DFN8, 3x3, 0.65P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506BY
ISSUE A
1
SCALE 2:1
A
B
D
DATE 23 MAY 2012
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
L
L1
PIN ONE
REFERENCE
2X
0.10 C
2X
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
0.10 C
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
ÏÏÏ
ÎÎ
ÏÏ
ÏÏÏ
ÎÎÎ ÎÎ
EXPOSED Cu
TOP VIEW
A1
A
(A3)
DETAIL B
0.05 C
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.05 C
NOTE 4
A1
SIDE VIEW
SEATING
PLANE
D2
DETAIL A
1
8X
C
4
L
K
e/2
8
5
8X
b
0.10 C A B
e
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
2.46
1.66
ÎÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
1
0.65
PITCH
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
8X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.20
2.40
3.00 BSC
1.40
1.60
0.65 BSC
0.20
−−−
0.20
0.40
0.00
0.15
GENERIC
MARKING DIAGRAM*
1
E2
8X
A3
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.53
3.30
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON56369E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8, 3X3, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON56369E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY B. FONTES.
23 MAR 2011
A
ADDED NOTE 5. REQ. BY B. MARQUIS.
23 MAY 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. A
Case Outline Number:
506BY
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