NCP6324B/C Evaluation Board User's Manual

NCP6324GEVB
NCP6324B/C Evaluation
Board User's Manual
3 MHz, 2 A, High Efficiency, Low Ripple,
Adjustable Output Voltage, Synchronous
Buck Converter
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EVAL BOARD USER’S MANUAL
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Overview
This document is a manual file for a demo board of the
NCP6324B/C, which includes demo board schematics, bill
of materials, PCB layout, jumper setup, and test procedure.
About NCP6324B/C
The NCP6324B/C, a family of synchronous buck
converters, which is optimized to supply different sub
systems of portable applications powered by one cell Li-ion
or three cell Alkaline/NiCd/NiMH batteries. The devices are
able to deliver up to 2 A on an external adjustable voltage
range from 0.6 V to 3.3 V. Operation with 3 MHz switching
frequency allows employing small size inductor and
capacitors. Input supply voltage feed-forward control is
employed to deal with wide input voltage range.
Synchronous rectification and automatic PWM/PFM power
save mode offer improved system efficiency. The
NCP6324B is in a space saving, low profile
2.0 × 2.0 × 0.75 mm WDFN−8 package.
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Typical Applications
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Features
• 2.5 V to 5.5 V Input Voltage Range
• External Adjustable Voltage
• Up to 2 A Output Current
NCP6324B
1uH
Vo = 0.6V to Vin
Cout
10uF
R1
Cfb
PGND
PVIN
SW
AVIN
Vin = 2.5V to 5.5V
Cin
10uF
AGND MODE/
PG
FB
Cellular Phones, Smart Phones, and PDAs
Portable Media Players
Digital Still Cameras
Wireless and DSL Modems
USB Powered Devices
Point of Load
Game and Entertainment System
Rpg
1M
Power Good
NCP6324C
1uH
Vo = 0.6V to Vin
Cout
10uF
R1
Enable
EN
3 MHz Switching Frequency
Synchronous Rectification
Automatic Power Save or External Mode Selection
Enable Input
Power Good Output
Soft Start
Over Current Protection
Active Discharge When Disabled. Hi−Z Version
Available upon Request
Thermal Shutdown Protection
WDFN−8, 2 × 2 mm, 0.5 mm Pitch Package
Maximum 0.8 mm Height for Super Thin Applications
Cfb
PVIN
SW
AVIN
Cin
10uF
AGND MODE/
PG
FB
R2
Vin = 2.5V to 5.5V
PGND
EN
Mode
Enable
R2
(a) Power Good Output (NCP6324B)
(b) External Mode Selection
(NCP6324C Available upon Request)
Figure 1. Typical Application Circuits
© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 0
1
Publication Order Number:
EVBUM2243/D
NCP6324GEVB
Table 1. PIN DESCRIPTION
Pin
Name
Type
1
PGND
Power
Ground
Power Ground for power, analog blocks. Must be connected to the system ground.
Description
2
SW
Power
Output
Switch Power pin connects power transistors to one end of the inductor.
3
AGND
Analog
Ground
Analog Ground analog and digital blocks. Must be connected to the system ground.
4
FB
Analog
Input
Feedback Voltage from the buck converter output. This is the input to the error amplifier. For fixed
output devices, this pin is directly connected to the output capacitor; For external adjustable output
devices, this pin is connected to the resistor divider network between the output and AGND.
5
EN
Digital
Input
Enable of the IC. High level at this pin enables the device. Low level at this pin disables the device.
6
PG
Digital
Output
PG pin is for NCP6324B with Power Good option. It is open drain output. Low level at this pin
indicates the device is not in power good, while high impedance at this pin indicates the device is
in power good.
7
AVIN
Analog
Input
Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or
larger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as
close as possible to this input.
8
PVIN
Power
Input
Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacitor
must bypass this input to the ground. This capacitor should be placed as close a possible to this
input.
9
PAD
Exposed
Pad
Exposed Pad. Must be soldered to system ground to achieve power dissipation performances.
This pin is internally unconnected
Table 2. MAXIMUM RATINGS
Value
Symbol
Min
Max
Unit
VPVIN, VAVIN
−0.3
7.0
V
VSW
−0.3
7.0
V
VEN, VPG
−0.3
7.0
V
VFB
−0.3
7.0
V
Human Body Model (HBM) ESD Rating are (Note 1)
ESD HBM
−
2,000
V
Machine Model (MM) ESD Rating are (Note 1)
ESD MM
−
200
V
−100
−10
100
10
Rating
Input Supply Voltage to GND
Switch Node to GND
EN, PG to GND
FB to GND
Latch up Current: (Note 2)
All pins, except digital pins
Digital pins
ILU
mA
Operating Junction Temperature Range
TJ
−40
125
°C
Operating Ambient Temperature Range
TA
−40
85
°C
Storage Temperature Range
TSTG
−55
Thermal Resistance Junction-to-Top Case (Note 4)
RqJC
12
°C/W
Thermal Resistance Junction-to-Board (Note 4)
RqJB
30
°C/W
Thermal Resistance Junction-to-Ambient (Note 4)
RqJA
62
°C/W
PD
1.6
W
MSL
1
−
Power Dissipation (Note 5)
Moisture Sensitivity Level (Note 6)
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115.
2. Latch up Current per JEDEC standard: JESD78 class II.
3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.
4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50 mm NCP6324EVB
board. It is a multilayer board with 1 once internal power and ground planes and 2−once copper traces on top and bottom of the board. If
the copper trances of top and bottom are 1 once too, RqJC = 11°C/W, RqJB = 30°C/W, and RqJA = 72°C/W.
5. .The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.
6. .Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
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NCP6324GEVB
Electrical Characteristics
Schematic of Demo Board
For electrical characteristics, please refer to
NCP6324B/C
datasheet
available
on
website:
http://www.onsemi.com.
A schematic of NCP6324B/C evaluation board is shown
in Figure 2, which is for a typical application with 1.8 V
output voltage. It is flexible to configure the board for both
PG devices (NCP6324B) and Mode devices (NCP6324C).
Please refer to Jumper Configuration for details.
Vin+
Vo+
L
1.0uH
J3
Co3 Co2 Co1
1
PGND
R1
220k
Cfb
15pF
AVIN
MODE/
PG
6
EN
5
SW
3
AGND
4
FB
Ren
8
7
PG
1M
Cin1
10uF
EN
Rpg
1M
R2
110k
Vo−
Vin_sen
2
PVIN
Vo+
Mode
Vo_sen
Rfb
20
DNP DNP 10uF
Cin2
100uF
IC1
NCP6324B/C
Vin−
Figure 2. Schematic of NCP6324B/C Evaluation Board
Table 3. BILL OF MATERIALS OF EVALUATION BOARD
Item
Part
Reference
Description
Package
Part Number
Manufacturer
Qty
1
IC1
3 MHz, 2 A, Synchronous Buck
Converter
WDFN−8
2.0 × 2.0 ×
0.75 mm
NCP63xyB/C
ON Semiconductor
1
2
Cin1
MLCC Cap 10 V, 10 mF, X5R,
±20%
0805
GRM21BR61A106KE19
muRata
1
3
Cin2
MLCC Cap 6.3 V, 100 mF, X5R,
±20%
1210
GRM32ER60J107ME20
muRata
1
4
Co1
MLCC Cap 6.3 V, 10 mF, X5R,
±20%
0603
GRM188R60J106ME47
muRata
1
5
L
Power Choke 1.0 mH, ±30%,
2450 mA, 30 mW
4.0 × 3.5 ×
1.65 mm
LQH44PN1R0NP0
muRata
1
6
Ren, Rpg
Thick Film Chip Resistors, 1 MW,
±5%, 0.1 W
0603
ERJ3GEYJ105V
Panasonic
2
7
R1
Thick Film Chip Resistors,
220 kW, ±1%, 0.1 W
0603
ERA3AEB224V
Panasonic
1
8
R2
Thick Film Chip Resistors,
110 kW, ±1%, 0.1 W
0603
ERA3AEB114V
Panasonic
1
9
Cfb
MLCC, 15 pF, 50 V, 0603
0603
ECJ1VC1H150J
Panasonic
1
10
Rfb
Thick Film Chip Resistors, 20 W,
±1%, 0.1 W
0603
ERA3AEB200V
Panasonic
1
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3
NCP6324GEVB
PCB Layout of Demo Board
ground planes (middle1 layer and middle2 layer) and 2-once
copper traces on top layer and bottom layer of the board.
Figure 3 shows layout information of the board.
A 80 × 50 mm PCB is designed for NCP6324B/C
evaluation board. It is a 4-layer board with 1-once internal
(a) TopOver Layer
(b) Top Layer
(c) Middle 1 Layer
(d) Middle 2 Layer
(e) Bottom Layer
Figure 3. PCB Layout of NCP6324B/C Evaluation Board
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4
NCP6324GEVB
Connections and Jumper Setup
jumper setup for both configurations are shown in Figure 4.
The default configuration of NCP6324B/C evaluation board
is for NCP6324B devices.
There are two main configurations of the demo board for
two different devices, which are NCP6324B (PG device)
and NCP6324C (Mode device). External connections and
Enable by Connecting EN
to Vin (Default)
Open (Default)
Pull PG to Vin (Default)
Pull PG to Vo
Short Rfb in
Normal Operation
(Default)
Disable by Connecting EN
to GND
Open and Inject AC
Signal (for AC Test)
1.8V
Output
2.5V ~ 5.5V
Supply
To Multi−Meter for Vin Measurement
To Multi−Meter for Vo Measurement
( a ) NCP6324B (Default)
FPWM Mode
Enable by Connecting EN
to Vin (Default)
AUTO Mode (Default)
Open (Default)
Short Rfb in
Normal Operation
(Default)
Disable by Connecting EN
to GND
Open and Inject AC
Signal (for AC Test)
1.8V
Output
2.5V ~ 5.5V
Supply
To Multi−Meter for Vin Measurement
To Multi−Meter for Vo Measurement
( b ) NCP6324C
Figure 4. Connections and Jumper Setup of NCP6324B/C Evaluation Board
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5
NCP6324GEVB
Test Procedure of Evaluation Board
7. Set the electronic load to 10 mA and enable its
output. Typical input supply current is about 6 mA.
8. Monitor the output voltage and SW node signal
using an oscilloscope. The converter should operate
in DCM with similar waveforms as shown in
Figure 5(a).
9. Increase the electronic load to 1.0 A. Typical input
supply current is about 565 mA.
10. Monitor the output voltage and SW node signal
using the oscilloscope. The converter should operate
in CCM with similar waveforms as shown in
Figure 5(b). The switching frequency is about
3 MHz.
11. After the test is done, make sure to disable the output
of power supply before remove power connectors to
protect the device from damage caused by possible
high voltage spike in input.
1. Prepare equipments as below list.
a. DC power supply
b. Electronic load
c. Multimeters
d. Oscilloscope
2. Check jumper setup to make sure it is a right default
configuration for the device under test.
3. Set the power supply to 3.6 V with a current limit
higher than 1 A, and then disable the output of the
power supply.
4. Connect the power supply to the evaluation board’s
connectors Vin+ and Vin−.
5. Disable output of the electronic load and connect it
to the evaluation board’s connectors Vo+ and Vo−.
6. Enable the output of the power supply and check the
1.8 V output voltage of the evaluation board.
(a) Io = 10 mA
(b) Io = 1000 mA
Figure 5. Typical Operation Waveforms of NCP6324B/C Evaluation Board
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