select the conversion resolution of the internal sigma-delta ADC. Four possible
resolutions can be set to maximize for either higher resolution or faster conversion times. The R1 and R0 bits will be
copied from the NVR1 and NVR0 in the Nonvolatile Configuration Register after device power-up or reset, allowing the
device to retain the conversion resolution that was previously set by the Nonvolatile Configuration Register prior to
power-down or reset.
Table 6-6.
20
Conversion Resolution
R1
R0
Conversion Resolution
0
0
9 bits
0.5000°C
25ms
0
1
10 bits
0.2500°C
50ms
1
0
11 bits
0.1250°C
100ms
1
1
12 bits
0.0625°C
200ms
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Conversion Time
6.3.3
FT1:FT0 Bits
The FT1 and FT0 bits are used to set the fault tolerance queue value which defines how many consecutive faults must
occur before the ALERT pin will be activated (see Section 5.2.1 “Fault Tolerance Limits” on page 11). The FT1 and FT0
bit settings provide four different fault values as detailed in Table 6-7. After the device powers up or resets, the FT1 and
FT0 bits will be copied from the NVFT1 and NVFT0 in the Nonvolatile Configuration Register; therefore, the fault
tolerance queue value will default to whatever value was previously stored in the Nonvolatile Configuration Register prior
to Configuration Register power-down or reset.
Table 6-7.
6.3.4
Fault Tolerance Queue
FT1
FT0
Consecutive Faults Required
0
0
1
0
1
2
1
0
4
1
1
6
POL Bit
The ALERT pin polarity is controlled by the POL bit. When the POL bit is in the Logic 0 state, the ALERT pin will be an
active low output. To configure the ALERT pin as an active high output, the POL bit must be set to the Logic 1 state.
After the device powers up or resets, the POL bit will be copied from the NVPOL bit in the Nonvolatile Configuration
Register; therefore, the polarity of the ALERT pin will default to the state defined by the Nonvolatile Configuration
Register prior to power-down or reset.
6.3.5
CMP/INT Bit
The CMP/INT bit controls whether the device will operate in the Comparator mode or the Interrupt mode. Setting the
CMP/INT bit to the Logic 0 state will put the device into the Comparator mode. Alternatively, when the CMP/INT bit is set
to the Logic 1 state, then the device will operate in the Interrupt mode. The function of the ALERT pin changes based on
the CMP/INT bit setting.
The CMP/INT bit will be copied from the NVCMP/INT bit in the Nonvolatile Configuration Register after the device powers
up or resets. Since the CMP/INT bit is copied from the NVCMP/INT bit, the device will default to whatever mode was
selected by the Nonvolatile Configuration Register prior to power-down or reset.
6.3.6
SD Bit
The SD bit is used to enable or disable the device's Shutdown mode. When the SD bit is in the Logic 0 state, the device
will be in the normal operational mode and perform continuous temperature measurements and conversions. When the
SD bit is set to the Logic 1 state, the device will finish the current temperature measurement and conversion and will
store the result in the Temperature Register, after which the device will then enter the Shutdown mode.
Resetting the SD bit back to a Logic 0 will return the device to the normal operating mode.
After the device powers up or resets, the SD bit will be copied from the NVSD bit in the Nonvolatile Configuration
Register. Therefore, it is possible for the device to automatically enter the Shutdown mode after power-up or reset by
setting the NVSD bit to the Logic 1 state prior to power-down or reset. See Section 5.3 “Shutdown Mode” on page 14 for
more details.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
21
6.3.7
NVRBSY
The Ready/Busy status of the Nonvolatile Configuration Register, Nonvolatile TLOW Limit Register, and Nonvolatile THIGH
Limit Register can be determined by reading the NVRBSY bit. When the NVRBSY bit is in the Logic 0 state, then the
Nonvolatile Configuration and Limit Registers are available to be read from or written to. When the NVRBSY bit is in the
Logic 1 state, the Nonvolatile Registers are busy and cannot be accessed for reading, writing, or copying. Attempting to
read the Nonvolatile Registers while the registers are busy will result in erroneous data being output. Similarly, any
attempts to write to one of the Nonvolatile Registers while the NVRBSY bit is in the Logic 1 state will result in the data
being ignored. Both the copy Nonvolatile Registers to Volatile Registers and the copy Volatile Registers to Nonvolatile
Registers commands will also be ignored when the NVRBSY bit is in the Logic 1 state. For more details and a complete
list of commands that are and are not allowed while NVRBSY is in the Logic 1 state, see Section 8. “Operations Allowed
During Nonvolatile Busy Status” on page 32.
Figure 6-4. Write to Configuration Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D8
0
SCK
Address Byte
SDA
1
0
0
1
A
Pointer Register Byte
A
A
0
0
MSB
0
0
0
0
0
0
Configuration Register Upper Byte
0
1
0
MSB
Start
by
Master
D15 D14 D13 D12 D11 D10 D9
MSB
ACK
from
Slave
ACK
from
Slave
ACK
from
Slave
Figure 6-5. Read from Configuration Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D8
1
SCK
Configuration Register Upper Byte
Address Byte
SDA
1
0
0
1
A
A
A
1
0
MSB
Start
by
Master
Note:
22
D15 D14 D13 D12 D11 D10 D9
MSB
ACK
from
Slave
NACK
from
Master
Stop
by
Master
Assumes the Pointer Register was previously set to point to the Configuration Register.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Stop
by
Master
6.4
Nonvolatile Configuration Register
The Nonvolatile Configuration Register is a 16-bit wide Read/Write Register used to manage key power-up/reset device
settings and operational modes including the locking of the AT30TSE752/754/758's various registers. The Nonvolatile
Configuration Register is used in conjunction with the Configuration Register to control how the device operates. All bits
in the Nonvolatile Configuration Register will retain their state even after the device has been powered down or reset. On
every power up or reset sequence, the contents of the most-significant byte (bits 15 through 8) of the Nonvolatile
Configuration Register will be copied into the Configuration Register, after which all device operations and settings will
then be controlled by the Configuration Register. By utilizing the Nonvolatile Configuration Register, the device can
power-up or reset in a pre-defined, user-selected operating mode (e.g. Comparator mode, Shutdown mode, etc.) with
pre-defined settings (e.g. 12-bit resolution, ALERT pin active high, etc.). Therefore, unlike standard LM75-type
temperature sensors, there is no need to update the Configuration Register settings after every power-up or reset.
Since the Nonvolatile Configuration Register utilizes nonvolatile storage cells, care must be taken when updating the
register to accommodate the aspects of an associated program time and finite program endurance limit. Power must not
be removed from the device during the internally self-timed programming cycle of the register. If power is removed prior
to the completion of the programming cycle, then the contents of the register cannot be guaranteed. In addition, the
contents of the register may become corrupt if it is programmed more than the maximum allowed number of writes.
Table 6-8.
Nonvolatile Configuration Register
Bit
Name
15
NU
14:13 NVR1:NVR0
Type Description
Not Used
Conversion Resolution
12:11 NVFT1:NVFT0 Fault Tolerance Queue
R
R/W
R/W
10
NVPOL
ALERT Pin Polarity
R/W
9
NVCMP/INT
Alarm Thermostat Mode
R/W
8
7:3
2
1
0
NVSD
RFU
RLCKDWN
RLCK
RFU
Shutdown Mode
Register Lock
Not used.
00
9-bits (Factory Default)
01
10-bits
10
11-bits
11
12-bits
00
Alarm after 1 Fault (Factory Default).
01
Alarm after 2 Consecutive Faults.
10
Alarm after 4 Consecutive Faults.
11
Alarm after 6 Consecutive Faults.
0
ALERT Pin is Active Low (Factory Default).
1
ALERT Pin is Active High.
0
Comparator Mode (Factory Default).
1
Interrupt Mode.
0
Temperature Sensor Performing Active Measurements
(Factory Default).
1
Temperature Sensor Disabled and Device in Shutdown
mode.
0
Reserved for Future Use.
0
All Configuration and Limit Registers are not locked down
(Factory Default).
1
All Configuration and Limit Registers are permanently
locked down (ROM) and can never be modified again.
0
All Configuration and limit registers are unlocked and can
be modified (Factory Default).
1
All Configuration and Limit Registers are locked and
cannot be modified.
0
Reserved for Future Use.
R/W
Reserved for Future Use
Register Lockdown
0
R/W
R/W
Reserved for Future Use R
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
23
To set the value of the Nonvolatile Configuration Register, the Master must first initiate a Start condition followed by the
AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the hard-wired A2-0 address pins).
After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the Master. The
Master must then send the appropriate Pointer Register byte of 11h to select the Nonvolatile Configuration Register.
After the Pointer Register byte of 11h has been sent, the AT30TSE752/754/758 will send another ACK to the Master.
After receiving the ACK from the AT30TSE752/754/758, the Master must then send two data bytes to the
AT30TSE752/754/758 to set the value of the Nonvolatile Configuration Register. Any subsequent bytes sent to the
AT30TSE752/754/758 will simply be ignored by the device. If the Master does not send two complete bytes of
Nonvolatile Configuration Register data prior to issuing a Stop or repeated Start condition, then the
AT30TSE752/754/758 will ignore the data and the contents of the Nonvolatile Configuration Register will not be changed.
After the Master has issued a Stop or repeated Start condition, the AT30TSE752/754/758 will begin the internally
self-timed program operation, and the contents of the Nonvolatile Configuration Register will be updated within a time of
tPROG. During this time, the NVRBSY bit in the Configuration Register will indicate that the device is busy. If the Master
issues a repeated Start condition instead of a Stop condition, the AT30TSE752/754/758 will abort the operation and the
contents of the Nonvolatile Configuration Register will not be changed.
In addition to the Master not sending two complete bytes of data, writing to the Nonvolatile Configuration Register will be
ignored and no operation will be performed under the following conditions: the Nonvolatile Registers are already busy
(the NVRBSY bit of the Configuration Register is in the Logic 1 state), the Volatile and Nonvolatile Registers are currently
locked (the RLCK bit of the Nonvolatile Configuration Register is in the Logic 1 state), or the Volatile and Nonvolatile
Registers are permanently locked down (the RLCKDWN bit of the Nonvolatile Configuration Register is in the Logic 1
state). However, the device will still respond with an ACK, except in the case of the Nonvolatile Registers being busy, to
indicate that it received the proper data bytes even though the program operation will not be performed. In the case of the
Nonvolatile Registers being busy, the device will respond with an ACK to the address and pointer bytes but will then
NACK when the data bytes are sent from the Master.
6.4.1
NVR1: NVR0 Bits
The nonvolatile NVR1 and NVR0 bits are used to select the power-up/reset default conversion resolution of the internal
sigma-delta ADC. Four possible resolutions can be set to maximize for either higher resolution or faster conversion
times. The NVR1 and NVR0 bits are set from the factory to default to the Logic 0 state to retain backwards compatibility
to industry-standard LM75-type devices.
Table 6-9.
24
Conversion Resolution
NVR1
NVR0
Conversion Resolution
0
0
9 bits
0.5°C
25ms
0
1
10 bits
0.25°C
50ms
1
0
11 bits
0.125°C
100ms
1
1
12 bits
0.0625°C
200ms
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Conversion Time
6.4.2
NVFT1:NVFT0 Bits
The nonvolatile NVFT1 and NVFT0 bits are used to set the power-up/reset default Fault Tolerance Queue value which
defines how many consecutive faults must occur before the ALERT pin will be activated (see Section 5.2.1 “Fault
Tolerance Limits” on page 11). The NVFT1 and NVFT0 bit settings provide four different fault values as detailed in
Table 6-10. Both the NVFT1 and NVFT0 bits are factory-set to default to the Logic 0 state.
Table 6-10. Fault Tolerance Queue
6.4.3
NVFT1
NVFT0
Consecutive Faults Required
0
0
1
0
1
2
1
0
4
1
1
6
NVPOL Bit
The nonvolatile NVPOL bit controls the power-up/reset default ALERT pin polarity. When the NVPOL bit is set to the
Logic 0 state, the ALERT pin will be an active low output after the device powers up or resets. Conversely, when the
NVPOL bit is set to the Logic 1 state, the ALERT pin will be an active high output. The NVPOL bit is set from the factory
to default to the Logic 0 state.
6.4.4
NVCMP/INT Bit
The nonvolatile NVCMP/INT bit controls whether the device will operate in the Comparator mode or the Interrupt mode
after a power-up or reset sequence. Setting the NVCMP/INT bit to the Logic 0 state (the factory default setting) will allow
the device to power-up/reset in the Comparator mode. Alternatively, when the NVCMP/INT bit is set to the Logic 1 state,
the device will power-up/reset in the Interrupt mode.
6.4.5
NVSD Bit
The nonvolatile NVSD bit is used to enable the device to power-up/reset in the Shutdown mode. When the NVSD bit is in
the Logic 0 state, the device will power-up/reset in the normal operational mode and perform continuous temperature
measurements and conversions. When the NVSD bit is set to the Logic 1 state, the device will automatically enter the
Shutdown mode after a power-up or reset sequence (see Section 5.3 “Shutdown Mode” on page 14 for more details).
The NVSD bit is factory-set to the Logic 0 state.
6.4.6
RLCKDWN
The one-time programmable RLCKDWN bit controls whether or not both the volatile and nonvolatile versions of the
configuration and limit registers will be permanently locked down. Once the RLCKDWN bit is set to the Logic 1 state, the
Configuration Register, TLOW Limit Register, THIGH Limit Register, Nonvolatile Configuration Register, Nonvolatile TLOW
Limit Register, and Nonvolatile THIGH Limit Register will be locked down and can never be modified again. Since the
RLCKDWN bit is one-time programmable, once the bit is set to the Logic 1 state, it cannot be reset again. The
RLCKDWN bit takes priority over the RLCK bit (see Section 7. “Register Locking” on page 31 for more details) and is
factory-set to the Logic 0 state.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
25
6.4.7
RLCK
The nonvolatile RLCK bit controls the reversible locking of both the Volatile and Nonvolatile Configuration and Limit
Registers. When the RLCK bit is set to the Logic 0 state, the Configuration Register, TLOW Limit Register, THIGH Limit
Register, Nonvolatile Configuration Register, Nonvolatile TLOW Limit Register, and Nonvolatile THIGH Limit Register will be
unlocked and can be modified. Alternatively, when the RLCK bit is set to the Logic 1 state, the Volatile and Nonvolatile
Configuration and Limit Registers will be locked and cannot be modified. When the registers are locked, only the RLCK
bit of the Nonvolatile Configuration Register can be altered and reset back to a Logic 0. Any attempts at changing other
bits in the Nonvolatile Configuration Register will be ignored. The RLCK bit is set from the factory to default to the
Logic 0 state. See Section 7. “Register Locking” on page 31 for more details.
Figure 6-6. Write to Nonvolatile Configuration Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
1
0
SCL
Address Byte
SDA
1
0
0
1
A
Pointer Register Byte
A
A
0
0
0
MSB
0
0
1
0
0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
1
2
3
4
5
6
7
8
9
1
Nonvolatile Configuration Register
Upper Byte
D15 D14 D13 D12 D11 D10
D9
2
3
4
5
6
7
8
9
Nonvolatile Configuration Register
Lower Byte
D8
0
MSB
D7
D6
D5
D4
D3
D2
D1
D0
0
MSB
ACK
from
Slave
Stop
by
Master
ACK
from
Slave
Figure 6-7. Read from Nonvolatile Configuration Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D0
1
SCL
Nonvolatile Configuration Register
Upper Byte
Address Byte
SDA
1
0
0
1
A
A
A
1
0
MSB
Start
by
Master
Note:
26
D15 D14 D13 D12 D11 D10 D9
D8
Nonvolatile Configuration Register
Lower Byte
0
MSB
ACK
from
Slave
D7
D6
D5
D4
D3
D2
D1
MSB
ACK
from
Master
NACK
from
Master
Assumes the Pointer Register was previously set to point to the Nonvolatile Configuration Register.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Stop
by
Master
6.5
TLOW and THIGH Limit Registers
The 16-bit TLOW and THIGH Limit Registers store the user-programmable lower and upper temperature limits for the
temperature alarm. Like the Temperature Register, the temperature data values of the TLOW and THIGH Limit Registers
are stored in the twos complement format with the MSB (bit 15) of the registers containing the sign bit (zero indicates a
positive number and a one indicates a negative number).
As with the Temperature Register, the resolution selected by the R1 and R0 bits of the Configuration Register will
determine how many bits of the TLOW and THIGH Limit Registers will be used. Therefore, when writing to the TLOW and
THIGH Limit Registers, up to 12 bits of data will be recognized by the device with the remaining LSBs being internally fixed
to the Logic 0 state. Similarly, when reading from the registers, up to 12 bits of data will be output from the device with the
remaining LSBs fixed in the Logic 0 state.
Table 6-11. TLOW Limit Register and THIGH Limit Register Format
Upper Byte
Lower Byte
Resolution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
12 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
11 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
10 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
9 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
0
Note:
TD = Temperature Data
To set the value of either the TLOW or THIGH Limit Register, the Master must first initiate a Start condition followed by the
AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the hard-wired A2-0 address pins).
After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the Master. The
Master must then send the appropriate Pointer Register byte of 02h to select the TLOW Limit Register or 03h to select the
THIGH Limit Register. After the Pointer Register byte has been sent, the AT30TSE752/754/758 will send another ACK to
the Master. After receiving the ACK from the AT30TSE752/754/758, the Master must then send two data bytes to the
AT30TSE752/754/758 to set the value of the TLOW or THIGH Limit Register. Any subsequent bytes sent to the
AT30TSE752/754/758 will simply be ignored by the device. If the Master does not send two complete bytes of data prior
to issuing a Stop or repeated Start condition, then the AT30TSE752/754/758 will ignore the data and the contents of the
register will not be changed.
In addition to the Master not sending two complete bytes of data, writing to the TLOW or THIGH Limit Register will be
ignored and no operation will be performed under the following conditions: the Nonvolatile Registers are busy because of
a copy operation (the NVRBSY bit of the Configuration Register is in the Logic 1 state), the Volatile and Nonvolatile
Registers are currently locked (the RLCK bit of the Nonvolatile Configuration Register is in the Logic 1 state), or the
Volatile and Nonvolatile Registers are permanently locked down (the RLCKDWN bit of the Nonvolatile Configuration
Register is in the Logic 1 state). However, the device will still respond with an ACK, except in the case of the Nonvolatile
Registers being busy, to indicate that it received the proper data bytes even though the contents of the TLOW or THIGH
Limit Register will not be changed. In the case of the Nonvolatile Registers being busy, the device will respond with an
ACK to the address and pointer bytes but will then NACK when the data bytes are sent from the Master.
In order to read the TLOW or THIGH Limit Register, the Pointer Register must be set or have been previously set to 02h to
select the TLOW Limit Register or 03h to select the THIGH Limit Register (if the previous operation was a Write to one of the
registers, then the Pointer Register will already be set for that particular limit register). If the Pointer Register has already
been set appropriately, the TLOW or THIGH Limit Register can be read by having the Master first initiate a Start condition
followed by the AT30TSE752/754/758 device address byte (1001AAA1 where “AAA” corresponds to the hard-wired A2-0
address pins). After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the
Master. The Master can then read the upper byte of the TLOW or THIGH Limit Register. After the upper byte of the register
has been clocked out of the AT30TSE752/754/758, the Master must send an ACK to indicate that it is ready for the lower
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
27
byte of data. The AT30TSE752/754/758 will then clock out the lower byte of the register, after which the Master must
send a NACK to end the operation. When the AT30TSE752/754/758 receives the NACK, it will release the SDA line so
that the Master can send a Stop or repeated Start condition. If the Master does not send a NACK but instead sends an
ACK after the lower byte of the register has been clocked out, then the device will repeat the sequence by outputting the
data again starting with the upper byte of the register.
After the device powers up or resets, both the TLOW and THIGH Limit Register values will be copied from the Nonvolatile
TLOW and THIGH Limit Registers; therefore, the TLOW and THIGH Limit Register values will default to whatever value was
previously stored in the Nonvolatile TLOW and THIGH Limit Registers prior to power-down or reset. The value of the high
temperature limit stored in the THIGH Limit Register must be greater than the value of the low temperature limit stored in
the TLOW Limit Register in order for the ALERT function to work properly; otherwise, the ALERT pin will output erroneous
results and will falsely signal temperature alarms.
Figure 6-8. Write to TLOW or THIGH Limit Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P1
P0
0
SCK
Address Byte
SDA
1
0
0
1
A
Pointer Register Byte
A
A
0
0
MSB
0
0
0
0
0
0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
1
2
3
4
5
6
7
8
9
1
TLOW or THIGH Limit Register
Upper Byte
D15 D14 D13 D12 D11 D10
D9
2
3
4
5
6
7
8
9
D0
0
TLOW or THIGH Limit Register
Lower Byte
D8
0
D7
MSB
D6
D5
D4
D3
D2
D1
MSB
ACK
from
Slave
Stop
by
Master
ACK
from
Slave
Figure 6-9. Read from TLOW or THIGH Limit Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D0
1
SCK
TLOW or THIGH Limit Register
Upper Byte
Address Byte
SDA
1
0
0
1
A
A
A
1
0
MSB
Start
by
Master
Note:
28
D15 D14 D13 D12 D11 D10 D9
TLOW or THIGH Limit Register
Lower Byte
D8
0
MSB
ACK
from
Slave
D7
D6
D5
D4
D3
D2
D1
MSB
ACK
from
Master
Assumes the Pointer Register was previously set to point to the TLOW or THIGH Limit Register.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
NACK
from
Master
Stop
by
Master
6.6
Nonvolatile TLOW and THIGH Limit Registers
The 16-bit Nonvolatile TLOW and THIGH Limit Registers store the power-up/reset default values for the volatile versions of
the TLOW and THIGH Limit Registers. Like their volatile counterparts, the temperature data values of the Nonvolatile TLOW
and THIGH Limit Registers are stored in the twos complement format with the MSB (bit 15) of the registers containing the
sign bit (zero indicates a positive number and a one indicates a negative number).
The values stored in both the Nonvolatile TLOW and THIGH Limit Registers will be retained even after the device has been
powered down or reset. On every power-up or reset sequence, the contents of the Nonvolatile TLOW Limit Register will be
copied into the TLOW Limit Register, and the contents of the Nonvolatile THIGH Limit Register will be copied into the THIGH
Limit Register. All temperature limit comparisons for the temperature alarm will be done using the volatile versions of the
TLOW and THIGH Limit Registers. By utilizing the Nonvolatile TLOW and THIGH Limit Registers, the device can
power-up or reset with pre-defined temperature limits specific to the particular application. Therefore, unlike standard
LM75-type temperature sensors, there is no need to update the lower and upper temperature limit values after every
power-up or reset.
Like the Nonvolatile Configuration Register, the Nonvolatile TLOW and THIGH Limit Registers utilize nonvolatile storage
cells, so the same care must be taken when updating the registers to accommodate for the associated program time and
finite program endurance limit. Power must not be removed from the device during the internally self-timed programming
cycle of the registers. If power is removed prior to the completion of the programming cycle, then the contents of the
register being updated cannot be guaranteed. In addition, the contents of the register may become corrupt if it is
programmed more than the maximum allowed number of writes.
As with the Temperature Register, the resolution selected by the R1 and R0 bits of the Configuration Register will
determine how many bits of the TLOW and THIGH Limit Registers will be used. Therefore, when writing to the TLOW and
THIGH Limit Registers, up to 12 bits of data will be recognized by the device with the remaining LSBs being internally fixed
to the Logic 0 state. Similarly, when reading from the TLOW and THIGH Limit Registers, up to 12 bits of data will be output
from the device with the remaining LSBs fixed in the Logic 0 state.
Table 6-12. Nonvolatile TLOW Limit Register and THIGH Limit Register Format
Upper Byte
Lower Byte
Resolution
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
12 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
11 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
10 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
9 bits
Sign
TD
TD
TD
TD
TD
TD
TD
TD
0
0
0
0
0
0
0
Note:
TD = Temperature Data
To set the value of either the Nonvolatile TLOW or THIGH Limit Register, the Master must first initiate a Start condition
followed by the AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the hard-wired A2-0
address pins). After the AT30TSE752/754/758 has received the proper address byte, the device will send an ACK to the
Master. The Master must then send the appropriate Pointer Register byte of 12h to select the Nonvolatile TLOW Limit
Register or 13h to select the Nonvolatile THIGH Limit Register. After the Pointer Register byte has been sent, the
AT30TSE752/754/758 will send another ACK to the Master. After receiving the ACK from the AT30TSE752/754/758, the
Master must then send two data bytes to the AT30TSE752/754/758 to set the value of the Nonvolatile TLOW or THIGH Limit
Register. Any subsequent bytes sent to the AT30TSE752/754/758 will simply be ignored by the device. If the Master
does not send two complete bytes of data prior to issuing a Stop or repeated Start condition, then the
AT30TSE752/754/758 will ignore the data and the contents of the register will not be changed.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
29
After the Master has issued a Stop condition, the AT30TSE752/754/758 will begin the internally self-timed program
operation, and the contents of the Nonvolatile TLOW or THIGH Limit Register will be updated within a time of tPROG. During
this time, the NVRBSY bit of the Configuration Register will indicate that the device is busy. If the Master issues a
repeated Start condition instead of a Stop condition, the AT30TSE752/754/758 will abort the operation and the contents
of the Nonvolatile TLOW or THIGH Limit Register will not be changed.
In addition to the Master not sending two complete bytes of data, writing to the Nonvolatile TLOW or THIGH Limit Register
will be ignored and no operation will be performed under the following conditions: the Nonvolatile Registers are already
busy (the NVRBSY bit of the Configuration Register is in the Logic 1 state), the Volatile and Nonvolatile Registers are
currently locked (the RLCK bit of the Nonvolatile Configuration Register is in the Logic 1 state), or the Volatile and
Nonvolatile Registers are permanently locked down (the RLCKDWN bit of the Nonvolatile Configuration Register is in the
Logic 1 state). However, the device will still respond with an ACK, except in the case of the Nonvolatile Registers being
busy, to indicate that it received the proper data bytes even though the program operation will not be performed. In the
case of the Nonvolatile Registers being busy, the device will respond with an ACK to the address and pointer bytes but
will then NACK when the data bytes are sent from the Master.
In order to read the Nonvolatile TLOW or THIGH Limit Register, the Pointer Register must be set or have been previously
set to 12h to select the Nonvolatile TLOW Limit Register or 13h to select the Nonvolatile THIGH Limit Register (if the
previous operation was a Write to one of the registers, then the Pointer Register will already be set for that particular limit
register). If the Pointer Register has already been set appropriately, the Nonvolatile TLOW or THIGH Limit Register can be
read by having the Master first initiate a Start condition followed by the AT30TSE752/754/758 device address byte
(1001AAA1 where “AAA” corresponds to the hard-wired A2-0 address pins). After the AT30TSE752/754/758 has received
the proper address byte, the device will send an ACK to the Master. The Master can then read the upper byte of the
Nonvolatile TLOW or THIGH Limit Register. After the upper byte of the register has been clocked out of the
AT30TSE752/754/758, the Master must send an ACK to indicate that it is ready for the lower byte of data. The
AT30TSE752/754/758 will then clock out the lower byte of the register, after which the Master must send a NACK to end
the operation. When the AT30TSE752/754/758 receives the NACK, it will release the SDA line so that the Master can
send a Stop or repeated Start condition. If the Master does not send a NACK but instead sends an ACK after the lower
byte of the register has been clocked out, then invalid data will be output by the device.
The Nonvolatile TLOW Limit Register is factory-set to default to 4B00h (+75C) and the Nonvolatile THIGH Limit Register is
set to default to 5000h (+80C); therefore, both registers will need to be modified if these default temperature limits are
not satisfactory for the application.
Figure 6-10. Write to Nonvolatile TLOW or THIGH Limit Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P1
P0
0
SCL
Address Byte
SDA
1
0
0
1
A
Pointer Register Byte
A
A
0
0
MSB
Start
by
Master
0
0
0
1
0
0
MSB
ACK
from
Slave
ACK
from
Slave
1
2
3
4
5
6
7
8
9
1
Nonvolatile TLOW or THIGH
Limit Register Upper Byte
D15 D14 D13 D12 D11 D10
D9
D8
0
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
4
5
6
7
8
9
D7
D6
D5
D4
D3
D2
D1
D0
0
MSB
ACK
from
Slave
AT30TSE752/754/758 [DATASHEET]
3
Nonvolatile TLOW or THIGH
Limit Register Lower Byte
MSB
30
2
ACK
from
Slave
Stop
by
Master
Figure 6-11. Read to Nonvolatile TLOW or THIGH Limit Register
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D0
1
SCL
Nonvolatile TLOW or THIGH
Limit Register Upper Byte
Address Byte
SDA
1
0
0
1
A
A
A
1
0
MSB
7.
D8
0
MSB
Start
by
Master
Note:
D15 D14 D13 D12 D11 D10 D9
Nonvolatile TLOW or THIGH
Limit Register Lower Byte
ACK
from
Slave
D7
D6
D5
D4
D3
D2
D1
MSB
ACK
from
Master
NACK
from
Master
Stop
by
Master
Assumes the Pointer Register was previously set to point to the Nonvolatile TLOW or THIGH Limit Register.
Register Locking
All Volatile and Nonvolatile Configuration and Limit Registers (the Configuration Register, TLOW Limit Register, THIGH
Limit Register, Nonvolatile Configuration Register, Nonvolatile TLOW Limit Register, and Nonvolatile THIGH Limit Register)
can be locked from data changes by utilizing the RLCK bit in the Nonvolatile Configuration Register. This provides the
ability to lock the registers and protect them from inadvertent or erroneous data changes, giving system designers a
more robust and secure temperature sensing solution compared to other industry devices. The RLCK bit can be reset so
that the various registers can be modified if needed. Resetting of the RLCK bit is done by writing to the Nonvolatile
Configuration Register and changing the RLCK bit back to a Logic 0 state. When the registers are locked, only the RLCK
bit of the Nonvolatile Configuration Register can be altered, and any attempts at changing other bits in the Nonvolatile
Configuration Register will be ignored.
In addition, the Volatile and Nonvolatile Configuration and Limit Registers can be permanently locked down by using the
RLCKDWN bit in the Nonvolatile Configuration Register. When the RLCKDWN bit is set, the Volatile and Nonvolatile
Configuration and Limit Registers will be permanently locked down so that they can never be modified again. Unlike the
RLCK bit, the RLCKDWN bit is one-time programmable and cannot be reset. Therefore, the lockdown mechanism is not
reversible. The RLCKDWN bit takes priority over the RLCK bit (see Table 7-1).
Having the ability to permanently lock down the Volatile and Nonvolatile Configuration and Limit Registers provides the
ability to have a pre-defined, secure, and unchangeable temperature sensing solution for applications dealing with
liability, risk, or safety concerns.
The register locking is not affected by power cycles or reset operations, including the General Call Reset. Therefore, if a
device is power cycled or reset with the registers in the locked or locked-down state, then the registers will remain locked
or locked-down when normal device operation resumes.
Table 7-1.
Register Locking
RLCKDWN
RLCK
Locking Status
0
0
Volatile and Nonvolatile Configuration and Limit Registers are unlocked and can be
modified.
0
1
Volatile and Nonvolatile Configuration and Limit Registers are locked and cannot be
modified except for the RLCK bit of the Nonvolatile Configuration Register which can be
reset.
1
0
Volatile and Nonvolatile Configuration and Limit Registers are permanently locked down and
can never be modified again.
1
1
Volatile and Nonvolatile Configuration and Limit Registers are permanently locked down and
can never be modified again.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
31
8.
Operations Allowed During Nonvolatile Busy Status
While the AT30TSE752/754/758 is busy performing nonvolatile operations such as programming the Nonvolatile
Configuration Register or the Serial EEPROM, certain other operations can still be executed. Table 8-1 details which
commands are allowed or not allowed during a Nonvolatile Busy operation. For those commands that are not allowed
during a Nonvolatile Busy operation, the device will respond with a NACK where it would normally respond with an ACK.
Example:
If attempting to write to the Nonvolatile Configuration Register, the device would respond with an ACK after
the device address byte and Pointer Register byte but then respond with a NACK instead of an ACK after
the Master has sent the upper byte of configuration register data.
When attempting to read a register during a Nonvolatile Busy operation, the device will NACK instead of ACK after the
AT30TSE752/754/758 device address byte has been received.
Table 8-1.
Command
Allowed or Not Allowed
Write to Pointer Register
Allowed
Read Temperature Register
Allowed
Read Configuration Register
Allowed(1)
Write Configuration Register
Not Allowed
Read TLOW or THIGH Limit Register
Allowed(1)
Write TLOW or THIGH Limit Register
Not Allowed
Read or Write Nonvolatile Configuration Register
Not Allowed
Read or Write Nonvolatile TLOW or THIGH Limit Register
Not Allowed
Copy Nonvolatile Registers to Volatile Registers
Not Allowed
Copy Volatile Registers to Nonvolatile Registers
Not Allowed
Read or Write to Serial EEPROM
Not Allowed
SMBus Alert Response Address (ARA)
Not Allowed
General Call (04h)
Not Allowed
General Call Reset (06h)
Not Allowed
Note:
32
Commands Allowed During Nonvolatile Busy Operations
1.
Not allowed during Copy Nonvolatile Registers to Volatile Registers operation.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
9.
Other Commands
The AT30TSE752/754/758 incorporates additional commands for other device functions. The command opcode consists
of a single byte of data that is sent from the Master to the AT30TSE752/754/758 in place of the Pointer Register byte.
Therefore, the device must first be addressed by the Master and then given the subsequent command opcode. Sending
any of the command opcodes to the AT30TSE752/754/758 will not change the contents of the Pointer Register byte.
Table 9-1.
Command Listing
Command
Opcode
Copy Nonvolatile Registers to Volatile Registers
B8h
1011 1000
Copy Volatile Registers to Nonvolatile Registers
48h
0100 1000
Figure 9-1. Command Loading
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
C1
C0
0
SCL
Address Byte
SDA
1
0
0
1
A
Command Byte
A
A
0
0
MSB
Start
by
Master
9.1
C7
C6
C5
C4
C3
C2
MSB
ACK
from
Slave
ACK
from
Slave
Copy Nonvolatile Registers to Volatile Registers
The Copy Nonvolatile Registers to Volatile Registers command allows the contents of the Nonvolatile Configuration
Register, Nonvolatile TLOW Limit Register, and Nonvolatile THIGH Limit Register to be copied into the Configuration
Register, TLOW Limit Register, and THIGH Limit Register. The copy process is automatically performed upon power-up or
reset, but the Copy Nonvolatile Registers to Volatile Registers command provides the ability to re-copy the data registers
if needed.
To copy the contents of the Nonvolatile Data Registers into the Volatile Data Registers, the Master must first initiate a
Start condition followed by the AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the
hard-wired A2-0 address pins). After the AT30TSE752/754/758 has received the proper address byte, the device will send
an ACK to the Master. The Master must then send the command byte of B8h for the Copy Nonvolatile Registers to
Volatile Registers operation. After the command byte of B8h has been sent, the AT30TSE752/754/758 will send another
ACK to the Master. After the Master has subsequently issued a Stop or repeated Start condition, the
AT30TSE752/754/758 will begin the internally self-timed copy operation. The copy process will take place in a maximum
time of tCOPYR during which time the NVRBSY bit in the Configuration Register will indicate that the nonvolatile registers
are busy. If the Master issues a repeated Start condition instead of a Stop condition, the AT30TSE752/754/758 will abort
the copy operation and the contents of the Volatile Data Registers will not be changed.
The Copy Nonvolatile Registers to Volatile Registers command will be ignored and no operation will be performed under
the following conditions: the Nonvolatile Registers are already busy (the NVRBSY bit of the Configuration Register is in
the Logic 1 state), the Volatile and Nonvolatile Registers are currently locked (the RLCK bit of the Nonvolatile
Configuration Register is in the Logic 1 state), or the Volatile and Nonvolatile Registers are permanently locked down
(the RLCKDWN bit of the Nonvolatile Configuration Register is in the Logic 1 state). However, the device will still respond
with an ACK to indicate that it received the command byte even though the copy process will not be performed.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
33
Figure 9-2. Copy Nonvolatile Registers to Volatile Registers
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
0
0
SCL
Address Byte
SDA
1
0
0
1
A
Command Byte
A
A
0
0
MSB
Start
by
Master
9.2
1
0
1
1
1
0
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
Copy Volatile Registers to Nonvolatile Registers
The Copy Volatile Registers to Nonvolatile Registers command allows the contents of the Configuration Register, TLOW
Limit Register, and THIGH Limit Register to be copied into the Nonvolatile Configuration Register, Nonvolatile TLOW Limit
Register, and Nonvolatile THIGH Limit Register. The Copy Volatile Registers to Nonvolatile Registers command can be
used in the event that the Volatile Data Registers are modified and it is desired for that newly modified data to become
the new power-up/reset defaults.
To copy the contents of the Volatile Data Registers into the Nonvolatile Data Registers, the Master must first initiate a
Start condition followed by the AT30TSE752/754/758 device address byte (1001AAA0 where “AAA” corresponds to the
hard-wired A2-0 address pins). After the AT30TSE752/754/758 has received the proper address byte, the device will send
an ACK to the Master. The Master must then send the command byte of 48h for the Copy Volatile Registers to
Nonvolatile Registers operation. After the command byte of 48h has been sent, the AT30TSE752/754/758 will send
another ACK to the Master. After the Master has subsequently issued a Stop or repeated Start condition, the
AT30TSE752/754/758 will begin the internally self-timed copy operation. The copy process will take place in a maximum
time of tCOPYW during which time the NVRBSY bit in the Configuration Register will indicate that the nonvolatile registers
are busy. If the Master issues a repeated Start condition instead of a Stop condition, the AT30TSE752/754/758 will abort
the copy operation and the contents of the Nonvolatile Data Registers will not be changed.
The Copy Volatile Registers to Nonvolatile Registers command will be ignored and no operation will be performed under
the following conditions: the nonvolatile registers are already busy (the NVRBSY bit of the Configuration Register is in the
Logic 1 state), the volatile and nonvolatile registers are currently locked (the RLCK bit of the Nonvolatile Configuration
Register is in the Logic 1 state), or the volatile and nonvolatile registers are permanently locked down (the RLCKDWN bit
of the Nonvolatile Configuration Register is in the Logic 1 state). However, the device will still respond with an ACK to
indicate that it received the command byte even though the copy process will not be performed.
Care must be taken when copying the Volatile Data Registers to the Nonvolatile Data Registers in order to accommodate
the associated program time and finite program endurance limit. Power must not be removed from the device during the
internally self-timed copy/program cycle. If power is removed prior to the completion of the copy/program cycle, then the
contents of the nonvolatile registers cannot be guaranteed. In addition, the contents of the nonvolatile registers may
become corrupt if programmed more than the maximum allowed number of Writes.
Figure 9-3. Copy Volatile Registers to Nonvolatile Registers
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
0
0
SCL
Address Byte
SDA
1
0
0
1
A
Command Byte
A
A
0
0
MSB
Start
by
Master
34
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
0
1
0
0
1
0
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
10.
Serial EEPROM
The AT30TSE752/754/758 contains an integrated 2Kb, 4Kb, or 8Kb Serial EEPROM that is a drop in functional
replacement for a stand alone 2-wire Serial EEPROM device enabling the added benefit of saving board space and
component cost. The Serial EEPROM can be used to permanently store system configuration, application specific, and
or user preference data.
10.1
Memory Organization
The Serial EEPROM in the AT30TSE752/754/758 is internally organized into pages or rows of data bytes. The
AT30TSE752 has 256 bytes and is internally organized with 16 pages of 16 bytes in each page. The AT30TSE754 has
512 bytes and is internally organized with 32 pages of 16 bytes in each page. The AT30TSE758 has 1024 bytes and is
internally organized with 64 pages of 16 bytes in each page.
Table 10-1. AT30TSE752/754/758 Serial EEPROM Memory Organization
10.2
Device
Density
Bytes in Each Page
Number of Pages in Array
AT30TSE752
2Kb (256 bytes)
16
16
AT30TSE754
4Kb (512 bytes)
16
32
AT30TSE758
8Kb (1024 bytes)
16
64
Memory Addressing
Every Serial EEPROM byte location within the AT30TSE752/754/758 can be individually accessed for Write or Read
operations. To access a byte location requires entering the desired byte address in the address field for a Write or Read
operation. The address field size will vary depending on the Serial EEPROM density; the AT30TSE752 requires an 8-bit
address field, AT30TSE754 requires a 9-bit address field and the AT30TSE758 requires a 10-bit address field.
Table 10-2 shows the address byte and the relationship of the P0 and P1 memory page address bits and the device
address bits (A2-A0). The P0 bit is the MSB of the required 9-bit address field for the AT30TSE754 and the P0 and P1
bits are the MSBs of the required 10-bit address field for the AT30TSE758. The P0 and P1 bits along with the word
address byte comprise the required 9-bit or 10-bit address field for the AT30TSE754 and AT30TSE758, respectively, to
enable every byte in the memory to be individually selected for a Write or Read operation.
The software device address bits (A2-A0) must match the corresponding hard-wired device address pins (A2-0) for proper
communication (ACK) to occur.
Example:
The AT30TSE752 requires that all three device address bits (A2-A0) must match the corresponding
hard-wired device address pins (A2-0). The AT30TSE754 requires the device address bits (A2 and A1) must
match the hard-wired device address pins (A2 and A1). The AT30TSE758 requires only the device address
bit (A2) to match the hard-wired device address pin (A2).
Table 10-2. Serial EEPROM Address Byte
Bit 7
Device
Bit 6
Bit 5
Bit 4
Bit 3
Device Type Identifier
Bit 2
Bit 1
Device Address
Bit 0
Read/Write
AT30TSE752
1
0
1
0
A2
A1
A0
R/W
AT30TSE754
1
0
1
0
A2
A1
P0
R/W
AT30TSE758
1
0
1
0
A2
P1
P0
R/W
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
35
10.3
Write Operations
The Serial EEPROM within the AT30TSE752/754/758 supports single byte writes up to a full 16 bytes per page. The only
difference between a Byte Write and a Page Write protocol sequence is the amount of data bytes loaded. Regardless of
whether a Byte Write or Page Write operation is performed, it will take the same amount of time to write the data to the
addressed memory location(s). The internal Write cycle will complete in the minimum tWR specification.
10.3.1 Byte Write
Following the Start condition from the Master, the device type identifier (1010), the device address bits and the R/W,
which is Logic 0 state, are placed onto the bus by the Master. This indicates to the addressed device that the Master will
follow by transmitting a byte with the word address. The AT30TSE752/754/758 will respond with an ACK during the ninth
clock cycle. Then the next byte transmitted by the Master is the 8-bit word address of the byte location in the memory to
be written. After receiving an ACK by the AT30TSE752/754/758, the Master will transmit the data byte to be written into
the addressed memory location. The AT30TSE752/754/758 responds with an ACK and then the Master generates a
Stop condition. The Stop condition initiates the internal Write cycle and, during this time, the AT30TSE752/754/758 will
not respond (NACK) to any valid protocol until the Write cycle is complete. The internal Write cycle will complete in the
minimum tWR specification.
Figure 10-1. Byte Write to Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D2
D1
D0
0
SCL
Device Address Byte
SDA
1
0
1
0
A
A/P1 A/P0
Word Address Byte
0
0
MSB
Start
by
Master
A7
A6
A5
A4
A3
A2
Data Byte
A1
A0
0
MSB
ACK
from
Slave
D7
D6
D5
D4
D3
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
10.3.2 Page Write
The device address byte, word address byte, and the first data byte are transmitted to the AT30TSE752/754/758 in the
same way as in the Byte Write protocol sequence. But instead of generating a Stop condition, the Master transmits up to
16 data bytes to the AT30TSE752/754/758, which are temporarily stored into an internal page buffer and will be written
into memory once the Master has generated the Stop condition. Upon receipt of each data byte, the four lower order
word address bits are internally incremented by one since the page size is 16 bytes. If the Master should transmit more
than 16 data bytes prior to generating the Stop condition, the address counter will roll over and the previously received
data will be replaced. As with the Byte Write operation, once the Stop condition is generated by the Master, then the
device's internal Write cycle will begin. The internal Write cycle will complete in the minimum tWR specification. A very
important point to understand is that Page Write operations are limited to writing data bytes within a single physical page
regardless of the number of bytes actually being written.
Example:
36
If a Page Write operation attempts to write across a physical page boundary, then the data will simply
rollover to the beginning of the same page and replace any existing data bytes previously loaded in the
page buffer.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Figure 10-2. Page Write to Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
0
0
SCL
Device Address Byte
SDA
1
0
1
0
A
Word Address Byte
0
A/P1 A/P0
0
0
MSB
Start
by
Master
1
0
0
0
0
ACK
from
Slave
ACK
from
Slave
2
3
4
5
6
7
8
9
1
2
Data Byte (n)
D7
0
MSB
D6
D5
D4
D3
D2
3
4
5
6
7
8
9
1
2
D1
D0
0
D7
D6
D5
D4
D3
D2
D1
D0
0
MSB
ACK
from
Slave
4
5
6
7
8
9
D1
D0
0
Data Byte (n+15)
Data Byte (n+1)
MSB
3
D7
D6
D5
D4
D3
D2
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
10.3.3 Acknowledge Polling
Since the AT30TSE752/754/758 will NACK during a Write cycle because it is busy writing data, this can be used to
determine when the Write cycle is complete and therefore could be used to maximize bus throughput. Once the Stop
condition for a write sequence has been issued from the Master, the AT30TSE752/754/758 initiates the internally
self-timed Write cycle and ACK polling can then be immediately started by the Master. This involves the Master
transmitting a Start condition followed the device address byte. If the AT30TSE752/754/758 is still busy with the Write
cycle, NACK will be returned by the device. If the Write cycle is complete, the device will ACK indicating the Write cycle is
complete and the Master can then proceed with the next Read or Write operation.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
37
10.4
Read Operations
Read operations are initiated in the same way as Write operations, with the exception that the R/W is set to a Logic 1
state. There are three basic types of Read operations: Current Address Read, Random Read, and Sequential Read.
10.4.1 Current Address Read
The AT30TSE752/754/758 contains an internal address counter that maintains the address of the last byte address
accessed during the last Read or Write operation incremented by one. The address stays valid between operations as
long as the power to the device is maintained. The address rollover during a Read operation is from the last byte of the
last memory page to the first byte of the first page. Upon receipt of the device address byte with the R/W bit set to a
Logic 1 state, the AT30TSE752/754/758 will ACK and transmit the 8-bit data byte. The Master will respond with a NACK
followed by a Stop condition to end the transmission. It is recommended to not rely on the Current Address Read
operation because the only way to guarantee the correct Read Address is to use the Random Read Protocol that loads
the specific starting byte address location of the data to be read. For more details about the Random Read Protocol, see
Section 10.4.2, Random Read.
Figure 10-3. Current Address Read from Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D2
D1
D0
1
SCL
Device Address Byte
SDA
1
0
1
0
A
A/P1 A/P0
Data Byte (n)
1
0
MSB
Start
by
Master
38
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
D7
D6
D5
D4
D3
MSB
ACK
from
Slave
NACK
from
Master
Stop
by
Master
10.4.2 Random Read
Random Read operations allow the Master to access any memory location in a random manner and requires a “dummy
write” sequence to preload the byte address of the data byte to be read. To perform this type of Read operation, the data
byte address must first be set. This is accomplished by sending the device address byte and the word address byte to
the AT30TSE752/754/758 as part of a Write operation or “dummy write” sequence. Once the word address byte is sent,
the Master generates a Start condition following the ACK. This terminates the Write operation but not before the
AT30TSE752/754/758’s internal address pointer is set. This is the reason it is called a “dummy write” sequence as its
only purpose is to preload the starting byte address to be read from. The Master then issues the device address byte
again, but with the R/W bit set to a Logic 1 state. The AT30TSE752/754/758 will ACK and transmit the data byte. The
Master will NACK and generate a Stop condition and the AT30TSE752/754/758 will discontinue the transmission.
Figure 10-4. Random Read from Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
0
0
0
SCL
Device Address Byte
SDA
1
0
1
0
A
Word Address Byte
A/P1 A/P0
0
0
0
MSB
0
0
0
0
0
MSB
Start
by
Master
ACK
from
Slave
ACK
from
Slave
Dummy Write
1
2
3
4
5
6
7
8
9
1
2
0
1
0
A
A/P1 A/P0
1
0
MSB
Start
by
Master
4
5
6
7
8
9
D2
D1
D0
1
Data Byte (n)
Device Address Byte
1
3
D7
D6
D5
D4
D3
MSB
ACK
from
Slave
NACK
from
Master
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
Stop
by
Master
39
10.4.3 Sequential Read
Sequential Read operations are initiated in the same way as a Random Read, except that after the
AT30TSE752/754/758 transmits the first data byte, the Master issues a ACK instead of a NACK and Stop condition in a
Random Read operation. This directs the AT30TSE752/754/758 to increment the internal address pointer by one and
transmit the next sequentially addressed data byte. The AT30TSE752/754/758 will repeat and continue transmitting
sequential data bytes until the Master wants to terminate the Read operation by issuing a NACK and Stop condition.
Figure 10-5. Sequential Read from Serial EEPROM
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
D2
D1
D0
0
SCL
Device Address Byte
SDA
1
0
1
0
A
Data Byte (n)
1
A/P1 A/P0
0
D7
MSB
Start
by
Master
1
2
3
4
5
6
7
8
9
D4
D3
ACK
from
Master
1
2
D6
D5
D4
D3
D2
3
4
5
6
7
8
9
1
2
D1
D0
0
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
D6
D5
D4
D3
D2
D1
D0
0
MSB
ACK
from
Master
AT30TSE752/754/758 [DATASHEET]
D7
3
4
5
6
7
8
9
D1
D0
1
Data Byte (n+x)
Data Byte (n+2)
MSB
40
D5
ACK
from
Slave
Data Byte (n+1)
D7
D6
MSB
D7
D6
D5
D4
D3
D2
MSB
ACK
from
Master
NACK
from
Master
Stop
by
Master
10.5
Software Write Protect
The AT30TSE752/754/758 features a Reversible Software Write Protect (RSWP) mode that once enabled, disables the
Serial EEPROM write circuitry and therefore, protects the contents of the entire memory array against any intentional or
unintentional Write operations. The RSWP feature is invoked by sending the “Set RSWP” protocol sequence to the
AT30TSE752/754/758 that is similar to a normal memory Write command sequence as shown in Table 10-3 and
Figure 10-6. The Master can set the memory array to Full Write Protection status by issuing a Start condition followed by
01100010 and the AT30TSE752/754/758 will respond with an ACK. Next, the Master sends the word address byte and
the AT30TSE752/754/758 will respond with an ACK. Then the Master sends the data byte and the AT30TSE752/754/758
will respond with an ACK. The word address and data bytes are don't care values. In addition, during the protocol
sequence, the A2 and A1 device address pins must be set to ground and the A0 device address pin set to VHV.
The Software Write Protection can be reversed to no protect status by the Master sending the “Clear RSWP” protocol
sequence as shown in Table 10-3 and Figure 10-7. This requires the Master to send a Start condition followed by
01100110, Word Address Byte, Data Byte, and a Stop condition with an ACK response from the AT30TSE752/754/758
after each byte transferred. The word address and data bytes are don't care values. In addition, during the protocol
sequence, the A2 device address pin must be set to ground, A1 device address pin set to VCC and the A0 device address
pin set to VHV.
The Write Protection status can be checked to see if the memory array is in full protection or not by sending a Start
condition followed by 01100011 (63h), if the AT30TSE752/754/758 responds with a NACK, this indicates the memory
array is in full write protect. Likewise, if the AT30TSE752/754/758 responds with an ACK, this indicates the memory array
is not protected.
Table 10-3. Software Write Protection for Serial EEPROM
Device Address Pin
RSWP Write
R/W
Command
A2
A1
A0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Set RSWP
GND
GND
VHV
0
1
1
0
0
0
1
0
Clear RSWP
GND
VCC
VHV
0
1
1
0
0
1
1
0
Note:
VHV = High Voltage. See Section 12.3 “DC Characteristics” on page 46 for more information.
Figure 10-6. Set Reversible Software Write Protect
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
X
X
X
0
SCL
Device Address Byte
SDA
0
1
1
0
0
0
Word Address Byte
1
0
0
MSB
Start
by
Master
Notes: 1.
2.
X
X
X
X
X
X
Data Byte
X
X
0
MSB
ACK
from
Slave
X
X
X
X
X
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
Apply GND at A2 and A1 pins and VHV at A0 pin.
X = Don't care
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
41
Figure 10-7. Clear Reversible Software Write Protect
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
X
X
X
0
SCL
Device Address Byte
SDA
0
1
1
0
0
1
Word Address Byte
1
0
0
MSB
Start
by
Master
Notes: 1.
2.
42
X
X
X
X
X
X
Apply GND at A2 and VCC at A1 pin and VHV at A0 pin.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
X
X
0
MSB
ACK
from
Slave
X = Don't care
Data Byte
X
X
X
X
X
MSB
ACK
from
Slave
ACK
from
Slave
Stop
by
Master
11.
SMBus Features and I2C General Call
11.1
SMBus Alert
The AT30TSE752/754/758 utilizes the ALERT pin to support the SMBus Alert function when the Alarm Thermostat mode
is set to the Interrupt mode (the CMP/INT bit of the Configuration Register is set to one) and the ALERT pin polarity is set
to active low (the POL bit of the Configuration Register is set to zero). The AT30TSE752/754/758 is a slave-only device,
and normally, slave devices on the SMBus cannot signal to the Master that they want to communicate. However, the
AT30TSE752/754/758 uses the SMBus Alert function (the ALERT pin) to signal to the Master that it wants to
communicate.
Several SMBus ALERT pins from different slave devices can be connected to a common SMBus Alert input on the
Master. When the SMBus Alert input on the Master is pulled low by one of the slave devices, the Master can perform a
specialized Read operation from the slave devices to determine which device sent the SMBus Alert signal.
The specialized Read operation is known as an SMBus Alert Response Address (ARA) and requires that the Master first
initiate a Start condition followed by the SMBus ARA code of 00011001. The slave device that generated the SMBus
Alert signal will respond to the Master with an ACK. After sending the ACK, the slave device will then output its own
device address (1001AAA for the AT30TSE752/754/758 where “AAA” corresponds to the hard-wired A2-0 address pins)
on the bus. Since the device address is seven bits long, the remaining eighth bit (the LSB) is used as an indicator to
notify the Master which temperature limit caused the alarm (the LSB will be a Logic 1 if the THIGH limit was met or
exceeded, and the LSB will be a Logic 0 if the TLOW limit was exceeded).
The SMBus ARA can activate several slave devices at the same time; therefore, if more than one slave responds,
standard SMBus arbitration rules apply and the device with the lowest address wins the arbitration. The device winning
the arbitration will clear its SMBus Alert output after it has responded to the SMBus ARA and provided its device address.
All other devices with higher addresses do not generate an ACK and continue to hold their SMBus Alert outputs low until
cleared. The Master will continue to issue SMBus ARA sequences until all slave devices that generated an SMBus Alert
signal have responded and cleared their SMBus Alert outputs.
Figure 11-1. SMBus Alert
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCK
AT30TSE752/754/758
Device Address Byte
SMBus ARA Code
SDA
0
0
0
1
1
0
0
1
0
MSB
Start
by
Master
Note:
1
0
0
1
A2
A1
A0 Limit
1
MSB
ACK
from
Slave
NACK
from
Master
Stop
by
Master
The “Limit” bit (the LSB) of the device address byte will be one or zero depending on if the THIGH or TLOW
limit was exceeded.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
43
11.2
SMBus Timeout
The AT30TSE752/754/758 supports the SMBus Timeout feature in which the AT30TSE752/754/758 will reset its serial
interface and release the SMBus (stop driving the bus and let SDA float high) if the SCL pin is held low for more than the
minimum tTIMEOUT specification. The AT30TSE752/754/758 will be ready to accept a new Start condition before tTIMEOUT
maximum has elapsed.
Figure 11-2. SMBus Timeout
tTIMEOUT (MAX)
tTIMEOUT (MIN)
SCL
Device will release Bus and
be ready to accept a new
Start Condition within this Time
11.3
General Call
The AT30TSE752/754/758 will respond to an I2C General Call address (0000000) from the Master only if the eighth bit
(the LSB) of the General Call address byte is zero. If the General Call address byte is 00000000, then the device will
send an ACK to the Master and await a command byte from the Master.
If the Master sends a command byte of 04h, then the AT30TSE752/754/758 will re-latch the status of its address pins in
case the system has assigned a new address to the device. If the Master sends a command byte of 06h (General Call
Reset), then the AT30TSE752/754/758 will re-latch the status of its address pins and perform a reset sequence. The
reset sequence will cause the contents of the Nonvolatile Data Registers to be copied into the Volatile Data Registers,
and the device will be busy for a maximum time of tPOR during the reset and copying operation.
44
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
12.
Electrical Specifications
12.1
Absolute Maximum Ratings*
Temperature under Bias . . . . . . . -40°C to +125°C
Storage Temperature . . . . . . . . . -65°C to +150°C
Supply voltage
with respect to ground . . . . . . . . . . . -0.5V to +7.0V
ALERT Pin. . . . . . . . . . . . . . . . -0.5V to VCC + 0.3V
All input voltages
with respect to ground . . . . . . . -0.5V to VCC + 0.5V
All other output voltages
with respect to ground . . . . . . . -0.5V to VCC + 0.5V
12.2
*Notice: Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
Functional operation of the device at these ratings or any
other conditions beyond those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods
may affect device reliability. Voltage extremes referenced
in the “Absolute Maximum Ratings” are intended to
accommodate short duration undershoot/overshoot
conditions and does not imply or guarantee functional
device operation at these levels for any extended period of
time.
Pull-up voltages applied to the ALERT pin that exceed the
“Absolute Maximum Ratings” may forward bias the ESD
protection circuitry. Doing so may result in improper device
function and may corrupt temperature measurements.
DC and AC Operating Range
Atmel AT30TSE752/754/758
Operating Temperature (Case)
Industrial High Temperature
-55C to +125C(1)(2)
VCC Power Supply
Notes: 1.
2.
2.7V to 5.5V
Device operation is guaranteed from -40°C to +125°C.
Device operation is not guaranteed at -55°C but ensured by characterization.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
45
12.3
DC Characteristics
Symbol
ICC
Active Current
Typ(1)
Max
Active Temperature Conversions,
Bus Inactive, VCC = 3.3V
95
125
Active Temperature Conversions,
Bus inactive, VCC = Max
120
175
Active Temperature Conversions,
fSCL = 400kHz, VCC = 3.3V
125
175
Active Temperature Conversions,
fSCL = 400kHz, VCC = Max
200
250
Condition
Min
Active Current,
Nonvolatile Register Read
VCC = 3.3V
0.3
0.5
VCC = Max
0.6
0.9
ICC1
Active Current,
Nonvolatile Register Read/Copy
VCC = 3.3V
0.7
0.9
VCC = Max
1.6
2.0
Bus Inactive, VCC = 3.3V
0.6
1.6
Bus Inactive, VCC = Max
1.1
3.5
fSCL = 400kHz, VCC = 3.3V
125
165
fSCL = 400kHz, VCC = Max
185
220
Shutdown Mode Current
Units
μA
ICC1
ISD
mA
mA
μA
ILI
Input Leakage Current
VIN = CMOS levels
±1
μA
ILO
Output Leakage Current
VOUT = CMOS levels
±1
μA
VIL
Input Low Voltage
0.3 x VCC
V
VIH
Input High Voltage
VHV
Input High Voltage,
Reversible Write Protection
VOL1
Output Low Voltage
VOL2
Output Low Voltage, ALERT
Pin
Note:
46
Parameter
1.
0.7 x VCC
7
10
V
IOL = 3mA
0.4
V
IOL = 4mA
0.4
V
Typical values characterized at TA = +25°C unless otherwise noted.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
V
12.4
Temperature Sensor Accuracy and Conversion Characteristics
Symbol
Parameter
Condition
Min
TA = 0°C to +55°C
VCC = 2.7V to 3.6V
TA = -5°C to +90°C
VCC = 2.7V to 3.6V
TA = -20°C to +125°C
VCC = 2.7V to 3.6V
TACC
Sensor Accuracy
TA = -40°C to +125°C
TA = 0°C to +55°C
VCC = 3.6V to 5.5V
TA = -20°C to +105°C
VCC = 3.6V to 5.5V
TA = -55°C to +125°C(2)
Conversion Resolution
tCONV
Conversion Time
Notes: 1.
2.
Selectable 9 to 12 bits
Max
±1.0
±1.5
±1.0
±2.0
±2.0
±3.0
Units
C
±3.0
VCC = 2.7V to 5.5V
TRES
Typ(1)
±1.0
±2.0
±2.0
±3.0
±3.0
0.5 (9 bits)
0.0625 (12 bits)
9-bit Resolution
25
37.5
10-bit Resolution
50
75
11-bit Resolution
100
150
12-bit Resolution
200
300
C
ms
Typical values characterized at VCC = 3.3V, TA = +25°C unless otherwise noted.
Sensor accuracy characterized to this range but not tested or guaranteed.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
47
12.5
AC Characteristics
Fast Mode
Symbol
Parameter
Min
Max
Units
fSCL
Serial Clock Frequency
1(1)
400
kHz
tSCLH
Clock High Time
600
ns
tSCLL
Clock Low Time
1300
ns
tR
Clock/Data Input Rise Time
300
ns
tF
Clock/Data Input Fall Time
300
ns
tSUDAT
Data In Setup Time
50
ns
tHDDAT
Data In Hold Time
0
ns
tV
Output Valid Time
tOH
Output Hold Time
tBUF
450
ns
0
ns
Bus Free Time Between Stop and Start Condition
600
ns
tSUSTA
Repeated Start Condition Setup Time (SCL High to SDA Low)
50
ns
tHDSTA
Start Condition Hold Time (SDA Low to SCL Low)
50
ns
tSUSTO
Stop Condition Setup Time (SCL High to SDA High)
50
ns
tNS
Noise Suppression Input Filter Time
tTIMEOUT
SMBus Timeout Time
CLOAD
Capacitive Load for SCL and SDA Lines
Note:
1.
25
50
ns
75
ms
400
pF
Minimum clock frequency must be at least 1kHz to avoid activating the SMBus Timeout feature.
Figure 12-1. SMBus/I2C Timing Diagram
tSCKH
tR
tSCKL
tF
SCL
tOH
tSUDAT
tSUSTO
tSUSTA
tV
SDA
IN
IN
Start
Condition
48
tHDSTA
tHDDAT
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
OUT
tBUF
OUT
IN
Stop
Condition
Start
Condition
IN
Repeated Start
Condition
12.6
Nonvolatile Register and Serial EEPROM Characteristics
Typ(1)
Max
Units
Nonvolatile Register Program Time
1.0
5.0
ms
tWR
Serial EEPROM Write Cycle Time
3.0
5.0
ms
tCOPYW
Volatile to Nonvolatile Register Copy Time
1.0
5.0
ms
tCOPYR
Nonvolatile to Volatile Register Copy Time
100
200
μs
NENDUR
Nonvolatile Register Program/Copy Endurance
SENDUR
Serial EEPROM Write Endurance
Symbol
Parameter
tPROG
Note:
12.7
1.
Min
50,000
100,000
Cycles
1,000,000
Cycles
Typical values characterized at VCC = 3.3V, TA = +25°C unless otherwise noted.
Power-Up Conditions
Symbol
Parameter
tPOR
Max
Units
Power-On Reset Time
500
μs
tPUW
Power-Up Device Delay before Nonvolatile Register or Memory
Program Allowed
500
μs
VPOR
Power-On Reset Voltage Range
2.6
V
tPU
Maximum Allowable Power-Up Time
1(1)
ms
Note:
1.
Min
Please reference the AT30TSE752A/754A/758A datasheet for devices that can accommodate power-up
(VCC ramp) times longer than the specified value.
Figure 12-2. Power-Up Timing
VCC
Device Access Permitted
VCC (min)
VPOR (max)
VPOR (min)
tPOR
tPUW
Do Not Attempt
Device Access
During this Time
tPU
Time
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
49
12.8
Pin Capacitance
Symbol
Parameter
CI/O(1)
(1)
CIN
Note:
12.9
1.
Min
Max
Units
Input/Output Capacitance (SDA and ALERT pins)
VI/O = 0V
8
pF
Input Capacitance (A2-0 and SCL pins)
VIN= 0V
6
pF
Not 100% tested (value guaranteed by design and characterization).
Input Test Waveforms and Measurement Levels
AC
Input
Levels
0.9VCC
VCC
2
0.1VCC
tR, tF < 5ns (10% to 90%)
12.10 Output Test Load
Device
Under
Test
100pF
50
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
AC
Measurement
Level
13.
Ordering Information
13.1
Atmel Ordering Code Detail
AT 3 0 T S E 7 5 2 - S S 8 - B
Atmel Designator
Product Family
30TSE = Digital Temperature Sensor
with Integrated EEPROM
Device Type
EEPROM Density
2 = 2-kilobit
4 = 4-kilobit
8 = 8-kilobit
Shipping Carrier Option
B = Bulk (Tubes)
Y = Bulk (Trays)
T = Tape and Reel
Device Grade
8 = Green, NiPdAu Lead Finish,
Industrial High Temperature Range
(–40°C to +125°C) Accuracy Guaranteed
Package Option
SS = 8-lead, 0.150" wide SOIC
XM = 8-lead, 3.0mm x 3.0mm MSOP
MA = 8-pad, 2.0mm x 3.0mm x 0.6mm
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
51
13.2
Green Package Options (Pb/Halide-free/RoHS Compliant)
Atmel Ordering Code
AT30TSE752-SS8-B
AT30TSE752-SS8-T
AT30TSE752-XM8-B
AT30TSE752-XM8-T
AT30TSE752-MA8-T
AT30TSE754-SS8-B
AT30TSE754-SS8-T
AT30TSE754-XM8-B
AT30TSE754-XM8-T
AT30TSE754-MA8-T
AT30TSE758-SS8-B
AT30TSE758-SS8-T
AT30TSE758-XM8-B
AT30TSE758-XM8-T
AT30TSE758-MA8-T
Note:
Package
Lead (Pad)
Finish
Operating
Voltage
Max. Freq.
(kHz)
NiPdAu
2.7V to 5.5V
400
Industrial High Temperature
(-55°C to +125°C)
NiPdAu
2.7V to 5.5V
400
Industrial High Temperature
(-55°C to +125°C)
NiPdAu
2.7V to 5.5V
400
Industrial High Temperature
(-55°C to +125°C)
Operation Range
8S1
8XM
8MA2
8S1
8XM
8MA2
8S1
8XM
8MA2
The shipping carrier option code is not marked on the devices.
Package Type
52
8S1
8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8XM
8-lead, 3.0mm x 3.0mm, Plastic Miniature Small Outline (MSOP)
8MA2
8-pad, 2.0mm x 3.0mm x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead (UDFN)
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
14.
Part Marking Detail
AT30TSE752, AT30TSE754 & AT30TSE758: Package Marking Information
8-lead SOIC
8-lead UDFN
8-lead MSOP
2.0 x 3.0 mm Body
ATML8YWW
###
@
AAAAAAAA
Note 1:
##
8 @
YXX
###
8 XX
YWW@
designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT30TSE752
Truncation Code ###: T5 or T752
AT30TSE754
Truncation Code ###: T6 or T754
AT30TSE758
Truncation Code ###: T7 or T758
Date Codes
Y = Year
3: 2013
4: 2014
5: 2015
6: 2016
Voltages
7: 2017
8: 2018
9: 2019
0: 2020
M = Month
A: January
B: February
...
L: December
WW = Work Week of Assembly
02: Week 2
04: Week 4
...
52: Week 52
Country of Assembly
Lot Number
@ = Country of Assembly
AAA...A = Atmel Wafer Lot Number
% = Minimum Voltage
Blank: 2.7V min
Grade/Lead Finish Material
Trace Code
8: Industrial (C)
(-40°C to 125°C)/NiPdAu
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
1/18/13
TITLE
Package Mark Contact:
[email protected]
AT30TSE75xSM, AT30TSE752, AT30TSE754 &
AT30TSE758 Package Marking Information
DRAWING NO.
REV.
30TSE75xSM
A
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
53
15.
Packaging Information
15.1
8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
SYMBOL MIN
A
1.35
NOM
MAX
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
6/22/11
Package Drawing Contact:
[email protected]
54
TITLE
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
GPC
SWB
DRAWING NO.
REV.
8S1
G
8XM — 8-lead MSOP
Pin 1
3
2
1
E
0.20 C B A
1
-B-
E1
CL
N
TOP VIEW
3
N
b
A2
3
2X
(N/2 TIPS)
2
1
0.05 S
15.2
SEE
DETAIL "A"
BOTTOM VIEW
END VIEW
e
0.25
BSC
A
0.07 R. MIN
2 PLACES
SEATING PLANE
0.10 C
A1
-HD
1
4
C
OC
SEATING
PLANE
-C-
DETAIL 'A'
-A-
COMMON DIMENSIONS
(Unit of Measure = mm)
SIDE VIEW
SYMBOL
NOTES:
1. DIMENSIONS "D" & "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS, AND ARE MEASURED
AT DATUM PLANE -H- , MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
2. DIMENSION IS THE LENGTH OF TERMINAL
FOR SOLDERING TO A SUBSTRATE.
3. TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
4. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.10mm AT SEATING PLANE.
5. DATUMS -A- AND -B- TO BE DETERMINED BY DATUM
PLANE -H- .
MIN
NOM
MAX
A
-
-
1.10
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.22
-
0.38
D
2.90
3.00
3.10
2.90
3.00
E
E1
L
TITLE
8XM, 8-lead, 3.0x3.0mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP/MSOP)
NOTE
1
4.90 BSC
e
C
OC
Package Drawing Contact:
[email protected]
L 2
3.10
1
2
0.65 BSC
0.40
0.55
0.80
0°
4°
8°
GPC
TZD
3/1/11
DRAWING NO. REV.
8XM
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
A
55
15.3
8MA2 — 8-pad UDFN
E
1
8
Pin 1 ID
2
7
3
6
4
5
D
C
A2
A
A1
E2
COMMON DIMENSIONS
(Unit of Measure = mm)
b (8x)
8
1
7
2
Pin#1 ID
6
D2
3
5
4
e (6x)
K
L (8x)
SYMBOL
MIN
NOM
MAX
D
1.90
2.00
2.10
E
2.90
3.00
3.10
D2
1.40
1.50
1.60
E2
1.20
1.30
1.40
A
0.50
0.55
0.60
A1
0.0
0.02
0.05
A2
–
–
0.55
C
L
NOTE
0.152 REF
0.30
e
0.35
0.40
0.50 BSC
b
0.18
0.25
0.30
K
0.20
–
–
3
9/6/12
Package Drawing Contact:
[email protected]
56
TITLE
8MA2, 8-pad, 2 x 3 x 0.6 mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No
Lead Package (UDFN)
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
GPC
YNZ
DRAWING NO.
8MA2
REV.
C
16.
Errata
16.1
Fault Counter
Issue:
The internal fault counter will be reset when updating the Configuration Register, the THIGH
Limit Register, or the TLOW Limit Register.
Workaround: None. The current version of the device was intentionally designed to operate this way; however, it
has been discovered that resetting of the fault counter when updating the registers is not
preferred.
Resolution:
The operation of the device has been changed with a new revision of the device,
AT30TSE752A/754A/758A, so updating the Configuration Register, the THIGH Limit Register, or
the TLOW Limit Register will not affect the internal fault counter. Please reference the Atmel
AT30TSE752A/754A/758A datasheet.
Issue:
After power-up, the device will not copy the contents of the NVFT1 and NVFT0 bits from the
Nonvolatile Configuration Register into the FT1 and FT0 bits of the Configuration Register
until after the first temperature conversion cycle has completed. As a result, both the FT1
and FT0 bits of the Configuration Register will be set to zero (Fault Tolerance Queue value
of one) for the first temperature conversion cycle. Therefore, a single temperature fault
could trigger the ALERT output for the very first temperature conversion after device
power-up.
Workaround: None
Resolution:
This issue has been corrected with a new revision of the device, AT30TSE752A/754A/758A, so
the NVFT1 and NVFT0 bits will be copied into the FT1 and FT0 bits prior to the first temperature
conversion cycle. Please reference the Atmel AT30TSE752A/754A/758A datasheet.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
57
16.2
ALERT Pin
Issue:
Depending on Power supply Ramp time, the ALERT pin may not be configured in the
proper state to be a true open drain.
Workaround: The ALERT pin must be pulled-high using an external pull-up resistor even when it is not used.
Care must also be taken to prevent this pin from being shorted directly to ground without a resistor
at any time whether during testing or normal operation.
Resolution:
16.3
The operation of the ALERT pin has been changed with a new revision of the device,
AT30TSE752A/754A/758A, so it is a true open drain. Please reference the Atmel
AT30TSE752A/754A/758A datasheet.
ALERT Pin State
Issue:
When switching between Comparator and Interrupt modes (or vice versa) while the ALERT
pin is active, the device will not retain its active alert state and will automatically deassert
the ALERT pin.
Workaround: None.
Resolution:
58
The operation of the ALERT pin has been changed with a new revision of the device,
AT30TSE752A/754A/758A, so it will properly retain the ALERT pin status when switching modes.
Please reference the Atmel AT30TSE752A/754A/758A datasheet.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
17.
Revision History
Doc. Rev.
Date
04/2014
Comments
End Of Life. AT30TSE752 replaced by AT30TSE752A; AT30TSE754 replaced by
AT30TSE754A; AT30TSE758 replaced by AT30TSE758A.
Remove RSWP status check command to 63h in Software Write Protect section.
Add Software Write Protection to the Address Byte table.
8751F
09/2013
Update AMR, DC Characteristics, Temperature Sensor Accuracy and Converison
Characteristics, and AC Characteristics tables.
Change maximum frequency in odering codes from 3400kHz to 400kHz
Update Errata section.
Update errata section.
8751E
07/2013
Correct RSWP status check command to 63h in Software Write Protect section.
Correct maximum frequency in odering codes from 400kHz to 3400kHz
Update footers and disclaimer page.
8751D
08/2012
8751C
06/2012
Remove duplicate paragraph in description section.
Add tPU Power-Up condition.
Update Atmel logos and disclaimer pager.
Update ALERT pin’s function description and errata.
Update Power-up Timing figure.
Add device operation temperatures (–40°C to +125°C) accuracy guaranteed.
Add sensor accuracy typical ±3.0 and remove value from max.
8751B
04/2012
Correct Clock High Time max value from 40kHz to 400kHz.
Change 45μA to 75μA for low power dissipation typical active current.
Change 0.1μA to 1μA for Shutdown mode typical active current.
Remove preliminary status.
Update template.
8751A
03/2011
Initial document release.
AT30TSE752/754/758 [DATASHEET]
Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013
59
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© 2013 Atmel Corporation. / Rev.: Atmel-8751F-DTS-AT30TSE752-754-758-Datasheet_092013.
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