Capacitance-Digital-Converter LSI for Electrostatic Capacitive Touch Sensors Evaluation Board User's Manual

LC717A10ARGPGEVB
Capacitance­Digital­Converter
LSI for Electrostatic
Capacitive Touch Sensors
Evaluation Board User's
Manual
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EVAL BOARD USER’S MANUAL
Introduction
In order for evaluation, it is necessary to obtain an
USB-to-Serial conversion module for SPI communication,
a PC to evaluate software, and a board with a designed
switch pattern.
This manual contains configuration, usage and main
specifications regarding Electrostatic Capacitive Touch
Sensor Evaluation Board (LC717A10ARGPGEVB).
For the latest edition of this manual, please refer to
ON Semiconductor homepage. (http://www.onsemi.com)
• Electrostatic Capacitive Touch Sensor Evaluation
Product Outline
•
This product is a board that can be used to evaluate LSI
“LC717A10AR”. Due to the fact it is 600 mil wide DIP
shape, it is easy to use. It can be set up to evaluate any given
touch switch pattern.
Board LC717A10ARGPGEVB
Accessory Connector Pin (8pin)
EVALUATION BOARD
LC717A10ARGPGEVB Evaluation Board Outline
Power LED
15.24
LED1
Cin8
R1
2.54
∅ 0.9
Cin7
2.54
Reset Switch
717A10
Touch Sensor LSI
LC717A10AR
Cin9
Cin6
LC717A10ARGPGEVB
Cin10
Cin5
Cin4
Cin11
C1
Cin12
Cin3
U1
Cin13
Cin2
R6
Cin14
Cin1
Cin0
Cin15
nCS
nRST
R5
SA0
Cref
SO
C2 R7
CrefAdd
C3
SDA
R4
SI
Cdrv
SCL
GND
SCK
R3
R2
3 2 1 GND
INTOUT
2 3
J P2
R8
1
INTOUT LED
SA1 LED2
JP 1
VDD
Figure 1. Configuration of LC717A10ARGPGEVB
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 3
1
Publication Order Number:
EVBUM2173/D
LC717A10ARGPGEVB
• Touch Sensor LSI:
•
• Reset Switch:
Electrostatic Capacitive Touch Sensor LSI
LC717A10AR
Power LED:
When a power is supplied, it turns on. Power supply
voltage is 2.6 to 5.5 V.
•
This is used to RESET Touch Sensor LSI. Use this
switch if any abnormality is encountered during
operation.
INTOUT LED:
When the INTOUT signal outputs, it turns on.
Evaluation Board Specifications
Non Connect
Cin11
Cin12
Cin13
Cin14
Cin15
CrefAdd
Cdrv
INTOUT
SA1
Cin7
Cin6
Cin9
LC717A10ARGPGEVB
Cin5
Cin10
Cin4
Cin11
C1
Cin3
Cin12
U1
Cin2
Cin13
R6
Cin14
Cin1
Cin0
Cin15
nCS
nRST
R5
SA0
Cref
SO
C2 R7
CrefAdd
C3
SDA
R4
SI
SCL
Cdrv
GND
SCK
R3
R2
3 2 1 GND
Cin6
SA1 LED2
VDD
2 3
J P2
Cref
Cin7
1
nRST
R1
JP 1
VDD
Figure 2. Terminal Pin Layout
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2
Cin5
Cin4
Cin3
Cin2
Cin1
Cin0
nCS
SA0/SO
R8
Cin10
LED1
717A10
Cin9
Cin8
INTOUT
Cin8
SDA/SI
SCL/SCK
GND
LC717A10ARGPGEVB
Table 1. SIGNAL PIN FUNCTIONS
Pin Name
I/O
Cin0
I/O
Capacitance Sensor Input
Pin Functions
Cin1
I/O
Capacitance Sensor Input
Cin2
I/O
Capacitance Sensor Input
Cin3
I/O
Capacitance Sensor Input
Cin4
I/O
Capacitance Sensor Input
Cin5
I/O
Capacitance Sensor Input
Cin6
I/O
Capacitance Sensor Input
Cin7
I/O
Capacitance Sensor Input
Cin8
I/O
Capacitance Sensor Input
Cin9
I/O
Capacitance Sensor Input
Cin10
I/O
Capacitance Sensor Input
Cin11
I/O
Capacitance Sensor Input
Cin12
I/O
Capacitance Sensor Input
Cin13
I/O
Capacitance Sensor Input
Cin14
I/O
Capacitance Sensor Input
Cin15
I/O
Capacitance Sensor Input
Cref
I/O
Reference Capacitance Input
CrefAdd
I/O
Reference Capacitance Input for Addition
Cdrv
O
Output for Capacitance Sensors Drive
INTOUT
O
Interrupt Output
SCL/SCK
I
Clock Input (I2C)/Clock Input (SPI)
nCS
I
Interface Selection/Chip Select Inverting Input (SPI)
nRST
I
External Reset Signal Inverting Input (2.2 kW Pull-up, with Switch)
SA1
I
Slave Address Selection (I2C)
SDA/SI
I/O
Data Input and Output (I2C)/Data Input (SPI)
SA0/SO
I/O
Slave Address Selection (I2C)/Data Output (SPI) (JP2 100 kW Pull-down)
VDD
−
Power Supply (2.6 V to 5.5 V). It is Connected to VDD of LC717A10AR
GND
−
Ground (Earth). It is Connected to VSS of LC717A10AR
Table 2. MAIN SPECIFICATIONS
Parameter
Conditions
Remarks
Board Size
35.56 × 20.32 (mm)
Board Material
Glass Epoxy (FR4)
Supply Voltage
2.6 to 5.5 V
Capacitance Touch Sensor
LC717A10AR
Communication Specification
SPI
Copper Foil: 35 mm, Thickness: 1.6 mm, 2-layer Board
It can be change to I2C Compatible Bus by Parts Exchange
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LC717A10ARGPGEVB
Table 3. JUMPER, PATTERN FOR ADDITIONAL PARTS
Pattern
Parameter
C2
Pattern for Cref Capacity Adjustment
Implement capacitor of any capacity as needed. (Size: 1608)
Set Contents
C3
Pattern for CrefAdd Capacity
Adjustment
Implement capacitor of any capacity as needed. (Size: 1608)
R3
Pattern for SCL Pull-up
When I2C compatible bus is chosen by nCS, implement a resistance of 2.2 kW.
(Size: 1608) (Pull-up VDD)
R4
Pattern for SDA Pull-up
When I2C compatible bus is chosen by nCS, implement a resistance of 2.2 kW.
(Size: 1608) (Pull-up VDD)
R5
Pattern for nCS Pull-up
When I2C compatible bus is chosen by nCS, implement a resistance of 2.2 kW.
(Size: 1608) (Pull-up VDD)
R7
Reserve Pattern
(R7 Initialization: Short) (Size: 1608)
(R8 Initialization: Open) (Size: 1608)
R8
Reserve Pattern
JP1
Pattern for I2C Compatible Bus Slave
Address Selection
When I2C compatible bus is chosen by nCS, set the I2C compatible bus slave
address by JP1 and JP2. When SPI is chosen, connect to the ground.
(JP1 Initialization: Ground Short)
1−2 Short: H Level
2−3 Short: L Level
JP2
Pattern for I2C Compatible Bus Slave
Address Selection/SO Pull-down
When I2C compatible bus is chosen by nCS, set the I2C compatible bus slave
address by JP1 and JP2. When SPI is chosen, implement a resistance of 100 kW
between 2 to 3. (It has been implemented.) (JP2 Initialization: Ground Pull-down)
1−2 Short: H Level
2−3 Short: L Level
Table 4. LC717A10AR I2C COMPATIBLE BUS SLAVE ADDRESS
SA1 Input
(JP1)
SA0 Input
(JP2)
7bit Slave Address
Binary Notation
8bit Slave Address
Low
Low
0x16
00101100b (Write)
0x2C
00101101b (Read)
0x2D
Low
High
0x17
00101110b (Write)
0x2E
00101111b (Read)
0x2F
High
High
Low
0x18
High
0x19
00110000b (Write)
0x30
00110001b (Read)
0x31
00110010b (Write)
0x32
00110011b (Read)
0x33
HOW TO USE
4. Install evaluation software to PC. The evaluation
software is available from the ON Semiconductor
Homepage, and selecting “LC717A10 software”.
Double-click on the icon “LC717A10App.exe”
from the installed folder and start it.
5. Press RESET Switch when evaluation board is
acting strange.
6. Please note: If the user directly touches the LSI on
the evaluation board or patterns with their finger, it
may cause malfunction or breakdown.
1. Connection of connector pin.
Solder attached connector pin (8pin) at the
position pictured in Figure 3.
2. Connect the LC717A10ARGPEVB to a board
with a designed switch pattern. When designing
a switch pattern, please refer to the Application
and Design Note on the ON Semiconductor Touch
Sensor Homepage.
3. Connect LC717A10ARGPGEVB to PC through
an USB-to-Serial conversion module. Supply the
power, and verify the Power LED is turned on.
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LC717A10ARGPGEVB
Cin8
LED1
R1
Cin7
717A10
Cin9
Cin6
LC717A10ARGPGEVB
Cin10
Cin5
Cin4
Cin11
C1
Cin12
Cin3
U1
Cin13
Cin2
R6
Cin14
Cin1
Cin0
Cin15
nCS
nRST
R5
SA0
Cref
SO
C2 R7
CrefAdd
C3
SDA
R4
SI
SCL
Cdrv
GND
SCK
R3
R2
3 2 1 GND
Non Connect
nCS
1
R8
2 3
J P2
SO
SI
INTOUT
SCK
SA1 LED2
JP 1
GND
VDD
VDD
Figure 3. Connection of Connector Pin
USB and Serial
Conversion Module
SPI
USB
Connector Pin (8pin)
LC717A10ARGPGEVB
PC
Header Pin (14pin × 2)
Touch Switch Board
(Other than LC717A10ARGPGEVB and Connector Pin (8pin) are not Attached.)
Figure 4. Connection Example of LC717A10ARGPGEVB
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6
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Figure 5. Circuit Diagrams
SA1
INTOUT
Cdrv
Cref
CrefAdd
nRST
Cin15
Cin14
Cin13
Cin12
Cin11
Cin10
Cin9
Cin8
SA1
INTOUT
Cdrv
Cref
CrefAdd
nRST
Cin15
Cin14
Cin13
Cin12
Cin11
Cin10
Cin9
Cin8
CN1
1 VDD
2 GND
3
4
5
6
7
8
I2C/SPI Connecter
R7
R5
VDD
R8
GND
3
R9
100 kW
2
JP2
1
VDD
R4
VDD
R3
GND
SW
R6
2.2 kW
VDD
GND
2
JP1
3
1
INTOUT
SA1
SCL/SCK
SDA/SI
SA0/SO
nCS
nRST
GND
LED2
ORANGE
R2
1.5 kW
INTOUT
22
23
24
25
26
27
28
C3
21
20
19
18
17
16
15
Cdrv
CrefAdd
Cref
Cin15
Cin14
Cin13
Cin12
Cin0
Cin1
Cin2
Cin3
VDD
VSS
Cin4
GND
LED1
GREEN
R1
1.5 kW
VDD
1
2
3
4
5
6
7
VDD
14
13
12
11
10
9
8
GND
C1
1 mF
VDD
SDA/SI
SA0/SO
nCS
Cin0
Cin1
Cin2
Cin3
Cin4
Cin5
Cin6
Cin7
VDD
GND
SCL/SCK
U1
LC717A10AR
Cin11
Cin10
Cin9
Cin8
Cin7
Cin6
Cin5
C4
VDD
GND
SCL/SCK
SDA/SI
SA0/SO
nCS
Cin0
Cin1
Cin2
Cin3
Cin4
Cin5
Cin6
Cin7
LC717A10ARGPGEVB
CIRCUIT DIAGRAMS
LC717A10ARGPGEVB
PRECAUTION FOR USE
For approach in the use of LSI and design rule of the
switch pattern: Please refer to the Application Note and
Design Note in ON Semiconductor Touch Sensor
Homepage.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
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