CTSSOP8 3x3 with Sensor Window

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
CTSSOP8 3x3
CASE 949AA−01
ISSUE O
DATE 17 JUL 2009
SCALE 2:1
4X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION AND IS
DETERMINED BETWEEN 0.08 AND 0.15 MM FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DOES NOT INCLUDE MOLD
PROTRUSIONS, TIE BAR BURRS, GATE BURRS OR FLASH. END
FLASH SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D AND
E1 DO INCLUDE ANY MOLD CAVITY MISMATCH AND ARE
DETERMINED AT THE GAUGE PLANE.
5. DATUMS A AND B TO BE DETERMINED AT THE GAUGE PLANE.
6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THIS ZONE.
7. D2 AND E2 DIMENSIONS FOR TOP SIDE OF PACKAGE DENOTE
SENSOR WINDOW SIZE AND LOCATION.
0.20 C
D
A
8
8X b
D
NOTE 5
0.15
D2
5
M
C A-B D
NOTE 3
E2
E
E1
0.25
PIN 1
INDICATOR
NOTE 6
1
4
B
e
NOTE 5
e/2
AUXILIARY
TOP VIEW
TOP VIEW
C
L
M
GAUGE
PLANE
DETAIL A
DETAIL A
A
A1
A2
C
8X
c
0.15 C
SEATING
PLANE
SIDE VIEW
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
8X
0.48
8X
0.72
MILLIMETERS
MIN
MAX
−−−
1.10
0.00
0.14
0.73
0.93
0.24
0.39
0.13
0.24
3.00 BSC
0.66
1.37
4.90 BSC
3.00 BSC
0.41
1.37
0.65 BSC
0.39
0.67
0°
8°
DIM
A
A1
A2
b
c
D
D2
E
E1
E2
e
L
M
GENERIC
MARKING DIAGRAM*
Top Mark
Bottom Mark
8
ÉÉ
ÉÉ
XXXXXX
G
YYWW
AALL
CCCCC
1
5.15
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON47771E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
CTSSOP8 3X3 WITH SENSOR 1WINDOW
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 Rev. 0
XXXXX
YY
WW
AA
LL
CCCCC
G
= Specific Device Code
= Year
= Work Week
= Assembly Location
= Wafer Lot
= Country of Origin
= Pb−Free Package
*This information is generic. Please refer to device data
sheet for actual part marking. Pb−Free indicator, “G”
or microdot “ G”, may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON47771E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
17 JUL 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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© Semiconductor Components Industries, LLC, 2009
July, 2009 − Rev. 01O
Case Outline Number:
949AA
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