Data Sheet

BGU7051
SiGe:C low noise high linearity amplifier
Rev. 2 — 11 November 2011
Product data sheet
1. Product profile
1.1 General description
The BGU7051 is a low noise high linearity amplifier for wireless infrastructure
applications.The LNA has a high input and output return loss and is designed to operate
between 0.5 GHz and 1.5 GHz. It is housed in a 3  3  0.85 mm3 10-terminal plastic thin
small outline package. The LNA is ESD protected on all terminals.
1.2 Features and benefits









Low Noise Figure (NF) = 0.65 dB at 900 MHz
High linearity performance, IP3O = 33 dBm at 900 MHz
High input and output return loss
Unconditionally stable
110 GHz transit frequency - SiGe:C technology
Supply voltage 3.3 V
Small 10-terminal leadless package 3  3  0.85 mm3
ESD protection on all terminals
Moisture sensitivity level 1
1.3 Applications
 LNA for wireless infrastructure applications (0.5 GHz to 1.5 GHz)
 Low noise applications
1.4 Quick reference data
Table 1.
Quick reference data
f = 900 MHz; VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified.
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Typ
Max
Unit
3.0
-
3.6
V
65
ICC
supply current
50
80
mA
Gass
associated gain
19.5 21.0
22.5
dB
NF
noise figure
-
0.65
0.95
dB
PL(1dB)
output power at 1 dB gain compression
15
16.5
-
dBm
IP3O
output third-order intercept point
30
33
-
dBm
BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
2. Pinning information
2.1 Pinning
terminal 1
index area
n.c.
1
10 n.c.
VCC1
2
9
VCC2
GND
3
8
GND
RF_IN
4
7
RF_OUT
GND
5
6
GND
BGU7051
aaa-000469
Transparent top view
Fig 1.
Pin configuration
2.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
n.c.
1, 10
not connected
VCC1
2
supply voltage
GND
3, 5, 6, 8
ground
RF_IN
4
RF input
RF_OUT
7
RF output
VCC2
9
supply voltage
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
BGU7051
BGU7051
Product data sheet
Description
Version
HVSON10 plastic thermal enhanced very thin small outline
package; no leads; 10 terminals; body 3  3  0.85 mm
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Rev. 2 — 11 November 2011
SOT650-1
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NXP Semiconductors
SiGe:C low noise high linearity amplifier
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min Max Unit
VCC
supply voltage
Pi(RF)CW
continuous waveform
RF input power
Tstg
storage temperature
65 150
C
Tj
junction temperature
-
C
Tamb
ambient temperature
VESD
electrostatic discharge
voltage
VCC = 3.3 V
0
5
V
-
20
dBm
150
40 85
C
Human Body Model (HBM);
According JEDEC standard 22-A114E
-
4
kV
Charged Device Model (CDM);
According JEDEC standard 22-C101B
-
2
kV
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
Typ
Unit
26
K/W
6. Characteristics
Table 6.
Characteristics
VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are measured at the device
RF in and RF output terminals.
Symbol
Parameter
VCC
Min
Typ
Max Unit
supply voltage
3.0
-
3.6
V
ICC
supply current
50
65
80
mA
Gass
associated gain
f = 750 MHz
-
23.5
-
dB
f = 850 MHz
-
21.5
-
dB
f = 900 MHz
19.5 21.0
22.5 dB
f = 750 MHz
-
-
dB
dB
NF
PL(1dB)
IP3O
Conditions
noise figure
output power at 1 dB gain compression
output third-order intercept point
BGU7051
Product data sheet
0.6
f = 850 MHz
-
0.63
-
f = 900 MHz
-
0.65
0.95 dB
f = 750 MHz
-
17.0
-
dBm
f = 850 MHz
-
16.5
-
dBm
f = 900 MHz
15
16.5
-
dBm
f = 750 MHz
-
32
-
dBm
f = 850 MHz
-
32
-
dBm
f = 900 MHz
30
33
-
dBm
2-tone; spacing 5 MHz; Pi = 20 dBm
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Rev. 2 — 11 November 2011
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
Table 6.
Characteristics …continued
VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are measured at the device
RF in and RF output terminals.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
RLin
input return loss
f = 750 MHz
-
27.5
-
dB
f = 850 MHz
-
26.0
-
dB
f = 900 MHz
-
24.5
-
dB
f = 750 MHz
-
18.0
-
dB
f = 850 MHz
-
17.5
-
dB
output return loss
RLout
ISL
isolation
K
Rollett stability factor
f = 900 MHz
-
18
-
dB
f = 750 MHz
-
29.5
-
dB
f = 850 MHz
-
27.5
-
dB
f = 900 MHz
-
26.5
-
dB
0 GHz  f  25 GHz
1
-
-
6.1 Performance curves
aaa-000470
0
S11
(dB)
-10
(1)
aaa-000471
35
S21
(dB)
30
25
(2) (3)
20
(1)
-20
(2)
(3)
15
10
-30
5
-40
500
700
900
1100
0
500
1300
1500
f (MHz)
VCC = 3.3 V.
700
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Input reflection coefficient as a function of
frequency
BGU7051
Product data sheet
1100
1300
1500
f (MHz)
VCC = 3.3 V.
(1) Tj = 40 C
Fig 2.
900
Fig 3.
Forward transmission coefficient as a function
of frequency
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
aaa-000472
0
aaa-000473
0
S12
(dB)
S22
(dB)
-10
(1) (2) (3)
-10
(1)
(2)
(3)
-20
-20
-30
-30
500
700
900
1100
-40
500
1300
1500
f (MHz)
VCC = 3.3 V.
700
1100
1300
1500
f (MHz)
VCC = 3.3 V.
(1) Tj = 40 C
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Fig 4.
900
Output reflection coefficient as a function of
frequency
Fig 5.
aaa-000474
40
S11,S21,
S22,S12,
(dB)
Reverse transmission coefficient as a function
of frequency
aaa-000475
25
K
20
S21
20
15
0
S11
10
(1)
S22
(2)
-20
(3)
5
S12
-40
0
0
500
1000
1500
2000
2500
f (MHz)
0
5
10
15
20
25
f (GHz)
VCC = 3.3 V; Tamb = 25 C.
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(3) Tj = 85 C
Fig 6.
Wideband s-parameters as a function of
frequency
BGU7051
Product data sheet
Fig 7.
Stability K-factor as a function of frequency
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
aaa-000476
20
aaa-000477
40
PL(1dB)
(dBm)
IP3O
(dBm)
(1)
(2)
18
30
(3)
(2)
(3)
(1)
16
20
14
10
12
10
700
800
900
0
700
1000
800
f (MHz)
1000
f (MHz)
VCC = 3.3 V.
VCC = 3.3 V.
(1) Tj = 40 C
(1) Tj = 40 C
(2) Tj = 25 C
(2) Tj = 25 C
(3) Tj = 85 C
(3) Tj = 85 C
Fig 8.
900
Output power at 1 dB gain compression as a
function of frequency
Fig 9.
Output third-order intercept point as a function
of frequency
aaa-000478
2
NF
(dB)
1.5
(3)
1
(2)
(1)
0.5
0
500
700
900
1100
1300
1500
f (MHz)
VCC = 3.3 V.
(1) Tj = 40 C
(2) Tj = 25 C
(3) Tj = 85 C
Fig 10. Noise figure as function of frequency
BGU7051
Product data sheet
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Rev. 2 — 11 November 2011
© NXP B.V. 2011. All rights reserved.
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
7. Application information
Figure 11 shows the typical application circuit for the BGU7051. The device is internally
matched to 50 , and therefore does not need any external matching. The value of the
input and output DC blocking C1 and C2 are recommended to be 1 nF. DC decoupling
capacitors C3 and C4 should be located as close as possible to the BGU7051.
In case different system blocks are supplied via the same voltage rail, it is recommended
to use a bias choke in the bias line on the positions of R1 and R2. The value of this choke
is depending on the frequency that needs to be decoupled.
R1
RF_INPUT
C7
C1
C5
C3
C4
VCC2
C9
R2
VCC1
VCC1
2
9
RF_IN 4
7 RF_OUT
3
5
6
C6
C2
C8
VCC2
C10
RF_OUTPUT
8
aaa-000479
See Table 7 for a list of components.
Fig 11. Typical application circuit
BGU7051
Product data sheet
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BGU7051
NXP Semiconductors
X2
C2
X3
RFOUT
SiGe:C low noise high linearity amplifier
C8
C10
C4
V2
C5
R2
GND
R1
V1
C9
C6
C7
C3
RFIN
C1
X1
aaa-000480
See Table 7 for a list of components.
Fig 12. Layout of the evaluation board
Table 7.
List of components
See Figure 11 for schematics.
Component
Value
Size
Function
capacitor
[1]
1 nF
0402
DC block
C3, C4
capacitor
[1]
100 pF
0402
bias decoupling
C5, C6
capacitor
[1]
100 nF
0402
bias decoupling
C7, C8, C9, C10
capacitor
[2]
100 nF
0603
optional
R1, R2
resistor
0
0402
C1, C2
BGU7051
Product data sheet
Description
[1]
Murata GRM155 or capacitor of same quality.
[2]
Murata GRM188 or capacitor of same quality.
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
8. Package outline
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
A
B
D
A
A1
E
c
detail X
terminal 1
index area
C
e1
terminal 1
index area
e
5
y
y1 C
v M C A B
w M C
b
1
L
Eh
6
10
Dh
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1)
Dh
E(1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.5
2
0.55
0.30
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT650-1
---
MO-229
---
EUROPEAN
PROJECTION
ISSUE DATE
01-01-22
02-02-08
Fig 13. Package outline SOT650-1 (HVSON10)
BGU7051
Product data sheet
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Rev. 2 — 11 November 2011
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
9. Abbreviations
Table 8.
Abbreviations
Acronym
Description
AC
Alternating Current
CW
Continuous Wave
ESD
ElectroStatic Discharge
ESR
Equivalent Series Resistance
HBM
Human Body Model
LNA
Low Noise Amplifier
PDA
Personal Digital Assistant
RF
Radio Frequency
SiGe:C
Silicon Germanium Carbon
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU7051 v.2
20111111
Product data sheet
-
BGU7051 v.1
Modifications:
BGU7051 v.1
BGU7051
Product data sheet
•
•
Figure 10: data plots updated
Unit dB changed to dBm for PL(1dB) in Section 6 “Characteristics”
20111027
Product data sheet
-
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Rev. 2 — 11 November 2011
-
© NXP B.V. 2011. All rights reserved.
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
BGU7051
Product data sheet
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BGU7051
NXP Semiconductors
SiGe:C low noise high linearity amplifier
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU7051
Product data sheet
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Rev. 2 — 11 November 2011
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NXP Semiconductors
SiGe:C low noise high linearity amplifier
13. Contents
1
1.1
1.2
1.3
1.4
2
2.1
2.2
3
4
5
6
6.1
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Performance curves . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 November 2011
Document identifier: BGU7051