DFN20 6x5, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN20, 6x5, 0.5P
CASE 505AB
ISSUE C
20
DATE 23 MAY 2012
1
SCALE 2:1
A
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL
AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION, DETAIL B ALTERNATE CONSTRUCTION IS NOT APPLICABLE.
B
PIN 1 LOCATION
E
2X
0.15 C
2X
TOP VIEW
0.15 C
0.10 C
A2
A
0.08 C
A1
SIDE VIEW (A3)
C
SEATING
PLANE
D2
20X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.65
0.75
0.20 REF
0.20
0.30
6.00 BSC
3.98
4.28
5.00 BSC
2.98
3.28
0.50 BSC
0.20
−−−
0.50
0.60
GENERIC
MARKING DIAGRAM*
e
L
20X
DIM
A
A1
A2
A3
b
D
D2
E
E2
e
K
L
1
10
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
G
E2
K
20
11
20X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3.24
PACKAGE
OUTLINE
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
20X
0.78
4.24
XXXXX
A
WL
YY
WW
G
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
5.30
1
20X
0.50
PITCH
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON13117D
ON SEMICONDUCTOR STANDARD
http://onsemi.com
20 PIN DFN, 6X5 MM, 0.5 MM PITCH
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON13117D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED TO PRODUCTION. REQ. BY P. CELAYA.
21 JUL 2003
A
CORRECTED MARKING DIAGRAM. REQ. BY J. LETTERMAN.
09 JUL 2004
B
CORRECTED DIMENSION B TO 0.20 MIN AND 0.30 MAX. REQ. BY S. WHITE.
05 DEC 2008
C
ADDED NOTE 5. REQ. BY B. MARQUIS.
23 MAY 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. C
Case Outline Number:
505AB